TWI290091B - Method for manufacturing molding die and molded article obtained by this die - Google Patents

Method for manufacturing molding die and molded article obtained by this die Download PDF

Info

Publication number
TWI290091B
TWI290091B TW095117335A TW95117335A TWI290091B TW I290091 B TWI290091 B TW I290091B TW 095117335 A TW095117335 A TW 095117335A TW 95117335 A TW95117335 A TW 95117335A TW I290091 B TWI290091 B TW I290091B
Authority
TW
Taiwan
Prior art keywords
die
original plate
molded article
article obtained
molding die
Prior art date
Application number
TW095117335A
Other languages
English (en)
Other versions
TW200714440A (en
Inventor
Munemitsu Abe
Shozo Takamura
Satoru Shimizu
Eiji Shinohara
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of TW200714440A publication Critical patent/TW200714440A/zh
Application granted granted Critical
Publication of TWI290091B publication Critical patent/TWI290091B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B29C33/3878Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/42Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/42Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424Moulding surfaces provided with means for marking or patterning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00Optical elements, e.g. lenses, prisms

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Micromachines (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
TW095117335A 2005-06-03 2006-05-16 Method for manufacturing molding die and molded article obtained by this die TWI290091B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005164283A JP4646705B2 (ja) 2005-06-03 2005-06-03 金型の製造方法及び成型品の製造方法

Publications (2)

Publication Number Publication Date
TW200714440A TW200714440A (en) 2007-04-16
TWI290091B true TWI290091B (en) 2007-11-21

Family

ID=37481562

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117335A TWI290091B (en) 2005-06-03 2006-05-16 Method for manufacturing molding die and molded article obtained by this die

Country Status (7)

Country Link
US (1) US20080072708A1 (zh)
EP (1) EP1886785A4 (zh)
JP (1) JP4646705B2 (zh)
KR (1) KR100911908B1 (zh)
CN (1) CN101189110B (zh)
TW (1) TWI290091B (zh)
WO (1) WO2006129633A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5261823B2 (ja) * 2007-01-25 2013-08-14 住友電工ファインポリマー株式会社 光学モジュールおよびその製造方法
KR101441721B1 (ko) * 2007-03-26 2014-09-17 키모토 컴파니 리미티드 표면 요철의 제작방법
KR100927457B1 (ko) * 2008-03-13 2009-11-19 주식회사 에이앤피 테크 금형의 제조 방법과 금형을 이용한 플라스틱 필름의 제조방법
CN108897080B (zh) * 2018-07-11 2021-03-26 Oppo广东移动通信有限公司 电子装置及用于电子装置的闪光灯镜片的加工方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5928257A (ja) * 1982-08-06 1984-02-14 Sanyo Electric Co Ltd デイスク原盤の製造方法
US4478769A (en) * 1982-09-30 1984-10-23 Amerace Corporation Method for forming an embossing tool with an optically precise pattern
JPH03156747A (ja) * 1989-11-14 1991-07-04 Canon Inc 光情報記録媒体用スタンパーの製造方法
JP3023440B2 (ja) * 1993-11-10 2000-03-21 日本航空電子工業株式会社 補強材入り軽量真空注型品及びその製造方法
US5641437A (en) * 1995-09-29 1997-06-24 Johnson & Johnson Vision Products, Inc. Marking of mold inserts to produce marked contact lenses
US5932315A (en) * 1997-04-30 1999-08-03 Hewlett-Packard Company Microfluidic structure assembly with mating microfeatures
JPH10312585A (ja) * 1997-05-12 1998-11-24 Sony Corp 光学記録媒体作製用スタンパ、スタンパ用原盤、および光学記録媒体の製造方法
US6393685B1 (en) * 1997-06-10 2002-05-28 The Regents Of The University Of California Microjoinery methods and devices
NL1009106C2 (nl) * 1998-05-08 1999-11-09 Od & Me Bv Werkwijze voor het vervaardigen van een stamper, stamper verkregen volgens een dergelijke werkwijze alsmede optische schijf verkregen onder toepassing van een dergelijke stamper.
US6503231B1 (en) * 1998-06-10 2003-01-07 Georgia Tech Research Corporation Microneedle device for transport of molecules across tissue
US6743211B1 (en) * 1999-11-23 2004-06-01 Georgia Tech Research Corporation Devices and methods for enhanced microneedle penetration of biological barriers
JP4465887B2 (ja) * 2001-02-01 2010-05-26 日本ビクター株式会社 成形金型の製造方法
JP2002326231A (ja) * 2001-02-28 2002-11-12 Konica Corp 光学素子用金型、光学素子及びマスター型
US6663820B2 (en) * 2001-03-14 2003-12-16 The Procter & Gamble Company Method of manufacturing microneedle structures using soft lithography and photolithography
JP4244527B2 (ja) * 2001-04-06 2009-03-25 ソニー株式会社 光ディスクの製造方法
WO2002098624A1 (en) * 2001-06-05 2002-12-12 Mikro Systems Inc. Methods for manufacturing three-dimensional devices and devices created thereby
DE50209985D1 (de) * 2002-11-25 2007-05-31 Weidmann Plastics Tech Ag Verfahren zur Herstellung eines Werkzeugeinsatzes zum Spritzgiessen eines teils mit zweistufigen Mikrostrukturen
JP4515207B2 (ja) * 2004-09-17 2010-07-28 セイコーインスツル株式会社 型の製造方法とその型を用いて製造された部品
US7615479B1 (en) * 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein

Also Published As

Publication number Publication date
CN101189110A (zh) 2008-05-28
CN101189110B (zh) 2012-07-04
EP1886785A1 (en) 2008-02-13
KR100911908B1 (ko) 2009-08-13
KR20080013988A (ko) 2008-02-13
JP2006334987A (ja) 2006-12-14
EP1886785A4 (en) 2010-12-15
US20080072708A1 (en) 2008-03-27
JP4646705B2 (ja) 2011-03-09
WO2006129633A1 (ja) 2006-12-07
TW200714440A (en) 2007-04-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees