TWI292192B - - Google Patents

Download PDF

Info

Publication number
TWI292192B
TWI292192B TW91137343A TW91137343A TWI292192B TW I292192 B TWI292192 B TW I292192B TW 91137343 A TW91137343 A TW 91137343A TW 91137343 A TW91137343 A TW 91137343A TW I292192 B TWI292192 B TW I292192B
Authority
TW
Taiwan
Prior art keywords
glass substrate
bottom plate
reaction chamber
preheating
disposed
Prior art date
Application number
TW91137343A
Other languages
English (en)
Chinese (zh)
Other versions
TW200411774A (en
Inventor
guo-shun Zheng
Tang Jiang I
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW91137343A priority Critical patent/TW200411774A/zh
Publication of TW200411774A publication Critical patent/TW200411774A/zh
Application granted granted Critical
Publication of TWI292192B publication Critical patent/TWI292192B/zh

Links

Landscapes

  • Chemical Vapour Deposition (AREA)
TW91137343A 2002-12-25 2002-12-25 Preheating reaction room TW200411774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91137343A TW200411774A (en) 2002-12-25 2002-12-25 Preheating reaction room

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91137343A TW200411774A (en) 2002-12-25 2002-12-25 Preheating reaction room

Publications (2)

Publication Number Publication Date
TW200411774A TW200411774A (en) 2004-07-01
TWI292192B true TWI292192B (ja) 2008-01-01

Family

ID=45067444

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91137343A TW200411774A (en) 2002-12-25 2002-12-25 Preheating reaction room

Country Status (1)

Country Link
TW (1) TW200411774A (ja)

Also Published As

Publication number Publication date
TW200411774A (en) 2004-07-01

Similar Documents

Publication Publication Date Title
US7313931B2 (en) Method and device for heat treatment
JP5549441B2 (ja) 保持体機構、ロードロック装置、処理装置及び搬送機構
TWI487058B (zh) 用於半導體基體上各種材質之分層沉積的裝置以及用於該裝置之升降銷
TWI411036B (zh) Shower head and substrate processing device
JP5303954B2 (ja) 疎水化処理方法、疎水化処理装置、塗布、現像装置及び記憶媒体
JP5129848B2 (ja) 接合装置及び接合方法
TWI412407B (zh) 減壓乾燥裝置
US11906246B2 (en) Organic film forming apparatus
US20010007246A1 (en) Thin-film deposition apparatus
WO2014123310A1 (en) Substrate support and substrate treating apparatus having the same
TW201334931A (zh) 用於拾取及放置熱3d玻璃之裝置及方法
US20150211792A1 (en) Substrate heating apparatus
JP5296132B2 (ja) 成膜装置
JP2018169050A (ja) 基板加熱装置、基板処理システム及び基板加熱方法
US8691706B2 (en) Reducing substrate warpage in semiconductor processing
JP2004052098A (ja) 基板処理装置およびそれに用いるサセプタ
TWI292192B (ja)
TWI700764B (zh) 裝載鎖定裝置中的基板冷卻方法、基板搬運方法及裝載鎖定裝置
TW201222622A (en) Apparatus for processing a substrate
TW516336B (en) Temperature-controlled chamber, and vacuum processing apparatus using the same, and heating method to process the object, cooling method to process the object
JP2019149578A (ja) 基板処理装置および基板処理方法
US20100003629A1 (en) Substrate firing device
JP2003059852A (ja) 基板の熱処理装置
TWI788363B (zh) 基板加熱裝置、基板處理系統及基板加熱方法
JP6096588B2 (ja) 基板処理装置及び基板処理方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees