TWI306722B - Electroluminescent device - Google Patents

Description

1306722 (1) 发明, description of the invention, (description of the invention should be described: the technical field, prior art, content of the invention, and a brief description of the drawings) The present invention relates to an organic electroluminescent device comprising a transparent substrate, Facing the first side of the transparent substrate and the second side opposite to the first side, the at least one electroluminescent element comprises an organic electroluminescent layer disposed between the transparent substrate and the cover and a transparent substrate and a cover Intermediate sealing member. An organic electroluminescent device is a new type of flat emissive display that can be used in many different applications, such as mobile phones, composers, computers, and other liquid crystal displays currently in use with or without backlights or flat display devices. The device includes a glass plate with one side covered with some optical foil and the other with a plurality of structured thin electrode layers such as transparent tin-doped indium oxide and various metals such as aluminum, tantalum, lithium or other metals. A luminescent polymer is placed between the electrodes. This stack of total thicknesses in the submicron range forms the active portion of the device. Because some of the layers of the stack are sensitive to oxygen or water, the active portion of the device must be sealed to a gas-tight and impervious level with a metal or glass cover or film or thick film layer. Always place an insulating layer on the electrode to prevent short circuit caused by the metal layer. A cover is adhered to the device by an (electrically insulating) adhesive to provide a cavity filled with a desiccant and/or a getter. In order to have a working display, the internal electrodes in the sealed area must be connected to the outside by an electrical conductor. These conductors typically extend over the surface of the glass and pass through a sealing line containing a layer of glue or film. This sealing technique has two major drawbacks: Adhesives such as epoxy, hot melt polymer or other organic components will always be 1306722 (2) The invention sequel will allow a little moisture to diffuse into the device and need to be used in the device. Gas material" (desiccant). A large number of electrodes drawn from the device are placed side by side with each other, and the interconnection of the fifth and the driving integrated circuits requires an additional electrical connection. This also applies to thin film and thick film sealed devices. Accordingly, it is an object of the present invention to provide an organic electroluminescent device having a tightly closed outer cover as described in the opening paragraph herein. The realization of this object is as follows: The cover plate is made of a material selected from the group consisting of glass ceramics and ceramic groups; 'The first conductive pattern formed on the first side of the cover plate includes a contact/contact pad; 'The second cover formed on the cover plate The second conductive pattern on the side includes a second contact pad; and the first and second conductive patterns are electrically connected to each other through an inner conductor extending in the cover. Since the conductor is provided through the cover plate, the sealing member can be selected to be thin and ideally to seal the outer cover. In particular, the cover is a high temperature co-fired ceramic (HTCC) or low temperature co-fired ceramic (LTCC) substrate. LTCC is a multi-layer co-fired ceramic material with high conductivity conductors in ceramic bodies. LTCC materials are absolutely impermeable to metals or glass. Its conductors include copper or newspaper. The thickness of the butterfly depends on the number of layers, usually (10) to 150 (four) per layer. 'Slow winding:: The base is flat, and the pitch of the upper electrode is currently 1 〇〇 == μπι. The expansion coefficient of the material can be adapted to a transparent substrate. Because the laughing layer "° structure can contain a desired number of internal conductors, so the number of 曰, EJ > 士(3)1306722 *" _ The description of the performance page is sufficient for the electroluminescent element to capture the full Shao Need to connect. The LTCC cover is tightly packed with the LTCC and the glass plate. The splicing can be placed on the right side of the LTCC and surround the device. In most cases (衮罝♦ imitation v order.a - & summer T does not require desiccant 3 and benefit% must pass through the seal. From and.", Ray Labium λ, Wenzhi. Scythe and electrode LTCC through hole (through_h ^ # ^ heterogeneous material IS or conductive epoxy resin. In LTCC and the acoustic value of w, π, . /, twist conductivity and line can extend in any direction, forming mutual Pick up even to include such as frequent crying _

The function of a passive component such as a package state, an inductor or a resistor. For the integration of the Lei selected eve, the beginning of the cement only the welding pattern of the road can be placed in any desired position. This combination results in an extremely thin and flat module that is extremely reliable. The extra cost of ltcc can be offset by the elimination of expensive interchange halls, the use of less packaging and more integrated functions.

In a suitable embodiment, at least two inner conductors extend into the cover, each interconnecting a first contact pad to a second contact pad that is not aligned with the first contact pad. In this example, the inner conductor extends substantially not only perpendicularly to the first cover but also laterally therewith. This has the advantage that the contact pad position can be selected as desired. In another example, each of the at least two inner conductors has a portion that extends substantially parallel to one of the sides of the cover. The substantially parallel extensions can be placed in a plurality of different levels 3 in the cover such that greater flexibility is provided, i.e., in an example, the first contact, especially the electroluminescent elements, is connected. The order of connection to the second contact pad to the external circuit is different. The electroluminescent element can be placed on a transparent substrate and a cover. In a first example, 1306722 - (4) Description of the Invention The continuation electroluminescent element is disposed on a transparent substrate and provided with an anode and a cathode interconnected to the first contact pad in a first conductive pattern on a first side of the cover Electrode pattern. This has the advantage that the electroluminescent element can be first applied to the glass substrate by tin-doped indium oxide and finally in various metals in accordance with conventional procedures. However, it is of course not excluded to place the electroluminescent element on the cover. This has the advantage that the first contact pads need not be interconnected to the electroluminescent element, i.e., the contact pads will form part of the electrode pattern.

The anode and cathode electrode patterns are preferably comprised of contact pads that are interconnected to the first contact pads by solder contacts. This solder joint allows the interconnection not to be limited to the side of the cavity formed by the cover and the transparent substrate. Moreover, this method has no effect on the sealing member.

Preferably, the intermediate sealing member comprises a weldable metal and the sealing member and the solder joint are welded in a single processing step. This is not only easy to manufacture but also allows the sealing member and the contact pad to be automatically aligned during the processing step. Another aspect is that the intermediate sealing member can comprise other materials. For example, if the transparent substrate comprises glass, the sealing member may be a siloxane material or the like, whereby the glass ceramic material of the cover sheet and the glass material of the transparent substrate are combined to form an integrated structure. In another example, the pitch of the electrode pattern contact pads may be greater than the pitch of at least some of the second contact pads to make the pitch smaller external circuits, especially the driver integrated circuits, capacitors and the like, which may be directly connected to the first Two contact pads. The use of a cover plate with internal conductors provides more flexibility in space requirements. The second side of the cover can be placed on a printed circuit board, as can the first side. This depends on the location of the second contact. 1306722 _ (5) Summary of the Invention In an advantageous example, a drive circuit is provided along one of the cover plates to connect to the second contact pad of the second conductive pattern. The advantage of having an inner conductor substrate in conjunction with the drive circuit is that the position of the drive circuit can be freely selected: on either the first side or the second side. A cavity can also be provided for the multilayer substrate in which the drive circuitry can be placed. This cavity provides good mechanical protection for the drive circuit. Additionally, the cavity can be used as a boundary applied to the package on the drive circuit. In a preferred embodiment, the cover is provided with at least two cavities, one for the drive circuit and one for the electroluminescent element. The transparent substrate can then be a flat plate. Furthermore, the transparent substrate can also be used as a monolithic module with a cover for driving the circuit cavity. Other aspects of the invention will be apparent upon reference to the examples described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a first electroluminescent device according to a first embodiment of the present invention, FIG. 2 is a schematic cross-sectional view of an electroluminescent device according to a second example of the present invention, and FIG. 3 is a cross-sectional view along I-Ι of FIG. A schematic cross-sectional view of the electroluminescent device of the third example of the present invention is taken from the line. Example 1 Figure 1 is a schematic cross-sectional view showing an electroluminescent device 1 of a first example of the present invention. For the sake of clarity, the present and subsequent drawings are not drawn to scale and some parts are enlarged. The electroluminescent device 1 comprises an electroluminescent element 2. The electroluminescent element 2 includes an electroluminescent organic layer 4 interposed between the hole-injecting electrode 3 through which the emitted light is transmitted and the electron injecting electrode 5. The electroluminescent element 2 is surrounded by a gas-tight and waterproof outer cover formed by the parts 6-10. The outer cover includes a first shape portion in the form of a light permeable glass plate 6. Field emission 1306722 W Lai (6) The optical element 2 is mounted on a board 6 which is a base of the field light-emitting element 2. The outer cover further includes a second shape portion in the form of a seesaw 7. The plates 6 and 7 are closed to each other by a low-melting metal alloy 10 to tightly seal the airtight and waterproof outer cover. The solder ring is bonded to the board 6 through a closed-loop conductive bonding layer 8 having the same shape as the closed loop. Similarly, the solder ring is bonded to the board 7 through a closed loop lap layer 9 having the same shape as the closed loop 1 〇.

