1305709 九、發明說明： 【發明所屬之技術領域】. 本發明係關於一種熱壓機，尤指一種其下模組包含有一可進 行預熱作業之加熱裝置以防止假銲並縮短製程時間之熱壓機。 【先前技術】 近幾年各種電子產品皆要求輕、薄、短、小，因此產品的使 用空間受到極大的關’凡舉液晶顯示器、筆記型電腦、手機等 等，所以在有限的空間内就必須要讓電路板間的連接元件能夠產 生繞曲，在此製程環境下軟式電路板就產生極為重要的角色。相 對的，硬式電路板與軟歧路板的紐合製程品_備受重視。 雖…：此項製私與機器設備已被研發數年，但亦有一些瓶頸不能 打破，請參考以下之說明： 第1圖為習知軟式電路板116與硬式電路板100之示意圖。如 第】圖所不’ -硬式電路板1〇〇具有不可繞曲性，其包含有一環 氧曰玻璃纖維基板搬、革少一主動元件刚、複數個被動元件 1〇6、複數個定位孔1〇8、複數個鮮塾⑽、複數個固定鲜塾⑴ 及接地大銅面114，其中銲㈣〇及第-固定録塾112具有錫錯 金屬及助銲劑。—軟式電路板116具有可繞曲性，其包含有一紛 月a基板118複數個定位孔12()、複數個第二固定鮮塾n 複數個零件腳124、她個賴線路126、複數個大銅面128及複 5 1305709 數個聯結端130。其中，當進行硬式電路板100與軟式電路板116 的熱壓合過程中，接地大銅面114與大銅面128會快速吸取熱壓 裝置（圖未不）所提供的熱能，而使其溫度無法完全達到融熔銲 '墊110上的錫鉛，因此造成硬式電路板100與軟式電路板116連 結不良’並形成假銲，大幅降低產品良率。此外，硬式電路板1〇〇 與軟式電路板116上皆有第一及第二固定銲墊112及122的設計， 其功能為增加抗拉扯的強度，但因製程上的限制無法由同一組熱 _ 魏置來完成銲接工作’而需由線外人工手鋅，形成人力浪費。 因此，本發明之機器的研發可運用在各軟、硬式電路板的熱壓 合工作，更能解決以上所列之二大問題，而使此製程作業更趨完 美。 【發明内容】 本發明之主要目的在於提供一種熱壓機，以解決習知技術中 所產生假銲的情形，以提高產品的良率。 為達上述目的，本發明提供一種熱壓機，其包含至少一下模 、⑽及至}-可動式上模組。其中，下模組具有—可調節溫度以 進仃預熱作業之加熱裝置，而可動式上模組，具有―熱壓裳置， 可相對下模組之加熱裝置移動，以在加熱裝置上進行—熱壓合作 業。此外，本㈣之熱壓機另包含至少―上蓋板，將位於加熱裝 置上之-軟式電路板與一硬式電路板壓住，以使熱壓裝置進行熱 1305709 壓合作業時，不致於讓軟式電路板與硬式電路板因下壓力量而產 生偏移。然後練式電路減硬枝路板藉由加錄置之預熱， 攝&1()()至15G度之間。最後制用紐裝置將軟 式電路板上之複數個零件腳分別銲接於硬式電路板之複數個銲墊 上0 由於本發明係具有可調節溫度之加熱裝置的下模組使得 •軟式電路板與硬式電路板的溫度維持於攝氏100至15〇度之間， 如此备進行熱壓合時’熱壓裝置的熱能將不會快速地被軟、硬式 電路板之大銅面所吸收，因此軟式電路板之零件腳具備足夠的熱 能來融溶錫錯並且確實的與硬式電路板之鲜塾連接，進而防止假 銲的_發生。此外，本剌之可溫㈣加絲置能於熱壓 合作業進行前預先將軟式電路板與硬式電路板加熱，因此可減少 熱壓合所需的咖，輯到驗製辦間的目的。 _ —為了使貝審查委員能更近一步瞭解本發明之特徵及技術内 令"月參閱以下有關本發明之詳細說明與附圖。然而所附圖式僅 供參考與辅助說明用，並非用來對本發明加以限制者。 【實施方式】 首先藉由第2圖及第3圖簡述本發明之熱壓機之基本構造盘 請參閱第2圖，第2圖為本發明第—較佳實施例之熱 壓機30的立體示意圖。如第2圖所示，本發明之熱壓機3〇包含 1305709 有-可動式上模組32以及-下模組36。其中，可動式上模組& 具有一熱壓裝置34，例如：·熱壓頭，且熱壓裝置34内包含有至少 高電阻材料(圖未顯示）’並藉由-高電流漁(圖未顯句提供一 .雌電、舒健裝置34之高電晴料，可絲壓裝置34於瞬間 產生高溫。而下模組36具有一可調節溫度之加熱裝置37，可依使 用者之不同需求，設-適當之加熱溫度細，於加熱至該溫度範 圍後’則維持於此溫度範圍。此外，熱壓機3〇另包含有至少一驅 % 動裝置(圖未顯示）’可以利用如氣動的方式下壓可動式上模組32， 以使可動紅她32之麗裝置34可姆下池36之加熱裝置 37移動，以在加熱裝置37上進行一熱壓合作業。 ή考第3圖’第3圖為本發明第—較佳實施例之熱麼機3〇 熱壓合二電路板50及70之立體示意圖。如第3圖所示，一硬式 電路板50放置於下模組36之加熱裝置37的上方表面，再於硬式 鲁電路板5〇上方放置一軟式電路板％，其中軟式電路板％包含有 複數個零件腳72 ’且硬式電路板5〇至少包含有相對應數量之焊塾 52，接著再於硬式電路板5〇與軟式電路板％ ±方放置一上蓋板 90 ’將位於加熱農置3?上之二電路板5〇與％壓住，以使熱壓裝 置34進彳了缝合作料致於絲^電路板％與硬式電路板 50因下壓力量而產生偏移。 /由於加熱裝置37可轉於所設定之溫度細，在此較佳實施 例係將脈度|&圍设定於攝氏繼至15〇度之間，以對加熱裝置上 8 1305709 的硬式電路板50與軟式電路板7〇進行預熱至攝氏丨⑻至15〇度 之間。在此溫度範圍並不會破壞與加熱裝置接觸之電路板表面， 亦不會使原本銲於電路板與其上的電子元件間的銲錫產生再熔之 現象。當然本發明下模組之加熱裝置預熱的溫度並不以攝氏 至⑼度間為限，可依不同電路板之材質或使用者需求，調整至 一較佳之溫度範圍。 利用驅動裝置(圖未顯示)驅動可動式上模組，以使熱壓裝 置34下壓，並於軟式電路板70之零件腳72與硬式電路板5〇之 銲墊52進行一熱壓合作業，由於硬式電路板5〇與軟式電路板％ 皆預先藉由可調節溫度之加熱裝置37加熱至攝氏溫度励至15〇 度之間’因此當錢裝置34進行熱壓合時，各鮮墊％之锡船皆 能獲得足夠的··完全祕，且#軟式板7()上具有大銅 面8〇時，熱能不會迅速地被大銅面8〇所吸收，使得各零件腳72 得以確實焊接於各銲墊52上，不會有假銲的_發生，提高產品 良率，此項優點特別當零件腳72的數目越多時，越加明顯。 值得注意的是，本發明熱壓機3〇之下模組36的加熱裝置37， 係可視製程的需要設計成—感應式的加歸置，當二電 70放置於下模組36上方並蓋上上蓋板9G後，錢行加熱至 預定溫度’或者設計成—恒溫的加紐置，將溫度—直維持於預 定溫度。在此較佳實施例中的加熱裝置37係為恆溫加熱裝置，且 由第4圖可知，加熱裝置37包含有一發熱塊66與—隔熱真空塊 1305709 64。發熱塊66上設有複數個定位栓56，主要功用在定位軟、硬式 電路板70及50。且發熱塊66與一加熱棒94連接，藉由一可調式 溫度控制器92之控制，使加熱棒94對加熱塊66加熱至攝氏1〇〇 至15〇度間’並保持於此溫度範圍中，以對置於加熱塊66上軟、 硬式電路板70、50進行預熱作業。另外，恆溫隔熱真空塊64，係 為設於加触66之觸’主要拥在嫌隔加触66之熱源傳 導至位於加熱塊外的電路板7〇、5〇之其它部份，且隔熱真空塊 64上设有複數個真空孔76 ,由—真空產生器(圖未示)產生真空， 具有定位、吸附及平坦化軟式電路板7〇的功用。 再參閱第4圖及下列步驟說明可更清楚明瞭本發明之軟、硬 式電路板熱壓結合的動作及熱壓機的功能。 步驟一：首先將硬式電路板5〇上的複數個第一定位孔54對 準下模組36的複數個定位栓（pin) %，將硬式電路板％放置於 :模組36的部品轉平台上。另軟式f路板7〇上的複數個第二 疋位孔74對準相對應之定位栓％，放置於硬式電路板％上方， 並利=真空赶器赴真空透過真空孔76對軟式板％予以 吸附疋位及平坦化，此時，軟、硬式電路板％及％上的第二、 第固疋!干t* 78、58及熱壓合區(即軟式電路板7〇上的零件腳72 與硬式電路板的㈣52)均位於加熱塊66上，且相互對準。 步驟二：當定位對準就續後，將-上蓋板90移到軟、硬式電 1305709 路板70及5G的紐合區並壓絲式電路板％與硬式電路板， 以防止軟、硬式電路板70及50因熱壓錢34下舰舰合區的 力量而產生偏移。 步驟三：在此同時，可調式溫度控制器92經由加熱棒94提 供溫度（約攝氏100〜15〇度）給發熱塊66，使發熱塊66 一直持續 維持在ϋ溫狀態。此步齡要拥在於提供熱_硬式電路板 5〇之熱壓合區，進行酿健，域錄溫隔減空塊64之阻 隔’防止加熱塊之熱源傳導至軟、硬式電路板7〇及5〇之熱壓合 區以外區域。 步驟四.熱壓裝置34下壓，使軟式電路板7〇與硬式電路板 5〇對應之舰合區結合，在紐裝置34尚未抬起前，由—空氣冷 部官96提供-高壓空氣吹拂冷卻熱壓裝置％及紐合區上的錫 鉛，完成後將熱壓裴置34抬起至定位點。 藉由加熱塊66於顏裝置34下塵前之預熱作業，可防止熱 壓裝置34的熱源被軟、硬式電路板7〇及5〇之大銅面8〇吸收或 傳導至下漁36，所造祕壓合雜鮮足所產生之贿情形。 明參閱第5圖，第5圖為本發明第二較佳實施例之多頭熱壓 機200的示意圖。如第5圖所示，本發明之熱壓機200可為一脈 衝式多頭熱壓機’其包含有三組可動式上模組搬、撕與2〇6、 1305709 二組下模組214與216、三組空氣冷卻管228、230與232、一下 模組平台234 ’及一滑軌236。其中’可動式上模組202、204與 206、下模組214與216，及空氣冷卻管228、230與232之構造與 功能均與第一較佳實施例所述相同，故在此不再贅述。不同的是， 此較佳實施例具有二下模組214、216設於下模組平台234上，且 下模組平台234滑設於滑軌236上，可帶動二下模組214、216在 滑執上滑動’以在三可動式上模組202、204、206下變換位置， • 以與不同之上模組202、204、206對應，進行熱壓合作業。當然， 本發明之熱壓機亦可依實際作業之需要，設計為配置有不同數量 之可動式上模組及下模組。 此較佳實施例係利用上模組2〇2、2〇6進行軟、硬式電路板之 零件腳與銲塾之熱壓合作業，另以上模組綱進行軟、硬式電路 板之第一、二固定銲墊之熱壓合作業。 分別於下模組214、216上欲接合之一組軟、硬式電路板，藉 由上模組204向下模組214壓合，以對下模組214上的軟、硬式 電路板(以下簡稱第-組電路板)進行第一、二固定銲墊之孰壓人作 此同時，上模組施向下模組216壓合，以對下模組二 埶壓^式^她扇第：組電路峨行零件腳與銲塾之 墨合後，藉㈣响⑽_6成== 216分別移置上模组加 使下松組214、 模、，且202、綱之下’同時驅動上模組搬、綱 1305709 向下模組214、216壓合，以分別對第一、二組電路板進行零件腳 與銲墊、第一、二固定銲墊之熱壓合作業。藉此，本發明之熱壓 機200可同步處理二組軟、硬式電路板之熱壓合作業，具有節省 工時的優點。 相較於習知技術，由於本發明之熱壓機係利用具有可調節溫 度之加熱裝置的下模喊得㈣祕減硬式電路板的溫度維持 於攝氏100至150度之間，如此當進行熱壓合時，熱壓裝置的熱 能將不會快速地被軟、硬式電路板之大銅面所吸收，因此軟式電 路板之零件腳具備足夠的熱能來融熔錫鉛，並且確實地與硬式電 路板之麵墊連接，進而防止假銲的情开)發生。此外，本發明之可 調節溫度的加絲置能於紐合作業進行前預先練式電路板與 硬式電路板加熱，目此可減少熱壓合所需的咖，以翻縮短製 程時間的目的。同時軟、硬式電路板上之固定驗亦能於同一機 台上完成熱壓合作業’可大量節省人工手銲之人力浪費。另外， 本發明之麵機可同步處理纽軟、硬式電職，所以具有節省 工時的優點。 以上所述僅為本發明之較佳實施例，凡依本發明申請專利範 圍所做之解變化與修飾，皆闕本發私涵蓋範圍。 1305709 【圖式簡單說明】 第1圖為習知軟式電路板與硬式電路板之示意圖。 第2圖為本發明第—較佳實施例之熱壓機的立體示意圖。 第3圖為本發明第—較佳實施例之熱壓機熱壓合二電路板之立 示意圖。 第4圖為本發明第一較佳實施例之熱壓機的細部立體示意圖。 第5圖為本發明第二較佳實施例之多頭熱壓機的示意圖。 【主要元件符號說明】 3〇熱壓機 32 可動式上模組 34 熱壓裝置 36 下模組 37 加熱裝置 50 硬式電路板 52 銲墊 54 第一定位孔 56 定位栓 58 第一固定銲墊 64 隔熱真空塊 66 發熱塊 70 軟式電路板 72 零件腳 74 第二定位孔 76 真空孔 78 第二固定銲墊 80 大銅面 90 上蓋板 92 可調式溫度控制器 94 加熱棒 96 空氣冷卻管 102 基板 .100 硬式電路板 106 被動元件 104 主動元件 110 銲·塾 108 定位孔 14 1305709 114 接地大銅面 112 第一固定銲墊 118 基板 116 軟式電路板 122 第二固定銲墊 120 定位孔 126 銅箔線路 124 零件腳 130 聯結端 128 大銅面 202 可動式上模組 200 熱壓機 206 可動式上模組 204 可動式上模組 210 熱壓裝置 208 熱壓裝置 214 下模組 212 熱壓裝置 228 空氣冷卻管 216 下模組 232 空氣冷卻管 230 .空氣冷卻管 236 滑軌 234 下模組平台 151305709 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a hot press, and more particularly to a heating device capable of preheating the lower module to prevent false welding and shorten the heat of the process time. press. [Prior Art] In recent years, all kinds of electronic products are required to be light, thin, short, and small. Therefore, the use space of the products is greatly reduced, such as liquid crystal displays, notebook computers, mobile phones, etc., so in a limited space The connection between the boards must be able to produce a wrap, and the flexible board plays an extremely important role in this process environment. Relatively, the matching process of hard circuit boards and soft manifolds is highly valued. Although...: This private and machine equipment has been developed for several years, but there are some bottlenecks that cannot be broken. Please refer to the following explanation: Figure 1 is a schematic diagram of a conventional flexible circuit board 116 and a hard circuit board 100. As shown in the figure, the hard circuit board 1〇〇 has non-refractorability, and includes an epoxy fiberglass substrate, a small active element, a plurality of passive components, and a plurality of positioning holes. 1〇8, a plurality of fresh glutinous rice (10), a plurality of fixed fresh enamels (1) and a grounded large copper surface 114, wherein the welding (four) 〇 and the first fixed 塾 112 have tin metal and flux. The flexible circuit board 116 has a flexible shape, and includes a plurality of positioning holes 12 () of the substrate 118, a plurality of second fixed blanks, a plurality of component legs 124, a plurality of lines 126, and a plurality of large Copper surface 128 and complex 5 1305709 several coupling ends 130. Wherein, during the thermal compression process of the rigid circuit board 100 and the flexible circuit board 116, the grounded large copper surface 114 and the large copper surface 128 quickly absorb the heat energy provided by the hot pressing device (not shown) to make the temperature thereof The tin-lead on the fusion soldering pad 110 cannot be completely achieved, thus causing poor connection between the rigid circuit board 100 and the flexible circuit board 116 and forming a false soldering, which greatly reduces the product yield. In addition, both the rigid circuit board 1 and the flexible circuit board 116 have the design of the first and second fixing pads 112 and 122, and the function is to increase the tensile strength, but the same group of heat cannot be used due to the limitation of the process. _ Wei set up to complete the welding work' and need to use artificial zinc outside the line to form a waste of manpower. Therefore, the development of the machine of the present invention can be applied to the thermal compression work of various soft and rigid circuit boards, and the two major problems listed above can be solved, and the process operation is more perfect. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a hot press to solve the situation of the false welding generated in the prior art to improve the yield of the product. To achieve the above object, the present invention provides a hot press comprising at least a lower mold, (10) and to a movable movable module. Wherein, the lower module has a heating device capable of adjusting the temperature to enter the preheating operation, and the movable upper module has a "hot pressing", which can be moved relative to the heating device of the lower module to perform on the heating device - Hot pressing cooperation. In addition, the heat press of (4) further comprises at least an "upper cover" for pressing the flexible circuit board on the heating device with a rigid circuit board, so that the hot pressing device performs the heat cooperation of 1305709, so as not to let The flexible circuit board and the hard circuit board are offset due to the amount of downward pressure. Then the training circuit hardened the road board by adding the preheating, taking &1()() to 15G degrees. Finally, the device is used to solder a plurality of component legs on the flexible circuit board to the plurality of pads of the hard circuit board. 0 Since the present invention has a lower module of a temperature-adjustable heating device, the flexible circuit board and the hard circuit The temperature of the board is maintained between 100 and 15 degrees Celsius. When hot pressing is performed, the thermal energy of the hot pressing device will not be quickly absorbed by the large copper surface of the soft and hard circuit board, so the flexible circuit board The foot of the part has enough thermal energy to melt the tin and is indeed connected to the fresh circuit board, thus preventing the occurrence of false soldering. In addition, the temperature (4) wire can be used to heat the flexible circuit board and the hard circuit board before the hot pressing cooperation, so that the coffee required for the hot pressing can be reduced, and the purpose of the inspection office can be reduced. _ - In order to enable the Beck Review Board to take a closer look at the features and technical details of the present invention, the following detailed description of the present invention and the accompanying drawings are incorporated. The drawings are to be considered in all respects as illustrative and not restrictive. [Embodiment] First, a basic structural disk of a hot press of the present invention will be briefly described with reference to FIGS. 2 and 3, and FIG. 2 is a second embodiment of the hot press 30 of the first preferred embodiment of the present invention. Stereoscopic view. As shown in Fig. 2, the hot press 3 of the present invention comprises a 1305709-movable upper module 32 and a lower module 36. Wherein, the movable upper module & has a hot pressing device 34, for example: a thermal indenter, and the hot pressing device 34 contains at least a high-resistance material (not shown) and is driven by high current (Fig. The high-powered clearing material of the female electric and comfort device 34 is provided, and the wire pressing device 34 generates high temperature in an instant. The lower module 36 has a heating device 37 capable of adjusting the temperature, which can be different according to the user. The demand is set such that the appropriate heating temperature is fine, and after heating to the temperature range, the temperature is maintained. In addition, the hot press machine 3 further includes at least one actuator (not shown). The movable upper module 32 is pressed in a pneumatic manner to move the heating device 37 of the movable lower chamber 36 to perform a hot pressing cooperation on the heating device 37. 3 is a perspective view of a thermal printer 3 and a thermocomposite circuit board 50 and 70 according to a preferred embodiment of the present invention. As shown in FIG. 3, a rigid circuit board 50 is placed in the lower module 36. a top surface of the heating device 37, and then placed a soft electric device above the hard circuit board 5 The board %, wherein the flexible board % includes a plurality of part legs 72' and the hard board 5 〇 contains at least a corresponding number of pads 52, and then placed on the hard board 5 〇 and the flexible board % ± square An upper cover 90' will press the two circuit boards 5〇 and % on the heating farm 3 to press the hot pressing device 34 into the seaming material to the wire board % and the hard circuit board 50 The amount of downward pressure is offset. / Since the heating device 37 can be rotated to the set temperature, in the preferred embodiment, the pulse degree & is set between Celsius and 15 degrees, to The hard circuit board 50 of the 8 1305709 on the heating device and the flexible circuit board 7〇 are preheated to between 摄(8) and 15 degrees Celsius. The temperature range does not damage the surface of the circuit board that is in contact with the heating device, nor does it The solder which is soldered between the circuit board and the electronic components on the circuit board is remelted. Of course, the temperature of the heating device of the lower module of the present invention is not limited to between Celsius and (9) degrees, and can be different according to different circuit boards. Material or user requirements, adjusted to a better temperature range The movable upper module is driven by a driving device (not shown) to press the hot pressing device 34, and a hot pressing cooperation is performed between the component foot 72 of the flexible circuit board 70 and the soldering pad 52 of the hard circuit board 5 Since the hard circuit board 5〇 and the flexible circuit board are all heated in advance by the temperature-adjustable heating device 37 to a temperature of 15 degrees Celsius, so when the money device 34 is hot-pressed, each fresh pad The tin boat of % can get enough ································································································ It is indeed soldered to each of the pads 52, and no false soldering occurs, which improves the product yield. This advantage is especially noticeable when the number of the component legs 72 is increased. It should be noted that the heating device 37 of the module 36 under the heat press of the present invention is designed to be inductively added and placed according to the needs of the process, and the second battery 70 is placed above the lower module 36 and covered. After the upper cover 9G, the money is heated to a predetermined temperature 'or designed to be a constant temperature, and the temperature is maintained at a predetermined temperature. The heating device 37 in the preferred embodiment is a constant temperature heating device, and as can be seen from Fig. 4, the heating device 37 includes a heat generating block 66 and an insulating vacuum block 1305709 64. The heating block 66 is provided with a plurality of positioning pins 56 for mainly positioning the soft and hard circuit boards 70 and 50. And the heating block 66 is connected to a heating rod 94, and the heating rod 94 heats the heating block 66 to between 1 〇〇 and 15 摄 in the temperature range and is maintained in the temperature range by the control of an adjustable temperature controller 92. The preheating operation is performed on the soft and rigid circuit boards 70, 50 placed on the heating block 66. In addition, the constant temperature insulating vacuum block 64 is disposed at the touch of the touch 66, and is mainly conducted by the heat source of the susceptor plus the contact 66 to the other parts of the circuit board 7〇, 5〇 located outside the heating block, and is separated. The vacuum block 64 is provided with a plurality of vacuum holes 76. The vacuum is generated by a vacuum generator (not shown), and has the function of positioning, adsorbing and flattening the flexible circuit board 7〇. Referring to Fig. 4 and the following steps, the operation of the thermocompression bonding of the soft and hard circuit board of the present invention and the function of the hot press can be more clearly understood. Step 1: First, the plurality of first positioning holes 54 on the hard circuit board 5 are aligned with the plurality of positioning pins (pin) % of the lower module 36, and the hard circuit board % is placed on the part conversion platform of the module 36. on. The plurality of second clamping holes 74 on the flexible f-plate 7 are aligned with the corresponding positioning pin %, placed above the hard circuit board %, and the vacuum driver goes to the vacuum through the vacuum hole 76 to the soft board% Adsorption and flattening, at this time, the second and second solids on the soft and hard boards % and %, dry t* 78, 58 and the hot press area (ie the part feet on the flexible circuit board 7〇) 72 and (4) 52) of the rigid circuit board are both located on the heating block 66 and are aligned with each other. Step 2: When the alignment is continued, move the upper cover 90 to the soft and hard electrical 1305709 board 70 and 5G junction area and press the circuit board % and the hard circuit board to prevent soft and hard The boards 70 and 50 are offset by the force of the ship's combined area under heat. Step 3: At the same time, the adjustable temperature controller 92 supplies a temperature (about 100 to 15 degrees Celsius) to the heat generating block 66 via the heating rod 94, so that the heat generating block 66 is continuously maintained in the temperature state. This step is to provide hot _ hard circuit board 5 〇 hot nip area, to carry out the brewing, the field recording temperature isolation block 64 barrier 'to prevent the heat source of the heating block to the soft and hard circuit board 7 〇 5〇 The area outside the hot press area. Step 4. The hot pressing device 34 is pressed down, so that the flexible circuit board 7〇 is combined with the ship-in area corresponding to the hard circuit board 5〇, and the air-cooling department officer 96 provides the high-pressure air blowing before the button device 34 has been lifted. The hot-pressing device % and the tin-lead on the bonding zone are cooled, and after completion, the hot-pressing device 34 is lifted up to the positioning point. By the preheating operation of the heating block 66 before the dusting of the device 34, the heat source of the hot pressing device 34 can be prevented from being absorbed or transmitted to the lower fishing 36 by the soft and hard circuit board 7〇 and the large copper surface 8〇. The bribery situation caused by the secrets made by the secrets. Referring to Figure 5, Figure 5 is a schematic view of a multi-head hot press 200 in accordance with a second preferred embodiment of the present invention. As shown in FIG. 5, the hot press 200 of the present invention can be a pulse type multi-head hot press 'which includes three sets of movable upper modules for moving, tearing and 2〇6, 1305709 two sets of lower modules 214 and 216. Three sets of air cooling tubes 228, 230 and 232, a lower module platform 234' and a sliding rail 236. The configurations and functions of the movable upper modules 202, 204 and 206, the lower modules 214 and 216, and the air cooling tubes 228, 230 and 232 are the same as those described in the first preferred embodiment, so that they are no longer Narration. The second embodiment of the present invention has two lower modules 214 and 216 disposed on the lower module platform 234, and the lower module platform 234 is slidably disposed on the sliding rail 236 to drive the two lower modules 214 and 216. Sliding on the slider to reduce the position of the three movable upper modules 202, 204, 206, and corresponding to the different upper modules 202, 204, 206 for hot pressing cooperation. Of course, the hot press of the present invention can also be designed with different numbers of movable upper and lower modules according to actual operation requirements. In the preferred embodiment, the upper module 2〇2, 2〇6 is used for the hot pressing cooperation between the parts and the soldering of the soft and hard circuit board, and the above module is the first of the soft and hard circuit boards. The second hot pad is a hot pressing cooperation industry. A set of soft and hard circuit boards are respectively connected to the lower modules 214 and 216, and the lower module 214 is pressed by the upper module 204 to the soft and hard circuit boards on the lower module 214 (hereinafter referred to as The first-group circuit board performs the pressing of the first and second fixed pads. At the same time, the upper module applies the downward module 216 to press the lower module to the second module. After the circuit is finished with the parts and the ink of the soldering iron, the (4) ringing (10)_6%== 216 respectively displaces the upper module and the lowering group 214, the mode, and the 202 and the lower part simultaneously drive the upper module to move, The element 1305709 is pressed down to the lower modules 214 and 216 to perform the hot pressing cooperation of the component legs and the pads, and the first and second fixed pads on the first and second sets of circuit boards, respectively. Thereby, the hot press 200 of the present invention can simultaneously process the hot press cooperation of two sets of soft and hard circuit boards, and has the advantage of saving man-hours. Compared with the prior art, since the hot press of the present invention utilizes a lower mold having a temperature-adjustable heating device, the temperature of the hard circuit board is maintained between 100 and 150 degrees Celsius, so that heat is performed. When pressed, the thermal energy of the hot pressing device will not be quickly absorbed by the large copper surface of the soft and hard circuit board, so the parts of the flexible circuit board have sufficient thermal energy to melt the tin and lead, and indeed with the hard circuit The surface pads of the board are connected to prevent the occurrence of false soldering. In addition, the temperature-adjustable wire feeding of the present invention can be used in the pre-pushing circuit board and the hard circuit board heating in the New Zealand industry, thereby reducing the need for hot pressing to shorten the processing time. At the same time, the fixed inspection on the soft and hard circuit boards can also complete the hot pressing cooperation on the same machine, which can save a lot of manpower for artificial hand welding. In addition, the noodle machine of the present invention can simultaneously process the soft and hard electric jobs, so that it has the advantage of saving man-hours. The above description is only the preferred embodiment of the present invention, and all the changes and modifications made by the patent application scope of the present invention are within the scope of the present disclosure. 1305709 [Simple description of the diagram] Figure 1 is a schematic diagram of a conventional flexible circuit board and a rigid circuit board. Fig. 2 is a perspective view showing the hot press of the first preferred embodiment of the present invention. Fig. 3 is a perspective view showing the hot-pressed two-circuit board of the hot press of the first preferred embodiment of the present invention. Figure 4 is a detailed perspective view of a hot press of a first preferred embodiment of the present invention. Figure 5 is a schematic view of a multi-head hot press of a second preferred embodiment of the present invention. [Main component symbol description] 3〇Hot press 32 Movable upper module 34 Hot pressing device 36 Lower module 37 Heating device 50 Hard circuit board 52 Solder pad 54 First positioning hole 56 Positioning pin 58 First fixing pad 64 Insulation vacuum block 66 Heat block 70 Flexible circuit board 72 Part foot 74 Second positioning hole 76 Vacuum hole 78 Second fixed pad 80 Large copper surface 90 Upper cover 92 Adjustable temperature controller 94 Heating rod 96 Air cooling tube 102 Substrate .100 Hard circuit board 106 Passive component 104 Active component 110 Soldering 塾 108 Locating hole 14 1305709 114 Grounding large copper surface 112 First fixing pad 118 Substrate 116 Flexible circuit board 122 Second fixing pad 120 Locating hole 126 Copper foil Line 124 Part foot 130 Connection end 128 Large copper surface 202 Movable upper module 200 Hot press 206 Movable upper module 204 Movable upper module 210 Hot pressing device 208 Hot pressing device 214 Lower module 212 Hot pressing device 228 Air cooling tube 216 lower module 232 air cooling tube 230. air cooling tube 236 slide rail 234 lower module platform 15