TWI289243B - Method, apparatus and system for process control at an interconnect level and computer readable program storage device - Google Patents

Method, apparatus and system for process control at an interconnect level and computer readable program storage device Download PDF

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Publication number
TWI289243B
TWI289243B TW092125872A TW92125872A TWI289243B TW I289243 B TWI289243 B TW I289243B TW 092125872 A TW092125872 A TW 092125872A TW 92125872 A TW92125872 A TW 92125872A TW I289243 B TWI289243 B TW I289243B
Authority
TW
Taiwan
Prior art keywords
control
interconnection
interconnect
workpiece
controller
Prior art date
Application number
TW092125872A
Other languages
English (en)
Chinese (zh)
Other versions
TW200408920A (en
Inventor
Robert J Chong
Eric O Green
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of TW200408920A publication Critical patent/TW200408920A/zh
Application granted granted Critical
Publication of TWI289243B publication Critical patent/TWI289243B/zh

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32183—Test cell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36284—Use of database for machining parameters, material, cutting method, tools
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Control By Computers (AREA)
TW092125872A 2002-09-30 2003-09-19 Method, apparatus and system for process control at an interconnect level and computer readable program storage device TWI289243B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/260,894 US6842661B2 (en) 2002-09-30 2002-09-30 Process control at an interconnect level

Publications (2)

Publication Number Publication Date
TW200408920A TW200408920A (en) 2004-06-01
TWI289243B true TWI289243B (en) 2007-11-01

Family

ID=32029815

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092125872A TWI289243B (en) 2002-09-30 2003-09-19 Method, apparatus and system for process control at an interconnect level and computer readable program storage device

Country Status (9)

Country Link
US (1) US6842661B2 (https=)
JP (1) JP2006501676A (https=)
KR (1) KR101001347B1 (https=)
CN (1) CN1685494A (https=)
AU (1) AU2003270745A1 (https=)
DE (1) DE10393397B4 (https=)
GB (1) GB2409339B (https=)
TW (1) TWI289243B (https=)
WO (1) WO2004032225A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8301288B2 (en) * 2004-06-16 2012-10-30 International Business Machines Corporation Optimized scheduling based on sensitivity data
US7235414B1 (en) * 2005-03-01 2007-06-26 Advanced Micro Devices, Inc. Using scatterometry to verify contact hole opening during tapered bilayer etch
US7964422B1 (en) 2005-11-01 2011-06-21 Nvidia Corporation Method and system for controlling a semiconductor fabrication process
KR100759684B1 (ko) * 2006-04-17 2007-09-17 삼성에스디아이 주식회사 건식식각장치 및 이를 이용한 유기전계발광 표시장치의식각방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3320035B2 (ja) * 1991-08-23 2002-09-03 株式会社半導体エネルギー研究所 半導体装置
US5844416A (en) * 1995-11-02 1998-12-01 Sandia Corporation Ion-beam apparatus and method for analyzing and controlling integrated circuits
US6041270A (en) * 1997-12-05 2000-03-21 Advanced Micro Devices, Inc. Automatic recipe adjust and download based on process control window
JP3310608B2 (ja) * 1998-01-22 2002-08-05 アプライド マテリアルズ インコーポレイテッド スパッタリング装置
US6054868A (en) * 1998-06-10 2000-04-25 Boxer Cross Incorporated Apparatus and method for measuring a property of a layer in a multilayered structure
JP3897922B2 (ja) * 1998-12-15 2007-03-28 株式会社東芝 半導体装置の製造方法、及びコンピュ−タ読取り可能な記録媒体
US6157078A (en) * 1999-09-23 2000-12-05 Advanced Micro Devices, Inc. Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication
JP3910324B2 (ja) * 1999-10-26 2007-04-25 ファブソリューション株式会社 半導体製造装置
JP3556549B2 (ja) * 1999-12-10 2004-08-18 シャープ株式会社 シート抵抗測定器および電子部品製造方法
US6413867B1 (en) * 1999-12-23 2002-07-02 Applied Materials, Inc. Film thickness control using spectral interferometry
US6470230B1 (en) 2000-01-04 2002-10-22 Advanced Micro Devices, Inc. Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication
US6747734B1 (en) 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
JP4437611B2 (ja) * 2000-11-16 2010-03-24 株式会社ルネサステクノロジ 半導体装置の製造方法
US6958814B2 (en) * 2002-03-01 2005-10-25 Applied Materials, Inc. Apparatus and method for measuring a property of a layer in a multilayered structure
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control

Also Published As

Publication number Publication date
DE10393397T5 (de) 2005-08-11
GB2409339B (en) 2006-05-10
TW200408920A (en) 2004-06-01
AU2003270745A1 (en) 2004-04-23
CN1685494A (zh) 2005-10-19
KR101001347B1 (ko) 2010-12-14
JP2006501676A (ja) 2006-01-12
US6842661B2 (en) 2005-01-11
WO2004032225A1 (en) 2004-04-15
US20040064214A1 (en) 2004-04-01
GB2409339A (en) 2005-06-22
DE10393397B4 (de) 2010-09-02
KR20050054969A (ko) 2005-06-10
GB0505536D0 (en) 2005-04-27

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MM4A Annulment or lapse of patent due to non-payment of fees