A strip of metal (e.g., copper or silver) inner conductor 12& extends over the board to connect the first contact pad 13a to the second contact pad 14& In a similar manner, the inner conductor 12b connects the first contact pad 13b to the misaligned second contact pad 14b' and the inner conductor 12c connects the first contact pad i3c to the misaligned second contact pad 14c. In the present example, the first contact pads Ua, nb, i3c and the second contact pads 14a, 14b, 14c are disposed on the same side of the cover 7, i.e., facing one side of the transparent substrate 6. The driving integrated circuit 15 is directly soldered to the contact pads i4a' 14b, 14c... because the driving integrated circuit is mounted on a portion of the cover extending over the transparent substrate 6 and on the "lower" side of the cover, as shown in the figure Device 1 is very flat"

The first contact plastics *13a, 13b, 13c.. 2 electrode pattern interconnection points 16a, i6b, formula). i is electrically connected to the electroluminescent device 16c (these may be in the form of a solder bump block parallel to the cover plate 7 (main) element 2 and the cover plate 7. The same items are the same inner conductor 12a ' 12b, 12c... respectively have a portion of a 'b' ^. which extends substantially laterally. The electroluminescence has a gas-filled void 17. Figure 2 is a second example of the electroluminescent device 21 of the present invention. The electroluminescent device 21 is similar to the first In an example, phase - ίο - 1306722 Invention: Description Continuation (7) Symbol representation, but the difference is that the driver integrated circuit 15 is (directly) lapped to the upper side of the cover 7 away from the transparent substrate 6 The arrangement is such that the drive integrated circuit 15 is located outside the junction with the intermediate sealing members 8, 9, 10. Thus, the inner conductors 12a' 12b, 12c... will be the first contact pads 13a on the lower side of the cover 7. , 13b, 13c··· is connected to the second contact 14a, 14b, 14c which is not aligned on the upper side of the cover 7.

3 is a schematic cross-sectional view of an electroluminescent device 31 of a third example of the present invention. The electroluminescent device 31 is similar to the first example, and the same items are denoted by the same reference numerals, but the difference is from the side of the transparent substrate 6. A drive integrated circuit 15 is provided at the "upper" side of the cover plate 7, and is arranged such that the drive integrated circuit 15 is located within the boundary area with the intermediate seal member 8'9'10. Thus, the inner conductors 12a, 12b, 12c... connect the first contact potentials on the lower side of the cover 7 to the second contact pads 14 on the upper side, 14b 1 14*c For example, the electroluminescent device 1 is manufactured as follows: 1. Process of the transparent plate portion:

A 64X64X1 mm broken glass ^ ^ 6 6 has a -150 nm thick tin indium oxide layer to form a hole into the lightning technology 1 n electrode 3 and region 11 (supplier)

Balzers) is based on soapy water and isopropanol, the main beta, first. According to the method described in Braun et al., Synthetic Method 66 (1994), 75, 〇6 υ·6 wt.% (2-methoxy-5-(2,7-dimethyloctyloxy W, phenylphenyl) A solution of ruthenium quinone Q in toluene is provided by a spin coating method to provide a luminescent layer 4 having a thickness of about 150 nm. The cotton ball and/or the blade are used to remove the field on the edge. Material. In mass production, & shot removal is a particularly good method to remove unnecessary fields from the metamaterial. Translucent -11 - (8) 1306722 Description of the continuation of a mask through vacuum deposition to form ~ιΛΛ ^ ^ 200 nm thick electron injecting electrode 5. Now the electroluminescent element 2 has been completed and mounted on the first glass plate 6. The mask is used for magnetron sputtering and every 4n - surname * J long rolling The phase deposition continuously provides a nickel layer of about 2 〇〇 nm thick and a 200 nm thick layer of silver enamel to form a patterned closed soldering layer 8 of the first closed loop shape. Only a few hundred nm thick a a. Layer 8 can also be provided in front of the electroluminescent layer and has no adverse effect on the spin coating process.

The cover 7 is made of a ceramic or glass ceramic material. Some low temperature co-fired pottery (LTCC) types include Taojing particles embedded in glass. Other types include crystallized glass. Some temperate co-calcined ceramics (HTCC) include pure ceramic materials.

The LTCC type system consists of a metallized pulp glass ceramic dielectric tape with a shrinkage degree. LTCC technology is different from thick film technology in which each layer needs to be printed, dried and calcined. LTCC technology is like printed circuit board technology, and all layers are processed at the same time (that is, all layers are punched, printed and baked at the same time). dry). Once all the layers are processed, they are stacked and co-fired at a temperature between 800 and 90 to form a high-density fully integrated substrate. The same method and material are used for the solder layer 8, the cover 7 and its internal conductors. The structure is provided with a closed-loop patterned patterned delamination layer 9 that mates with a first closed loop on the plate 6. The resulting plate is immersed in tin (50 wt.%) having a melting point of 145 ° C and maintaining a liquid state at 155 ° C. Lead (32 wt.%) cadmium (18 wt_%) (supplier Witmetaal BV) in a low melting point metal alloy solution. After the plate is removed from the solution, only the lap layer 9 has been provided with solder to form the plate 6 The second closed loop of the first closed loop is matched. • 12- 1306722 (9) I The descending horse can also deposit solder in the first contact #13a, 13b, 13c ··_t. 3. Connect the boards:

The treated panels 6 and 7 were placed on a hot plate maintained at 155 ° C to dissolve the low melting metal alloy. The first and second closed loops are then mated together to engage the plates 6 and 7. It is sufficient to place the first plate at the top of the second closed loop. The molten low-melting metal alloy then pulls the two closed loops into their maximum overlap position while the electrical interconnection between the electroluminescent element and the cover also forms a mutual contact. After cooling, the closed loop 10 is solidified to form a package. The airtight and waterproof cover of the house-light-emitting element 2 has a gap 17 between the electroluminescent element 2 and the plate 7 due to the closed loop 10 being 200 μm thick, since the joint plates 6 and 7 are carried out in dry nitrogen gas, so The gap is filled with dry nitrogen gas. Alternatively, the flux can be directly printed (screened) on the lower surface of the cover 7. After the base 6 is joined to the cover 7, the combination is heated to the point where the broth becomes soft (preferably below 120 ° C) and re-cooled. The pattern on the base 6 and the cover 7 is self-aligned due to the softening of the solder.

In summary, the invention relates to an organic electroluminescent device comprising an electroluminescent element supported on a transparent substrate. A cover plate provided with a ceramic or glass ceramic material is sealed to the transparent substrate with a metal sealing member to form an airtight outer cover for the electroluminescent element. The cover plate supports a drive integrated circuit. The cover has an inner conductor connecting the first contact 塾 connected to the electroluminescent element to the second contact pad connected to the driving integrated circuit, and the at least one first contact aligning with the second contact pad connected thereto does not mutually alignment. Schematic representation symbol 1,21, 31 electroluminescent device-13 - 1306722(10) 2 electroluminescent element 3 hole injection electrode 4 electroluminescence organic layer 5 electron injection electrode 6 glass plate 7 cover plate 8 conductive welding Layer 9 Solder layer 10 Closed loop 11 Region 12a, 12b, 12c Inner conductor 13a, 13b, 13c First contact pad 14a, 14b, 14c Second contact 塾 15 Drive integrated circuit 16a, 16b, 16c Interconnect point 17 Filled with gas The gap a, b, c part of the invention description continuation page

-14-

Claims (1)

1306722^ Patent application: 1. An organic electroluminescent device comprising: - a transparent substrate, - a cover having a first side facing the transparent substrate and a second side opposite the first side - at least one illumination An element comprising an organic electroluminescent layer disposed between the transparent substrate and the cover, and An intermediate sealing member joining the transparent substrate to the cover plate, characterized in that: - the cover plate is made of a material selected from the group consisting of glass ceramics and ceramics; - a first conductive pattern is formed on the first surface of the cover plate a first contact pad on the side; a second conductive pattern formed on one side of the cover and including a second contact pad; - the first and the second conductive patterns are electrically connected to each other through at least two inner conductors extending in the cover plate, the inner conductors extending in the cover plate, wherein a conductor interconnects the first contact pads to the wrong A second contact pad of the first contact pad is permitted, and a portion of the at least two inner conductors extend substantially parallel to one of the sides of the cover. 2. The device of claim 1, wherein the electroluminescent device is placed on a transparent substrate and provided with an anode that is connected to the first contact pad of the first conductive pattern on the first side of the cover. And a cathode electrode pattern. 3. The device of claim 2, wherein the anode and cathode electrode patterns comprise contact pads that are interconnected to the first contact pad by solder joints. B06722 Patent Application Continuation Page * .W, ·"' b Μ 4. The device of claim 3, wherein the intermediate sealing member comprises a weldable metal, the sealing member and the solder joint are processed Solder in the step. 5. The device of claim 2, wherein the pitch of at least some of the first contact pads is greater than the pitch of at least some of the second contact pads. 6. The device of claim 1 wherein the device has a drive circuit coupled to the second contact pad of the second conductive pattern on one side of the cover. 7. The device of claim 6, wherein the drive circuit is disposed at a first side of the cover. 8. The device of claim 1, wherein the cover is made by a common calcining technique.