KR100668548B1 - 전도체 조성물 및 그의 용도 - Google Patents

전도체 조성물 및 그의 용도 Download PDF

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Publication number
KR100668548B1
KR100668548B1 KR1020037013230A KR20037013230A KR100668548B1 KR 100668548 B1 KR100668548 B1 KR 100668548B1 KR 1020037013230 A KR1020037013230 A KR 1020037013230A KR 20037013230 A KR20037013230 A KR 20037013230A KR 100668548 B1 KR100668548 B1 KR 100668548B1
Authority
KR
South Korea
Prior art keywords
composition
component
electrically conductive
particles
delete delete
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020037013230A
Other languages
English (en)
Korean (ko)
Other versions
KR20040030572A (ko
Inventor
사라 제인 미어스
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20040030572A publication Critical patent/KR20040030572A/ko
Application granted granted Critical
Publication of KR100668548B1 publication Critical patent/KR100668548B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Paints Or Removers (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020037013230A 2001-04-09 2002-04-04 전도체 조성물 및 그의 용도 Expired - Fee Related KR100668548B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0108888.9 2001-04-09
GBGB0108888.9A GB0108888D0 (en) 2001-04-09 2001-04-09 Conductor composition IV
PCT/US2002/010504 WO2002082467A1 (en) 2001-04-09 2002-04-04 Conductor compositions and the use thereof

Publications (2)

Publication Number Publication Date
KR20040030572A KR20040030572A (ko) 2004-04-09
KR100668548B1 true KR100668548B1 (ko) 2007-01-16

Family

ID=9912548

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037013230A Expired - Fee Related KR100668548B1 (ko) 2001-04-09 2002-04-04 전도체 조성물 및 그의 용도

Country Status (8)

Country Link
EP (1) EP1377985B1 (enExample)
JP (1) JP4252315B2 (enExample)
KR (1) KR100668548B1 (enExample)
CN (1) CN1307650C (enExample)
DE (1) DE60229367D1 (enExample)
GB (1) GB0108888D0 (enExample)
TW (1) TWI317526B (enExample)
WO (1) WO2002082467A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010110626A3 (en) * 2009-03-27 2010-12-09 Ls Cable Ltd. Composition for conductive paste containing nanometer-thick metal microplates with surface-modifying metal nano particles
WO2010101418A3 (en) * 2009-03-04 2010-12-09 Ls Cable Ltd. Composition for conductive paste containing nanometer-thick metal microplates

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0307547D0 (en) 2003-04-01 2003-05-07 Du Pont Conductor composition V
TW201115592A (en) * 2009-06-19 2011-05-01 Du Pont Glass compositions used in conductors for photovoltaic cells
JP2014201683A (ja) * 2013-04-05 2014-10-27 ｎ−ｔｅｃｈ株式会社 融雪塗料およびこれを利用した施工方法、融雪システム
WO2021141021A1 (ja) * 2020-01-08 2021-07-15 ナミックス株式会社 抵抗体ペースト、焼成体及び電気製品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE52134B1 (en) * 1980-07-31 1987-07-08 Du Pont Thick film conductor compositions
US4510179A (en) * 1981-08-18 1985-04-09 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate and the manufacturing process for it
JPH08134388A (ja) * 1994-11-14 1996-05-28 Matsushita Electric Ind Co Ltd 導電性インキ
JP2001028290A (ja) * 1999-05-07 2001-01-30 Ibiden Co Ltd ホットプレート及び導体ペースト

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010101418A3 (en) * 2009-03-04 2010-12-09 Ls Cable Ltd. Composition for conductive paste containing nanometer-thick metal microplates
WO2010110626A3 (en) * 2009-03-27 2010-12-09 Ls Cable Ltd. Composition for conductive paste containing nanometer-thick metal microplates with surface-modifying metal nano particles

Also Published As

Publication number Publication date
JP4252315B2 (ja) 2009-04-08
KR20040030572A (ko) 2004-04-09
JP2004533091A (ja) 2004-10-28
EP1377985B1 (en) 2008-10-15
CN1511325A (zh) 2004-07-07
GB0108888D0 (en) 2001-05-30
TWI317526B (en) 2009-11-21
WO2002082467A1 (en) 2002-10-17
EP1377985A1 (en) 2004-01-07
DE60229367D1 (de) 2008-11-27
CN1307650C (zh) 2007-03-28

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