1297190 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種封裝載體之檢測方法及其裝置，尤係 關於一種用於檢測封裝載體上之細部構造之幾何盥：、 置規袼之方法及其量測裝置。 、立 【先前技術】 於大部分封裝製帛中半導體晶粒多需I固定於一封褒載 體，例如.金屬導線架（leadframe)或捲帶式封裴 • Can^ Package，· TCP)之膠帶。然無論於進入封裝薇㈣時 或下線投入封裝製程，封裝載體都需要一再被檢視外觀或 查核重要尺寸，如此可確保封裝製程中各站之良率與單位 時間產出量均符合標準。 尤其在銲線（wire bonding)站作業前，品檢人員或作業人 員會而要调閱銲線圖，並在放大鏡或顯微鏡下比對導線架 之内引腳是否歪斜或其他缺陷。若内引腳歪斜超過允許（收） φ 規格則勢必會影響銲線品質，或者造成銲線機頻蘋停機而 嚴重影響單位時間產出量。然而上述比對方式不但不精 確’而且於有限時間内不能涵蓋太多細部尺寸之檢測。一 般封裝廠大多於進料檢驗時會採用較精確之投影機檢測導 線架之細部尺寸，然於廠内前段封裝製程（自晶圓切割至銲 線）站多無設有此種較昂貴之設備，亦即精確之量測無法於 生產線上直接執行。 圖1係一習知封裝載體之上視示意圖。封裝載體1〇可以 是分離條狀之導線架或者為連續之膠帶，無論導線架或膠 1297190 U，每—封裝單元11可與一晶粒 長侧邊上有複數個定位孔12或 帶都具有複數個封裝單元 相接合’而封裝載體1〇兩 傳送孔。 圖2係圖！中a部分之放大圖。該封裝載體㈣一導線 架型式之載體，半導體晶粒可固定於中間之晶粒載座⑻e _川卜並可藉*金屬導線將圍繞在旁邊之㈣腳㈣打 lead)l 12與晶粒電性連接。如圖2所示，由對角延伸至晶 粒載座1U旁之内引腳112長度最長，因此於導線架製： 或封裝製程中較容易產生歪斜。當内引腳112有歪斜時， 銲線設備將無法精確銲線，或者超出其機器視覺之影像辨 識設定而自動停機。尤其當導線架之腳數(_ c〇unt)愈多 時，例如用於160或208隻之高腳數封裝之導線架，精細 内引腳之檢測愈顯得重要及困難。 細上所述，電子封裝界亟需一種能有效檢測封裝載體上 成何尺寸規格之方法及有關量測工具，藉此可提升封裝良 率及維持單位時間内之高產出量。 【發明内容】 本發明之目的係提供一種封裝載體之快速檢測方法及其 政置’藉由將一標示量測圖型之透光片疊置於封裝載體 上’並藉由對該封裝載體與量測圖型之比對結果而立即判 斷出封裝載體之不良處。 本务明之另一目的係提供一種封裂載體之低成本檢測方 法及其裝置，不需要昂貴之量測設備就能精確找出封裝载 體之不良處。 1297190 :達上述目的’本發明揭示一種封裝載體之檢測方法， 、糸將—標示量測圖型之透光量測片對準於_封裝載體 上，而檢視該封裝載體上各細部構造與該彡光量測片上量 :圖型之相對關係，其中該量測圖型係該封裝载體之正確 、田。p尺寸加上可允許誤差範圍之圖案。根據該㈣位置關 系可以判斷該封裝載體上各細部構造之尺寸何為不良處。 本發明另揭示-種封裝載體之檢測裝置，係用來檢視一 • #裝載體上細部尺寸，其包含-透光量測片及一承載座。 口亥封裝載體係置於承載座上，又將該透光量測片對準疊置 於4封裝載體上。檢視該封裝載體上細部尺寸與該透光量 測片上量測圖型之相對位置關係，即可判斷該封裝載體上 細部尺寸何為不良處。 該檢測裝置另包含一上蓋體，該上蓋體可以壓合在該透 光畺測片上，使该透光量測片完全貼合並對準在該封裝載 體表面。 _ 4承載座5又有呈階梯狀之複數個承靠面，可供不同寬度 之該封裝載體分別固定於對應之該承靠面上。各該承靠面 上設有複數個導梢可供該封裝載體及該透光量測片固定位 置。 【實施方式】 圖3係本發明封裝載體之檢測裝置之立體示意圖。檢測 裝置30包含一承載座3卜一透光量測片32及一上蓋體33。 承載座3 1之上表面有呈階梯狀之複數個承靠面，其包括第 一承靠面3 11及第二承靠面3 12，可分別供不同寬度之封裝 1297190 載體80固定於對應之承靠面上。於第一承靠面3ιι上設有 第-導梢314(guidePin)’又第二承靠面312上另設有第二 導梢3 15。藉由第-導梢314或第二導梢315穿越過封裝載 體80上之定位孔81，就能精確固定封裝載體8〇與承載座 3 1之相對位置。 標示量測圖型322之透光量測片32係疊置於封裝載體 80上。由於透光量測片32之兩側邊設有複數個量測定位孔 _ 321，因此同樣藉由第—導梢314或第二導梢315穿越過量 測定位孔321，就能精確對準透光量測片32與封裝载體⑽ 之相對位置。只要檢視封裝載體8〇上細部尺寸與透光量测 片32上對應量測圖型322之相對關係，就能判斷封裝載體 80上至少一細部構造何為不良處。 該檢測裝置30另包含一上蓋體33,藉由上蓋體33之壓 合部332壓在透光量測片32上，可使透光量測片32完全 貼合並對準在封裝載體8〇表面，如此量測圖型322才能有 • 效度量封裝載體80上至少一細部構造。上蓋體33中間有 後數個觀測視窗333,從觀測視窗333就能清楚檢視比對結 果。、為能使上蓋體33在承載座3 1上不會滑移，可以利用 承载座31之肩部316上凸出之上蓋導梢313插入上蓋體33 之上蓋疋位孔331内而固定位置。為避免第一導梢314或 第二導梢315干涉到上蓋體33之壓合部332，可在上蓋體 33側邊鑽設第-定位孔334及第二定位孔奶以分別容納 第一導梢314及第二導梢315之凸出端部。 為月b增強對比封裝載體8〇上細部尺寸與透光量測片 1297190 之光線亮度，於承載座31下 下方可设置一發光元件35。另 外，當封裝韻8G上固定晶粒8 处_ 竹日日粒84面向承 載座31而利於透光量測片32仍緊貼合於封裝栽體80上。 圖4⑷及4⑻係一量測圖型323與内引腳112之比對扯 果，可量測封裝載體上各細部構造之位置公差_内引: 112歪斜量超過允許規格時，其端部之輪廓線會和量測圖型 323交又’反之’全部之内引腳112會落在量測圖型切1297190 IX. Description of the Invention: [Technical Field] The present invention relates to a method and apparatus for detecting a package carrier, and more particularly to a method for detecting a geometry of a detail structure on a package carrier: And its measuring device. [Prior Art] In most packaging systems, the semiconductor die needs to be fixed to a carrier, such as a leadframe or a tape-and-reel package. . However, the package carrier needs to be repeatedly inspected or checked for important dimensions when entering the package (4) or when the package is put into the packaging process. This ensures that the yield and unit time output of each station in the packaging process are in compliance with the standard. Especially before the wire bonding station, the quality inspector or operator will need to access the wire bond diagram and compare the pins inside the lead frame to any deviation or other defects under a magnifying glass or microscope. If the inner pin is skewed beyond the allowable (received) φ specification, it will inevitably affect the quality of the wire, or cause the wire machine to stop and seriously affect the output per unit time. However, the above comparison method is not only inaccurate and does not cover the detection of too many detail sizes for a limited time. In general, most of the packaging factories use a more accurate projector to detect the details of the lead frame during the inspection of the lead. However, in the front-end packaging process (from wafer to soldering), there is no such expensive equipment. That is, accurate measurement cannot be performed directly on the production line. Figure 1 is a schematic top view of a conventional package carrier. The package carrier 1 can be a strip-shaped lead frame or a continuous tape. Regardless of the lead frame or the glue 1297190 U, each package unit 11 can have a plurality of positioning holes 12 or strips on a long side of a die. A plurality of package units are joined to each other and the carrier is provided with two transfer holes. Figure 2 is a diagram! A magnified view of the a part. The package carrier (4) is a carrier of the lead frame type, and the semiconductor die can be fixed in the middle of the die carrier (8) e _ 川 卜 and can be surrounded by a metal wire to surround the (four) foot (four) lead led 12 12 and the die Sexual connection. As shown in Fig. 2, the inner lead 112 extending diagonally to the side of the crystal carrier 1U has the longest length, so that skewing is more likely to occur in the lead frame: or the packaging process. When the inner pin 112 is skewed, the wire bonding equipment will not be able to accurately wire the wire or automatically stop beyond the machine vision image recognition setting. Especially when the number of legs of the lead frame (_c〇unt) is increased, for example, for a lead frame of 160 or 208 high-pin packages, the detection of the fine internal pins becomes more important and difficult. As described above, there is a need in the electronic packaging industry for a method for effectively detecting the dimensions of a package carrier and related measurement tools, thereby improving package yield and maintaining high throughput per unit time. SUMMARY OF THE INVENTION The object of the present invention is to provide a method for quickly detecting a package carrier and its management 'by stacking a light-receiving sheet of a measurement pattern on a package carrier' and by using the package carrier The comparison between the measurement patterns and the results immediately determines the disadvantages of the package carrier. Another object of the present invention is to provide a low-cost detection method for a cracked carrier and a device thereof, which can accurately find the disadvantage of the package carrier without requiring an expensive measuring device. 1297190: For the above purpose, the present invention discloses a method for detecting a package carrier, and aligning the light-transmitting measurement sheet of the measurement pattern with the _ package carrier, and viewing the detailed structure of the package carrier and the The amount of light on the measurement chip: the relative relationship of the patterns, wherein the measurement pattern is the correct and the field of the package carrier. The p size plus a pattern of allowable error ranges. According to the (4) positional relationship, it can be judged whether the size of each detail structure on the package carrier is a bad place. The invention further discloses a detecting device for a package carrier, which is used for inspecting a detail of a #loading body, which comprises a light transmitting measuring piece and a bearing seat. The package package is placed on the carrier, and the light-transmissive measurement sheet is aligned on the package carrier. By examining the relative positional relationship between the size of the package on the package carrier and the measurement pattern on the light-transmissive tablet, it can be determined whether the size of the package on the package carrier is defective. The detecting device further comprises an upper cover body which can be pressed onto the light transmitting measuring piece so that the light transmitting measuring piece is completely attached and aligned on the surface of the package carrier. The carrier 4 further has a plurality of bearing surfaces in a stepped shape, and the package carriers of different widths are respectively fixed to the corresponding bearing surfaces. Each of the bearing surfaces is provided with a plurality of guiding tips for fixing the package carrier and the light transmitting measuring piece. Embodiments Fig. 3 is a perspective view showing a detecting device of a package carrier of the present invention. The detecting device 30 includes a carrier 3, a light transmitting measuring piece 32 and an upper cover 33. The upper surface of the carrier 3 1 has a plurality of bearing surfaces in a stepped shape, and includes a first bearing surface 311 and a second bearing surface 312. The package 1297190 can be fixed to the corresponding package. Bearing the face. A first guide tip 314 is disposed on the first bearing surface 3 ιι and a second guide tip 3 15 is further disposed on the second bearing surface 312. By the first guide tip 314 or the second guide tip 315 traversing the positioning hole 81 on the package carrier 80, the relative position of the package carrier 8's and the carrier 31 can be accurately fixed. The light transmitting gauges 32 of the marking pattern 322 are stacked on the package carrier 80. Since the two sides of the light transmitting measuring piece 32 are provided with a plurality of measuring holes _321, the first guiding tip 314 or the second guiding tip 315 can also pass through the excess measuring hole 321 to accurately align. The position of the light measuring sheet 32 and the package carrier (10). As long as the relative relationship between the size of the package carrier 8 and the corresponding measurement pattern 322 on the light transmission amount measuring chip 32 is examined, it can be determined whether at least one detail of the package carrier 80 is defective. The detecting device 30 further includes an upper cover 33. The pressing portion 332 of the upper cover 33 is pressed against the light transmitting measuring piece 32, so that the light transmitting measuring piece 32 can be completely attached and aligned on the surface of the package carrier 8. Thus, the measurement pattern 322 can have an at least one detail configuration on the package carrier 80. There are a plurality of observation windows 333 in the middle of the upper cover 33, and the comparison result can be clearly viewed from the observation window 333. In order to prevent the upper cover 33 from slipping on the carrier 31, the upper cover 313 can be inserted into the upper cover 33 of the upper cover 33 by the shoulder 316 of the carrier 31 to be fixed. In order to prevent the first guiding end 314 or the second guiding end 315 from interfering with the nip portion 332 of the upper cover body 33, the first positioning hole 334 and the second positioning hole milk may be drilled on the side of the upper cover body 33 to respectively receive the first guiding The protruding ends of the tip 314 and the second guiding tip 315. For the month b, the brightness of the package on the package 8 and the light transmittance of the light transmission sheet 1297190 can be enhanced, and a light-emitting element 35 can be disposed below the carrier 31. In addition, when the fixed crystal grain 8 is placed on the package 8G, the bamboo granule 84 faces the carrier 31, so that the light transmitting measuring piece 32 is still in close contact with the package carrier 80. Figure 4 (4) and 4 (8) are the comparison between a measurement pattern 323 and the inner pin 112, and can measure the position tolerance of each detail structure on the package carrier. _Introduction: 112 When the amount of skew exceeds the allowable specification, the end portion thereof The contour line will be intersected with the measurement pattern 323 and the other words in the opposite direction will fall on the measurement pattern.
内或重疊’如圖4(b)所示。該量測圖型切係將正確之内 引腳112尺寸繪製而成。 除此之外，如圖5所示亦為—量測位置公差示意圖，可 藉由更單純之量測圖型324(標*允許誤差之範圍）及⑵以 簡化比對作業。當左侧内引腳丨丨2 ▽丨判丨i2之端部接觸圓形之該量 測圖型324,而右側内引腳112之端部相對較遠離該量測圖 型324時，量測人員就能判定内引腳112端部均往右側偏 移。當然三角形之該量測圖㉟325可用來判斷内引腳US 根部是否也有偏移之現象。 圖6係-量測圖型326與膠帶6〇之比對結果示意圖，亦 意m 60上之一圓％ 61孔位或 線路係重要尺寸，因此藉由透光量測# 32上該量測圖型 326之虛線圓區域，就能比較出膠帶6〇上圓形61是否已超 出允許規格，本實施例不只限定於量測捲帶載體封裝中所 使用之膠帶，更可適用於導線m其他需要比對之細部 構造，只要是重要的孔位或者是線路，均能適用於本發明 之實施例。上述檢測方法不僅簡單易實施，更可避免尺規 -10- 1297190 轉換及反覆對照銲線圖。 圖7係一透光量測片之示意圖，可用於量測封裝載體上 各細部構造之尺寸公差，其中該量測圖型係該封裝载體之 正確細部尺寸加上可允許誤差範圍之圖案。透光量測片W 上除了有圓形之量測圖型326外，尚有一直徑較小之量測 圖型326,及一直徑較大之量測圖型326,，。當待測之孔位或 圓形銲墊之中心與量測圖型326之中心對準後，就能藉由 量測圖型326’及量測圖型326"之圓周範圍決定該孔位或圓 形銲墊是否實際直徑過小或過大。若孔位製造之直徑過 小，則會落於量測圖型326，内；相反，若孔位製造之直徑 過大，則會落於量測圖型326，，外。 圖8係另一透光量測片之示意圖，可用於量測封裝載體 上各細部構造之尺寸公差及位置公差。透光量測片32,有左 f兩組量測圖型，每一組均有一量測基準標記328及328，。 藉由該量測基準標I己328可以確保和待測之封裝載體相互 對準，又量測鮮標t 328，可以確保和待測孔位之中心點 ;由量測圖型327及右邊之量測基準標記328可先量 測待測孔位是否位置偏差，若位於量測圖型及Μ?，之 間，，則表示落在可允收之位置公差之内。#量測基準標記 328對準待測孔位之中心點時，而再由量測圖型326、326’ 及326 ，就能進一步確認該孔位之實際直徑是否符合標 =，,，亦即是否製造不良而造成直徑過大（超出至量測圖型 326之圓周外）或過小（落於量測圖型3%，之 以辨識尺寸公差。 精 -11 - 1297190 圖9係另一透光量測片之示意圖，可用於 上各細邱摄、生夕Ρ _4· \ β 、里41封裴載體 各、Ρ構造之尺寸公差及位置公差。透光量測片3左 右兩組量測圖型，分別適於量測不同之待 位及，一為内引腳），每-組均有—量測基準標 328。兩組量測圖型之量測步驟如圖8及圖*⑷之 揭露，故不在此贅述。 〇Internal or overlapping ' is shown in Figure 4(b). The measurement pattern cuts the correct size of the pin 112. In addition, as shown in Fig. 5, it is also a measurement position tolerance diagram, which can be simplified by comparing the pattern 324 (the range of the allowable error) and (2). When the left inner pin 丨丨2 ▽丨 determines that the end of the i2 contacts the circular measurement pattern 324, and the end of the right inner pin 112 is relatively far from the measurement pattern 324, the measurement is performed. The person can determine that the ends of the inner pins 112 are offset to the right. Of course, the measurement map 35325 of the triangle can be used to determine whether the root of the inner pin US is also offset. Fig. 6 is a schematic diagram showing the result of the comparison between the measurement pattern 326 and the tape 6〇, and also means that one of the m 60 is a 61% hole or an important dimension of the line system, so the measurement is performed by the light transmission measurement #32. The dotted circle area of the type 326 can compare whether the circle 61 on the tape 6 has exceeded the allowable specification. This embodiment is not limited to the tape used in the measurement of the tape carrier package, and is more suitable for the wire m. The detailed structure of the alignment can be applied to the embodiment of the present invention as long as it is an important hole position or a line. The above detection method is not only simple and easy to implement, but also avoids the ruler -10- 1297190 conversion and repeated comparison of the wire bond diagram. Figure 7 is a schematic illustration of a light transmitting gauge that can be used to measure the dimensional tolerances of the various detail configurations on the package carrier, wherein the measurement pattern is the correct detail size of the package carrier plus a pattern of allowable error ranges. In addition to the circular measuring pattern 326, the light transmitting measuring piece W has a smaller diameter measuring pattern 326 and a larger diameter measuring pattern 326. When the center of the hole to be tested or the center of the circular pad is aligned with the center of the measurement pattern 326, the hole can be determined by the circumference of the measurement pattern 326' and the measurement pattern 326" Whether the circular pad is actually too small or too large. If the diameter of the hole is too small, it will fall within the measurement pattern 326. On the contrary, if the diameter of the hole is too large, it will fall on the measurement pattern 326, and outside. Figure 8 is a schematic illustration of another light transmissive measuring sheet that can be used to measure dimensional tolerances and positional tolerances of various detail configurations on the package carrier. The light transmission measuring chip 32 has two sets of measurement patterns on the left f, and each set has a measurement reference mark 328 and 328. By measuring the reference mark I 328, it is ensured that the package carriers to be tested are aligned with each other, and the fresh mark t 328 is measured, and the center point of the hole to be tested can be ensured; the measurement pattern 327 and the right side are The measurement reference mark 328 can first measure whether the position of the hole to be tested is positional deviation. If it is located between the measurement pattern and the Μ?, it means that it falls within the tolerance of the position that can be accepted. # When the measurement reference mark 328 is aligned with the center point of