1300082 玖、發明說明： 【發明所屬之技術領域】 本發明係有關一種樹脂組成物，及含有該樹脂組成物之背 膠超薄銅箔介電層材料。 【先前技術】 目前電子產品朝向輕薄短小、高性能及可攜帶化方向發 轉，使得封裝、印刷電路板（PCB)等下游產業，對製程及材 料方面，均要求必須滿足高密度、高可靠度的特性。 傳統PCB是由玻纖布、樹脂及銅箔所構成。因為基板含 有玻纖布，故在使用雷射鑽孔機鑽孔時，將造成微孔成型性 不佳，且製程繁複、成本較高，所以現今技術先進國家已逐 步使用RCC製程技術（”Resin Coated c〇pper”，背膠銅摆）， 可省卻玻纖布含浸樹脂手續，不僅簡化製程且可降低成本、 減少重量，目前已大量使用在筆記型電腦、行動電話、pDA 等可攜式產品中。 另外’作為電力及信號導線的銅箔材料，為求高密度細線 化，將銅箔厚度薄化，已為不得不然之趨勢，所以厚度從以 前18μιη或35μπι降至目前3至6μηι，稱之為超薄銅馆㈨加 thin copper foil) 〇 一般超薄的背膠銅箔，係利用鋁箔作為載體，然後在鋁箔 上做適當的表面前處理與分離層（或稱為黏合層）處理，之後 再電鍍3至6μιη厚的銅箔層，經過粗化、抗熱及抗氧化層 處理，再塗佈清漆以形成介電層（dielectric layer)，最後將 承載鋁箔撕離。此超薄背膠銅箔可適用於pCB與積體電路 板（1C )載板上。不過，目前市售的超薄背膠銅箔，普遍面 1300082 臨介電層太脆，抗熱性不佳 點。 與超薄銅箔接著效果不好等缺 及耐高溫性之需求，以現有技術而 吕’如去除玻纖布以達到基板輕薄之目的會導致基板易脆. ”口何去除玻纖布同時又得以維持基板的功能，成為業求 解決的問題。 :案發明人經廣泛研究發現，具有某些特定組份之樹脂組 成物，，加人有機溶劑調製成清漆，㈣於銅落（導電層）上， 即可形成-介電層以取代破璃纖維膠布㈣叫），—可省下 玻纖布，二能耐高溫’且勃性強，適用於各種電路設計。應 用此超薄背膠㈣基板製程之印刷電路板，在厚度上比傳統 ,刷电路板薄二分之—以上，且由於製程與材料的簡化，故 能大幅降低成本。 【發明内容】 本發明的目的在於提供一種樹脂組成物。 本發明之另-目的在於提供-種含有冑樹脂組成物之背 膠超薄鋼落介電層材料。 【實施方式】 、本發明提供一種樹脂組成物，其包含··（a) 0.5至25重量 丫刀數之黏著向分子化合物（’’binder polymer，，）；（b) 1〇至45 重I份數之含溴樹脂；（c) 10至60重量份數之環氧樹脂； 及（d) 5至35重量份數之硬化劑。 可用於本發明樹脂組成物中之黏著高分子化合物，較佳的 含量今#人《 、 至15重量份’且其平均分子量介於5, 〇〇〇至 Μ0,000 之間。 l3〇〇082 本發明樹脂組成物中所使用的黏著高分子化合物並無特 殊限制’可祕本發明之黏著高分子化合物例如可為，但不 限於混合聚丁二浠橡膠（”mixed p〇iybutadiene rubber,,)、聚 酯樹脂（"polyester")、@埽酸系樹脂（”acrylic及聚胺 基甲酸樹脂（”P〇lyUrethane")，及此等高分子化合物之混合物 等。 可用於本發明樹脂組成物中之含溪樹脂，其含溪比例，以 該樹脂組成物總重量計，係為5至25重量％。 本發明樹脂組成物中所使用的含溴樹脂並無特殊限制，可 用於本發明《含溴樹脂例如可為，但不限於含溴環氧樹脂、 吕/穴永酯樹脂及海龍（”Hal〇ns”）及其混合物等。 可用於本發明樹脂組成物中之環氧樹脂，較佳的含量係介 於15至30重量份。 本發明樹脂組成物中所使用的環氧樹脂，係包含至少一種 /、有呵玻璃轉化溫度（，，glass_transiti〇n temperature”，Tg) 者’其中該高玻璃轉化溫度係指1〇(rc以上。 、本發明樹脂組成物中所使用的環氧樹脂係為含二或多個 g旎基<環氧樹脂，其例如可為，但不限於雙酚c，bisphen〇r) %氧树脂、雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚s J %氧樹脂、酚醛型酚醛環氧樹脂、酚醛型烷基酚醛環氧樹 脂、改質（Modified)酚醛環氧樹脂、雙環戊二烯 (ndiCycl〇pentadiene”）環氧樹脂或其混合物。 可用於本發明樹脂組成物中之硬化劑，較佳的含量介於 17至2 5重量份。 本發明樹脂組成物中所使用的硬化劑係熟悉此項技術之 1300082 人士所熟知者，其非限制性實例包括··含胺化合物、胍類 (guanidine")硬化劑及咪峻（”imidaz0〗e")硬化劑。 本發明樹脂組成物可視需要包含熟悉此項技術者已知之 添加劑，此等添加劑例如可為消泡劑（Def〇aming Agent)、流 平劑（Levelling Agent)、表面密著劑（Adhesive Pr〇m〇ter)、石夕 燒偶合劑（Silane Coupling Agent)或其混合物等。 本發明另外提供一種背膠超薄銅箔介電層材料，其包含上 述樹脂組成物與有機溶劑。 本發明之背膠超薄銅箔介電層材料，當黏著高分子化合物 <含量低於0.5重量份時，則無法與超薄銅箔達到良好的接 著效果，然若含量超過25重量份時，則抗化藥性不佳；當 含溴樹脂的含量低於10重量份時，則耐燃性會降低；當環 ，樹脂之含量低於10重量份時，則抗熱性會大幅降低：然 若含量超過60重量份時，則介電層變脆、再加工性困難； ^當硬化劑之含量低於5重量份時，則抗熱性降低，然若含 量超過35重量份時，則抗化藥性會下降。 適用於本發明介電層材料中的有機_並無特殊限制々 需能溶解上述樹脂組成物者即可，其實例包括，但不限於甲 醇、丙酮、甲乙酮或甲苯或其混合物等。 、 复施例 以下料例將對本發明做進一步之說明，唯非用以限制本 發明之範圍，任何熟悉本發明技術領域者，在不達背本發明 〈精神下所得以達成之修飾及變化 " t施例i -化均屬於本發明之範圍。 15重量份的羧基封端丁二烯 ^ ^ h (Carboxyl Terminated 13000821300082 发明Invention Description: [Technical Field] The present invention relates to a resin composition, and a backing ultra-thin copper foil dielectric layer material containing the resin composition. [Prior Art] At present, electronic products are moving toward light, short, high-performance and portability, making downstream industries such as packaging and printed circuit boards (PCBs) required to meet high density and high reliability in terms of process and materials. Characteristics. The conventional PCB is made of fiberglass cloth, resin and copper foil. Because the substrate contains fiberglass cloth, when drilling with a laser drilling machine, the microporous formability will be poor, and the process is complicated and the cost is high. Therefore, RCC process technology has been gradually used in advanced countries ("Resin" Coated c〇pper", adhesive copper pendulum), can save the fiberglass cloth impregnating resin, not only simplify the process, but also reduce the cost and reduce the weight. It has been widely used in notebook computers, mobile phones, pDA and other portable products. in. In addition, as a copper foil material for electric power and signal wires, in order to achieve high-density thinning, the thickness of copper foil is thinned, which has become a tendency, so the thickness has been reduced from the previous 18μιη or 35μπι to the current 3 to 6μηι. Ultra-thin copper (nine) plus thin copper foil) 〇 generally ultra-thin adhesive copper foil, using aluminum foil as a carrier, and then on the aluminum foil to do the appropriate surface pre-treatment and separation layer (or called adhesion layer) treatment, and then A 3 to 6 μm thick copper foil layer is electroplated, subjected to a roughening, heat and oxidation resistant layer treatment, and then a varnish is applied to form a dielectric layer, and finally the carrier aluminum foil is peeled off. This ultra-thin backing copper foil is suitable for pCB and integrated circuit board (1C) carrier boards. However, currently available ultra-thin adhesive copper foil, the common surface 1300082 dielectric layer is too brittle, heat resistance is not good. With the ultra-thin copper foil, the effect is not good, and the need for high temperature resistance is lacking. According to the prior art, the removal of the fiberglass cloth to achieve the lightness of the substrate may cause the substrate to be brittle. "How to remove the fiberglass cloth at the same time The function of the substrate has been maintained, and it has become a problem to be solved. The inventors have found through extensive research that a resin composition having certain specific components is added with an organic solvent to prepare a varnish, and (iv) a copper drop (conductive layer). On the top, the dielectric layer can be formed to replace the glass fiber tape (4), which can save the fiberglass cloth, and can withstand high temperature and strong berth, suitable for various circuit designs. Apply this ultra-thin backing (four) substrate The printed circuit board of the process is thinner than the conventional brush board, and the cost can be greatly reduced due to the simplification of the process and the material. SUMMARY OF THE INVENTION An object of the present invention is to provide a resin composition. Another object of the present invention is to provide a backing ultra-thin steel-off dielectric layer material containing an enamel resin composition. [Embodiment] The present invention provides a resin composition comprising (a) 0.5 to 25 weight 丫 number of adhesive molecules (''binder polymer,,); (b) 1 〇 to 45 parts by weight of bromine-containing resin; (c) 10 to 60 parts by weight of epoxy Resin; and (d) 5 to 35 parts by weight of a hardener. The adhesive polymer compound which can be used in the resin composition of the present invention, preferably in a content of "managed to 15 parts by weight" and having an average molecular weight of 5, 〇〇〇至Μ0,000. l3〇〇082 The adhesive polymer compound used in the resin composition of the present invention is not particularly limited. The adhesive polymer compound of the present invention may be, for example, but not limited to Mixed polypyrene rubber ("mixed p〇iybutadiene rubber,"), polyester resin ("polyester"), @埽酸 resin ("acrylic and polyurethane resin" ("P〇lyUrethane"), and a mixture of such polymer compounds, etc. The sulphur-containing resin which can be used in the resin composition of the present invention has a brook ratio of 5 to 25% by weight based on the total weight of the resin composition. There are no special restrictions on the bromine-containing resin used. The bromine-containing resin which can be used in the present invention can be, for example, but not limited to, a bromine-containing epoxy resin, a lyophane resin and a sea dragon ("Hal〇ns"), a mixture thereof, etc. It can be used in the resin composition of the present invention. The epoxy resin preferably has a content of 15 to 30 parts by weight. The epoxy resin used in the resin composition of the present invention contains at least one glass transition temperature (, glass_transiti〇n temperature). , Tg) wherein the high glass transition temperature means 1 〇 or more (rc or more. The epoxy resin used in the resin composition of the present invention contains two or more g sulfhydryl groups < epoxy resin, for example, May be, but not limited to, bisphenol c, bisphen〇r) % oxygen resin, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol s J % oxygen resin, novolac novolac epoxy resin, phenolic Type alkyl novolac epoxy resin, modified novolac epoxy resin, dicyclopentadiene (ndiCycl〇pentadiene) epoxy resin or a mixture thereof. The hardener which can be used in the resin composition of the present invention is preferably contained in an amount of from 17 to 25 parts by weight. The hardener used in the resin composition of the present invention is well known to those skilled in the art, and non-limiting examples include amine-containing compounds, guanidine "hardeners, and imidaz0. e") Hardener. The resin composition of the present invention may optionally contain additives known to those skilled in the art, such as Def〇aming Agent, Levelling Agent, and surface adhesion. (Adhesive Pr〇m〇ter), Silane Coupling Agent, or a mixture thereof, etc. The present invention further provides a backing ultra-thin copper foil dielectric layer material comprising the above resin composition and an organic solvent. The adhesive ultra-thin copper foil dielectric layer material of the invention can not achieve a good adhesion effect with the ultra-thin copper foil when the adhesive polymer compound content is less than 0.5 parts by weight, but if the content exceeds 25 parts by weight When the content of the bromine-containing resin is less than 10 parts by weight, the flame resistance is lowered; when the content of the ring is less than 10 parts by weight, the heat resistance is greatly lowered. However, if the content exceeds 60 parts by weight, the dielectric layer becomes brittle and the reworkability is difficult; ^When the content of the hardener is less than 5 parts by weight, the heat resistance is lowered, and if the content exceeds 35 parts by weight, The chemical resistance may be lowered. The organic material suitable for use in the dielectric layer material of the present invention is not particularly limited and needs to be capable of dissolving the above resin composition, and examples thereof include, but are not limited to, methanol, acetone, methyl ethyl ketone or toluene or The present invention is further described in the following examples, which are not intended to limit the scope of the present invention, and any one skilled in the art of the present invention may achieve the modifications obtained without departing from the spirit of the present invention. And variations " t example i-chemical are within the scope of the invention. 15 parts by weight of carboxyl terminated butadiene ^ ^ h (Carboxyl Terminated 1300082
Butadiene Acrylonitrile，CTBN)( 1072CG，南帝橡膠）為成分 a， 25重量份含溴環氧樹脂（環氧當量=499，軟化點溫度為75 °C，含溴量為 2lwt· %，YDB-500, Toto chemical Industry，Co.， Ltd·)為成分b，10重量份bisphenol-A環氧樹脂（環氧當量 =2000 且軟化點為 124°C，Epicion 7051，Dai-Nippon Ink Chemistry， Co·，Ltd·)與 15 重量份甲驗·酉分趁型 (ncresol_novolac type11)環氧樹脂（環氧當量=215且軟化點為 78〇C，Epicion N-673，Dai-Nippon Ink Chemistry, Co.3 Ltd.) 為成分c，將上述樹脂溶解於甲乙酮（溶劑），加入30重量份 胺類化合物（二胺二苯基颯"Diamine Diphenyl Sulfonen，DDS) 及2重量份（2-乙基-4-甲基咪唑，2-E4MZ)為成分d，，2重 量份的流平劑以及4重量份的表面密著劑，即可得到清漆。 比較例1 15重量份的CTBN (1072CG，南帝橡膠）為成分a，10重 量份雙酚A型環氧樹脂（環氧當量=2000且軟化點為124 °C，Epicion 7051，Dai-Nippon Ink Chemistry，Co·，Ltd.)與 15重量份甲酚-酚醛型之酚醛環氧樹脂（環氧當量=215且軟 化點為 78°C，Epicion N-673， Dai-Nippon Ink Chemistry, Co.? Ltd.)為成分c，將上述樹脂溶解於甲乙酮中，加入30 重量份胺類化合物（DDS)及2重量份2-E4MZ為成分d，2 重量份的流平劑以及4重量份的表面密著劑，即可得到清 漆。 實施例2 10重量份的CTBN(1072CG，南帝橡膠）為成分a，35重 量份含溴環氧樹脂（環氧當量=499，軟化點溫度為75°C，含 1300082 溴量為 21 重量 ％，YDB-500，Toto Chemical Industry，Co.， Ltd·)為成分b，15重量份雙酚A型環氧樹脂（環氧當量=2000 且軟化點為 124°C，Epicion 705 1，Dai-Nippon Ink Chemistry， Co.，Ltd.)與20重量份甲酚-酚醛型環氧樹脂（環氧當量=215 且軟化點為 78°C，Epicion N-673，Dai-Nippon Ink Chemistry， Co.，Ltd.)為成分c，將上述樹脂溶解於甲乙酮中，加入15 重量份胺類化合物（DDS)及2重量份2-E4MZ為成分d，2 重量份的流平劑以及4重量份的表面密著劑’即可得到清 漆。 比較例2 35重量份之含溴環氧樹脂（環氧當量=499，軟化點溫度為 75 °C，含溴量為 21 重量 ％，YDB-500, Toto Chemical Industry， Co.，Ltd.)為成分b，15重量份雙酚A型環氧樹脂（環氧當量 =2000，軟化點為 124°C，Epicion 7051，Dai-Nippon Ink Chemistry，Co·，Ltd.)與20重量份甲酚-酚醛型環氧樹脂（環 氧當量=215 且軟化點為 78°C，Epicion N-673，Dai-Nippon Ink Chemistry，Co.，Ltd.)為成分c，將上述樹脂溶解於甲乙 酮中，加入15重量份胺類化合物（DDS)及2重量份2-E4MZ 為成分d，2重量份的流平劑以及4重量份的表面密著劑， 即可得到清漆。 比較例2-1 30重量份的CTBN(1072CG，南帝橡膠）為成分a，35重量 份含溴環氧樹脂（環氧當量=499，軟化點溫度為75°C，含溴 量為 21 重量 ％，YDB-500, Toto Chemical Industry，Co.，Ltd.) 為成分b，15重量份雙酚A型環氧樹脂（環氧當量=2000且 1300082 軟化點為 124〇C，Epicion 705 1，Dai-Nippon Ink Chemistry， Co.，Ltd.)與20重量份甲酚-酚醛型環氧樹脂（環氧當量=215 且軟化點為 78°C，Epicion N-673，Dai-Nippon Ink Chemistry， Co.，Ltd.)為成分c，將上述樹脂溶於甲乙酮中，加入15重 量份胺類化合物（DDS)及2重量份2-E4MZ為成分d，2重量 份的流平劑以及4重量份的表面密著劑，即可得到清漆。 青施例3 15重量份的CTBN (1072CG，南帝橡膠）為成分a，40重 量份含溴環氧樹脂（環氧當量=499，軟化點溫度為75°C，含 溴量為 21 重量％，YDB-500，Toto chemical Industry，Co·， Ltd.)為成分b，20重量份雙酚A型環氧樹脂（環氧當量=2000 且軟化點為 124°C，Epicion 705 1，Dai-Nippon Ink Chemistry， Co.，Ltd.)與25重量份甲酚-酚醛型環氧樹脂（環氧當量=215 且軟化點為 78 °C，Epicion N-673 ’ Dai-Nippon Ink Chemistry, Co.，Ltd.)為成分c，將上述樹脂溶於甲乙酮中， 加入20重量份胺類化合物（DDS)及2重量份2-E4MZ為成分 d， 2重量份的流平劑以及4重量份的表面密著劑，即可得 到粘著劑清漆。 比較例3 15重量份的CTBN (1072CG，南帝橡膠）為成分a，40重 量份含溴環氧樹脂（環氧當量=499,軟化點溫度為75°C， 含溴量為 21 重量 ％，YDB-500, Toto Chemical Industry，Co·， Ltd.)為成分b，25重量份甲酚-酚醛型環氧樹脂（環氧當量 =215 且軟化點為 78°C，Epicion N-673，Dai-Nippon Ink Chemistry，Co·，Ltd.)為成分c，將上述樹脂溶於甲乙酮中， -12 - 1300082 加入20重量份胺類化合物（DDS)及2重量份2-E4MZ為成分 d，2重量份的流平劑以及4重量份的表面密著劑，即可得 到粘著劑清漆。 比較例3-1 15重量份的CTBN (1072CG，南帝橡膠）為成分a，40重 量份含溴環氧樹脂（環氧當量=499,軟化點溫度為75°C， 含溴量為 21 重量 ％，YDB-5 00, Toto Chemical Industry，Co·， Ltd.)為成分b，20重量份雙酚A型環氧樹脂（環氧當量=2000 且軟化點為 124°C，Epicion 705 1，Dai-Nippon Ink Chemistry， Co.，Ltd.)與25重量份甲酚-酚醛型環氧樹脂（環氧當量=215 且軟化點為 78°C，Epicion N_673，Dai-Nippon Ink Chemistry， Co.，Ltd.)為成分c，將上述樹脂溶於甲乙酮中，加入40重 量份胺類化合物（DDS)及2重量份2-E4MZ為成分d，2重量 份的流平劑以及4重量份的表面密著劑，即可得到粘著劑清 漆。 將上述實施例與比較例調製成的清漆，塗佈於超薄銅箔 (厚度為3μιη或6μιη)的抗氧化層粗糙面上，在80至100°C 溫度下乾燥10分鐘，使膠液厚度在60至80μπι，製成背膠 超薄銅箔，依照ASTM規範，測試耐燃性、抗化藥性和剝 離強度。所得結果如表1所示。 -13- 1300082 表1 實施例 1 比較例 1 實施例 2 比較例 2 比較例 2-1 實施例 3 比較例 3 比較例 3-1 黏著高分子化合物 (1072CG)/重量份 15 15 10 0 30 15 15 15 含澳樹脂 (YDB-500)/重量份 25 0 35 35 35 40 40 40 環 氧 樹 脂 Epicion 7051 重量份 10 10 15 15 15 20 0 20 Epicion N-673 重量份 15 15 20 20 20 25 25 25 硬化劑(DDS) 重量份 30 30 15 15 15 20 20 40 焊料浴 (288°C，60sec) 通過 通過 通過 通過 通過 通過 通過 通過 美國UL 94V-0耐燃 性測試 通過 燃燒 通過 通過 通過 通過 通過 通過 抗化藥性 (鍍鎳金藥水 85〇C/90 min) 良好 良好 良好 良好 差 良好 良好 差 填孔測試（Viahole embedding ) 平整 平整 平整 溢膠 溢膠 平整 溢膠 平整 剝離強度 (kgf/cm2) 一般 (normal) 1.0 1.0 1.2 0.8 1.4 1.2 1.0 1.0 PCT 0.8 0.8 1.1 0.3 1.2 1.1 0.6 0.8Butadiene Acrylonitrile, CTBN) (1072CG, Nandi Rubber) as component a, 25 parts by weight of bromine-containing epoxy resin (epoxy equivalent = 499, softening point temperature of 75 ° C, bromine content of 2 lwt · %, YDB-500 , Toto chemical Industry, Co., Ltd.) as component b, 10 parts by weight of bisphenol-A epoxy resin (epoxy equivalent = 2000 and softening point of 124 ° C, Epicion 7051, Dai-Nippon Ink Chemistry, Co., Ltd·) with 15 parts by weight of 甲 酉 酉 ( (ncresol_novolac type 11) epoxy resin (epoxy equivalent = 215 and softening point of 78 〇 C, Epicion N-673, Dai-Nippon Ink Chemistry, Co. 3 Ltd .) as component c, the above resin was dissolved in methyl ethyl ketone (solvent), 30 parts by weight of an amine compound (Diamine Diphenyl Sulfonen, DDS) and 2 parts by weight (2-ethyl-4-) were added. Methylimidazole, 2-E4MZ) is a component d, 2 parts by weight of a leveling agent, and 4 parts by weight of a surface sealant to obtain a varnish. Comparative Example 1 15 parts by weight of CTBN (1072CG, Nandi Rubber) was component a, 10 parts by weight of bisphenol A type epoxy resin (epoxy equivalent = 2000 and softening point was 124 ° C, Epicion 7051, Dai-Nippon Ink) Chemistry, Co., Ltd.) with 15 parts by weight of a phenolic novolac type phenolic epoxy resin (epoxy equivalent = 215 and a softening point of 78 ° C, Epicion N-673, Dai-Nippon Ink Chemistry, Co.? Ltd.) is component c, the above resin is dissolved in methyl ethyl ketone, 30 parts by weight of amine compound (DDS) and 2 parts by weight of 2-E4MZ are added as component d, 2 parts by weight of leveling agent and 4 parts by weight of surface dense With the agent, you can get the varnish. Example 2 10 parts by weight of CTBN (1072CG, Nandi rubber) as component a, 35 parts by weight of bromine-containing epoxy resin (epoxy equivalent = 499, softening point temperature of 75 ° C, containing 1300082 bromine amount of 21% by weight) , YDB-500, Toto Chemical Industry, Co., Ltd.) as component b, 15 parts by weight of bisphenol A type epoxy resin (epoxy equivalent = 2000 and softening point of 124 ° C, Epicion 705 1, Dai-Nippon) Ink Chemistry, Co., Ltd.) with 20 parts by weight of cresol novolac type epoxy resin (epoxy equivalent = 215 and softening point of 78 ° C, Epicion N-673, Dai-Nippon Ink Chemistry, Co., Ltd.) .) as component c, the above resin was dissolved in methyl ethyl ketone, 15 parts by weight of an amine compound (DDS) and 2 parts by weight of 2-E4MZ as component d, 2 parts by weight of a leveling agent and 4 parts by weight of surface adhesion were added. A varnish can be obtained. Comparative Example 2 35 parts by weight of a bromine-containing epoxy resin (epoxy equivalent = 499, softening point temperature of 75 ° C, bromine content of 21% by weight, YDB-500, Toto Chemical Industry, Co., Ltd.) was Component b, 15 parts by weight of bisphenol A type epoxy resin (epoxy equivalent = 2000, softening point of 124 ° C, Epicion 7051, Dai-Nippon Ink Chemistry, Co., Ltd.) and 20 parts by weight of cresol-phenolic aldehyde Type epoxy resin (epoxy equivalent = 215 and softening point of 78 ° C, Epicion N-673, Dai-Nippon Ink Chemistry, Co., Ltd.) as component c, the above resin was dissolved in methyl ethyl ketone, and 15 weight was added. A varnish was obtained by using an amine compound (DDS) and 2 parts by weight of 2-E4MZ as the component d, 2 parts by weight of a leveling agent, and 4 parts by weight of a surface sealant. Comparative Example 2-1 30 parts by weight of CTBN (1072CG, Nandi Rubber) as component a, 35 parts by weight of bromine-containing epoxy resin (epoxy equivalent = 499, softening point temperature of 75 ° C, bromine content of 21 weight %, YDB-500, Toto Chemical Industry, Co., Ltd.) as component b, 15 parts by weight of bisphenol A type epoxy resin (epoxy equivalent = 2000 and 1300082 softening point is 124 〇 C, Epicion 705 1, Dai -Nippon Ink Chemistry, Co., Ltd.) with 20 parts by weight of cresol novolac type epoxy resin (epoxy equivalent = 215 and softening point of 78 ° C, Epicion N-673, Dai-Nippon Ink Chemistry, Co.) , Ltd.) is component c, the above resin is dissolved in methyl ethyl ketone, 15 parts by weight of an amine compound (DDS) and 2 parts by weight of 2-E4MZ are added as component d, 2 parts by weight of a leveling agent, and 4 parts by weight of a surface. A varnish can be obtained with a sealant. Example 3 15 parts by weight of CTBN (1072CG, Nandi rubber) as component a, 40 parts by weight of bromine-containing epoxy resin (epoxy equivalent = 499, softening point temperature of 75 ° C, bromine content of 21% by weight) , YDB-500, Toto chemical Industry, Co·, Ltd.) as component b, 20 parts by weight of bisphenol A type epoxy resin (epoxy equivalent = 2000 and softening point of 124 ° C, Epicion 705 1, Dai-Nippon Ink Chemistry, Co., Ltd.) with 25 parts by weight of cresol novolac type epoxy resin (epoxy equivalent = 215 and softening point of 78 ° C, Epicion N-673 ' Dai-Nippon Ink Chemistry, Co., Ltd. .) as component c, the above resin is dissolved in methyl ethyl ketone, 20 parts by weight of an amine compound (DDS) and 2 parts by weight of 2-E4MZ as component d, 2 parts by weight of a leveling agent and 4 parts by weight of surface adhesion The adhesive can be used to obtain an adhesive varnish. Comparative Example 3 15 parts by weight of CTBN (1072CG, Nandi Rubber) was component a, 40 parts by weight of a bromine-containing epoxy resin (epoxy equivalent = 499, a softening point temperature of 75 ° C, and a bromine content of 21% by weight, YDB-500, Toto Chemical Industry, Co., Ltd.) as component b, 25 parts by weight of cresol novolac epoxy resin (epoxy equivalent = 215 and softening point of 78 ° C, Epicion N-673, Dai- Nippon Ink Chemistry, Co., Ltd.) is component c, the above resin is dissolved in methyl ethyl ketone, -12 - 1300082 is added with 20 parts by weight of an amine compound (DDS) and 2 parts by weight of 2-E4MZ is a component d, 2 parts by weight. An adhesive varnish is obtained by using a leveling agent and 4 parts by weight of a surface adhesive. Comparative Example 3-1 15 parts by weight of CTBN (1072CG, Nandi Rubber) as component a, 40 parts by weight of bromine-containing epoxy resin (epoxy equivalent = 499, softening point temperature of 75 ° C, bromine content of 21 weight %, YDB-5 00, Toto Chemical Industry, Co., Ltd.) as component b, 20 parts by weight of bisphenol A type epoxy resin (epoxy equivalent = 2000 and softening point of 124 ° C, Epicion 705 1, Dai -Nippon Ink Chemistry, Co., Ltd.) with 25 parts by weight of cresol novolac type epoxy resin (epoxy equivalent = 215 and softening point of 78 ° C, Epicion N_673, Dai-Nippon Ink Chemistry, Co., Ltd.) .) as component c, the above resin is dissolved in methyl ethyl ketone, 40 parts by weight of an amine compound (DDS) and 2 parts by weight of 2-E4MZ as component d, 2 parts by weight of a leveling agent and 4 parts by weight of surface adhesion are added. The adhesive can be used to obtain an adhesive varnish. The varnish prepared in the above examples and comparative examples was applied to an anti-oxidation layer rough surface of an ultra-thin copper foil (thickness of 3 μm or 6 μm), and dried at a temperature of 80 to 100 ° C for 10 minutes to make a thickness of the glue. At 60 to 80 μm, a super-adhesive copper foil is prepared and tested for flame resistance, chemical resistance and peel strength in accordance with ASTM specifications. The results obtained are shown in Table 1. -13- 1300082 Table 1 Example 1 Comparative Example 1 Example 2 Comparative Example 2 Comparative Example 2-1 Example 3 Comparative Example 3 Comparative Example 3-1 Adhesive Polymer Compound (1072CG) / Parts by Weight 15 15 10 0 30 15 15 15 Resin-containing resin (YDB-500) / part by weight 25 0 35 35 35 40 40 40 Epion Epion 7051 parts by weight 10 10 15 15 15 20 0 20 Epicion N-673 parts by weight 15 15 20 20 20 25 25 25 Hardener (DDS) Parts by weight 30 30 15 15 15 20 20 40 Solder bath (288 ° C, 60 sec) Pass through by passing through the US UL 94V-0 flame resistance test by passing through the pass through pass through pass through Medicinal properties (nickel-plated gold syrup 85〇C/90 min) Good good Good good Good good Good good hole filling test (Viahole embedding) Flat leveling and smoothing overflow gel overflow flattening Epoxy peeling strength (kgf/cm2) Normal 1.0 1.0 1.2 0.8 1.4 1.2 1.0 1.0 PCT 0.8 0.8 1.1 0.3 1.2 1.1 0.6 0.8
結論 · 1.比較實施例1和比較例1之測試結果可知，添加含溴環氧 樹脂可增加背膠超薄銅箔的耐燃性。 2.比較實施例2和比較例2之測試結果可知，添加黏著高分 -14- 1300082 子化5物，可使背膠超薄銅箔在壓合後的剝離強度變大， 具有較佳的接著效果。 3·比較實施例2和比較例2-丨之測試結果可知，添加過量的 黏著高分子化合物，雖可增加剝離強度，但是耐化藥性會 降低而且會造成流膠過快而有填孔不佳的問題。 4. 比較實施例3和比較例3之測試結果可知，不添加軟化點 溫度高於塵合溫度的環氧樹脂，則背膠超薄銅络進行壓合 過程中會產生流膠過快的現象，不利於填孔。 5. 比較實施例3和比較例3]之測試結果可知，添加過量的 硬化劑，則耐化藥性會降低。 -15-Conclusions 1. Comparing the test results of Example 1 and Comparative Example 1, it was found that the addition of a bromine-containing epoxy resin can increase the flame resistance of the ultra-thin copper foil of the adhesive. 2. Comparing the test results of Example 2 and Comparative Example 2, it can be seen that the addition of the adhesive high score -14-1300082 sub-material can make the peel strength of the back-coated ultra-thin copper foil after pressing become larger, and has better Then the effect. 3. Comparing the test results of Comparative Example 2 and Comparative Example 2 - 可, it can be seen that the addition of an excessive amount of the adhesive polymer compound can increase the peel strength, but the chemical resistance is lowered and the gelation is too fast and the pore filling is poor. The problem. 4. Comparing the test results of Example 3 and Comparative Example 3, it can be seen that if the epoxy resin having a softening point temperature higher than the dusting temperature is not added, the ultra-thin copper matrix of the back-adhesive will cause excessive gelation during the pressing process. It is not conducive to filling holes. 5. Comparing the test results of Example 3 and Comparative Example 3, it was found that when an excessive amount of the hardener was added, the chemical resistance was lowered. -15-