TWI306014B - - Google Patents
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- Publication number
- TWI306014B TWI306014B TW95118666A TW95118666A TWI306014B TW I306014 B TWI306014 B TW I306014B TW 95118666 A TW95118666 A TW 95118666A TW 95118666 A TW95118666 A TW 95118666A TW I306014 B TWI306014 B TW I306014B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- thermal
- layered
- conductive sheet
- heating element
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 claims description 34
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 2
- 235000006040 Prunus persica var persica Nutrition 0.000 claims 1
- 240000006413 Prunus persica var. persica Species 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 9
- 239000004020 conductor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 206010036790 Productive cough Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095118666A TW200744436A (en) | 2006-05-25 | 2006-05-25 | Layered thermal conductive interface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095118666A TW200744436A (en) | 2006-05-25 | 2006-05-25 | Layered thermal conductive interface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200744436A TW200744436A (en) | 2007-12-01 |
| TWI306014B true TWI306014B (https=) | 2009-02-01 |
Family
ID=45071278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095118666A TW200744436A (en) | 2006-05-25 | 2006-05-25 | Layered thermal conductive interface |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200744436A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115500043A (zh) * | 2021-06-18 | 2022-12-20 | 亚旭电脑股份有限公司 | 散热装置组装方法与散热装置 |
| CN117279282A (zh) * | 2023-11-13 | 2023-12-22 | 东莞记忆存储科技有限公司 | 一种具有散热器的微应力板卡 |
-
2006
- 2006-05-25 TW TW095118666A patent/TW200744436A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200744436A (en) | 2007-12-01 |
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