the hole to be tested, and then by the measurement patterns 326, 326' and 326, it can be further confirmed whether the actual diameter of the hole position conforms to the standard =,, that is, Whether the manufacturing is poor or not, the diameter is too large (beyond the circumference of the measurement pattern 326) or too small (falling 3% of the measurement pattern to identify the dimensional tolerance. Fine -11 - 1297190 Figure 9 is another amount of light transmission The schematic diagram of the measuring piece can be used for the dimensional tolerances and positional tolerances of each of the fine Qiu, the _4· \ β , the 41 裴 carrier and the Ρ structure. The light transmission measuring instrument 3 is about two sets of measurement patterns Each is suitable for measuring different positions and one is an inner pin), and each group has a measurement reference 328. The measurement steps of the two sets of measurement patterns are disclosed in Fig. 8 and Fig. 4 (4), and therefore will not be described here. 〇
本發明之技術内容及技術特點已揭示如上1而孰悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種不 背離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者’而應包括各種不背離本發明之 替換及修飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1係一習知封裝載體之上視示意圖； 圖2係圖1中Α部分之放大圖； 圖3係本發明封裝載體之檢測裝置之立體示意圖；The technical and technical features of the present invention have been disclosed in the above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is not to be construed as limited by the scope of BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic top view of a conventional package carrier; FIG. 2 is an enlarged view of a portion of the package of FIG. 1;
圖4(a)及4(b)係一量測圖型與内引腳之比對結果示意圖； 圖5係另一量測圖型與内引腳之比對結果示意圖； 圖6係一量測圖型與膠帶之比對結果示意圖； 圖7係一透光量測片之示意圖； 圖8係另一透光量測片之示意圖；以及 圖9係另一透光量測片之示意圖。 【主要元件符號說明】 10 封裝載體 12 定位孔 11 封裝單元 3 0 檢測裝置 -12- 1297190Figure 4 (a) and 4 (b) is a schematic diagram of the comparison of a measurement pattern and an internal pin; Figure 5 is a schematic diagram of the comparison between another measurement pattern and an internal pin; Figure 6 is a quantity FIG. 7 is a schematic view of a light transmitting measuring piece; FIG. 8 is a schematic view of another light transmitting measuring piece; and FIG. 9 is a schematic view of another light transmitting measuring piece. [Main component symbol description] 10 Package carrier 12 Positioning hole 11 Package unit 3 0 Detection device -12- 1297190
31 承載座 32、 321、32"透光 33 上蓋體 35 發光元件 60 膠帶 61 圓形 80 封裝載體 81 定位孔 84 晶粒 111 晶粒載座 112 内引腳 311 第一承靠面 312 第二承靠面 313 上蓋導梢 314 第一導梢 315 第二導梢 316 肩部 321 量測定位孔 322〜326 > 326、 326，，、327、 327’ 量測圖型 331 上蓋定位孔 332 壓合部 333 觀測視窗 334 第一定位孔 335 第二定位孔 328 、328、32『 量測基準標記31 Carrier 32, 321、32"Light transmission 33 Upper cover 35 Light-emitting element 60 Tape 61 Round 80 Package carrier 81 Positioning hole 84 Die 111 Die carrier 112 Inner pin 311 First bearing surface 312 Second bearing The front surface of the cover 313 is covered by the guide 314, the first guide end 315, the second guide end 316, the shoulder portion 321 of the measurement position hole 322~326 > 326, 326,, 327, 327' measurement pattern 331 upper cover positioning hole 332 Portion 333 observation window 334 first positioning hole 335 second positioning hole 328, 328, 32" measurement reference mark
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