TWI307128B - - Google Patents

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Publication number
TWI307128B
TWI307128B TW95117554A TW95117554A TWI307128B TW I307128 B TWI307128 B TW I307128B TW 95117554 A TW95117554 A TW 95117554A TW 95117554 A TW95117554 A TW 95117554A TW I307128 B TWI307128 B TW I307128B
Authority
TW
Taiwan
Prior art keywords
cover
substrate
metal
wafer
molten
Prior art date
Application number
TW95117554A
Other languages
English (en)
Chinese (zh)
Other versions
TW200744137A (en
Inventor
qing-fu Zou
hong-zhong Li
Original Assignee
qing-fu Zou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by qing-fu Zou filed Critical qing-fu Zou
Priority to TW095117554A priority Critical patent/TW200744137A/zh
Publication of TW200744137A publication Critical patent/TW200744137A/zh
Application granted granted Critical
Publication of TWI307128B publication Critical patent/TWI307128B/zh

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  • Micromachines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW095117554A 2006-05-17 2006-05-17 Wafer-level vacuum packaging method TW200744137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095117554A TW200744137A (en) 2006-05-17 2006-05-17 Wafer-level vacuum packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095117554A TW200744137A (en) 2006-05-17 2006-05-17 Wafer-level vacuum packaging method

Publications (2)

Publication Number Publication Date
TW200744137A TW200744137A (en) 2007-12-01
TWI307128B true TWI307128B (ko) 2009-03-01

Family

ID=45071545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117554A TW200744137A (en) 2006-05-17 2006-05-17 Wafer-level vacuum packaging method

Country Status (1)

Country Link
TW (1) TW200744137A (ko)

Also Published As

Publication number Publication date
TW200744137A (en) 2007-12-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees