TWI289183B - A lamp set with a multi-layer heat dissipation structure - Google Patents

A lamp set with a multi-layer heat dissipation structure Download PDF

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Publication number
TWI289183B
TWI289183B TW94122673A TW94122673A TWI289183B TW I289183 B TWI289183 B TW I289183B TW 94122673 A TW94122673 A TW 94122673A TW 94122673 A TW94122673 A TW 94122673A TW I289183 B TWI289183 B TW I289183B
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Taiwan
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heat
heat sink
hole
heat pipe
sink
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TW94122673A
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Chinese (zh)
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TW200702593A (en
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Bin-Juine Huang
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Advanced Thermal Devices Inc
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Abstract

The invention is about a lamp set with a multi-layer heat dissipation structure. This lamp set has at least one heat conductive base. The sidewall of each heat conductive base forms at least a stairway-shaped heat conductive platform. The heat dissipation fins are arranged respectively in each heat conductive platform so that the structure of multi-layer heat dissipation is formed. The heat dissipation area of this lamp set thus is increased. When the lamp set starts to illuminate the light, the heat that is generated will pass the heat dissipation base to the heat dissipation fins. The multi-layer heat dissipation structure will speed up the heat dissipation and increase the heat dissipation effect, while produced via easier processes.

Description

.1289183 九、發明說明: 月日修(更)正替換頁 【發明所屬之技術領域】 本發明係一種具有多重疊層散熱結構之照明燈具,係 提仏種散熱效果較佳、製作方便的散熱燈具。 【先前技術】 隨著照明科技的提升,具有高亮度、高壽命與節省電 能等優點的半導體發光裝置已逐漸取代傳統的發光裝置, 然而半導體發光裝置皆是由若干LED (Light 叫.1289183 IX. INSTRUCTIONS: MONTHLY REPAIR (more) replacement page [Technical field of invention] The present invention is a lighting fixture with multiple laminated heat dissipation structures, which provides better heat dissipation and convenient heat dissipation. Lighting. [Prior Art] With the advancement of lighting technology, semiconductor light-emitting devices with advantages of high brightness, long life and power saving have gradually replaced conventional light-emitting devices. However, semiconductor light-emitting devices are composed of several LEDs (Light called

Di ode)4 /包所組成的,而各LED燈泡的燈心所能忍受的溫 度一般不能超過1 2 〇 °C,一旦超過該溫度會造成LED燈 泡的損毀,為了避免LED燈泡損毀,半導體發光裝置的散 熱結構就有其重要性。 現有的散熱燈具結構,請配合參考第九圖所示,其具 有一散熱殼體(70),散熱殼體(7〇)的一端連接有 一燈桿(7 1 )。 於使用時,可將一設有若干LED燈泡(7 3 )的發光 裝置(7 2 ) f密貼附於散熱殼體(7 〇 )的内側面,並 將燈桿(7 1 )設置於一合適位置處,當發光裝置(72) 發光時,各LED燈泡(7 3 )所產生的熱量會傳導至散熱 殼體(7 0 )處,藉由散熱殼體(7 〇 )達到散熱之效果。 然而現有散熱結構還是有其缺點存在,因為散熱殼體 (7 0 )皆為鋁鑄品,因此其模具較貴,重量較重,並且 散熱殼體(7 0 )僅為單層殼體,其散熱面積有限,導致 其散熱能力不足。 .1289183Di ode) 4 / package, and the temperature of the LED bulb can not withstand the temperature can not exceed 1 2 〇 ° C, once this temperature will cause damage to the LED bulb, in order to avoid LED bulb damage, semiconductor lighting device The heat dissipation structure has its importance. For the structure of the existing heat-dissipating lamp, please refer to the figure ninth, which has a heat-dissipating housing (70), and one end of the heat-dissipating housing (7〇) is connected with a light pole (7 1 ). In use, a light-emitting device (7 2 ) f provided with a plurality of LED bulbs (7 3 ) is closely attached to the inner side of the heat-dissipating housing (7 〇), and the light pole (7 1 ) is disposed on the first At a suitable position, when the light-emitting device (72) emits light, the heat generated by each of the LED bulbs (73) is conducted to the heat-dissipating housing (70), and the heat-dissipating effect is achieved by the heat-dissipating housing (7 〇). However, the existing heat dissipation structure still has its shortcomings, because the heat dissipation housings (70) are all aluminum castings, so the molds are expensive, the weight is heavy, and the heat dissipation housing (70) is only a single layer housing, The heat dissipation area is limited, resulting in insufficient heat dissipation. .1289183

本發明者有鑑於現有散熱燈具結構,其散熱能力明顯 不足’於是著手開# ’以期提供—種可以使燈具具有良好The present inventors have in view of the existing heat-dissipating lamp structure, and the heat-dissipating capability is obviously insufficient. Therefore, it is possible to provide a good-looking lamp.

散熱能力的照明燈具’經過不斷的試驗與努力,終於開發 出本發明。 X j發明之主要創作目的在於提供—種多層式散熱片結 構’藉以增加散熱面積,以期得到較佳的散熱效果且製作 方便之照明燈具。 為了達到前述之創作目的’本發明的技術手段在於提 供一種具有多重疊層散熱結構之照明燈具,其具有至少一 個導熱座’各導熱座的側壁形成有至少一個呈階梯狀的導 熱平台’於導熱座的-端部可供設置由若+ LED燈泡所组 成的發光裝置; 至少一片散熱片,各散熱片形成有至少一個貫孔,貫 孔可供導熱座貫穿,並使各散熱片與導熱座的各導熱平台 相互固定且構成熱傳導路徑。 當發光褒置發光時’各LED㈣所產生的熱能可破由 導熱座傳導至各散熱片4,藉由多層次散熱片結構增 熱面積以增快散熱之速度。 並且至少—片的散熱片與具有至少一個散熱平台的導 熱座相互結合並構成熱傳導’可增加彼此之間的散熱面 積’亚且散熱片可配合實際需求,改變其形狀與結構’所 以其散熱效果佳,同時能滿足較大的散熱面積的需求鱼 觀造型,且製作方便。 一 1289183 -----------------------W ----------------- ^ ^ 、 pr^/c&gt; ;\i} ?] ;;^( 【κ 方也方式】 ..—.....….…一..、〜.....〜'.^ 人本發明係一種具有多重疊層散熱結構之照明燈具,請 配合筝考第一圖所示,為本發明之第一實施例,於本實施 中其具有至少一個導熱座(1〇)、至少一個發光裝 置(20)、若干呈弧狀彎折的散熱片(3〇)與一燈桿 (40); 、,么4導熱座(1 〇 )的側壁形成有若干呈階梯狀的導熱 L ( 1 1 ),而使導熱座(1 〇 )為一由上而下遞增外 &amp;的柱體,於各導埶卑a Γ Ί 口 V…干σ ( 1 1 )處形成有若干相互間隔 、累孔$於導熱座(1 0 )的一端面形成有若干螺孔; 、口玄1光裝置(2 〇 ),係由若干LED燈泡(2丄)所 成I光衣Ϊ ( 2 〇 )係設置於導熱座(丄〇 )的另一 端面處; 。放熱片(3 〇 )’分別形成有至少一個或多個貫孔 貝孔(3 1 )的孔徑分別匹配於相對應導熱平 (1 1 )的外I,而分別套設在對應的導熱平台(丄1 ) 、酋放堯、片(3 〇 )於鄰近貫孔(3丄)的周圍且相對 於^熱平台(1 1 )上所設螺孔之位置處形成有穿孔,再 固^件(如螺絲)分別依序貫穿散熱#( 3 cn的穿 孔,並與導埶平a r Ί、 、…σ 11)的螺孔相互螺固,藉此將散埶 片(3〇)與導熱座( …、 (1 〇)相互結合,並且構成熱傳導; 燈椁(4 Π、 4+ ,八—端係與已具有散熱片(3 0 )的 4 座(3 s 勺另一玄而部相互固接。 於使用時,可蔣、丨炊4曰f / A、 將( 4 ο )的另端固定於一適當位 .1289183 iy 置處,例如:室内的天花板,當發光裝置(2 〇)發光時, 各LED @泡(2 1 )所產生的熱能可經由導熱座(丄J) 傳導至各散熱片(3 〇 )處’藉由多層次的散熱片㈡〇 ) 結構,而達到增加散熱面積之方式,藉此增快散熱之速度。 另外,於本實施例中,相鄰於發光裝置(2 〇 )的— 散熱片(3 0 )内側面可為—光反射面(3 2 ),該光反 射面(3 2 )可反射發光裳置(2 〇 )所產生之光=, 提升照明亮度。 ^ 請配合參考第二及三圖所示,為本發明 施例’其基本構成與前一實施例相同,不同處在於散心 的形狀變化,如圖所示,各散熱片(3 0 A ) ( 3 〇 B) 可為-弧面彎折、平面狀的片體或鰭片狀的片^,並於各 散熱片(3 〇 A )( 3 Ο B )的側面間隔突形成有若干散 熱’.’、曰片(3 1 A ) ( 3 1 B ),以增加散熱面積,進而增 快散熱之效率。 曰 另外’本發明的第一、二及三實施例中,可於其上裝 設-增:其散熱效果的散熱模組,該散熱模組可如同隨後 所述之第四實施例中的迴路熱管散熱模組,也可以是—種 由單管式傳統熱管組成的散熱模組。 請配合參考第四、五及六圖所示,為本發明之第四實 施例’於本實施例中,其具有一導熱座(工〇 )、—下散 熱片(3〇C)、至少1中散熱片(3〇d)、—上L 熱片(3 〇 E )、-迴路熱管散熱模(5 〇 )、一外散 熱片(3〇F)、'一前支撞η f β π、 月j叉茯片(60)、一後支撐片(6 1289183 ' u與—燈捍(62); 4下散熱片(3 〇 c ) 貫孔(3ΐΓ、 乂成有至少一個貫孔(3ic), 丄L )的周圍形成士 ⑽(30c)的—倒2若干穿孔⑴…於下 3C),請配入 面大伸形成有若干散熱,鳍片(3 4C),藉由粗越表面(3:不’該側面為粗糙表面(3 的散熱面積; 4 c )增加下散熱片(3 0 C ) 該中散熱月(3 〇 D )甘4 的貫孔(31C)處形成有〜,相對於下散熱片(3〇C) D)的周圍形成有若干貝孔(3iD—),貫孔(3 1 〇)依序貫穿下散熱片 2D),前述之導熱座(1 散熱片(3〇D)的貫孔(3iC?貫孔(31C)與中 貫穿散熱片(3 0)的穿$ ),數固定件分別依序 、d U」的牙孔,並與導埶 孔相互螺固,並且構成熱傳導;…千口( 1 1 )的螺 該上散熱片(3 0 E ),並_而丨二^ 片(3 1 E )兮也丨而+ ’、 {面形成有若干散熱鰭 1 E ),该側面亦為粗糙表面, 相對於導埶座(i 〇 )的浐% + 上放熱片(3 0 Ξ ) 彳…压(1 0 )的多而面之螺孔位置處 2 E ),數固定件依序貫穿 :有牙孔(3 η ρ , 、、片(3 0 Ε )的穿孔(? 2E),並與導熱座(1Q)之螺孔相互 ^孔(3 散熱片(30E)與導熱座(1〇) 〃 ’精此將上 並且構成熱傳導; —端部相互固定, 該迴路熱管散熱模組(50),其係固&amp; (3 〇 Ξ )的另一側面,迴路熱管散熱模組 月…、片 一熱管散熱片(51)、一個熱導管5〇)具有 5 3 )與一包含有 日修(更)正替換頁 1289183 迴路熱管蒸發器(5 2 a、从 --- $ $人△ + A )的熱管吸熱塊體(5 2 ) ,士主 再吻考第六圖所示,熱管吸熱塊體(52 =, 散熱片(3 〇 e )與熱管 ':、上 於導熱座(1 0)的位置# 之間’亚且相對 rt 4 〕位置處,而且貼附於上散埶t! f Q η Ε )與熱管散熱片(5 ] Λ 4… 月文熱片(3 〇 1)係固定於上散熱片(3 以片(5 熱導管(5 q彳&amp; ’ 相拔 )的一端係與迴路熱管蒸發器(^ 9 Δ、 相連、,、口亚構成熱導, 〈52Α) 1)緊密貼…广、之管壁係與熱管散熱片(5 ^ 丨仃運結,以形成一熱管迴路, 光裝置(2 〇 )的]9 :前述之發 μ , r LiiD燈泡(2 1 )之埶量導A也 片(5 1 ); … V入熱管散熱 熱導管(5 如、 d )其内充灌有工作流體,M i 在迴路熱管蒸發 错由工作流體 (5 , , ( 5 2 A )吸熱蒸發成蒸氣,叙— 〈3 d )流至另一 ☆山也μ ^ 鉍熱導管 ^ L 而熱管散熱片(5 1 )虛,、人 而放熱,熱量經由該虎办/ ~凝成液體 另知利用迴路埶營 …、v t (5 3) 埶其一 、、、备态(5 2 A )的毛細現參 …、吕瘵發器(5 9 △、 象吸回迴路 路· )内繼績吸熱蒸發,而構成, 格, 战〜循環迴 一固定桎(q iB 4U 丄F ) ’其係固定於上勒献y 相對於外散熱片㈠… '上放熱# (30E) 片(S Ί、 0 F )的側面處,並且貫穿勃# (5 1 )所形成之♦方r ^ t 、牙熱管散熱 的足, 貝孔(5 4 )與外散埶片广〇 的另-側面直接相 A 政熱片(3 0F) (1 0 ) ^ 合固定並構成熱傳導(即-道^ u)截面較大眭、 田導熱座 W声 ^ X ^ ),並且相鄰於導埶座卩j ^ 置處,該固定才主(? p、 u ( 1 〇 )的位 3 1 F )可使迴路熱管散熱模钽(5 〇 ) 10 :·導換頁 .1289183 與外散熱片(3 0 F )連結固定,進而使其外散( 3 OF)與迴路熱管散熱模組(5〇)的熱管吸熱塊體(5 2 )透過熱管散熱片(5 1 )相互結合; 於不同的實施例中,並且導熱座(i 〇 )截面較小, 而只需適當的散熱功能時,固定柱(3丄F)可設置於外 散熱片(3 〇 F )與迴路熱管散熱模組(5 〇 )之間· 該外散熱片(3 0 F )除散熱功能外,也用以保错迴 路熱管散熱模組(50) ’藉以避免外物撞擊、鳥獸;_ 或排泄物污染,另外’如熱管散熱片(5 i )、經過特殊加 強結構設計與表面處理而可抵抗外物撞擊或排泄物污毕, 為降,成本’外散熱片(30F)可移除不用. 定二Γ (60)與後支撐片(61),其係分別固 …、片(30E)與下散熱片(3〇 端,前支撐片(6 〇 )與後支…兩 干風孔(6〇1) (611) (61)分別形成有若 孔(6&quot;)之門:二?,於後支撐片(61)的風 丄;t間形成有一桿「 〇)與後支揮iWR〕W ) ’前支撑片(6 夂又保片(Θ 1 )的功用在 E)與下散熱片(3QC),t支#上放熱片(3〇 支撐力量; 错以使本實施例具有適當的 燈桿(6 2 ),苴一端彳办 的捍孔(612)位置處,;:置固設於後支撑片(6!) 件螺固或其他方式(如焊接)各固定方式除可為固定 中具有亀識者可輕易實施,’:不方f:其所屬技術領域 本貫施例於實際使用時將二 T將燈桿(6 2 )的另端設 11 1289183 置於一適當位置處,例如:室If需—要ϋ〜认—一」 主&gt;Τ而要妝明的位置處,去 光裝置(2 0 )發光時,各UD燈 &quot; 且/S c 2 1 )所產生的埶 能玎經由導熱座(1 〇)傳導至下散熱片(3 〇 C)、中 散熱月(30D)、上散熱片(3〇E)、迴路熱管散敎 模組(50)與外散熱片(3〇F)|,藉此達到散熱之 效果。 而W支撐片(60)與後支禮片(61)的風孔(6 0 1 ) ( 6 1 1 )使外部的低溫空氣可於上散熱片(3 0The lighting fixture of the heat dissipation capability has finally developed the present invention through continuous experimentation and efforts. The main purpose of the Xj invention is to provide a multi-layered heat sink structure, which is used to increase the heat dissipation area, in order to obtain a better heat dissipation effect and to manufacture a convenient lighting fixture. In order to achieve the aforementioned creative purpose, the technical means of the present invention is to provide a lighting fixture having a multi-layer heat dissipation structure, which has at least one heat-conducting seat, and the side walls of each of the heat-conducting seats are formed with at least one stepped heat-conducting platform for conducting heat. The end portion of the seat can be provided with a light-emitting device composed of a + LED bulb; at least one heat sink, each fin is formed with at least one through hole, the through hole is for the heat conducting seat to penetrate, and the heat sink and the heat conducting seat are Each of the heat transfer platforms is fixed to each other and constitutes a heat conduction path. When the illuminating device emits light, the thermal energy generated by each of the LEDs (four) can be broken by the heat conducting seat to the heat sinks 4, and the heat absorbing area is increased by the multi-layer heat sink structure to increase the speed of heat dissipation. And at least the heat sink of the sheet and the heat conducting seat having at least one heat dissipating platform are combined with each other to form a heat conduction 'to increase the heat dissipating area between each other' and the heat sink can be matched with actual needs to change its shape and structure. Good, at the same time, it can meet the needs of large heat dissipation area, and it is easy to make. One 1279183 -----------------------W ----------------- ^ ^ , pr^/c&gt ; ;\i} ?] ;;^( [κ方也方式] ....................1..,~.....~'.^ People This invention is a kind of overlap The lighting fixture of the layer heat dissipation structure, please refer to the first embodiment of the kite test, which is a first embodiment of the present invention. In the present embodiment, it has at least one heat conducting seat (1〇), at least one light emitting device (20), and several The heat sink (3〇) and the light pole (40) which are bent in an arc shape form a plurality of stepped heat conduction L (1 1 ) on the side wall of the heat conducting seat (1 ,), and the heat conducting seat is formed (1 〇) is a column that is incremented from top to bottom and is formed at a distance V Γ Ί mouth V... dry σ ( 1 1 ) with a number of mutually spaced, reaped holes in the heat conducting seat (1) 0) is formed with a plurality of screw holes on one end surface; and a light-emitting device (2 〇), which is made up of a plurality of LED bulbs (2 turns), is disposed on the heat-transfer seat (丄〇) The other end face of the heat release sheet (3 〇) is formed with at least one or more through hole holes (3 1 ) respectively, and the apertures are respectively matched to the relative The outer I of the heat conduction flat (1 1 ) is respectively set on the corresponding heat conduction platform (丄1), the emirate, and the slice (3 〇) around the adjacent through hole (3丄) and relative to the heat platform ( 1 1) A perforation is formed at the position of the screw hole provided on the upper part, and the fixing member (such as a screw) is sequentially penetrated through the heat dissipation # (3 cn perforation, and the guide 埶 ar Ί, ... σ 11) The holes are screwed to each other, thereby combining the dilated sheet (3〇) with the heat conducting seat (..., (1 〇) and forming heat conduction; the lamp 椁 (4 Π, 4+, 八-end and already having the heat sink) 4 of the (3 0 ) (3 s scoops of another mysterious part are fixed to each other. When used, can be Jiang, 丨炊 4曰f / A, the other end of ( 4 ο ) is fixed in a suitable position. 1281913 Iy placed, for example: indoor ceiling, when the light-emitting device (2 〇) emits light, the heat generated by each LED @2 (2 1 ) can be transmitted to each heat sink (3 〇) via the heat-conducting seat (丄J) 'With a multi-layer heat sink (2) 〇) structure, the way to increase the heat dissipation area is achieved, thereby increasing the speed of heat dissipation. In addition, in this embodiment, adjacent to the light-emitting device (2) 〇) — The inner side of the heat sink (30) can be a light reflecting surface (3 2 ), which can reflect the light generated by the light emitting surface (2 〇) to improve the brightness of the illumination. ^ Please refer to the second and third figures for the embodiment of the present invention. The basic configuration is the same as that of the previous embodiment. The difference lies in the shape change of the center of gravity, as shown in the figure, each heat sink (30 A) ( 3 〇B) can be a curved, flat sheet or fin-shaped sheet ^, and a number of heat dissipation is formed on the sides of each heat sink (3 〇A ) ( 3 Ο B ). ', 曰 (3 1 A) (3 1 B), to increase the heat dissipation area, thereby increasing the efficiency of heat dissipation. In addition, in the first, second and third embodiments of the present invention, a heat dissipation module having a heat dissipation effect may be mounted thereon, and the heat dissipation module may be a circuit as in the fourth embodiment described later. The heat pipe cooling module can also be a heat dissipation module composed of a single-tube conventional heat pipe. Please refer to the fourth, fifth and sixth figures, which is a fourth embodiment of the present invention. In the embodiment, it has a heat conducting seat (worker), a lower heat sink (3〇C), at least 1 Medium heat sink (3〇d), upper L heat film (3 〇E), loop heat pipe heat sink (5 〇), one outer heat sink (3〇F), 'a front branch η f β π, Month j fork piece (60), one rear support piece (6 1289183 'u and - lamp 捍 (62); 4 lower heat sink (3 〇 c) through hole (3 ΐΓ, 乂 into at least one through hole (3ic) , 丄L) around the formation of the 士 (10) (30c) - pour 2 a number of perforations (1) ... in the lower 3C), please fit the surface to form a large amount of heat dissipation, fins (3 4C), by rough surface (3 :Do not 'the side is a rough surface (3 heat dissipation area; 4 c) increase the lower heat sink (3 0 C). The middle heat dissipation month (3 〇D) Gan 4's through hole (31C) is formed with ~, relative to The lower heat sink (3〇C) D) is formed with a plurality of bell holes (3iD—), and the through holes (3 1 〇) sequentially penetrate the lower heat sink 2D), the aforementioned heat conducting seat (1 heat sink (3〇D) ) through hole (3iC? through hole (31C) and through the heat sink (30) Wearing $), the fixed pieces are sequentially, d U", and are screwed to the guide hole, and constitute heat conduction; ... Thousands of mouths (1 1 ) of the screw on the heat sink (30 E), And _ 丨 ^ 2 ^ piece (3 1 E ) 兮 丨 and + ', { surface formed with a number of heat sink fins 1 E ), the side is also a rough surface, relative to the guide ( (i 〇) 浐% + The upper heat sink (30 Ξ) 彳...the pressure (1 0 ) of the multi-faceted screw hole position 2 E ), the number of fixing parts are sequentially penetrated: there are dental holes (3 η ρ , , , (3 0 Ε Perforation (? 2E) and mutual hole with the screw hole of the heat conducting seat (1Q) (3 heat sink (30E) and heat conducting seat (1〇) 〃 'finish this and constitute heat conduction; , the loop heat pipe cooling module (50), the other side of the fastening &amp; (3 〇Ξ ), the loop heat pipe cooling module month ..., the sheet heat pipe heat sink (51), a heat pipe 5 〇) has 5 3) With a heat pipe heat sink block (5 2 ) containing a daily repair (more) positive replacement page 1289183 loop heat pipe evaporator (5 2 a, from --- $ $ person △ + A ), the gentleman kisses again Test tube shown in Figure 6, heat pipe The hot block (52 =, heat sink (3 〇e ) and heat pipe ':, at the position of the heat transfer seat (10) between the 'sub and relative rt 4' position, and attached to the upper divergence t ! f Q η Ε ) with heat pipe heat sink (5 ] Λ 4... Moon heat film (3 〇 1) is fixed to the upper heat sink (3 with a piece (5 heat pipe (5 q彳 &amp; 'supplied) One end is connected with the loop heat pipe evaporator (^ 9 Δ, connected, and the sub-portion constitutes the thermal conductivity, <52Α) 1) Closely attached to the wide wall tube and the heat pipe fins (5 ^ 丨仃 transport knot to form A heat pipe loop, the light device (2 〇)]9: the aforementioned hair μ, r LiiD bulb (2 1 ) 埶 导 A A (5 1 ); ... V into the heat pipe heat pipe (5, d ) The working fluid is filled therein, and the M i in the loop heat pipe evaporates from the working fluid (5, , ( 5 2 A ) absorbs heat and vaporizes into vapor, and the Syrian-<3 d) flows to another ☆ mountain also μ ^ 铋 heat The tube ^ L and the heat pipe fin (5 1 ) is virtual, and the person is exothermic, the heat is passed through the tiger / ~ condensed into a liquid, otherwise knowing to use the circuit to camp..., vt (5 3) 埶一,,, 5 2 A ) The capillary is now... The hairspray (5 9 △, like the suction back circuit) has a heat absorption evaporation, and the composition, the lattice, the war ~ the cycle back to a fixed 桎 (q iB 4U 丄F ) 'the system is fixed on the upper y y relative On the outer heat sink (1)... 'Top heat # (30E) on the side of the piece (S Ί, 0 F ), and through the 勃# (5 1 ) formed by the square r ^ t, the heat pipe of the heat pipe, the hole (5 4) Directly opposite to the other side of the external sputum film A Zhengzheng film (30F) (1 0) ^ fixed and formed a heat conduction (ie - channel ^ u) large cross section, field heat conduction seat W sound ^ X ^ ), and adjacent to the guide 卩 ^ j ^ placed, the fixed only master (? p, u ( 1 〇) bit 3 1 F ) can make the loop heat pipe cooling module (5 〇) 10 : · guide page .1289183 and the outer heat sink (30F) is fixed and externally dispersed (3 OF) The heat pipe heat absorbing block (52) of the loop heat pipe heat dissipating module (5〇) is coupled to each other through the heat pipe fins (5 1 ); in different embodiments, and the heat conducting seat (i 〇) has a small cross section, When only proper heat dissipation is required, the fixed post (3丄F) can be placed between the outer heat sink (3 〇F) and the loop heat pipe cooling module (5 〇). The outer heat sink (3 0 F ) In addition to the heat dissipation function, it is also used to protect the loop heat pipe cooling module (50) 'to avoid foreign objects, birds and beasts; _ or waste pollution, and 'such as heat pipe heat sink (5 i ), after special reinforcement structure design and The surface treatment can resist the impact of foreign objects or the discharge of waste materials. In order to reduce the cost, the external heat sink (30F) can be removed. The two (60) and the rear support sheets (61) are respectively fixed, The piece (30E) and the lower heat sink (3 end, front support piece (6 〇) and rear support... two dry air holes (6〇1) (611) (61) are respectively formed (6&quot;) The door: two?, the wind of the rear support piece (61); between the t formed a "「" and the rear support iWR] W) 'front support piece (6 夂 and security film (Θ 1 The function is to use E) and lower heat sink (3QC), t-branch on the hot plate (3 〇 support force; wrong to make this embodiment have a suitable light pole (6 2 ), the 捍 one side of the pupil ( 612) Position,;: Fixing on the rear support piece (6!) Screwing or other means (such as welding). The fixing method can be easily implemented for those who have the knowledge of fixing. ': No square f: In the actual application, the second embodiment places the other end of the light pole (6 2 ) 11 1289183 in an appropriate position, for example, the room If-required-recognition-one main &gt; At the position where the makeup is to be made, when the light-emitting device (20) emits light, the heat generated by each of the UD lamps &quot; and /S