CN110696446A - High-heat-dissipation metal aluminum-based copper-clad plate and preparation method thereof - Google Patents

High-heat-dissipation metal aluminum-based copper-clad plate and preparation method thereof Download PDF

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CN110696446A
CN110696446A CN201911009595.6A CN201911009595A CN110696446A CN 110696446 A CN110696446 A CN 110696446A CN 201911009595 A CN201911009595 A CN 201911009595A CN 110696446 A CN110696446 A CN 110696446A
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plate
cover body
heat
driving
metal aluminum
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熊超
陈定红
耿克非
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Changzhou Aohong Electronics Co Ltd
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Changzhou Aohong Electronics Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284Application of adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/06Coating on the layer surface on metal layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/26Polymeric coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/302Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558Impact strength, toughness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2217Oxides; Hydroxides of metals of magnesium
    • C08K2003/222Magnesia, i.e. magnesium oxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • C08K2003/282Binary compounds of nitrogen with aluminium

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  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses a high-heat-dissipation metal aluminum-based copper-clad plate and a preparation method thereof, wherein the prepared metal aluminum-based copper-clad plate has the thermal conductivity of 3.8-4.4W/m.k and can resist the temperature of 320-360 ℃ by effectively proportioning aluminum oxide, silicon dioxide, silicon carbide, aluminum nitride and magnesium oxide. According to the hot-pressing device, the gear is driven to rotate through the output shaft of the first motor, the gear is meshed with the gear to drive the rack to move, the rack drives the lower cover body to move, the lower cover body drives the sliding block at the bottom to move along the sliding rail, and then the lower cover body is moved out of the rack.

Description

High-heat-dissipation metal aluminum-based copper-clad plate and preparation method thereof
Technical Field
The invention relates to the technical field of metal aluminum-based copper-clad plates, in particular to a high-heat-dissipation metal aluminum-based copper-clad plate and a preparation method thereof.
Background
An aluminum-based copper clad laminate, i.e., an aluminum substrate, is one of raw materials, and is a plate-shaped material prepared by using electronic glass fiber cloth or other reinforcing materials, soaking resin, single resin and the like as an insulating bonding layer, coating copper foil on one surface or two surfaces of the insulating bonding layer and performing hot pressing, and is called a copper-clad laminate aluminum substrate, which is called an aluminum-based copper clad laminate for short.
Patent document (CN 201210003238.0) discloses a method for manufacturing a high thermal conductivity metal-based copper-clad plate, which is characterized in that high thermal conductivity glue made of magnesium hydroxide, aluminum oxide, boron nitride, epoxy resin, acetone and dicyandiamide is coated on the back of a copper foil, and the high thermal conductivity metal-based copper-clad plate is dried, cut, placed on a metal substrate for lamination and then coated with a protective film, so that the manufactured high thermal conductivity metal-based copper-clad plate has the advantages of low cost, good interlayer bonding force and environmental protection. But this high heat conduction metal base copper-clad plate's thermal diffusivity and temperature resistance are all not ideal, and hot pressing equipment among the prior art is all too complicated simultaneously, and inconvenient will treat in the hot pressboard puts into hot pressing equipment simultaneously, and hot pressing equipment's inside also can't be opened completely, is not convenient for follow-up cleanness, maintenance.
Disclosure of Invention
The invention aims to provide a high-heat-dissipation metal aluminum-based copper-clad plate and a preparation method thereof, and solves the following technical problems: (1) the thermal conductivity of the prepared metal aluminum-based copper-clad plate is 3.8-4.4W/m.k according to ISO22007-2:2008, the temperature can be resisted by 320-360 ℃ according to GB/T3512-containing 2014, and the technical problems of poor heat dissipation and heat resistance of the metal aluminum-based copper-clad plate in the prior art are solved; (2) the gear is driven to rotate through the output shaft of the first motor, the gear is meshed with the gear to drive the rack to move, the rack drives the lower cover body to move, the lower cover body drives the sliding block at the bottom to move along the sliding rail, and then the lower cover body is moved out of the rack; (3) the second motor output shaft drives the lead screw and rotates, the lead screw drives the connecting piece decline of outer peripheral face, the connecting piece drives the lifter plate decline, the first rod cover of lifter plate both sides extends the pole setting and slides down, and then the lifter plate drives the upper cover body downstream, upper cover body and lower cover body cooperation fixed connection, dead lever bottom is pegged graft with the annular hole cooperation simultaneously, through the upper cover body and the separation setting of the lower cover body, solve among the prior art hot pressing equipment inside be difficult to open completely and carry out clear technical problem.
The purpose of the invention can be realized by the following technical scheme:
a high-heat-dissipation metal aluminum-based copper-clad plate comprises a copper foil, a heat-dissipation adhesive layer, an adhesive layer and an aluminum plate, wherein the copper foil, the heat-dissipation adhesive layer, the adhesive layer and the aluminum plate are sequentially stacked and pressed for molding; the heat dissipation adhesive layer is prepared from the following raw materials in parts by weight: 40-70 parts of epoxy resin, 2-5 parts of a toughening agent, 1-3 parts of a coupling agent, 3-6 parts of a curing agent and 30-50 parts of a heat-conducting filler.
The high-heat-dissipation metal aluminum-based copper-clad plate is prepared by the following steps:
the method comprises the following steps: weighing the raw materials according to the weight parts, and uniformly mixing to prepare a heat dissipation glue solution;
step two: uniformly coating the prepared heat dissipation glue solution on the back surface of the copper foil, and drying in a dryer to form a heat dissipation glue layer on the back surface of the copper foil;
step three: laminating an adhesive layer and an aluminum plate on a heat-dissipation adhesive layer in sequence to form a laminated plate, driving a gear to rotate by a first motor output shaft, driving a rack to move by gear meshing, driving a lower cover body to move by the rack, driving a sliding block at the bottom to move along a sliding rail by the lower cover body, further moving the laminated plate out of a rack, placing the laminated plate on a lower heating plate of hot-pressing equipment, driving a lower cover body to move into the rack by a first motor, driving a lead screw to rotate by a second motor output shaft, driving a connecting piece at the outer peripheral surface to descend by the lead screw, driving a lifting plate to descend by the connecting piece, driving first rod sleeves at two sides of the lifting plate to slide downwards along the vertical rod, driving an upper cover body to move downwards by the lifting plate, fixedly connecting the upper cover body and the lower cover body in a matching way, meanwhile, inserting and connecting the bottoms of fixing rods with annular holes, second rod sleeves at the corners of the lower pressing plate extend along the fixed rods to move downwards, then the lower pressing plate drives the upper heating plate to move downwards, the upper heating plate downwards extrudes the laminated plate on the lower heating plate and heats the laminated plate, and a semi-finished metal aluminum-based copper-clad plate is formed after hot pressing is completed;
step four: and (4) trimming the semi-finished product of the metal aluminum-based copper-clad plate to prepare the finished product of the metal aluminum-based copper-clad plate.
Further, in the heat-conducting filler, the components and the mass fraction of the components in the total component are as follows: 0-99% of aluminum oxide, 0-10% of silicon dioxide, 0-5% of silicon carbide, 0-20% of aluminum nitride and 0-2% of magnesium oxide, wherein the sum of the contents of all the components in the heat-conducting filler is 100%.
Further, the toughening agent is one or more of phenolic resin, nitrile rubber, acrylic rubber, polyvinyl acetate and polyurethane.
Further, the curing agent is one or more of phenolic resin, diaminodiphenyl sulfone and diaminodiphenylamine.
Further, the coupling agent is an organic silane compound, the curing agent is phenolic resin, diaminodiphenyl sulfone or a combination thereof, and the toughening agent is one or more of phenolic resin, nitrile rubber and acrylic rubber.
Further, the hot pressing equipment comprises a frame, a support plate is fixedly installed at the bottom of the frame, a first motor is installed on the lower end face of the support plate, an output shaft of the first motor penetrates through the support plate, a gear is sleeved at the end of the support plate, one side of the gear is meshed and connected with a rack, the rack is fixed on the lower end face of a lower cover body, sliders are installed on two sides of the rack, the sliders are arranged on the upper surface of slide rails in a sliding manner, the slide rails are fixedly installed on the upper end face of the support plate, a water cooling plate is installed at the bottom of an inner cavity of the lower cover body, a heat insulation plate is installed on the upper end face of the water cooling plate, annular holes are formed in two sides of the heat insulation plate, a lower heating plate is further installed on the upper end face of the heat insulation plate, an upper cover, both ends of the vertical rod are arranged on the frame through bearing seats, the upper end surface of the lifting plate is also provided with a connecting piece, the connecting piece is rotatably sleeved on the peripheral surface of the screw rod, the top of the screw rod is connected with an output shaft of the second motor, the second motor is arranged on the frame through a motor fixing seat, a telescopic cylinder is arranged in the middle of the top of the upper cover body, the piston rod of the telescopic cylinder penetrates through the upper wall of the upper cover body and is connected with a lower pressing plate, an upper heating plate is arranged in the middle of the lower end surface of the lower pressing plate, the corners at four positions of the upper end surface of the upper heating plate are respectively provided with a second rod sleeve, the second rod sleeve is sleeved on the peripheral surface of the fixed rod in a sliding way, the top of the fixed rod is connected with the inner wall of the top of the upper cover body, the inner wall of the upper cover body is provided with heat preservation cotton, and the bottom of the fixed rod is matched and spliced with the annular hole, one side of the upper cover body is penetrated and provided with a vacuumizing port, and the vacuumizing port is connected with an external vacuum pump through a pipe.
The invention has the beneficial effects that:
(1) according to the high-heat-dissipation metal aluminum-based copper-clad plate and the preparation method thereof, the surface adhesive force between the heat-dissipation adhesive layer and the aluminum plate is increased by adding the adhesive layer and the coupling agent, the internal stress of the combination of the adhesive layer and the aluminum plate is eliminated, the difference influence of different expansion coefficients in the hot pressing process is reduced, the flexibility of the adhesive film is increased by adding the toughening agent, the problem of insufficient brittleness of the heat-dissipation adhesive layer is further solved, and aluminum oxide, silicon dioxide, silicon carbide and the like are used as heat-conducting fillers, so that the heat-dissipation performance of the high-. According to ISO22007-2:2008, the thermal conductivity of the prepared metal aluminum-based copper-clad plate is 3.8-4.4W/m.k, and the temperature can be resisted by 320-360 ℃ according to GB/T3512-2014;
(2) the hot pressing equipment is convenient to place the laminated plate into the lower cover body through the arrangement, a hand does not need to be manually stretched into the rack to place the laminated plate, certain safety is achieved, and meanwhile, the moving process of the laminated plate is more stable through gear transmission matching with the slide rail and slide block guiding;
(3) the screw rod is driven to rotate by the output shaft of the second motor, the screw rod drives the connecting piece on the outer peripheral surface to descend, the connecting piece drives the lifting plate to descend, the first rod sleeves on the two sides of the lifting plate extend to the vertical rod to slide downwards, the lifting plate drives the upper cover body to move downwards, the upper cover body is matched and fixedly connected with the lower cover body, meanwhile, the bottom of the fixed rod is matched and spliced with the annular hole, the hot pressing equipment enables the upper cover body and the lower cover body which do not work to be in a separated state through the arrangement, the cleaning of the inner parts of the upper cover body and the lower cover body is convenient, meanwhile, the placement of the laminated plate is more convenient, the practicability is high, the vacuum pump vacuumizes the inner cavities of the upper cover body and the lower cover body through the vacuumizing hole, the piston rod of the telescopic cylinder pushes the lower pressing plate to move downwards, the second rod sleeves at the corners of the lower pressing plate extend to the fixed rod to, through the setting of the heat preservation cotton and the water-cooling board of last hot plate, lower hot plate, the upper cover inner wall, heated board, effectively guarantee when carrying out high-efficient hot pressing to the lamination board, prevent that the high temperature of hot pressing in-process from transmitting upper cover body, cover outer wall down.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic structural view of a hot press apparatus of the present invention;
FIG. 2 is an internal structural view of the upper cover of the present invention;
FIG. 3 is an internal structural view of the lower cover of the present invention;
FIG. 4 is an installation view of the lifter plate of the present invention;
FIG. 5 is a structural view of the support plate of the present invention;
fig. 6 is a view showing the connection of the support plate and the lower cover of the present invention.
In the figure: 1. a frame; 2. a support plate; 3. a first motor; 4. a gear; 5. a rack; 6. a slide rail; 7. a slider; 8. a lower cover body; 81. a water-cooling plate; 82. a thermal insulation board; 821. an annular aperture; 83. a lower heating plate; 9. a motor fixing seat; 10. a second motor; 11. a lead screw; 111. a connecting member; 12. a lifting plate; 13. erecting a rod; 131. a first rod sleeve; 14. an upper cover body; 141. a vacuum pumping port; 15. a telescopic cylinder; 16. a lower pressing plate; 161. an upper heating plate; 17. a second rod sleeve; 18. and (5) fixing the rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 6, the present invention provides a technical solution:
example 1
A high-heat-dissipation metal aluminum-based copper-clad plate comprises a copper foil, a heat-dissipation adhesive layer, an adhesive layer and an aluminum plate, wherein the copper foil, the heat-dissipation adhesive layer, the adhesive layer and the aluminum plate are sequentially stacked and pressed for molding; the heat dissipation adhesive layer is prepared from the following raw materials in parts by weight: 40 parts of epoxy resin, 2 parts of phenoxy resin, 1 part of silane coupling agent, 3 parts of diamino diphenyl sulfone and 30 parts of heat-conducting filler (98% of aluminum oxide, 1% of silicon dioxide, 0.2% of silicon carbide and 0.8% of magnesium oxide).
The high-heat-dissipation metal aluminum-based copper-clad plate is prepared by the following steps:
the method comprises the following steps: weighing the raw materials according to the weight parts, and uniformly mixing to prepare a heat dissipation glue solution;
step two: uniformly coating the prepared heat dissipation glue solution on the back surface of the copper foil, and drying in a dryer to form a heat dissipation glue layer on the back surface of the copper foil;
step three: laminating an adhesive layer and an aluminum plate on a heat-dissipation adhesive layer in sequence to form a laminated plate, driving a gear to rotate by a first motor output shaft, driving a rack to move by gear meshing, driving a lower cover body to move by the rack, driving a sliding block at the bottom to move along a sliding rail by the lower cover body, further moving the laminated plate out of a rack, placing the laminated plate on a lower heating plate of hot-pressing equipment, driving a lower cover body to move into the rack by a first motor, driving a lead screw to rotate by a second motor output shaft, driving a connecting piece at the outer peripheral surface to descend by the lead screw, driving a lifting plate to descend by the connecting piece, driving first rod sleeves at two sides of the lifting plate to slide downwards along the vertical rod, driving an upper cover body to move downwards by the lifting plate, fixedly connecting the upper cover body and the lower cover body in a matching way, meanwhile, inserting and connecting the bottoms of fixing rods with annular holes, second rod sleeves at the corners of the lower pressing plate extend along the fixed rods to move downwards, then the lower pressing plate drives the upper heating plate to move downwards, the upper heating plate downwards extrudes the laminated plate on the lower heating plate and heats the laminated plate, and a semi-finished metal aluminum-based copper-clad plate is formed after hot pressing is completed;
step four: and (4) trimming the semi-finished product of the metal aluminum-based copper-clad plate to prepare the finished product of the metal aluminum-based copper-clad plate.
Specifically, the rotating speed of the rotor of the high-speed centrifuge in the first step is 3500r/min, and the stirring time is 30 min; in the second step, the drying temperature of the dryer is 100 ℃; the hot pressing temperature in the third step is 200 ℃.
The thermal conductivity of the metal aluminum-based copper-clad plate in the embodiment 1 is 3.8W/m.k, and the temperature resistance is 320 ℃.
Example 2
A high-heat-dissipation metal aluminum-based copper-clad plate comprises a copper foil, a heat-dissipation adhesive layer, an adhesive layer and an aluminum plate, wherein the copper foil, the heat-dissipation adhesive layer, the adhesive layer and the aluminum plate are sequentially stacked and pressed for molding; the heat dissipation adhesive layer is prepared from the following raw materials in parts by weight: 70 parts of epoxy resin, 5 parts of diamino diphenyl sulfone, 3 parts of silane coupling agent, 6 parts of curing agent and 50 parts of heat-conducting filler (80% of aluminum oxide, 8% of silicon dioxide, 3.5% of silicon carbide and 8.5% of aluminum nitride).
The high-heat-dissipation metal aluminum-based copper-clad plate is prepared by the following steps:
the method comprises the following steps: weighing the raw materials according to the weight parts, and uniformly mixing to prepare a heat dissipation glue solution;
step two: uniformly coating the prepared heat dissipation glue solution on the back surface of the copper foil, and drying in a dryer to form a heat dissipation glue layer on the back surface of the copper foil;
step three: laminating an adhesive layer and an aluminum plate on a heat-dissipation adhesive layer in sequence to form a laminated plate, driving a gear to rotate by a first motor output shaft, driving a rack to move by gear meshing, driving a lower cover body to move by the rack, driving a sliding block at the bottom to move along a sliding rail by the lower cover body, further moving the laminated plate out of a rack, placing the laminated plate on a lower heating plate of hot-pressing equipment, driving a lower cover body to move into the rack by a first motor, driving a lead screw to rotate by a second motor output shaft, driving a connecting piece at the outer peripheral surface to descend by the lead screw, driving a lifting plate to descend by the connecting piece, driving first rod sleeves at two sides of the lifting plate to slide downwards along the vertical rod, driving an upper cover body to move downwards by the lifting plate, fixedly connecting the upper cover body and the lower cover body in a matching way, meanwhile, inserting and connecting the bottoms of fixing rods with annular holes, second rod sleeves at the corners of the lower pressing plate extend along the fixed rods to move downwards, then the lower pressing plate drives the upper heating plate to move downwards, the upper heating plate downwards extrudes the laminated plate on the lower heating plate and heats the laminated plate, and a semi-finished metal aluminum-based copper-clad plate is formed after hot pressing is completed;
step four: and (4) trimming the semi-finished product of the metal aluminum-based copper-clad plate to prepare the finished product of the metal aluminum-based copper-clad plate.
Specifically, the rotating speed of a rotor of the high-speed centrifuge in the first step is 4000r/min, and the stirring time is 40 min; the drying temperature of the dryer in the second step is 175 ℃; the hot pressing temperature in the third step is 220 ℃.
The thermal conductivity of the metal aluminum-based copper-clad plate in the embodiment 2 is 4.4W/m.k, and the temperature resistance is 360 ℃.
The hot-pressing equipment comprises a frame 1, a support plate 2 is fixedly installed at the bottom of the frame 1, a first motor 3 is installed on the lower end face of the support plate 2, an output shaft of the first motor 3 penetrates through the support plate 2, the end part of the output shaft is sleeved with a gear 4, one side of the gear 4 is engaged and connected with a rack 5, the rack 5 is fixed on the lower end face of a lower cover body 8, sliders 7 are installed on two sides of the rack 5, the sliders 7 are arranged on the upper surface of slide rails 6 in a sliding manner, the slide rails 6 are fixedly installed on the upper end face of the support plate 2, a water cooling plate 81 is installed at the bottom of an inner cavity of the lower cover body 8, a heat insulation plate 82 is installed on the upper end face of the water cooling plate 81, annular holes 821 are formed in two sides of the heat insulation plate 82, a lower heating plate 83 is also installed on the upper end face, two ends of the upright rod 13 are both mounted on the frame 1 through bearing seats, the upper end surface of the lifting plate 12 is also provided with a connecting piece 111, the connecting piece 111 is rotatably sleeved on the outer peripheral surface of the screw rod 11, the top of the screw rod 11 is connected with an output shaft of a second motor 10, the second motor 10 is mounted on the frame 1 through a motor fixing seat 9, a telescopic cylinder 15 is mounted at the middle position of the top of the upper cover body 14, a piston rod of the telescopic cylinder 15 penetrates through the upper wall of the upper cover body 14 and is connected with a lower pressing plate 16, an upper heating plate 161 is mounted at the middle position of the lower end surface of the lower pressing plate 16, second rod sleeves 17 are mounted at four corners of the upper end surface of the upper heating plate 161, the second rod sleeves 17 are slidably sleeved on the outer peripheral surface of the fixed rod 18, the top of the fixed rod 18 is connected with the inner, the evacuation port 141 is connected to an external vacuum pump via a pipe.
Referring to fig. 1-6, the operation of the hot pressing apparatus of the present embodiment is as follows:
the output shaft of the first motor 3 drives the gear 4 to rotate, the gear 4 is meshed with the gear to drive the rack 5 to move, the rack 5 drives the lower cover body 8 to move, the lower cover body 8 drives the bottom slide block 7 to move along the slide rail 6, the lower cover body 8 is moved out of the rack 1, the laminated plate is placed on the lower heating plate 83 of the hot pressing equipment, the first motor 3 drives the lower cover body 8 to move into the rack 1, the output shaft of the second motor 10 drives the lead screw 11 to rotate, the lead screw 11 drives the connecting piece 111 on the outer peripheral surface to descend, the connecting piece 111 drives the lifting plate 12 to descend, the first rod sleeves 131 on two sides of the lifting plate 12 slide downwards along the vertical rods 13, the lifting plate 12 drives the upper cover body 14 to move downwards, the upper cover body 14 is fixedly connected with the lower cover body 8 in a matching way, the bottom of the fixed rod 18 is inserted into the annular hole 821 in a matching way, the vacuum pump vacuumizes the inner cavities of, the second rod sleeves 17 at the corners of the lower press plate 16 extend along the fixing rods 18 to move downwards, so that the lower press plate 16 drives the upper heating plate 161 to move downwards, the upper heating plate 161 downwards extrudes the laminated plate on the lower heating plate 83 and heats the laminated plate, and after hot pressing, a semi-finished metal aluminum-based copper-clad plate is formed.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.

Claims (9)

1. A high heat dissipation metal aluminum base copper-clad plate is characterized by comprising a copper foil, a heat dissipation adhesive layer, an adhesive layer and an aluminum plate, wherein the copper foil, the heat dissipation adhesive layer, the adhesive layer and the aluminum plate are sequentially stacked and pressed for forming; the heat dissipation adhesive layer is prepared from the following raw materials in parts by weight: 40-70 parts of epoxy resin, 2-5 parts of a toughening agent, 1-3 parts of a coupling agent, 3-6 parts of a curing agent and 30-50 parts of a heat-conducting filler.
