TWI308470B - Substrate structure having high dielectric compound material and fabrication method thereof - Google Patents

Description

1308470 *. • Nine, invention description: [Technical field to which the invention pertains] The present invention relates to a substrate structure of the same type and right ancient & ,, and the structure of the substrate of the dielectric composite material [Prior Art]

π fn ° on the US board continues to pursue high-speed and high-performance, so that the electronic components must be added to the substrate to meet the needs of various electronic industries. = The development of sexual composite materials is mainly the current high dielectric powder 2:: Γ " structure of the main, such as this patent _ Λ, Li Di 2001-181027 'US patent:: public: (1). __ and other patent documents are all (4) like J: not = because the high dielectric phase between the electrodes is not continuous, but there is equivalent dielectric constant •• variability and uneven distribution due to dielectric properties at different locations - Step to increase the dielectric constant, which can be achieved by mentioning the number, for example, this patent No. 18, the national first position bribe, the US patent 65th lst, the day; the opening 2〇〇 4 21 0941, and The patent document "Epi Patent No. Epi6694i2" is bonded to a polymer comprising a cross-linking of a high-dielectric particle component to bond the two dielectric powders into the organic molecular chain. However, such organic materials that are still dielectric, not only costly, but also the inorganic rubber, 110018 5 1308470 injury caused the loss of the original organic material adhesion and softness. On the other hand, the patent documents of U.S. Patent No. 6,039,920, U.S. Patent No. 2005,256,240, and International Patent Publication No. WO2004034409 disclose the control of the size of the dielectric phase to be close to the polymer size to enhance high mixing. The dielectric constant is still. However, nano-sized powders or crystal phases are not easy to handle and the material cost is relatively high.

Furthermore, the interfacial polarization phenomenon generated by the conductive component during the application of the electric field causes the movable charge to be blocked by the interface or detained by the material, and also provides another enhancement to the Taman - The way of dielectric constant of polymer composites. For example, Japanese Patent No. discloses that an electrical component county is coated on a dielectric surface, and Chinese A-Patent No. (10) 432598 discloses the addition of nanocarbon ^ _, No. 6,956,971 'US Patent No. 20_8510. Conductive particles do not add to the surface of the shell, which makes it unfavorable. In addition, the addition of conductive particles can improve the dielectric loss. Moreover, the concept of Japanese patents is not easy, so that the problem of resistance to electric ink remains. The ceramic fiber s / 2GG1 - 313445 reveals that it is a high- dielectric material that lacks high dielectric properties to obtain high dielectric properties. The bismuth fiber cloth will cause the composite material to be non-soft. The high dielectric composite material of the pre-formed fired phase is conventionally ordered and infused with an organic dual tool to regularly align it to a dielectric constant relative to south. However, the rule 110018 6 1308470 * · Arrangement makes large-area production difficult, and the pre-sintered ceramic fiber is expensive to manufacture and difficult to control in size, and the use of ceramic fiber makes the composite material not soft 2, so that the composite material only In the laboratory production stage. There is also a template method for making composites of 1-3 structure, which uses anodized alumina (ΑΑ0) or heavy ion impacted polycarbonate (pc) as a template, but these templates are expensive and cannot be large. Area manufacturing reduces the chances of applying high dielectric properties.

In order to increase the electronic assembly density and increase the electrical performance, an important method of combining a high dielectric composite material with a circuit board to produce a built-in capacitor (embedded^apaci tor) has been developed. At present, the method of the built-in capacitor can be mainly classified into two types - a printed circuit board process using a high dielectric composite material, for example, the first patent of the patent - No. 321462, the US patent No. 6068878, the US patent No. 61 91934, U.S. Patent No. 69,671, 38, Japanese Patent No. 2004-207747, Japanese Patent No. 2, No. 5-1919, and International Patent Publication No. WO9941 No. 01, for the use of thinner dielectrics The layer, the use of a multilayer structure, the increase of the dielectric layer electrode area or the bonding of the PCB process. In addition, it is a process technology using a thin film high dielectric layer, for example, Japanese Patent No. 42-69859, U.S. Patent No. 536255, U.S. Patent No. 6,751,822, U.S. Patent No. 2,614,347, U.S. Patent No. 200501 1857, etc. Patent literature. However, the above-mentioned patents relating to built-in capacitors emphasize the structure in which a specific capacitor element is formed. There is no particular limitation on increasing the dielectric constant of the capacitor layer. ^ In addition, Japanese Patent No. 2002-270780 combines a composite material and a thin film method to '0- 3 high dielectric composite material by grinding and thinning to make the total thickness of 110018 7 1308470 • · - the film thickness is less than High dielectric powder and number and capacitance, but micro-level polishing process '〉 can get high dielectric often ~ ® this 'how to low dielectric loss:: mention: its practicality is not high. The dielectric constant, and at the same time, has a low level:, 'improving the dielectric composite material. The current research in the electronic assembly industry: the production area, etc., is the subject of research and development.

The purpose of this X month is to provide a substrate structure having a composite material and a method of making the same. , ,,. Between the structures; the electrical property provided by the present invention has a high dielectric material including a copper box conductive layer; a dielectric layer, a soil anti-ji structure, and a material composition; f 1-3 a material and an insulating organic material ^ , 3,, " The dielectric composite material; and the guide spot

曰 ' is used to bond the conductive layer of steel foil to the mesh fabric made of J dimension as a template, which will contain 曰 = = listen to the use of fiber 埴 此 此 此 巧 巧 巧 槪 有 有 有Material, open ^ and ^ in the 'burning to remove the template and then infused with insulating organic material II, the high dielectric composite material, and then use the conductive adhesive to bond the copper foil to the ancient +w, - to t The use of the composite material is (4) 高 The high dielectric material in the substrate is a mesh woven fabric filled with a high dielectric plate, and a large-area mold can be produced at a low cost to adjust the proportion of the hole of the template. With the size of the hole, changing the dielectric constant t improves the uniformity of the distribution of the dielectric material and reduces the dielectric loss. In addition, the conductive adhesive is used to improve the copper-conducting layer and the high-dielectric composite material. Peeling force. = Ming also provides a method for manufacturing a substrate with a high dielectric composite material: a mesh braid made of fiber is used as a template, and in the hole 110018 8 !3 〇 8470 = 3 = dielectric material After the fiber template is removed by firing, a high dielectric composite material of the second structure is coated on the surface of the composite material, and the high dielectric composite material is bonded to the high dielectric composite material and subjected to hot rolling to make the copper crucible [embodiment] Show: Figure: The substrate structure of the present invention having a high dielectric composite material. As shown, the substrate junction of the present invention

; electrical layer 11. The dielectric layer 130 and the conductive adhesive layer 150 for transferring the copper material to the dielectric layer 130. Dielectric layer 130; ancient eight upper:: two absolutely: organic material 133 consists of; :=: fabric as a slab structure ' is made of fiber mesh woven team 4 filled with holes containing high dielectric materials Feed the oblique *', ., dimension; / The invention is used to make the high-conformity quot; η "2 figure is not the original space of the space ^ ι / only the fiber woven fabric is the shape % fiber part is formed with:: two!:; two: 31 The position 'and the n〇 in the template, . _ _ has two connections of insulating organic material * take ', $ into a high dielectric composite material with a structure of 3 (10), by changing the fiber braid The electrical conductivity of the hole is filled by AA丄ANH „周整高的介介币,商"electric material ratio. In the high dielectric composite material, the proportion of the thumb electrical material can increase the entanglement of the composite material: less increase:: r (four) two; two, knot -, borrow ===== thick to slow down the increase The high dielectric content of the material Π0018 1308470 « t, the effect of peeling force. In one embodiment, the high dielectric material comprises from 10 to 90% of the high dielectric composite, preferably from 75% of the high dielectric charge. ^ Further, by changing the hole size of the fiber braid template, the individual dimensions of the high dielectric material formed in the composite material can also be adjusted, further 碉敕^

The softness and flexibility of the composite material. On the other hand, for the special LI, we design a fiber braid template with different hole sizes to form a tool.

The composite material of the electric material can be produced at a specific position... ‘Two Λσ is used for the built-in capacitive element of the Κβ multilayer board. However, force::: When it is too large, the area that does not produce the bonding force with the copper swell - 2 will also cause the stripping force to produce unstable discontinuities: In the dielectric composite material, the high dielectric material is arrested. good. The inch system is not more than 150 micrometers. Compared with the substrate structure t of the present invention, it can have a high dielectric constant such as 'dielectric constant higher than 105' and a spontaneous electric pole (electrical raaterial) as the high level of the eight-year ferroelectric material. Dielectric material.于—W; 丨 “Perovski te) oxide Tao Jing bow, Taiqi phase material. In addition, Titanium 兮 ancient + 々 丨 丨 丨 丨 丨 丨 丨 丨 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十There is no specific limitation on the insulating organic sub-electricity in the electrical composite material, and it is generally used for the production of the dielectric motor Lu. In this specific example, the organic materials of the bismuth, the ba, the ho, can be used as the insulating organic material. Barrier resin, such as insulating epoxy tree, in the substrate structure of the present invention, the germanium layer is bonded to the high dielectric property, and the layer is electrically conductively bonded to the dielectric layer. In the specific example, 110018 10 1308470 4 * 2 Resin-pointing agent with conductive metal powder Example of 琶 metal powder includes, but Μ ¥电粘层. The powder. In this specific real money, material, in silver metal powder Or a conductive metal powder of copper or more;: = lanthanide containing 5 (four) layer in addition to improving the high dielectric property (4) the conductive adhesive force, and is also used to enhance the high dielectric composite material ;=Electric layer is suitable for multi-layer PCB "process. The level of the electrical layer, special

The method for producing a substrate having a high dielectric property is made of a mesh woven fabric made of a fiber, for example, a fiber woven fabric as a template. As shown in Fig. 3, the fiber = the same = fat fiber braid (the first weave (the first megagram). For the early heart, the fourth figure shows the steps of the present invention. For example, the fabric shown in the figure First, the pre-oxidation treatment of 2 to 3, c, and then ==: The reticular fiber woven fabric is attached to the flat ceramic or the glass substrate 2〇广 as the fiber braid template 2〇3. Then, as in the servant and the stencil, _ 2G5 containing a high dielectric material is filled in the hole of the braid template, and after firing to remove the fiber template, a high dielectric wire 2 〇 5 is formed. In Fig. 4d, the "permanent grease 2 () 7 system is infused into the hole formed by the wire-forming template, and has a high dielectric property of the structure of the structure. As shown in Fig. 4e, After the substrate 2〇1 is applied, a conductive adhesive is applied to the surface of the high dielectric composite material 210, and hot rolling is performed to obtain a high dielectric property of copper. 2 〇 〇 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 Π Π Π Π Π Π Π Π Π Π Π Π Π Π Π Π Π Π Π The hole ratio and the hole size of the template form a high dielectric composite material with a number of materials: 1 and 1 electric material, thereby adjusting the dielectric uniformity of the dielectric distribution: using a conductive adhesive to enhance the copper drop Disc: Eight "Beibei" and further layer peeling force. 幵"^¥Electrical layer and South dielectric composite material dielectric method of the present invention, the use of

Example and hole size, direct m隹, 4 fabric template hole ratio and rule two: material storage of her slurry fiber only to fill with high dielectric material with 35 to 7, = fruit board It has a pore size of 1〇 to 9〇%, and a hole of 75% to 75%. Another ancient product recognizes that the size of the high dielectric material is too large, resulting in the :::: dimension in the _ force production material: the hole size of the fabric template is the residue of the ttr release hole when the doubling is used, and the resin can be controlled by Irrigation density = viscosity, and the use of vacuum pumping to improve resin infusion, etc.:: The method can use high dielectric constants and spontaneously polarized dielectric composite materials in high dielectric materials)乍为 &(perov<,kit λ ^ early 使用 uses an oxide with a perovskite phase = (4) klte) as a high dielectric constant ferroelectric material, and using an insulating resin as the insulating organic material::: ...the resin adhesive of conductive metal powder, which will be: 2 = dielectric layer. In a specific example, the resin has a conductivity of 50 to 90% by weight, and the current is φν μ / 〇 is equivalent to a powder. Preferably, the resin 110018 12 ^08470

I belongs to 60 to 85% by weight of conductive metal powder. Examples of the conductive gold-limb include silver metal powder or copper metal powder. The specifics of the invention are described in detail by the specific embodiments of the invention, but are not intended to limit the scope of the invention. General case

Under the condition, 44% of the reticular fiber braid was used as a template at 250V. _ __ from ^ Γ f powder, 〇.5% _ dispersant, 2% polyethylene butoxide: dywnyl Butyrai, PVB), and 17 5% (such as coffee ylketcme, ancestors) Difficult = template hole for the woven fabric. At a temperature of δ(10) : = = = = from a Md—:) Irrigation Structure::: The hole left behind is made of 1-3 ^...丨$ as a dielectric layer. The surface of the composite material is coated with a conductive-til1' to be subjected to hot calendering bonding (4) and the high dielectric composite material. Measure the peel strength between (4) the dielectric layer and (4), and record the result in iMMJ. Repeat the steps in Example 1 to find the hole of the woven fabric template. Change to 65%. The high dielectric composite dielectric peel strength was measured, and the results were recorded in Table i. ",,, 5 pairs of berths - M example 1 Repeat the steps of Example 1, using only epoxy resin (speaking from Union 110018 13 1308470 - ,

Carbide, ERL4221E) acts as a dielectric layer. The peel strength was recorded and the results were recorded. Between the inner layer and the copper box ASJL2. The procedure of Example 1 was repeated, and only the monthly μμ兖 was used as the dielectric layer. Measuring the oxide ceramics of the dielectric layer disk phase, the results are recorded in the peel strength between the tables'

The procedure of Example 1 was repeated, using only Carbide' ERL 4221E) as the dielectric sound day (10) from Uni〇n = the agent. The strength between the high dielectric composite dielectric layer and the copper box was measured, and the results were recorded in Table 1. ^ & 重复 The procedure of Example 1 was repeated to directly measure the high dielectric composite dielectric layer and steel; the results are reported in Table 1. 』 雕 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The oxide pottery says “layer” and replaces the conductive adhesive with direct compression. The remaining amount is recorded as the peel strength between the dielectric layer and the copper slab and the result is recorded 0018 14 1308470 Table 1 Comparative Example 1 Miscellaneous 1 Huan & ί column 2 Comparative Example 2 Example 1 _ Example 2 Financial Example 3 _ Example A Proportion of Tai ore phase Wei like ceramic (%) 0 44 65 100 0 44 65 100 Peel strength (lb) 5.2 4.75 4.25 4.0 5.5 4.2 3 0 The results of Table 1 are shown in Figure 5. According to Figure 5, the high dielectric material can be improved by the conductive adhesive layer. 'Reducing the effect of increasing the high dielectric material content on reducing the strength. Example 曰 Repeat the procedure of Example 1 to change the pore ratio of the reticular fiber braid template to 3 G%. Measure the dielectric strength and dielectric loss, The results are reported in Table 2. Repeat the procedure of Example 1 to change the hole of the reticular fiber braid template: 45 %. Dielectric strength and dielectric loss were measured, and the results are reported in Table 2.

Apply L, the hole strength and dielectric loss of the reticular fiber braid template, and change the result to repeat the step ratio of Example 1 to 55%. The measurement dielectric is shown in Table 2. X Shi You 110018 15 1308470 Heavy Ue Example 1 step, the hole proportion of the reticular fiber braid template is changed to 70%. The dielectric constant and dielectric loss were measured and the results were recorded in Table 2. Table 2 Example 1 3 Example 4 Example 5 Example 6 Ratio of oxide ceramics with matte phase (%) 30 45 55 70 590 670 910 1250 Dielectric loss 7 7.5 6.9 6 The results of Table 2, Shown in Figure 6. According to Fig. 6, the composite material obtained by the template for increasing the ratio of the holes is shown, because the ceramics are produced in comparison with the high case, and the ruthenium (solid line part). The Tauman phase occupies an area of more than Η%, and the composite material has a dielectric f-number of 1 GGG or more, which is about 45% of the original (4) material of the ceramic (4). The dielectric loss increases with the composition of the high dielectric material, increasing 'to the highest value at a content ratio of about 5Q%, and then decreasing with the increase of the composition of Lu Taowan (dashed line). f施合丨f 7

Using a 7-shaped fiber braid having a hole ratio of 44% and a single hole area of 丨5 μm square, pre-oxidized at 25 (rc) as a mold = 8〇% oxide ceramic powder having a perovskite phase, 0.5% of D-16 JJ 2% polyvinyl butyral (pVB), ' =1 7. Methyl ethyl ketone (MEK) was prepared into a polymer, and the slurry was prepared. Fill the template hole of the fiber braid. Sintering at 110018 16 1308470 * » at 810 ° C for 1 ,, ii . Γ 丹 Dane resin (purchased from

Um〇nCarblde, ERL4221E) is perforated to remove the pores left by the target, and is made of 丨3 & M fiber, and the rear plate has d3 and 纟. The structure of the dielectric composite material is layered. A conductive adhesive is applied to the surface of the composite material, and a hot calender is applied: and the high dielectric composite material. The measured dielectric constant - poise is recorded in Table 3. /, η knows the loss, and the result of the example 8

The procedure of Example 7 was repeated to change the single hole area of the reticular fiber braid template to the square micrometer square. The results of measuring the peel strength between the high dielectric and the copper box and the dielectric constant and dielectric loss::: are shown in Table 3. Electrical phase loss 'Asian junction' Example 9 The procedure of Example 7 was repeated to change the area of the woven fiber woven hole to 25 〇〇 micrometer square, the early layer of the plate, the peel strength between the layer and the copper drop, and the dielectric property. The composite dielectric results are reported in Table 3. The number and dielectric loss, and f example = the steps of the seventh embodiment, the mesh fiber woven hole area was changed to 6000 micron square. Measure the ancient people, the early - of the board - the peel strength between the copper box, and the dielectric: two = dielectric results are shown in Table 3. Sigh /,; loss of electricity, and

Implement your M I repeating the steps of Example 7 to change the area of the hole and the door area of the machine fiber braid template to 1325G micron square. People +, early ~ in the board. Λ 丨 丨 丨 丨 丨 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 Loss and will

IkAi column 5 The procedure of Example 8 was repeated for direct dusting. The high dielectric composite dielectric layer was measured with copper; 2 conductive dots were measured and the results are reported in Table 3. Separation strength, and feAjj 6

Repeat the step 9 of Example 9 to directly compress the human agent. The measurement of the ancient poetry into the w1 by & σ instead of coating the conductive adhesive, the middle of the "encapsulated coffin dielectric layer and copper foil will be recorded in the results of Table 3." (four) strength 'sub-repetition of the steps of Example 10 The direct contact between the dielectric layer and the copper crucible was measured by direct press-in and demon 7 soil. The peel strength between the high dielectric composite dielectric layer and the copper crucible was measured, and the results are reported in Table 3. &MM 8 % The procedure of Example 11 was repeated to directly coat the conductive adhesive. The peel strength between the high dielectric composite dielectric layer and the copper foil was measured, and the results are reported in Table 3. Table 3 15 800 2500 Early one hole area 5.2 763 5.1 764

4.55 Miscellaneous 10 11 tb$ 交例 th|Crossing example 6 tb|Case 8 6000 4.8 766 13250 4.7 4.65 800 4.85 2500 6000 13250 4.7 4.4 4.1 18 110018 1308470 • *. The results of Table 3 are shown in section 7. Figure and Figure 8. According to Figure 7, the effect of increasing the area of a single hole on the strength can be mitigated by a conductive adhesive using a fiber braid template with the same hole ratio = stop. Fig. 8 shows that the method of the present invention uses a fiber braid template of the same hole type to increase the single hole area to increase the dielectric constant (solid line portion) while reducing the dielectric loss (dashed line portion).

The above examples are merely illustrative of the principles and pots of the invention and are not intended to limit the invention. Anyone who is familiar with the art > The spirit and scope of the invention is reversed 耵m 耵The above-mentioned only examples are modified and falsified. Therefore, the scope of the protection of the present invention is listed. The illustration of the substrate structure of the present invention having a high dielectric composite material is shown in the drawings. FIG. 2 is a plan view showing the electrical composite material of the substrate of the present invention. "% layer" " Fig. 3a is a submicrograph of the method of the present invention; an electric 3b image of the early braid template is a p submicrograph of the method of the present invention; 4a to 4e are steps showing the substrate of the material; X/clothing has a high dielectric property. The fifth figure shows the ratio of the high dielectric material of the present invention and the ancient medium, and the substrate structure of the electroceramic composite material, copper The relationship between the peeling strength and the peeling strength of the composite material 110018 19 1308470 « system; the middle 6th high-mapping system shows the ratio of the dielectric material of the substrate having the high dielectric composite material to the dielectric constant and the dielectric loss turn off

Figure 7 is a graph showing the relationship between the area of the substrate structure/tantalum dielectric material having a high dielectric composite material and the peel strength between the copper foil and the composite material, and the Fig. 8 shows that the present invention has high dielectric properties. The relationship between the dielectric constant of the south dielectric material and the dielectric loss in the substrate structure of the composite material. [Main component symbol description] 101 substrate structure 110 copper beryllium conductive layer 130 dielectric layer 130' high dielectric composite material 131 high dielectric material 133 insulating organic material 150 conductive adhesive layer 201 substrate 203 fiber braid template, 205' Slurry with high dielectric material 205 high dielectric wire 207 Insulation resin 210 high dielectric composite material 220 steel foil 110018 20

Claims (1)

^08470 十见49399 Patent application test ~^ΡΤ7Τ3Γ: •2. 4. 5. 6. 8. Shenjing Patent Fanyuan: 1 heavy-duty composite copper box conductive layer; The electric layer consists of a dielectric material and a three-degree electrical composite material that are connected to each other by a space of a girl's milk; and a wind/page structure. The conductive layer is used to bond the conductive layer of the copper foil to the dielectric. As in the patent application, the first system includes 1〇 to 9()^=H, and the dielectric layer of the king yu/e south dielectric material . For example, in the substrate structure of the item i of the range, the size of the material between the materials is not more than 150 μm. Such as the scope of patent application! The substrate structure of the item, wherein the material is a ferroelectric material. For example, the substrate structure of claim 4 of the patent scope is an oxide ceramic having a perovskite phase. For example, the substrate structure machine material of the first application of the patent scope is a resin. The substrate structure of claim 1, wherein the conductive recording layer is formed of a resin adhesive containing a conductive metal powder. The substrate structure of the seventh aspect, wherein the resin dot sheet 3 has 50 to 90% by weight of the conductive metal powder. The substrate structure of the eighth item of the patent of Shenyue, wherein the conductive metal powder system is selected from the group consisting of silver metal powder or copper metal powder (Τ' I pu - 没丁1月疒日:修(更) Original—'--__ The dielectric layer is high dielectric. Among the ferroelectric materials, the insulation has 110018 (revision) 21 9. 1308470 月ί日修 (more) 正本群_Ι"·ι._ 1 1 __ ...... 1 11 -- A method of manufacturing a substrate having a high dielectric composite material, comprising: using a fiber The mesh braid is used as a template, and the hole is filled with a slurry containing a high dielectric material; after the fiber template is fired and then the insulating organic material is poured, a space-connected high dielectric material and a three-dimensional space are connected. The material is composed of a high dielectric composite material having a bismuth structure; a conductive adhesive is coated on the surface of the composite material; and 11 is bonded to the high dielectric composite material by hot rolling. The method of claim 10, wherein the fiber braid 12 has a hole of 1 to 90%. • As claimed in the patent scope 1 〇 ^ ψ ^ ^ ^, the law, in which the fiber braided ^ W formed by the pull hole of the hole 13. If the size of the name is not more than 150 microns. The system of the third paragraph of the patent of the company is pre-oxidized. , 'The fiber weaves the pre-oxidation>>14. For the method of the patent scope, item 13, 15 Π, under the conditions of 2〇0 to the war:, the high dielectric material. The method of item 10 of the scope is a ferroelectric material. a τ where 'the ferroelectric material, wherein the insulating organic 6. The method of claim 15 is an oxide ceramic having a perovskite phase. 7. The method of applying for patent scope 10 is a resin. Wherein, the conductive adhesive 110018 (revision) 1 δ. The method of claim 10 of the patent scope 22 1308470 The agent is a resin adhesive containing a conductive metal powder. The method of claim 18, wherein the resin adhesive contains 50 to 90% by weight of the conductive metal powder. 20. The method of claim 19, wherein the conductive metal powder system is selected from the group consisting of silver metal powder or copper metal powder. 23 110018 (revised edition)