TWI312375B - Organometallic complexes and their use as precursors to deposit metal films - Google Patents
Organometallic complexes and their use as precursors to deposit metal films Download PDFInfo
- Publication number
- TWI312375B TWI312375B TW095103783A TW95103783A TWI312375B TW I312375 B TWI312375 B TW I312375B TW 095103783 A TW095103783 A TW 095103783A TW 95103783 A TW95103783 A TW 95103783A TW I312375 B TWI312375 B TW I312375B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- metal
- organometallic complex
- butyl
- alkyl
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 44
- 239000002184 metal Substances 0.000 title claims abstract description 43
- 125000002524 organometallic group Chemical group 0.000 title claims abstract description 27
- 239000002243 precursor Substances 0.000 title claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 28
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 16
- 239000010941 cobalt Substances 0.000 claims abstract description 16
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 16
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 13
- 229910052742 iron Inorganic materials 0.000 claims abstract description 12
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 8
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000001257 hydrogen Substances 0.000 claims abstract description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 7
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract description 7
- 125000003118 aryl group Chemical group 0.000 claims abstract description 5
- -1 cycloaliphatic Chemical group 0.000 claims abstract description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 239000011701 zinc Substances 0.000 claims abstract description 4
- 125000003709 fluoroalkyl group Chemical group 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 31
- 229910052757 nitrogen Inorganic materials 0.000 claims description 23
- 239000010408 film Substances 0.000 claims description 22
- 238000000151 deposition Methods 0.000 claims description 15
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 14
- 238000005229 chemical vapour deposition Methods 0.000 claims description 13
- 238000000231 atomic layer deposition Methods 0.000 claims description 12
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 4
- 229910001507 metal halide Inorganic materials 0.000 claims description 4
- 150000005309 metal halides Chemical class 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 239000000376 reactant Substances 0.000 claims description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical group [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052684 Cerium Inorganic materials 0.000 claims 3
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 claims 1
- 208000001836 Firesetting Behavior Diseases 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 125000004428 fluoroalkoxy group Chemical group 0.000 claims 1
- 239000002667 nucleating agent Substances 0.000 claims 1
- 238000005096 rolling process Methods 0.000 claims 1
- 238000004062 sedimentation Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 210000000952 spleen Anatomy 0.000 claims 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
- 229910052741 iridium Inorganic materials 0.000 abstract description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052762 osmium Inorganic materials 0.000 abstract description 3
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005137 deposition process Methods 0.000 abstract description 2
- 150000004767 nitrides Chemical class 0.000 abstract description 2
- 229910052702 rhenium Inorganic materials 0.000 abstract 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 33
- 239000013078 crystal Substances 0.000 description 14
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000003446 ligand Substances 0.000 description 7
- 150000004696 coordination complex Chemical class 0.000 description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000011065 in-situ storage Methods 0.000 description 4
- 239000005909 Kieselgur Substances 0.000 description 3
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 150000002902 organometallic compounds Chemical class 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 238000004467 single crystal X-ray diffraction Methods 0.000 description 3
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 3
- 239000003039 volatile agent Substances 0.000 description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 235000019439 ethyl acetate Nutrition 0.000 description 2
- 239000002035 hexane extract Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- PVBKQYOOKXZUNU-UHFFFAOYSA-N 1-(9h-fluoren-1-yl)-9h-fluorene Chemical compound C1C2=CC=CC=C2C2=C1C(C=1C=CC=C3C4=CC=CC=C4CC=13)=CC=C2 PVBKQYOOKXZUNU-UHFFFAOYSA-N 0.000 description 1
- ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 2,3-dimethylbutane Chemical group CC(C)C(C)C ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 0.000 description 1
- 125000000339 4-pyridyl group Chemical group N1=C([H])C([H])=C([*])C([H])=C1[H] 0.000 description 1
- OQLZINXFSUDMHM-UHFFFAOYSA-N Acetamidine Chemical compound CC(N)=N OQLZINXFSUDMHM-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910021580 Cobalt(II) chloride Inorganic materials 0.000 description 1
- 229910020676 Co—N Inorganic materials 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021577 Iron(II) chloride Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 241000282376 Panthera tigris Species 0.000 description 1
- 229910004200 TaSiN Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229910008807 WSiN Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011011 black crystal Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- PYFRLDVYGBCYLI-UHFFFAOYSA-N decyl dihydrogen phosphite Chemical compound CCCCCCCCCCOP(O)O PYFRLDVYGBCYLI-UHFFFAOYSA-N 0.000 description 1
- 125000006612 decyloxy group Chemical group 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- GNVJAGJVKLUNGZ-UHFFFAOYSA-N ethynyl acetate Chemical compound CC(=O)OC#C GNVJAGJVKLUNGZ-UHFFFAOYSA-N 0.000 description 1
- OJCSPXHYDFONPU-UHFFFAOYSA-N etoac etoac Chemical compound CCOC(C)=O.CCOC(C)=O OJCSPXHYDFONPU-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 239000012452 mother liquor Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62C—FIRE-FIGHTING
- A62C3/00—Fire prevention, containment or extinguishing specially adapted for particular objects or places
- A62C3/02—Fire prevention, containment or extinguishing specially adapted for particular objects or places for area conflagrations, e.g. forest fires, subterranean fires
- A62C3/0221—Fire prevention, containment or extinguishing specially adapted for particular objects or places for area conflagrations, e.g. forest fires, subterranean fires for tunnels
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
- C07F15/06—Cobalt compounds
- C07F15/065—Cobalt compounds without a metal-carbon linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
- C07F15/02—Iron compounds
- C07F15/025—Iron compounds without a metal-carbon linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
- C07F15/04—Nickel compounds
- C07F15/045—Nickel compounds without a metal-carbon linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/10—Compounds having one or more C—Si linkages containing nitrogen having a Si-N linkage
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21F—SAFETY DEVICES, TRANSPORT, FILLING-UP, RESCUE, VENTILATION, OR DRAINING IN OR OF MINES OR TUNNELS
- E21F11/00—Rescue devices or other safety devices, e.g. safety chambers or escape ways
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21F—SAFETY DEVICES, TRANSPORT, FILLING-UP, RESCUE, VENTILATION, OR DRAINING IN OR OF MINES OR TUNNELS
- E21F7/00—Methods or devices for drawing- off gases with or without subsequent use of the gas for any purpose
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mining & Mineral Resources (AREA)
- Life Sciences & Earth Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Geology (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Biodiversity & Conservation Biology (AREA)
- Ecology (AREA)
- Forests & Forestry (AREA)
- Public Health (AREA)
- Pulmonology (AREA)
- Chemical Vapour Deposition (AREA)
Description
1312375 九、發明說明: 發明所屬之技術領域 本發明涉及有機金屬前驅物,和在基材例如碎、金屬 氮化物和其他金屬層上製造含金屬的保形薄膜的沈積方 法0 先前拮術 φ 厚度為5〇A或更少的金屬和金屬氧化物高保形薄膜在 包括微電子學和磁資訊存儲的電子器件的製造中越來越引 起人們的注意。這些薄膜通常通過化學氣相沈積(cvd) 和原子層沈積(ALD)法生產^隨著元件器件(即電晶體) -尺寸的減小以及元件器件密度的增大和電路的圖案化,就 、相备地需要可通過CVD或ALD法製造這類薄膜的新穎有 機金屬前驅物化合物。 熱穩疋的金屬脒化物已經被選用作生產過渡金屬的高 •保形薄膜的候選物件。其可用於生產邏輯和記憶體件。用 於、種金屬縣化物中的示範性金屬包括姑、凱、鐵和錄。 已經證明’來自VIIb、vm、Ιχ和X族金屬的金屬矽 化物疋電子學領域,特別是在積體電路製造和微電子領域 、丨^注目的化合物。由於其良好的熱和化學穩定性、低電 • ㈣、寬加工範圍以及其對石夕晶格較小的晶格失配,當器 按比例縮小時對金屬矽化物的興趣增加,這使得金屬矽 化物在矽上磊晶生長。 、專利和文早中給出了適於通過CVD和ALD生產保 1312375 形的金屬或金屬氧化物薄膜的有機金屬化合物,以及其在 電子工業中的用途。 US 6,777,565 B2 和 US 6,753,245 B2 中公開了使用通式 的有機金屬化合物沈積金屬薄膜,其中厘為 選自Vllb、VIII、IX或X族的金屬,例如鐵、鈷、鎳、錳、 鍺等等。還公開了曱矽烷基亞磷酸金屬鹽,並且其實例包 括通式為 H2M[(CH3)3SiOP(OC2H5)2]4 和 φ M(CH3)3SiOP(〇CH3)2]5 的那些。 US 2002/0081381中公開了在ALD方法中使二(乙醯基 丙酮根合)鈷與氫或矽烷交替地反應形成鈷膜。鈷可以被 用作為銅和擴散壁壘層之間的膠合層以增加粘合,擴散壁 - 壘層例如來自TiN、TaN和WN。 . US 2002/0016〇65中公開了使用有機金屬錯合物形成含 金屬薄膜’其中金屬中心與螯合的C,N-供體配位基配位。 例如在一個實施例中,使用一種錯合物 • C〇{C(SiMe3)2(C5H4N)}2在矽基材上形成鈷膜。 WO 2004/046417 A2 和 Roy G. Gordon 等人在 vl/ierwaie Layer Deposition of Transition Metals, Nature Materials, 茗2卷,74P p⑽3卒77方j中公開了使用金屬脒化物作為 有機金屬前驅物通過ALD形成高保形薄膜。雙(Ν,Ν,-二異 丙基乙脒根合)鈷(II)、雙(Ν,Ν,-第三丁基乙脒根合)錳和三 (Ν,Ν'_二異丙基-2-第三丁脒根合)鑭用作前驅物。 發明内容 6 ‘1312375 本發明涉及有機金屬前驅物以及使用這些有機金屬前 驅物在基材,例如矽、金屬氮化物和其他金屬層上形成含 金屬保形薄膜的沈積方法。這些薄膜已經應用在電腦晶 片、光學器件、磁資訊記憶體和塗布在載體材料上的金屬 催化劑上。 有機金屬前驅物為具有下式的N,N,_烷基“,丨—烷基甲矽 烷基胺基金屬錯合物:
. 其中Μ為選自Vllb、VIII、IX和X族的金屬,並且金屬的 特定實爿包括結、鐵、鎳、猛、飢、鑭、釕、鋅、銅、鈀、 鉑、銥、銖、锇,並且R1-5可相同或不同並選自氫、烷基、 • 统氧基、氟代烷基和烷氧基、脂環族基和芳基。 通過這些有機金屬錯合物(特別是N,N,_烷基·M-烧基 曱矽烷基胺基金屬錯合物前驅物)可得到一些優點,並且 這些優點包括: , 以良好收率形成反應性的Ν,Ν'-烷基_丨,卜烷基甲矽烷基 胺基金屬錯合物的能力; 產生適用於各種各樣電氣應用的高保形金屬薄膜的能 力; 形成適用於微電子設備的高保形金屬氧化物薄膜的能 7 1312375 力; 由於錯合物的高化學反應性,提高Ν,Ν'-烷基-1,1-烷基 甲矽烷基胺基金屬錯合物和基材表面之間表面反應的能 力;和 通過改變N,N’-烷基-1,;1_烷基曱矽烷基胺基金屬錯合物 上的R基團,來調整N,N’-烷基-ΐ,ι _烷基曱矽烷基胺基金屬 錯合物的物理性質的能力。 實施方式 本發明涉及一類有機金屬錯合物,特別是具有螯合的 N,N'-供體配位基的n,N’-烷基-^-烷基曱矽烷基胺基金屬 錯合物’以及其合成和在沈積過程中的應用。這些 虎基- μ-烧基曱矽烧基胺基金屬錯合物的通式可表示如 下.MfR^R^SRNRlNR^R5);^,其中 M 為選自 VIIb 、VIII、 IX和X族的金屬,並且金屬的特定實例包括鈷、鐵、鎳、 錳、釕、鋅、銅、鈀、鉑、銥、銖、锇,並且r1-5選自氫 原子、烧基或烧氧基、氟代烷基和烷氧基以及脂環族基。 k些有機金屬錯合物,例如N,N,-烷基-1,1-烷基曱矽烷 基胺基金屬錯合物可用作可能的前驅物,通過化學氣相沈 1 ( CVD)或原子層沈積(ald)法在小於则。c的溫度下 製化4金屬或金屬氧化物薄膜。cVD法可在有或沒有還原 劑或氧化劑的情況下進行’然而ald法通常涉及使用其他 反應物,例如還原劑或氧化劑。 有機金屬錯合物可通過式(Μχ。的無水二價金屬鹵化 8 *1312375 物的反應製備,其中χ優選(^或Br。在一個優選實施方 案中’使MCI2與2當量的Ν,Ν1-烷基-1,1-烷基甲矽烷基胺 基鋰(R^KLiNR^NW))反應。下列反應方程式是代 表性的:
MX2 + R1R2Si(LiNR3XNR4R5)-► M{R1R2Si(LiNR3)(NR4R5)} + 2LiX N,N'-烷基_i,i_烷基曱矽烷基胺基鋰 φ ( RlR2si(Li舰3)(NR4R5))可通過使式 RYsiCHNR^NI^R5) 的有機化合物與例如LiBu11的烷基鋰的原位反應而得到。 作為形成熱穩定化合物的一個優選方法,優選選擇具有 較大R基的配位基’例如具有C3_4烷基、芳基或帶有氮原 子的環基的配位基。這些大基團能夠在反應期間防止聚合 . 物類物質的形成。另一方面存在競爭問題,亦即連接到矽 原子上的R基應當盡可能地小,以降低所得有機金屬化合 物的分子量並使得所得錯合物具有較高蒸氣壓。連到氮原 • 子上的優選取代基為異丙基、第二丁基和第三丁基,並且 甲基和曱氧基為優選的連接到矽原子上的取代基。 多種溶劑可用於該反應。由於金屬鹵化物在反應介質中 有較低的溶解度,建議使用極性溶劑,例如四氫吱喃 , (THF )。所得錯合物通常高度溶於烴類溶劑,例如己烷 中。因此,通過除去反應溶劑、使用己烷萃取和過濾,易 於從反應混合物中分離所得錯合物。 以下實施例說明N,N,·烷基-1,1·烷基甲矽烷基胺基金屬 錯合物的製僙及其在薄膜沈積過程中作為前驅物的應用。 9 1312375 實施例1 雙(N,N,<(第三丁基w小二曱基曱矽烷基胺基)姑⑼ 的合成 將15克(〇.116摩爾)無水(:〇(;:12加入到裝有1〇〇毫升 THF的1升Schlenk燒瓶中。向該燒瓶中加入
MhSKLiNButKHNBut),其通過 Me2Si(HNBut)2 ( 49 5 克, 0.245摩爾)與2.5M LiBun己燒溶液(%毫升,〇 μ摩爾) 在200毫升己烷中的反應原位製備。將混合物在室溫下攪 拌過夜。反應完全後,真空除去所有揮發物,並使用己烷 混合物(200毫升)萃取反應所得黑色固體。將己烷萃取 物通過具有砂藻土墊的玻璃燒結物過濾得到深藍色溶 液。將該溶液濃縮至約50毫升並保持在_4〇χ:,得到黑色 b曰體收集得到20克晶體並在真空乾燥。通過將母液濃縮 至約1 〇毫升,另外得到5克黑色晶體。
基於鈷的收率為84%。對於c^H^CoNji2的分析計算 值:Co’ 12.76; C’ 52.02; N’ 12 13 ; H,1〇 %。測定值:
Co,13_20 ; C,49.52 ; N,11.44 ; Η,9.72。 通過X射線單晶分析對深藍色晶體雙(Ν,Ν,_:(第三丁 基)-1,1-二甲基曱矽烷基胺基)鈷(11)進行結構特徵化。如下 結構表明:鈷在扭曲的四面體環境中被兩個Ν,Ν,_二(第三 丁基)-1,1-二甲基甲矽烧基胺基配位基配位。平均Co-N趣 離為 2.006 A。 1312375 C(5)
甲基甲矽烷基胺 以上表示雙(N,N'_二(第三丁基)_ι,κ 基)钻(II)的晶體結構。 原子的數量由X射線單晶結構分析確定 實施例2 • 雙(Ν,Ν’_二(第三丁基)-Μ_二甲基曱矽烷基胺基)鎳(11) 的合成 除了使用NiCh代替CoCl2外,重複實施例1的過程。 將10克(0.077摩爾)無水NiCl2加入到裝有8〇毫升THF 的1升Schlenk燒瓶中。向該燒瓶中加入 MedKUNButXHNBut),其通過 MeaSiCHNBu% ( 32.0 克, 0.154摩爾)與2·5Μ LiBun己烷溶液(61.6毫升,0.154摩 爾)在200毫升己烷中的反應原位製備。將混合物在室溫 下攪拌過夜。 11 1312375 然後真空除去所有揮發物,並使用己烷(2〇〇毫升)s 取所得黑色固體。通過具有矽藻土墊的玻璃燒結物過捷★ 烷萃取物,得到深綠色溶液。將溶液濃縮至約5〇毫升教 持在_40 C,得到黑色晶體。收集得到25克晶體並在真二 乾燥。基於錄的收率為7〇%。 一 < 通過X射線單晶分析對深綠色晶體雙(N,N,-二(第= 基)1,1 — f基甲石夕燒基胺基)錄(η)進行结構特徵化。如 •結構表明:鎳在扭曲的四面體環境中被兩個Ν,Ν,-二(第^ 丁基)1 ’ 1 一曱基曱石夕烧基胺基配位基配位。平均距 離為2.005 A。雙(N,N,<(第三丁基)“山二甲基甲矽烷基 私:基)鎳(II)的結構如下表示:
通過X射線單晶結構分析獲得的雙(N,N,_二(第三丁 基)-1,1-二甲基甲矽烷基胺基)鎳(11)的晶體結構 12 1312375 實施例3 雙(N,N,·二(第三丁基二曱基曱矽烷基胺基)鐵(I1) 的合成 除了使用FeCl2代替c〇Cl2外,重複實施例1的過程。 將10克(0.079摩爾)無水peCl2加入到裝有5〇亳升THF 的1升Schlenk燒瓶中。向該燒瓶中加入 鲁 Me2Sl(LlNBut)(HNBut),其通過 MejUHNButh ( 32.0 克, 0.158摩爾)與2.5M LiBu11己烷溶液(63.1毫升,0.158摩 爾)在200毫升己烷中的反應原位製備。將混合物在室溫 下攪拌過夜。然後真空除去所有揮發物,並使用己烷(2〇〇 • *升)萃取所得黑色固體。通過具有矽藻土墊的玻璃燒結 物過濾己烷萃取物,得到紫色溶液。將溶液濃縮至約5〇毫 升並保持在-40°C ’得到黑色晶體。收集得到1 6克晶體並 在真空乾燥。基於鐵的收率為44%。對於 •的分析計算值:Fe,12.18; C,52.3 7; N,12.22; Η,HK99。 測定值:Fe,11.81 ; C,52.37 ; Ν,11.29 ; Η,9.21。 通蟑X射線單晶分析對紫色晶體雙(Ν,Νι_二(第三丁 基)-1,1·二曱基甲矽烷基胺基)鎳(11)進行結構特徵化。如下 • 結構表明:鐵在扭曲的四面體環境中被兩個Ν,Ν,_:(第三 丁基)-1,1- 一曱基曱石夕烧基胺基配位基配位。平均Fe_N距 離為 2.048 A。 13 1312375
通過X射線單晶結構分析獲得的雙(N,N’_二(第三 基)-1,1_二甲基甲矽烷基胺基)鐵(II)的晶體結構 實施例4 • 雙(Ν,Ν'-·^(異丙基l·1,1·二甲基曱矽烷基胺基)钻(II)的 合成 將5克(〇.〇385摩爾)無水C〇Cl2加入到裝有5〇毫升 THF的5GG毫升Sehlenk燒版中。向該燒瓶中加入 ,Me2Si(LiNBut)(HNBuV 其通過 Me2Si(HNBut)2 ( 14 2 克, 請15摩爾)與2.說㈣己燒溶液(32.6毫升,〇〇815 摩爾)在100¾升己烧中的反應原 溫下攪拌過夜。然後真空除去所有揮 。將混合物在至 毫升)萃取反應所得黑色固體#==並使用^ 通過具有矽藻土墊的玻璃 14 1312375 燒結物過慮己院萃取物’得到深藍色溶液。將溶液濃縮至 約10毫升並保持在-40°C,得到黑色晶體。收集得到1〇克 晶體並在真空乾燥。基於鈷的4率為64%。 實施例5 雙(N,N’_二(第三丁基)-1,1_二甲基甲矽烷基胺基)鈷(π)
的CVD ^ 在此實施例中,將雙(N,N,-二(第三丁基^,丨-二甲基甲 矽烷基胺基)鈷(II)用作形成薄膜的有機金屬前驅物,在常 規CVD設備中使用已知CVD技術在矽基材上形成金屬矽 化物膜。 „ 在此實施例中’在鼓泡器中在90°C蒸發雙(Ν,Ν'-二(第 三丁基)-1,1-二甲基甲矽烷基胺基)鈷(11),並與1〇〇 sccmN2 載氣一起進入CVD室。CVD室為具有加熱的基材支架的冷 壁體系。基材保持在400°C,沈積室壓力保持在1托。所 φ 得薄膜的EDX分析表明,薄膜中含有鈷。 由說明書和實施例可知,在用於製造固態電晶體、電 容、通用介面適配器和電路的電子器件中,通式 的ν,Ν'-烧基-1,1-烷基曱矽烷基 . 胺基金屬錯合物可用於在基材上形成金屬或准金屬氧化 物,包括在銅和擴散壁壘(例如TaN、TiN、WN、TaSiN、 WSiN)之間形成膠合層。ν,ν1-烷基-1,1-烷基甲矽烷基胺基 金屬錯合物可以與還原劑接觸,或不與還原劑接觸(還原 劑亦即氫氣、肼、單烷基肼、二烷基肼、氨以及其混合物)。 15 、1312375 含氧反應物可根據需要被加入到沈積室中,氧化劑的實例 包括水、〇2、H202和臭氧。僅僅由於ALD方法的自約束性 質,與CVD法相比,優選使用ALD法來沈積Ν,Ν·-烷基-1,1-烷基甲矽烷基胺基金屬錯合物。通過ALD形成的薄膜能夠 生成45納米及以下的薄膜。
Claims (1)
1312375 '"****···· —·γγτιμ·Λιγ·Τ* 十、申請專利範圍: 1 . 一種以下列結構表示的有機金屬錯合物,
其中Μ為選自vilb、VIII、IX和X族所組成的群組的金屬, 並且R1·5可相同或不同並選自氫、烷基、烷氧基、I代烷 基、氟代烷氧基、脂環族基和芳基所組成的群組。 2’如申請專利範圍第1項所述的有機金屬錯合物,其 中Μ選自鈷、鐵、鎳、錳、釕、鋅、銅、鈀、鉑、銀、銖 和锇所組成的群組。 3. 如申請專利範圍第2項所述的有機金屬錯合物,其 中Rl 5選自氫和烷基所組成的群組。 4. 如申請專利範圍第1項所述的有機金屬錯合物,其 具有化學名稱雙甘、 笑1 ,N •一(第二丁基)-M-二曱基曱矽烷基 胺基)銘(II)。 如申π專利範圍s i項所述的有機金屬錯合物,其 具有化學名稱雙- - 、,以_一(第二丁基)-1,1-二曱基甲矽饶基 17 1312375 胺基)鐵(π)。 6·如申請專利範圍第1項所述的有機金屬錯合物,其 具有化學名稱雙(N,N,-二(第三丁基)4,1:曱基曱矽烷基 胺基)鎳(II)。 7.—種用於在基材上形成保形金屬或金屬氧化物薄膜 擊的此積方法其中將有機金屬前驅物加入到沈積室、蒸發 並且沈積在基材上,其改進包括使用申請專利範圍第t項 中所述的有機金屬錯合物作為所述的有機金屬前驅物。 8 ·如中請專利範圍第7項中所述的沈積方法,其中該 . 沈積方法為化學氣相沈積法。 9申明專利範圍帛7項中所述的沈積方法,其中該 籲 沈積方法為原子層沈積法。 1〇.如申請專利範圍第7項中所述的沈積方法,其中該 有機金屬錯合物由下式表示. 1312375 /、2中M為選自鐵、鎳、鈷和銅所組成的群組的金屬,R1和 彼此獨立地表示甲基或甲氧基,並且R3、R4和R5彼此 獨立地選自異丙基、第二丁基和第三丁基所組成的群組。 1如申清專利範圍第7項所述的沈積方法其中在引 所述有機金屬前驅物後’向沈積室中加入還原劑以產生 金屬薄膜。 如申β專利範圍第Π項所述的方法,其中所述還 原劑選自氮氣、胁 1§ .l·1» i HU L孔骄早说基肼、二烷基肼、氨以及其混合 物所組成的群組。 13 ·如申請專利範圍第12 if斛、+、& ‘ 1 ^ ^ 、、 項所述的方法,其中所述沈 積方法為化學氣相沈積法。 ·如申請專利範圍第12 積方法為原子層沈積法。 項所述的方法,其中所述沈 1 5 .如申請專利範圍第7 人項宁所述的沈積方法,其中將 3軋反應物引入到沈積室中 膜。 1備金屬氧化物薄 16 .如申請專利範圍第15 ^ „ 巧所述的方法,其中該含氧 成的群組 反應物選自水、〇2、Η2〇2和臭氧所組 19 <1312375 17· —種形成具有以下結構的有機金屬錯合物的方法
其包括:將通式MX2的金屬鹵化物與兩當量的通式為 R^R^SiCLiNR^NR^R5)的甲矽烷基化合物反應,其中“為 選自Vllb、VIII、IX和X族所組成的群組的金屬,χ為以 或Br,並且Ri·5可相同或不同並選自氫、烷基、烷氧基、 氟代烷基和烷氧基、脂環族基和芳基所組成的群組。 18. 如申請專利範圍第17項所述的方法,其中M為選 自鐵、鎳、鈷和銅所組成的群組的金屬。 19. 如申請專利範圍第18項所述的方法,其中…和 R2為甲基或甲氧基’並且…^和…選自異丙基^二 丁基和第三丁基所組成的群組。 20 ·如申請專利範圍第i 5項所述的方法,其中可以通 過還原劑將所得的金屬氧化物薄膜還原成金 原劑選自:氯氣、,、單院基骄、二燒基脾、氨以及其: 合物所組成的群组。 20
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US9051641B2 (en) * | 2001-07-25 | 2015-06-09 | Applied Materials, Inc. | Cobalt deposition on barrier surfaces |
US20070281476A1 (en) * | 2006-06-02 | 2007-12-06 | Lavoie Adrien R | Methods for forming thin copper films and structures formed thereby |
WO2008142653A2 (en) * | 2007-05-21 | 2008-11-27 | L'air Liquide-Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | New cobalt precursors for semiconductor applications |
JP2009016782A (ja) * | 2007-06-04 | 2009-01-22 | Tokyo Electron Ltd | 成膜方法及び成膜装置 |
KR100892573B1 (ko) * | 2007-10-08 | 2009-04-10 | 한국화학연구원 | 신규의 망간 아미노알콕사이드 화합물 및 그 제조 방법 |
EP2462148A1 (en) * | 2009-08-07 | 2012-06-13 | Sigma-Aldrich Co. LLC | High molecular weight alkyl-allyl cobalttricarbonyl complexes and use thereof for preparing dielectric thin films |
TW201124552A (en) * | 2009-09-02 | 2011-07-16 | Ulvac Inc | Method for forming co film |
JP2011066060A (ja) * | 2009-09-15 | 2011-03-31 | Tokyo Electron Ltd | 金属シリサイド膜の形成方法 |
US8632853B2 (en) | 2010-10-29 | 2014-01-21 | Applied Materials, Inc. | Use of nitrogen-containing ligands in atomic layer deposition methods |
US8952355B2 (en) * | 2011-09-29 | 2015-02-10 | Intel Corporation | Electropositive metal containing layers for semiconductor applications |
JP5842687B2 (ja) * | 2012-03-15 | 2016-01-13 | 宇部興産株式会社 | コバルト膜形成用原料及び当該原料を用いたコバルト含有薄膜の製造方法 |
WO2014118747A1 (en) * | 2013-01-31 | 2014-08-07 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Cobalt-containing compounds, their synthesis, and use in cobalt-containing film deposition |
KR102181249B1 (ko) * | 2013-01-31 | 2020-11-20 | 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 | 코발트-함유 화합물, 이의 합성, 및 코발트-함유 필름 침착에서의 용도 |
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US10329057B2 (en) | 2015-11-11 | 2019-06-25 | Oculus Design LLC | Spill resistant cup lid |
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US5603988A (en) * | 1995-06-02 | 1997-02-18 | Morton International, Inc. | Method for depositing a titanium or tantalum nitride or nitride silicide |
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