2. The high-heat-dissipation metal aluminum-based copper-clad plate is prepared by the following steps:
the method comprises the following steps: weighing the raw materials according to the weight parts, placing the raw materials into a high-speed centrifuge for stirring, uniformly mixing to prepare a heat dissipation glue solution, uniformly coating the prepared heat dissipation glue solution on the back surface of the copper foil, placing the copper foil into a dryer for drying, and forming a heat dissipation glue layer on the back surface of the copper foil;
step two: sequentially laminating an adhesive layer and an aluminum plate on a heat-dissipation adhesive layer to form a laminated plate, placing the laminated plate on a lower heating plate of hot-pressing equipment, driving a lower cover body to move into a rack by a first motor, driving a lead screw to rotate by an output shaft of a second motor, driving a connecting piece on the outer peripheral surface to descend by the lead screw, driving a lifting plate to descend by the connecting piece, driving first rod sleeves on two sides of the lifting plate to extend along a vertical rod to slide downwards, driving an upper cover body to move downwards by the lifting plate, vacuumizing an inner cavity of the upper cover body and an inner cavity of the lower cover body to be vacuumized by a vacuum pump, pushing a lower pressing plate to move downwards by a piston rod of a telescopic cylinder, driving second rod sleeves at four corners of the lower pressing plate to extend along the fixed rod to move downwards, driving an upper heating plate to move downwards, downwards by the upper heating plate, pressing;
step three: and (4) trimming the semi-finished product of the metal aluminum-based copper-clad plate to prepare the finished product of the metal aluminum-based copper-clad plate.
3. The high-heat-dissipation metal aluminum-based copper-clad plate and the preparation method thereof according to claim 1, wherein the heat-conducting filler comprises the following components in percentage by mass based on the total components: 0-99% of aluminum oxide, 0-10% of silicon dioxide, 0-5% of silicon carbide, 0-20% of aluminum nitride and 0-2% of magnesium oxide, wherein the sum of the contents of all the components in the heat-conducting filler is 100%.
4. The high-heat-dissipation metal aluminum-based copper-clad plate according to claim 1, wherein the toughening agent is one or more of phenolic resin, nitrile rubber, acrylic rubber, polyvinyl acetate and polyurethane.
5. The high-heat-dissipation metal aluminum-based copper-clad plate according to claim 1, wherein the curing agent is one or more of phenolic resin, diaminodiphenyl sulfone and diaminodiphenylamine.
6. The high-heat-dissipation metal aluminum-based copper-clad plate according to claim 1, wherein the coupling agent is an organosilane compound, the curing agent is phenolic resin, diamino diphenyl sulfone or a combination thereof, and the toughening agent is one or more of phenoxy resin, nitrile rubber and acrylic rubber.
7. The preparation method of the high-heat-dissipation metal aluminum-based copper-clad plate is characterized in that the metal aluminum-based copper-clad plate is prepared by the following steps:
the method comprises the following steps: weighing the raw materials according to the weight parts, and uniformly mixing to prepare a heat dissipation glue solution;
step two: uniformly coating the prepared heat dissipation glue solution on the back surface of the copper foil, and drying in a dryer to form a heat dissipation glue layer on the back surface of the copper foil;
step three: sequentially laminating an adhesive layer and an aluminum plate on a heat-dissipation adhesive layer to form a laminated plate, placing the laminated plate on a lower heating plate of hot-pressing equipment, driving a lower cover body to move into a rack by a first motor, driving a lead screw to rotate by an output shaft of a second motor, driving a connecting piece on the outer peripheral surface to descend by the lead screw, driving a lifting plate to descend by the connecting piece, driving first rod sleeves on two sides of the lifting plate to extend along a vertical rod to slide downwards, driving an upper cover body to move downwards by the lifting plate, vacuumizing an inner cavity of the upper cover body and an inner cavity of the lower cover body to be vacuumized by a vacuum pump, pushing a lower pressing plate to move downwards by a piston rod of a telescopic cylinder, driving second rod sleeves at four corners of the lower pressing plate to extend along the fixed rod to move downwards, driving an upper heating plate to move downwards, downwards by the upper heating plate, pressing;
step four: and (4) trimming the semi-finished product of the metal aluminum-based copper-clad plate to prepare the finished product of the metal aluminum-based copper-clad plate.
8. The method for preparing the high-heat-dissipation aluminum-based copper-clad plate as claimed in claim 6, wherein the rotor speed of the high-speed centrifuge is 3500-; the drying temperature of the dryer in the second step is 100-175 ℃; in the third step, the hot pressing temperature is 200-220 ℃.
9. The preparation method of the high-heat-dissipation metal aluminum-based copper-clad plate according to claim 6, wherein the working steps of the hot-pressing equipment are as follows:
the first motor output shaft drives the gear to rotate, the gear is meshed with the gear to drive the rack to move, the rack drives the lower cover body to move, the lower cover body drives the sliding block at the bottom to move along the sliding rail, the lower cover body is moved out of the frame, the laminated plate is placed on the heating plate, the first motor drives the lower cover body to move into the frame, the second motor output shaft drives the screw rod to rotate, the screw rod drives the connecting piece at the outer peripheral surface to descend, the connecting piece drives the lifting plate to descend, the first rod sleeves at two sides of the lifting plate slide downwards along the vertical rods, the lifting plate drives the upper cover body to move downwards, the upper cover body is fixedly connected with the lower cover body in a matched mode, meanwhile, the bottom of the fixing rod is inserted into the annular hole in a matched mode, the vacuum pump vacuumizes the inner cavities of the upper cover body and the lower cover body through the vacuumizing hole, the telescopic cylinder piston rod pushes the, and the upper heating plate downwards extrudes the laminated plate on the lower heating plate and heats the laminated plate, and a semi-finished product of the metal aluminum-based copper-clad plate is formed after hot pressing is finished.
CN201911009595.6A 2019-10-23 2019-10-23 High-heat-dissipation metal aluminum-based copper-clad plate and preparation method thereof Pending CN110696446A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113787182A (en) * 2021-09-17 2021-12-14 江西伟创丰电路有限公司 Press-forming type finish machining equipment for producing aluminum-based copper-clad plate
CN115008856A (en) * 2022-06-23 2022-09-06 中车戚墅堰机车车辆工艺研究所有限公司 Preparation equipment and method of multilayer foil metal matrix composite material

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1655924A (en) * 2002-05-30 2005-08-17 米卡多科技株式会社 Heating-type vacuum press device
TW200706084A (en) * 2005-07-29 2007-02-01 Orient Semiconductor Elect Ltd Hot mounting machine
TW201330739A (en) * 2012-01-06 2013-07-16 Kocam Int Co Ltd Hot-press laminating method for copper circuit and housing substrate
CN103722807A (en) * 2013-12-17 2014-04-16 浙江伟弘电子材料开发有限公司 High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof
CN206953651U (en) * 2017-06-08 2018-02-02 苏州耐斯德自动化设备有限公司 Small-sized glue hot-pressing curing machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1655924A (en) * 2002-05-30 2005-08-17 米卡多科技株式会社 Heating-type vacuum press device
TW200706084A (en) * 2005-07-29 2007-02-01 Orient Semiconductor Elect Ltd Hot mounting machine
TW201330739A (en) * 2012-01-06 2013-07-16 Kocam Int Co Ltd Hot-press laminating method for copper circuit and housing substrate
CN103722807A (en) * 2013-12-17 2014-04-16 浙江伟弘电子材料开发有限公司 High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof
CN206953651U (en) * 2017-06-08 2018-02-02 苏州耐斯德自动化设备有限公司 Small-sized glue hot-pressing curing machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113787182A (en) * 2021-09-17 2021-12-14 江西伟创丰电路有限公司 Press-forming type finish machining equipment for producing aluminum-based copper-clad plate
CN115008856A (en) * 2022-06-23 2022-09-06 中车戚墅堰机车车辆工艺研究所有限公司 Preparation equipment and method of multilayer foil metal matrix composite material

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