TWI302351B - - Google Patents

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Publication number
TWI302351B
TWI302351B TW91124248A TW91124248A TWI302351B TW I302351 B TWI302351 B TW I302351B TW 91124248 A TW91124248 A TW 91124248A TW 91124248 A TW91124248 A TW 91124248A TW I302351 B TWI302351 B TW I302351B
Authority
TW
Taiwan
Prior art keywords
titanium nitride
forming
torr
nitride layer
deposition
Prior art date
Application number
TW91124248A
Other languages
English (en)
Chinese (zh)
Inventor
Ching Hua Chen
Original Assignee
Powerchip Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powerchip Semiconductor Corp filed Critical Powerchip Semiconductor Corp
Priority to TW91124248A priority Critical patent/TWI302351B/zh
Priority to US10/941,939 priority patent/US7030015B2/en
Application granted granted Critical
Publication of TWI302351B publication Critical patent/TWI302351B/zh

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  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW91124248A 2002-10-21 2002-10-21 TWI302351B (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW91124248A TWI302351B (ja) 2002-10-21 2002-10-21
US10/941,939 US7030015B2 (en) 2002-10-21 2004-09-16 Method for forming a titanium nitride layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91124248A TWI302351B (ja) 2002-10-21 2002-10-21

Publications (1)

Publication Number Publication Date
TWI302351B true TWI302351B (ja) 2008-10-21

Family

ID=45070465

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91124248A TWI302351B (ja) 2002-10-21 2002-10-21

Country Status (1)

Country Link
TW (1) TWI302351B (ja)

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