TWI294175B - - Google Patents
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- Publication number
- TWI294175B TWI294175B TW094131420A TW94131420A TWI294175B TW I294175 B TWI294175 B TW I294175B TW 094131420 A TW094131420 A TW 094131420A TW 94131420 A TW94131420 A TW 94131420A TW I294175 B TWI294175 B TW I294175B
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- thin
- thin body
- heat
- thermally conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/013461 WO2007010615A1 (fr) | 2005-07-22 | 2005-07-22 | Feuille thermoconductrice, procédé de fabrication d’une telle feuille conductrice, et module d’alimentation employant la feuille thermoconductrice |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200705627A TW200705627A (en) | 2007-02-01 |
TWI294175B true TWI294175B (fr) | 2008-03-01 |
Family
ID=37668504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094131420A TW200705627A (en) | 2005-07-22 | 2005-09-13 | Heat transfer sheet, and manufacturing method thereof, power module using the heat transfer sheet |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4582144B2 (fr) |
TW (1) | TW200705627A (fr) |
WO (1) | WO2007010615A1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MX2008015288A (es) * | 2006-05-31 | 2008-12-12 | Denki Kagaku Kogyo Kk | Unidad de fuente de luz de diodo emisor de luz. |
US20100027261A1 (en) * | 2007-01-30 | 2010-02-04 | Denki Kagaku Kogyo Kabushiki Kaisha | Led light source unit |
JP4854571B2 (ja) * | 2007-04-06 | 2012-01-18 | 三菱電機株式会社 | 半導体レーザ装置 |
JP2010073965A (ja) * | 2008-09-19 | 2010-04-02 | Denso Corp | 半導体冷却ユニット |
JP5484429B2 (ja) * | 2011-11-18 | 2014-05-07 | 三菱電機株式会社 | 電力変換装置 |
JP5877056B2 (ja) * | 2011-12-22 | 2016-03-02 | 日本シイエムケイ株式会社 | パワーモジュール用絶縁放熱基板とその製造方法 |
JP6813473B2 (ja) * | 2017-12-26 | 2021-01-13 | 公益財団法人鉄道総合技術研究所 | 放熱基板及びその製造方法 |
JP2019176060A (ja) * | 2018-03-29 | 2019-10-10 | 帝人株式会社 | 電気絶縁性熱伝導シート及びその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995002313A1 (fr) * | 1993-07-06 | 1995-01-19 | Kabushiki Kaisha Toshiba | Feuille d'evacuation thermique |
JP2004172286A (ja) * | 2002-11-19 | 2004-06-17 | Kyocera Chemical Corp | 熱伝導シート |
-
2005
- 2005-07-22 JP JP2007525482A patent/JP4582144B2/ja not_active Expired - Fee Related
- 2005-07-22 WO PCT/JP2005/013461 patent/WO2007010615A1/fr active Application Filing
- 2005-09-13 TW TW094131420A patent/TW200705627A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPWO2007010615A1 (ja) | 2009-01-29 |
JP4582144B2 (ja) | 2010-11-17 |
TW200705627A (en) | 2007-02-01 |
WO2007010615A1 (fr) | 2007-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |