TWI307128B - - Google Patents

Download PDF

Info

Publication number
TWI307128B
TWI307128B TW95117554A TW95117554A TWI307128B TW I307128 B TWI307128 B TW I307128B TW 95117554 A TW95117554 A TW 95117554A TW 95117554 A TW95117554 A TW 95117554A TW I307128 B TWI307128 B TW I307128B
Authority
TW
Taiwan
Prior art keywords
cover
substrate
metal
wafer
molten
Prior art date
Application number
TW95117554A
Other languages
English (en)
Chinese (zh)
Other versions
TW200744137A (en
Inventor
qing-fu Zou
hong-zhong Li
Original Assignee
qing-fu Zou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by qing-fu Zou filed Critical qing-fu Zou
Priority to TW095117554A priority Critical patent/TW200744137A/zh
Publication of TW200744137A publication Critical patent/TW200744137A/zh
Application granted granted Critical
Publication of TWI307128B publication Critical patent/TWI307128B/zh

Links

Landscapes

  • Micromachines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW095117554A 2006-05-17 2006-05-17 Wafer-level vacuum packaging method TW200744137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095117554A TW200744137A (en) 2006-05-17 2006-05-17 Wafer-level vacuum packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095117554A TW200744137A (en) 2006-05-17 2006-05-17 Wafer-level vacuum packaging method

Publications (2)

Publication Number Publication Date
TW200744137A TW200744137A (en) 2007-12-01
TWI307128B true TWI307128B (ko) 2009-03-01

Family

ID=45071545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117554A TW200744137A (en) 2006-05-17 2006-05-17 Wafer-level vacuum packaging method

Country Status (1)

Country Link
TW (1) TW200744137A (ko)

Also Published As

Publication number Publication date
TW200744137A (en) 2007-12-01

Similar Documents

Publication Publication Date Title
US6479320B1 (en) Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
JP4480939B2 (ja) ガラス系材料からなるフラット基板を構造化する方法
US7981765B2 (en) Substrate bonding with bonding material having rare earth metal
US7015074B2 (en) Vacuum package fabrication of integrated circuit components
RU2536076C2 (ru) Способ соединения, герметичная конструкция, изготовленная данным способом, и система герметичных конструкций
JP2010525558A (ja) 電気的相互接続構造体及びその形成方法
WO2001056921A2 (en) Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
JP2007245339A (ja) マイクロ電子コンポジット特にｍｅｍｓの密閉キャビティ内の被包構造
CN101261932A (zh) 一种低温圆片键合方法
CN101542702A (zh) 基于硅通孔的三维晶圆叠层的键合方法
EP1633480B1 (fr) Procede de collage de substrats micro-structures
TWI545665B (zh) 氣密式晶圓封裝
TWI307128B (ko)
KR101637288B1 (ko) 은 페이스트의 접합 방법
US9718674B2 (en) Thin capping for MEMS devices
JP2012028750A (ja) 少なくとも２つの基板同士を、厚さを較正して結合するための方法
JP6022065B2 (ja) 基板アセンブリ、基板をボンディングする方法および装置
JP6128566B2 (ja) 材料層を互いに接合する方法および生じるデバイス
KR100759826B1 (ko) 열제어 장치 및 열제어 장치의 제조 방법
CN104662649B (zh) 直接键合工艺
JP4964505B2 (ja) 半導体装置およびその製造方法、並びに電子部品
US20100308475A1 (en) Composite of at least two semiconductor substrates and a production method
TW200830515A (en) Method for sealing vias in a substrate
KR100944530B1 (ko) 유리성형을 이용하여 제조한 웨이퍼 범핑용 템플릿 및 그제조 방법
JP2004318136A5 (ko)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees