JPH11312581A - El element and its manufacture - Google Patents
El element and its manufactureInfo
- Publication number
- JPH11312581A JPH11312581A JP10134318A JP13431898A JPH11312581A JP H11312581 A JPH11312581 A JP H11312581A JP 10134318 A JP10134318 A JP 10134318A JP 13431898 A JP13431898 A JP 13431898A JP H11312581 A JPH11312581 A JP H11312581A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- transparent substrate
- sealing body
- adhesive
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000007789 sealing Methods 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000000463 material Substances 0.000 claims abstract description 44
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000007772 electrode material Substances 0.000 claims abstract description 7
- 239000002274 desiccant Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 10
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 8
- 239000010453 quartz Substances 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 125000006617 triphenylamine group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UHXOHPVVEHBKKT-UHFFFAOYSA-N 1-(2,2-diphenylethenyl)-4-[4-(2,2-diphenylethenyl)phenyl]benzene Chemical compound C=1C=C(C=2C=CC(C=C(C=3C=CC=CC=3)C=3C=CC=CC=3)=CC=2)C=CC=1C=C(C=1C=CC=CC=1)C1=CC=CC=C1 UHXOHPVVEHBKKT-UHFFFAOYSA-N 0.000 description 1
- ZMLPKJYZRQZLDA-UHFFFAOYSA-N 1-(2-phenylethenyl)-4-[4-(2-phenylethenyl)phenyl]benzene Chemical group C=1C=CC=CC=1C=CC(C=C1)=CC=C1C(C=C1)=CC=C1C=CC1=CC=CC=C1 ZMLPKJYZRQZLDA-UHFFFAOYSA-N 0.000 description 1
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- -1 aluminum chelate complex Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 150000004866 oxadiazoles Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000002979 perylenes Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、平面光源やディ
スプレイ、その他所定のパターン等の発光表示に用いら
れるチップ状ＥＬ素子とその製造方法に関する。[0001] 1. Field of the Invention [0002] The present invention relates to a chip-shaped EL element used for light-emitting display of a flat light source, a display, and other predetermined patterns, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来、有機ＥＬ（エレクトルミネッセン
ス）素子は、透明な基板に透孔性のＩＴＯ膜を一面に形
成し、所定のストライプ状等の形状にエッチングし透明
電極を形成し、さらにこの透明電極の表面に発光層を全
面蒸着により形成している。この発光層は、有機ＥＬ材
料であり、トリフェニルアミン誘導体（ＴＰＤ）等のホ
ール輸送材料を設け、その上に発光材料であるアルミキ
レート錯体（Ａｌｑ3）等の電子輸送材料を積層したも
のや、これらの混合層からなる。そしてその表面に、Ａ
ｌ，Ｌｉ，Ａｇ，Ｍｇ，Ｉｎ等の背面電極が、上記透明
電極と対面するように蒸着等で設けられ、発光部を形成
している。2. Description of the Related Art Conventionally, an organic EL (electroluminescence) element is formed by forming a porous ITO film on a transparent substrate on one surface and etching it into a predetermined stripe or the like to form a transparent electrode. A light-emitting layer is formed on the entire surface of the transparent electrode by vapor deposition. This light emitting layer is an organic EL material, in which a hole transporting material such as a triphenylamine derivative (TPD) is provided, and an electron transporting material such as an aluminum chelate complex (Alq 3 ) as a light emitting material is laminated thereon. And a mixed layer of these. And on the surface, A
A back electrode of 1, Li, Ag, Mg, In or the like is provided by vapor deposition or the like so as to face the transparent electrode, and forms a light emitting portion.
【０００３】この有機ＥＬ素子は、発光層の形成されて
いない縁周部の基板上に設けられた回路接続用電極にリ
ード線が接続され、このリード線を通って外部の回路と
接続される。そしてこの回路接続用電極を経て駆動電流
が、陽極の透明電極と陰極の背面電極との間に流れ、発
光層が発光するものである。In this organic EL device, a lead wire is connected to a circuit connection electrode provided on a substrate around the periphery where no light emitting layer is formed, and is connected to an external circuit through the lead wire. . Then, a drive current flows between the transparent electrode of the anode and the back electrode of the cathode through the electrode for circuit connection, and the light emitting layer emits light.
【０００４】また、発光部を構成する有機ＥＬ材料は、
水分や化学溶媒の存在下で容易に劣化することから、基
板と背面ガラス板との間で、発光部の周囲に接着剤を塗
布し、レジン等で封止し密閉する。またこのとき基板と
背面ガラス板との間の空間には乾燥した窒素ガス等が充
填される。そして、発光部に接続した回路接続用電極を
露出させ、この回路接続用電極と接続するリード線であ
るフレキシブルフラットケーブル等を用いて駆動回路と
接続していた。The organic EL material constituting the light emitting section is
Since it is easily deteriorated in the presence of moisture or a chemical solvent, an adhesive is applied around the light emitting portion between the substrate and the rear glass plate, sealed with a resin or the like, and sealed. At this time, the space between the substrate and the rear glass plate is filled with dry nitrogen gas or the like. Then, the circuit connection electrode connected to the light emitting section is exposed, and the circuit connection electrode is connected to the drive circuit using a flexible flat cable or the like which is a lead wire connected to the circuit connection electrode.
【０００５】[0005]
【発明が解決しようとする課題】上記従来の技術の場
合、回路接続用電極とリード線の端部を接続したリード
線接続部は、発光部が形成された基板の同一平面上の縁
周部に設けられ、表示装置の発光面以外の部分の面積が
大きくなる原因となっていた。また発光層の有機ＥＬ材
料は化学的に脆弱な材料であり、水分の存在下で容易に
劣化するため、背面板を設けて密封する必要があり、こ
の背面板の大きさや重さにより有機ＥＬ素子が全体的に
大きく、また厚みが厚く、重くなっていた。In the case of the above prior art, the lead wire connecting portion connecting the circuit connecting electrode and the end of the lead wire is formed on the same peripheral edge of the substrate on which the light emitting portion is formed. And the area of the portion other than the light emitting surface of the display device becomes large. Further, since the organic EL material of the light emitting layer is a chemically fragile material and easily deteriorates in the presence of moisture, it is necessary to provide a back plate and seal it. The device was overall large, thick and heavy.
【０００６】さらに回路接続用電極にリード線等を接続
する工程が必要であり、製造工程が多く、生産効率が低
下するという問題点も有していた。特に接続にフラット
ケーブル等の材料との接続ポイントを形成する工程が必
要であり、また工程数も多くなるため不良品も増えるも
のであった。Further, a step of connecting a lead wire or the like to the circuit connecting electrode is required, which involves many manufacturing steps and lowers production efficiency. In particular, a step of forming a connection point with a material such as a flat cable is required for connection, and the number of steps is increased, so that defective products are increased.
【０００７】この発明は上記従来の問題点に鑑みてなさ
れたものであり、薄く、軽量で高品位な発光表示を長期
間持続することが可能なＥＬ素子とその製造方法を提供
することを目的とする。The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide an EL element which is thin, lightweight, and can maintain a high-quality light-emitting display for a long period of time, and a method of manufacturing the same. And
【０００８】[0008]
【課題を解決するための手段】この発明のＥＬ素子は、
ガラスや石英、樹脂等の透明な基板表面に、ＩＴＯ等の
透明な電極材料により形成された透明電極と、この透明
電極に積層されたＥＬ材料からなる発光層と、この発光
層に積層され、上記透明電極に対向して形成された背面
電極とからなる発光部を備え、上記発光部全体を覆い、
回路基板材料からなる封止体とが設けられ、上記透明な
基板と上記封止体は一部分で導電性を有する異方性導電
体ペースト等の接着剤により周囲が接着され、上記透明
な基板と上記封止体の間の空間が密封されて互いに固定
されているＥＬ素子である。An EL device according to the present invention comprises:
A transparent electrode formed of a transparent electrode material such as ITO on a transparent substrate surface such as glass, quartz, or resin, a light emitting layer made of an EL material laminated on the transparent electrode, and a light emitting layer laminated on the light emitting layer. A light-emitting portion comprising a back electrode formed opposite to the transparent electrode, covering the entire light-emitting portion,
A sealing body made of a circuit board material is provided, and the transparent substrate and the sealing body are partially adhered to each other with an adhesive such as an anisotropic conductive paste having conductivity, and the transparent substrate and An EL element in which a space between the sealing bodies is sealed and fixed to each other.
【０００９】さらに、上記透明な基板と封止体との間の
密封された空間には、不活性ガスが充填されているもの
である。また、上記透明な基板と封止体との間の密封さ
れた空間には、乾燥剤あるいは酸化防止剤が設けられて
いる。上記透明な基板と封止体との間の密封された空間
の上記封止体には、有底のものや透孔の凹部を有し、こ
の凹部に上記乾燥剤あるいは酸化防止剤が設けられてい
る。そして、上記封止体の表面には回路パターンが形成
され、この回路パターンと上記背面電極と透明電極と
が、上記接着剤を介して電気的に接続している。Further, the sealed space between the transparent substrate and the sealing body is filled with an inert gas. A desiccant or an antioxidant is provided in a sealed space between the transparent substrate and the sealing body. The sealing body in a sealed space between the transparent substrate and the sealing body has a bottomed or through-hole recess, and the drying agent or the antioxidant is provided in the recess. ing. A circuit pattern is formed on the surface of the sealing body, and the circuit pattern, the back electrode, and the transparent electrode are electrically connected via the adhesive.
【００１０】またこの発明は、透明な基板表面に透明な
電極材料により透明電極を形成し、この透明電極にＥＬ
材料からなる発光層を真空薄膜形成技術により積層し、
上記発光層に背面電極を真空薄膜形成技術により積層し
て発光部を形成し、上記背面電極を囲むように上記発光
部の縁周部に、一部分で導電性を有する異方性導電体ペ
ースト等の接着剤を塗布し、加圧して上記透明な基板と
封止体とを電気的に接続し、回路基板材料からなる封止
体の所定の位置に上記発光部を密封するように、上記接
着剤により上記透明な基板を固定するＥＬ素子の製造方
法である。Further, according to the present invention, a transparent electrode is formed on a transparent substrate surface using a transparent electrode material, and the transparent electrode is provided with an EL.
Light emitting layers made of materials are laminated by vacuum thin film forming technology,
A light emitting portion is formed by laminating a back electrode on the light emitting layer by a vacuum thin film forming technique, and an anisotropic conductive paste partially conductive around an edge of the light emitting portion so as to surround the back electrode. The transparent substrate and the sealing body are electrically connected by applying an adhesive, and the bonding is performed so that the light emitting portion is sealed at a predetermined position of the sealing body made of a circuit board material. This is a method for manufacturing an EL element in which the transparent substrate is fixed with an agent.
【００１１】[0011]
【発明の実施の形態】以下、この発明の実施形態につい
て図面に基づいて説明する。図１はこの発明のＥＬ素子
の第一実施形態を示すもので、この実施形態のＥＬ素子
は、ガラスや石英、樹脂等の透明基板１０の一方の表面
に発光部１２が形成されている。発光部１２は、透明基
板１０の側面に設けられた透明電極と、この透明電極の
表面に積層された発光層と、発光層の表面で透明電極と
対向する背面電極とからなる。また背面電極の表面に
は、純度が９９．９９９％以上のＡｌ等による導電パタ
ーンがストライプ状に積層されていてもよく、またこの
表面に図示しない保護層を積層してもよい。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of an EL element of the present invention. In the EL element of this embodiment, a light emitting section 12 is formed on one surface of a transparent substrate 10 made of glass, quartz, resin or the like. The light emitting section 12 includes a transparent electrode provided on a side surface of the transparent substrate 10, a light emitting layer laminated on the surface of the transparent electrode, and a back electrode facing the transparent electrode on the surface of the light emitting layer. A conductive pattern made of Al or the like having a purity of 99.999% or more may be laminated on the surface of the back electrode in a stripe shape, and a protective layer (not shown) may be laminated on this surface.
【００１２】ここで、透明電極はＩＴＯ等の透明な電極
材料からなり、所定のピッチでストライプ状に設けられ
ている。発光層は、５００Å程度の厚さのホール輸送材
料、及び５００Å程度の厚さの電子輸送材料、その他発
光材料によるＥＬ材料からなり、透明電極の全面に積層
されている。Here, the transparent electrodes are made of a transparent electrode material such as ITO, and are provided in a stripe pattern at a predetermined pitch. The light emitting layer is made of a hole transporting material having a thickness of about 500 °, an electron transporting material having a thickness of about 500 °, and other EL materials made of a light emitting material, and is laminated on the entire surface of the transparent electrode.
【００１３】発光層は、母体材料のうちホール輸送材料
としては、トリフェニルアミン誘導体（ＴＰＤ）、ヒド
ラゾン誘導体、アリールアミン誘導体等がある。一方、
電子輸送材料としては、アルミキレート錯体（Ａｌ
ｑ3）、ジスチリルビフェニル誘導体（ＤＰＶＢｉ）、
オキサジアゾール誘導体、ビスチリルアントラセン誘導
体、ベンゾオキサゾールチオフェン誘導体、ペリレン
類、チアゾール類等を用いる。さらに適宜の発光材料を
混合してもよく、ホール輸送材料と電子輸送材料を混合
した発光層を形成してもよく、その場合、ホール輸送材
料と電子輸送材料の比は、１０：９０乃至９０：１０の
範囲で適宜変更可能である。In the light emitting layer, as a hole transporting material among the base materials, there are a triphenylamine derivative (TPD), a hydrazone derivative, an arylamine derivative and the like. on the other hand,
As electron transport materials, aluminum chelate complexes (Al
q 3 ), distyrylbiphenyl derivatives (DPVBi),
An oxadiazole derivative, a bistyrylanthracene derivative, a benzoxazolethiophene derivative, perylenes, thiazoles, or the like is used. Further, an appropriate light emitting material may be mixed, or a light emitting layer in which a hole transport material and an electron transport material are mixed may be formed. In this case, the ratio of the hole transport material to the electron transport material is 10:90 to 90. : 10 can be appropriately changed.
【００１４】背面電極は、Ｌｉを０．０１〜０．０５％
程度含む純度９９％程度のＡｌ−Ｌｉ合金、その他Ａｌ
−Ｍｇ等の陰極材料からなり、発光層の表面で、透明電
極と対向し、互いに略直角方向に位置する所定のピッチ
を有したストライプ状に形成されている。The back electrode is composed of 0.01 to 0.05% of Li.
Al-Li alloy of about 99% purity, including other Al
It is made of a cathode material such as -Mg or the like, and is formed in a stripe shape having a predetermined pitch, which faces the transparent electrode on the surface of the light emitting layer and is located substantially perpendicular to each other.
【００１５】また発光部１２の縁周部には、気密性が高
く導電性を有する接着剤１４が設けられ、この接着剤１
４は、ＥＬ材料と反応しない樹脂材料で、透水性、透気
性、含水性を有せず、加圧方向に導電性を示す異方性導
電体ペースト等である。An adhesive 14 having high airtightness and conductivity is provided around the periphery of the light emitting section 12.
Reference numeral 4 denotes a resin material that does not react with the EL material, such as an anisotropic conductive paste that does not have water permeability, gas permeability, or water content, and has conductivity in the pressing direction.
【００１６】この透明基板１０は、封止体１８の所定の
位置に、接着剤１４を介して密着され、透明基板１０の
発光部１２と封止体１８の間の空間２０には、乾燥した
窒素ガスが充填される。また空間２０に充填されるガス
は、不活性なものであればよく、空間２０内に乾燥剤や
酸化防止剤を設けてもよい。この封止体１８は、ガラス
板やセラミック板、樹脂板、その他表面を絶縁処理した
金属板等からなり、表面に回路パターン１６が形成され
た回路基板材料により構成されている。The transparent substrate 10 is adhered to a predetermined position of the sealing body 18 via an adhesive 14, and a space 20 between the light emitting portion 12 of the transparent substrate 10 and the sealing body 18 is dried. Nitrogen gas is filled. The gas filled in the space 20 may be an inert gas, and a desiccant or an antioxidant may be provided in the space 20. The sealing body 18 is made of a glass plate, a ceramic plate, a resin plate, a metal plate or the like whose surface is insulated, and is made of a circuit board material having a circuit pattern 16 formed on the surface.
【００１７】発光部１２は、接着剤１４を介して回路パ
ターン１６の回路用接続部２２と電気的に接続し、回路
パターン１６は、このＥＬ素子を駆動する回路や、その
制御回路等を含むものである。The light emitting section 12 is electrically connected to the circuit connecting section 22 of the circuit pattern 16 through the adhesive 14, and the circuit pattern 16 includes a circuit for driving the EL element, a control circuit for the circuit, and the like. It is a thing.
【００１８】また接着剤１４の外側面や透明基板１０及
び封止体１６と接着剤１４の接合部にＵＶ硬化樹脂等の
シール材料を塗布してもよく、このことにより空間２０
の密封性を更に向上させることができる。Further, a sealing material such as a UV curable resin may be applied to the outer surface of the adhesive 14 and the joint between the transparent substrate 10 and the sealing body 16 and the adhesive 14.
Can be further improved.
【００１９】ここで、異方性導電体ペーストとは、導
通、絶縁、接着の３つの機能を併せ持つ無溶剤一液型の
液状接着剤で、液状熱硬化性樹脂中に導電性微粒子を分
散させた構造をしており、電極間にはさみこんで熱圧着
することにより、加圧方向に導電性を有し、辺方向に絶
縁性を維持する。例えば、Ａｕコートされた樹脂粒子が
混入した樹脂を使用する場合、粒子が加圧により偏平化
し、被着電極と画接触し、これにより様々な材質の被着
電極に対して適用することができる。Here, the anisotropic conductive paste is a solventless one-part type liquid adhesive having three functions of conduction, insulation and bonding, in which conductive fine particles are dispersed in a liquid thermosetting resin. It has a conductive structure in the pressing direction and maintains insulation in the side direction by being sandwiched between the electrodes and thermocompression-bonded. For example, when using a resin mixed with Au-coated resin particles, the particles are flattened by pressure and come into image contact with the electrode to be deposited, whereby the material can be applied to electrodes of various materials. .
【００２０】また粒子径は一般に３〜５μｍ程度であ
り、樹脂中の金属密度は、１６μｍの厚さで１００００
〜４００００個／ｍｍ2であり、熱硬化性樹脂として
は、例えばエポキシ樹脂やポリイミド樹脂がある。熱硬
化性樹脂のかわりにポリエステル樹脂等の熱可塑性樹脂
を用いてもよく、厚さ方向に加圧すると厚さ方向にのみ
導電性を得ることができる材料であればよい。The particle diameter is generally about 3 to 5 μm, and the metal density in the resin is 10,000 when the thickness is 16 μm.
４０40,000 / mm 2 , and examples of the thermosetting resin include an epoxy resin and a polyimide resin. Instead of the thermosetting resin, a thermoplastic resin such as a polyester resin may be used, and any material may be used as long as it can obtain conductivity only in the thickness direction when pressed in the thickness direction.
【００２１】この実施形態のＥＬ素子の製造方法は、透
明基板１０の表面にＩＴＯ等の電極材料を全面蒸着し、
エッチング等によりストライプ状の透明電極を形成す
る。またマスク蒸着によりストライプ状に形成してもよ
い。In the method of manufacturing an EL device according to this embodiment, an electrode material such as ITO is entirely deposited on the surface of the transparent substrate 10;
A striped transparent electrode is formed by etching or the like. Further, it may be formed in a stripe shape by mask evaporation.
【００２２】次に発光部１２の透明電極にホール輸送材
料及び電子輸送材料によるＥＬ材料からなる発光層を真
空蒸着やスパッタリングその他真空薄膜形成技術により
積層する。そして発光層の全面に導電性材料をマスク蒸
着により積層し、エッチングによりストライプ状の背面
電極を形成する。またこの発光部１２の縁周部全周にわ
たって異方性導電体ペーストからなる接着剤１４を塗布
する。Next, a light emitting layer made of an EL material made of a hole transporting material and an electron transporting material is laminated on the transparent electrode of the light emitting section 12 by vacuum evaporation, sputtering or other vacuum thin film forming techniques. Then, a conductive material is laminated on the entire surface of the light emitting layer by mask evaporation, and a striped back electrode is formed by etching. An adhesive 14 made of an anisotropic conductive paste is applied over the entire periphery of the light emitting portion 12.
【００２３】ここで蒸着条件は、例えば真空度が６×１
０-6 Ｔｏｒｒで、ＥＬ材料の場合、５０Å／ｓｅｃの蒸
着速度で成膜させる。また白色光の発光層等は、フラッ
シュ蒸着により形成してもよい。フラッシュ蒸着法は、
予め所定の比率で混合したＥＬ材料を３００℃〜６００
℃好ましくは４００℃〜５００℃に加熱した蒸着源に落
下させ、ＥＬ材料を一気に蒸発させるものである。また
そのＥＬ材料を容器中に収容し、急速にその容器を加熱
し、一気に蒸着させるものでもよい。Here, the deposition conditions are, for example, that the degree of vacuum is 6 × 1.
0-6 Torr, 50% / sec.
The film is formed at the deposition speed. The white light emitting layer
It may be formed by flash evaporation. Flash evaporation method
The EL material previously mixed at a predetermined ratio is 300 ° C. to 600
℃, preferably dropped to a deposition source heated to 400 ℃ ~ 500 ℃
The EL material is evaporated at a stroke. Also
Put the EL material in a container and heat the container rapidly
Alternatively, it may be one that is vapor deposited at a stretch.
【００２４】一方封止体１８の側面には、スクリーン印
刷等により所定の回路パターン１６が形成され、さらに
はんだ付け等の加熱処理工程を必要とする電子部品を設
け、回路パターン１６の所定の位置には、金メッキ等に
よる回路用接続部２２を形成する。On the other hand, a predetermined circuit pattern 16 is formed on the side surface of the sealing body 18 by screen printing or the like, and an electronic component requiring a heat treatment process such as soldering is provided. The circuit connecting portion 22 is formed by gold plating or the like.
【００２５】この後、乾燥窒素雰囲気下で接着剤１４と
回路用接続部２２が接続するようにかつ透明基板１０の
周囲で密封されるように、封止体１８上に接着剤１４を
塗布し、透明基板１０と封止体１８との間の空間を密封
する。このとき、透明基板１０と封止体１８とを互いに
圧接するように加熱及び加圧し、接着剤１４が加圧方向
に導電性を保持するようにする。これにより、発光部１
２と回路用接続部２２の間で電気的に接続状態となる。
なお、このときの加熱温度は、１５０℃、３０秒の低温
短時間の接合が好ましい。Thereafter, the adhesive 14 is applied on the sealing body 18 in a dry nitrogen atmosphere so that the adhesive 14 and the circuit connecting portion 22 are connected and sealed around the transparent substrate 10. Then, the space between the transparent substrate 10 and the sealing body 18 is sealed. At this time, heating and pressing are performed so that the transparent substrate 10 and the sealing body 18 are pressed against each other, so that the adhesive 14 maintains conductivity in the pressing direction. Thereby, the light emitting unit 1
2 and the circuit connecting portion 22 are electrically connected.
The heating temperature at this time is preferably a low-temperature short-time bonding of 150 ° C. for 30 seconds.
【００２６】また発光部１８と封止体１８間の空間２０
は窒素ガスが充填され、導電性を確認後空間２０の密封
性向上のためにＵＶ硬化樹脂を、接着剤１４と透明基板
１０および封止体１８との接合面に塗布してもよく、Ｕ
Ｖ硬化樹脂以外にも加熱の必要がなく、気密性の高い密
封材料であればよい。The space 20 between the light emitting section 18 and the sealing body 18
Is filled with nitrogen gas, and after confirming the conductivity, a UV curable resin may be applied to the joint surface between the adhesive 14, the transparent substrate 10 and the sealing body 18 to improve the sealing property of the space 20.
Other than the V-cured resin, any sealing material that does not require heating and has high airtightness may be used.
【００２７】この実施形態のＥＬ素子によれば、封止体
１８に回路パターン１６を形成することにより構成部材
が減り、また厚みを薄くすることにより、小型化、軽量
化ができる。また回路パターン１６の一部に回路用接続
部２２を設け、異方性導電体ペースト等の一部に導電性
を有した接着剤１４を介して発光部１２と接続させるた
め、接着部分と電気的接続部分のスペースを兼用するこ
とができ、表示部分の割合を多くすることができる。さ
らに、空間２０の気密性が高く、素子の寿命を延ばすこ
とができる。また、空間２０内の環境を良好に保持する
ため、乾燥剤や酸化防止剤のような劣化防止剤を設けて
もよい。According to the EL device of this embodiment, the number of constituent members can be reduced by forming the circuit pattern 16 on the sealing body 18, and the size and weight can be reduced by reducing the thickness. Also, a circuit connecting portion 22 is provided in a part of the circuit pattern 16 and a part of the anisotropic conductive paste or the like is connected to the light emitting portion 12 through an adhesive 14 having conductivity. The space of the connection part can be shared, and the ratio of the display part can be increased. Furthermore, the airtightness of the space 20 is high, and the life of the element can be extended. Further, in order to maintain the environment in the space 20 well, a deterioration preventing agent such as a desiccant or an antioxidant may be provided.
【００２８】次にこの発明の第二実施形態について図２
を基にして説明する。ここで上記実施形態と同様の部材
は同一の符号を付して説明を省略する。この実施形態の
透明基板１０の表面には第一実施形態と同様に、透明電
極、発光層、背面電極が積層して形成された発光部１２
と、発光部１２の外縁部に異方性導電体ペースト等の接
着剤１４が設けられている。Next, a second embodiment of the present invention will be described with reference to FIG.
The description will be made based on FIG. Here, the same members as those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted. On the surface of the transparent substrate 10 of this embodiment, as in the first embodiment, a light emitting section 12 formed by laminating a transparent electrode, a light emitting layer, and a back electrode.
In addition, an adhesive 14 such as an anisotropic conductive paste is provided on the outer edge of the light emitting unit 12.
【００２９】一方、封止体２４は、ガラス板やセラミッ
ク板、樹脂板、表面を絶縁処理した金属板等からなり、
側面に回路パターン１６や回路用接続部２２等が形成さ
れ、さらに透明基板１０と接合したとき、発光部１２と
対向する位置に凹部２６が形成されている。この凹部２
６内にはその形状に対応した乾燥剤２８が設けられてい
る。On the other hand, the sealing body 24 is made of a glass plate, a ceramic plate, a resin plate, a metal plate whose surface is insulated, or the like.
A circuit pattern 16, a circuit connecting portion 22, and the like are formed on a side surface, and a concave portion 26 is formed at a position facing the light emitting portion 12 when bonded to the transparent substrate 10. This recess 2
A drying agent 28 corresponding to the shape is provided in 6.
【００３０】透明基板１０と封止体２４は、接着剤１４
が回路用接続部２２と接続するように接合され、封止体
２４と発光部１２との間の密封された空間２０には、窒
素ガスが充填されている。The transparent substrate 10 and the sealing body 24 are
Are connected so as to be connected to the circuit connecting portion 22, and the sealed space 20 between the sealing body 24 and the light emitting portion 12 is filled with nitrogen gas.
【００３１】この実施形態のＥＬ素子の製造方法は、透
明基板１０の表面に上記と同様の方法で発光部１２を形
成し、また封止体２４の所定の部分を凹状に除去し、凹
部２６を形成した後、回路パターン１６や回路用接続部
２２をスクリーン印刷等により形成し、はんだつけ等の
熱処理工程を必要とする電子部品を設ける。In the method of manufacturing the EL device of this embodiment, the light emitting portion 12 is formed on the surface of the transparent substrate 10 in the same manner as described above, and a predetermined portion of the sealing body 24 is removed in a concave shape. After that, the circuit pattern 16 and the circuit connecting portion 22 are formed by screen printing or the like, and electronic components that require a heat treatment step such as soldering are provided.
【００３２】次に凹部２６の形状に対応した乾燥剤２８
を凹部２６内に設置し、封止体２４の所定の位置に接着
剤１４を塗布する。そして、窒素雰囲気下で接着剤１４
と回路用接続部２２が接続するように透明基板１０と封
止体２４を接合する。またこのとき透明基板１０と封止
体２４を接合する方向に加圧し、加熱することにより異
方性導電体ペーストの接着剤２４を硬化させ、かつ発光
部１２と回路用接続部２２が電気的な接続を有するよう
にする。Next, a desiccant 28 corresponding to the shape of the concave portion 26
Is placed in the concave portion 26, and the adhesive 14 is applied to a predetermined position of the sealing body 24. Then, under a nitrogen atmosphere, the adhesive 14
The transparent substrate 10 and the sealing body 24 are joined so that the circuit connecting part 22 is connected to the transparent substrate 10. At this time, pressure is applied in a direction in which the transparent substrate 10 and the sealing body 24 are joined, and the adhesive 24 of the anisotropic conductive paste is cured by heating. Have a good connection.
【００３３】さらに、接着剤１４の外側面や透明基板１
０及び封止体２４の接合部には、気密性が高く、高温の
加熱処理を必要としないＵＶ硬化樹脂等の樹脂を塗布し
てもよい。Further, the outer surface of the adhesive 14 and the transparent substrate 1
A resin such as a UV curable resin that has high airtightness and does not require high-temperature heat treatment may be applied to the joint between the O and the sealing body 24.
【００３４】この実施形態のＥＬ素子によれば、発光部
１２と封止体１２間の空間２０に多少の水分や不純物が
残留しても乾燥剤２８により吸収されるため、良好な環
境が維持され、発光層等の劣化を防止し、信頼性も高く
なる。また乾燥剤２８に酸化防止剤等を混合してもよ
く、空間２０内の環境に悪影響を与えないものであれば
よい。According to the EL device of this embodiment, even if a small amount of moisture or impurities remains in the space 20 between the light emitting section 12 and the sealing body 12, the moisture is absorbed by the desiccant 28, so that a favorable environment is maintained. Thus, deterioration of the light emitting layer and the like is prevented, and the reliability is improved. Further, an antioxidant or the like may be mixed with the desiccant 28, as long as it does not adversely affect the environment in the space 20.
【００３５】次にこの発明の第三実施形態について図３
を基にして説明する。ここで上記実施形態と同様の部材
は同一の符号を付して説明を省略する。この実施形態の
透明基板１０の表面には第一実施形態と同様に、透明電
極、発光層、背面電極が積層して形成された発光部１２
と、発光部１２の外縁部に導電性ペースト等の接着剤１
４が設けられている。Next, a third embodiment of the present invention will be described with reference to FIG.
The description will be made based on FIG. Here, the same members as those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted. On the surface of the transparent substrate 10 of this embodiment, as in the first embodiment, a light emitting section 12 formed by laminating a transparent electrode, a light emitting layer, and a back electrode.
And an adhesive 1 such as a conductive paste on the outer edge of the light emitting section 12.
4 are provided.
【００３６】また、封止体３０は、ガラス板やセラミッ
ク板、樹脂板、表面を絶縁処理した金属板等からなり、
側面に回路パターン１６や回路用接続部２２等が形成さ
れ、さらに透明基板１０と接合したとき、発光部１２と
対向する位置に、封止体３０の表裏面を貫通する複数の
凹部である透孔３２が形成されている。この透孔３２内
には乾燥剤３４が充填され、回路パターン１６等が形成
された側面の反対側の面に透孔３２をふさぐように平板
状の密封部材３６が設けられている。The sealing body 30 is made of a glass plate, a ceramic plate, a resin plate, a metal plate whose surface is insulated, or the like.
When the circuit pattern 16 and the circuit connecting portion 22 are formed on the side surface and further joined to the transparent substrate 10, a plurality of transparent recesses penetrating the front and back surfaces of the sealing body 30 are provided at positions facing the light emitting portion 12. A hole 32 is formed. A desiccant 34 is filled in the through hole 32, and a flat sealing member 36 is provided on the surface opposite to the side surface on which the circuit pattern 16 and the like are formed so as to cover the through hole 32.
【００３７】透明基板１０と封止体２４は、接着剤１４
の一部が回路用接続部２２と接続するように接合され、
封止体２４と発光部１２との間の密封された空間２０に
は、窒素ガスが充填されている。The transparent substrate 10 and the sealing body 24 are
Are joined so as to be connected to the circuit connecting portion 22;
The sealed space 20 between the sealing body 24 and the light emitting unit 12 is filled with nitrogen gas.
【００３８】この実施形態のＥＬ素子の製造方法は、透
明基板１０の表面に上記と同様の方法で発光部１２を形
成し、接着剤１４を設ける。また封止体３０の所定の位
置には予め複数の透孔３２を形成し、はんだつけ等の熱
処理工程を必要とする電子部品を設ける。In the method of manufacturing an EL device according to this embodiment, the light emitting section 12 is formed on the surface of the transparent substrate 10 in the same manner as described above, and the adhesive 14 is provided. In addition, a plurality of through holes 32 are formed in predetermined positions of the sealing body 30 in advance, and electronic components that require a heat treatment process such as soldering are provided.
【００３９】次に透孔３２内に乾燥剤３４を充填し、回
路パターン１６形成面の反対側の側面で、透孔３２を覆
うように密封部材３６を接着剤等で接着固定する。Next, a desiccant 34 is filled in the through hole 32, and a sealing member 36 is fixed with an adhesive or the like so as to cover the through hole 32 on the side surface opposite to the surface on which the circuit pattern 16 is formed.
【００４０】次に窒素雰囲気下で接着剤１４と回路用接
続部２２が接続するように透明基板１０と封止体３０を
接合し、熱圧着により密封するとともに、接着剤１４に
異方性をもたせる。Next, the transparent substrate 10 and the sealing body 30 are joined so that the adhesive 14 and the circuit connecting portion 22 are connected in a nitrogen atmosphere, and the sealing is performed by thermocompression bonding. Give it.
【００４１】さらに接着剤１４の外側面や透明基板１０
及び封止体３０の接合部に気密性が高く、高温の加熱処
理を必要としないＵＶ硬化樹脂等の樹脂を塗布してもよ
い。Further, the outer surface of the adhesive 14 and the transparent substrate 10
Alternatively, a resin such as a UV-curable resin that does not require high-temperature heat treatment may be applied to the joint of the sealing body 30.
【００４２】この実施形態のＥＬ素子によれば、透孔３
２を利用し乾燥剤３４を充填することにより、通常の製
造工程で製造される封止体をそのまま用いることができ
る。また乾燥剤２８に酸化防止剤等を混合してもよく、
空間２０内の環境に悪影響を与えないものであればよ
い。According to the EL device of this embodiment, the holes 3
By using 2 and filling the desiccant 34, a sealed body manufactured in a normal manufacturing process can be used as it is. Further, an antioxidant or the like may be mixed with the desiccant 28,
Any material that does not adversely affect the environment in the space 20 may be used.
【００４３】なおこの発明のＥＬ素子は、上記実施形態
に限定されるものではなく、ＥＬ材料や乾燥剤を適宜選
択することが可能であり、電極等の薄膜の形成は、蒸着
以外のスパッタリングやその他の真空薄膜形成技術によ
り形成してもよい。The EL device of the present invention is not limited to the above embodiment, and an EL material and a desiccant can be appropriately selected. The thin film such as an electrode can be formed by sputtering other than vapor deposition. It may be formed by other vacuum thin film forming techniques.
【００４４】[0044]
【発明の効果】この発明のＥＬ素子とその製造方法は、
封止体に回路パターンを形成し、導電性の接着剤を介し
て電気的に接続させることにより、ＥＬ素子を薄く、小
型、軽量化することができる。また表示装置における発
光面の割合が大きくなり、相対的に発光面以外の面によ
る実質占有面積を減少させることが可能である。さらに
従来のような高価な封止体を用いることなく製造方法も
容易なものであることから、製造コストを押さえること
ができる。According to the present invention, the EL device and the method for manufacturing the same are as follows.
By forming a circuit pattern on the sealing body and electrically connecting the EL element via a conductive adhesive, the EL element can be thinner, smaller, and lighter. Further, the proportion of the light emitting surface in the display device is increased, and the substantial occupation area by the surface other than the light emitting surface can be relatively reduced. Furthermore, since the manufacturing method is easy without using an expensive sealing body as in the related art, the manufacturing cost can be suppressed.
【図１】この発明の第一実施形態のＥＬ素子を示す断面
図である。FIG. 1 is a sectional view showing an EL device according to a first embodiment of the present invention.
【図２】この発明の第二実施形態のＥＬ素子を示す断面
図である。FIG. 2 is a sectional view showing an EL device according to a second embodiment of the present invention.
【図３】この発明の第三実施形態のＥＬ素子を示す断面
図である。FIG. 3 is a sectional view showing an EL element according to a third embodiment of the present invention.
１０ 透明基板 １２ 発光部 １４ 接着剤 １６ 回路パターン １８，２４，３０ 封止体 ２０ 空間 ２２ 回路用接続部 ２６ 凹部 ２８，３４ 乾燥剤 ３２ 透孔 ３６ 密封部材 DESCRIPTION OF SYMBOLS 10 Transparent substrate 12 Light emitting part 14 Adhesive 16 Circuit pattern 18, 24, 30 Sealing body 20 Space 22 Circuit connection part 26 Depression 28, 34 Desiccant 32 Through-hole 36 Sealing member
───────────────────────────────────────────────────── フロントページの続き (72)発明者 福本 滋 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shigeru Fukumoto 3158 Shimookubo, Osawano-cho, Kamishinkawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd.
Claims (7)
より形成された透明電極と、この透明電極に積層された
ＥＬ材料からなる発光層と、この発光層に積層され、上
記透明電極に対向して形成された背面電極とからなる発
光部を備え、上記発光部を覆う回路基板材料からなる封
止体が設けられ、上記透明な基板と上記封止体は一部分
で導電性を有する接着剤により周囲が接着され、上記透
明な基板と上記封止体の間の空間が密封されて互いに固
定されていることを特徴とするＥＬ素子。1. A transparent electrode formed of a transparent electrode material on a surface of a transparent substrate, a light emitting layer of an EL material laminated on the transparent electrode, and a light emitting layer laminated on the light emitting layer and facing the transparent electrode. A light-emitting portion comprising a back electrode formed by forming a sealing member made of a circuit board material covering the light-emitting portion, wherein the transparent substrate and the sealing member are partially conductive and have an adhesive. An EL element characterized in that the periphery thereof is adhered to the transparent substrate and the space between the transparent substrate and the sealing body is sealed and fixed to each other.
された空間には、不活性ガスが充填されていることを特
徴とする請求項１記載のＥＬ素子。2. The EL device according to claim 1, wherein a sealed space between the transparent substrate and the sealing body is filled with an inert gas.
された空間には、乾燥剤あるいは酸化防止剤が設けられ
ていることを特徴とする請求項１または２記載のＥＬ素
子。3. The EL device according to claim 1, wherein a desiccant or an antioxidant is provided in a sealed space between the transparent substrate and the sealing body.
された空間の上記封止体には凹部を有し、この凹部に上
記乾燥剤あるいは酸化防止剤が設けられていることを特
徴とする請求項１または２記載のＥＬ素子。4. The sealing body in a sealed space between the transparent substrate and the sealing body has a concave portion, and the drying agent or the antioxidant is provided in the concave portion. 3. The EL device according to claim 1, wherein:
形成され、この回路パターンと上記背面電極と透明電極
とが、上記接着剤を介して電気的に接続したことを特徴
とする請求項１記載のＥＬ素子。5. A circuit pattern is formed on a surface of the sealing body, and the circuit pattern, the back electrode, and the transparent electrode are electrically connected via the adhesive. 2. The EL device according to 1.
ことを特徴とする請求項１または５記載のＥＬ素子。6. The EL device according to claim 1, wherein the adhesive is an anisotropic conductive resin.
より透明電極を形成し、この透明電極にＥＬ材料からな
る発光層を真空薄膜形成技術により積層し、上記発光層
に背面電極を真空薄膜形成技術により積層して発光部を
形成し、上記背面電極を囲むように上記発光部の縁周部
に、一部分で導電性を有する接着剤を塗布し、加圧して
上記透明な基板と封止体とを電気的に接続し、回路基板
材料からなる封止体の所定の位置に上記発光部を密封す
るように、上記接着剤により上記透明な基板を固定する
ＥＬ素子の製造方法。7. A transparent electrode is formed on a surface of a transparent substrate using a transparent electrode material, a light emitting layer made of an EL material is laminated on the transparent electrode by a vacuum thin film forming technique, and a back electrode is formed on the light emitting layer by a vacuum thin film. A light emitting portion is formed by laminating by a forming technique, and an adhesive having a partial conductivity is applied to a peripheral portion of the light emitting portion so as to surround the back electrode, and is pressurized and sealed with the transparent substrate. A method for manufacturing an EL element, wherein the transparent substrate is fixed by the adhesive so as to electrically connect the substrate to the body and to seal the light emitting portion at a predetermined position of a sealing body made of a circuit board material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10134318A JPH11312581A (en) | 1998-04-27 | 1998-04-27 | El element and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10134318A JPH11312581A (en) | 1998-04-27 | 1998-04-27 | El element and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11312581A true JPH11312581A (en) | 1999-11-09 |
Family
ID=15125509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10134318A Pending JPH11312581A (en) | 1998-04-27 | 1998-04-27 | El element and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11312581A (en) |
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1998
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