c 2 1 ) is conducted to the lower heat sink via the heat-conducting seat (1 〇) ( 3 〇C), medium heat dissipation month (30D), upper heat sink (3〇E), loop heat pipe bulk module (50) and external heat sink (3〇F)|, to achieve the effect of heat dissipation. The wind holes (6 0 1 ) (6 1 1 ) of the W support piece (60) and the rear support piece (61) allow the external low temperature air to be applied to the upper heat sink (3 0

E)與下散熱月㈡0C)之間流動,藉此達到熱對流之 效果,進而達到散熱之效果。 請配合參考第八圖所示,為本發明之第五實施例,由 於某些設置照明燈具的位置需要較多的亮%,因此昭明燈 臭會設置有多個導熱座(1〇),藉此增加發光裝置(2 0 )’以便增加照明燈具所發出的亮《,於本實施例中, 導熱座(1 0 )的數!為兩個,而照明燈具的其它各構件 與導熱座(1 0 )之相對應的關係亦隨之改變。E) and the lower heat dissipation month (2) 0C) flow, thereby achieving the effect of heat convection, thereby achieving the effect of heat dissipation. Please refer to the eighth embodiment of the present invention. In the fifth embodiment of the present invention, since some positions of the lighting fixtures need more brightness percentage, the Zhaoming lamp smell is provided with a plurality of heat conducting seats (1〇). This increases the illuminating device (20) to increase the brightness emitted by the luminaire, in this embodiment, the number of thermal pads (10)! For two, the relationship between the other components of the lighting fixture and the heat conducting seat (10) also changes.

vt' 所。本务明之散熱片係使用銘擠製成法, 多片的散熱片與具有多個散熱平台(1 1)的導熱座(1 〇 )相互結合與熱導通,可增加彼此之間的散熱面積,其 製程容易’並可輕易拆裝’進而可降低生產成[並且散 熱片可配:實際需求1文變其形狀與結構,所以其散熱效 果佳’同k ab滿;^較大的散熱面積的需求與外觀造型。 【圖式簡單說明】 第一圖係本發明之第 一實施例之剖面圖 12 1289183Vt'. The heat sink of the present invention is made by the indentation method, and the plurality of fins and the heat conducting seat (1 )) having a plurality of heat dissipating platforms (1 1) are combined with each other and thermally conducted to increase the heat dissipating area between each other. The process is easy to 'can be easily disassembled' and thus can reduce the production [and the heat sink can be equipped with: the actual demand 1 text changes its shape and structure, so its heat dissipation effect is good 'with k ab full; ^ larger heat dissipation area Demand and appearance. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a cross-sectional view of a first embodiment of the present invention 12 1289183

第二圖係本發μ &gt; # — 月之弟二實施例之剖面圖。 第三圖係本發明之穿_ — 十与又月之弟二實施例之剖面圖。 第四圖係本發明$楚 —u f} 月之乐四貫施例之立體外觀 弟五圖係本發明夕楚 ^ ° a之罘四貫施例之立體分解 弟六圖係本發明夕贷 — ° w月之罘四實施例之局部平面 第七圖係下散熱片之局部平面圖。 回 第八圖係本發明之第五實施例之之立體外觀圖。 第九圖係現有燈具結構之剖面圖。 (1 1 )導熱平台 (2 1 ) LED 燈;;包 (3 1 )貫孔 (30A)散熱片 (30B)散熱片 (3 0 C )下散熱片 (3 2 C )穿孔 (3 4 C )粗链表面 (3 1 D )貫孔 (3 Ο E )上散熱片 (30F)外散熱片 (3 1 F )固定柱 (5 0 )迴路熱管散熱模組 (5 2 )熱管吸熱塊體 5 2 A )迴路熱管蒸發器 【主要元件符號說明】 (10)導熱座 (2〇)發光裝置 (3〇)散熱片 (3 2 )光反射面 (3 1 A )散熱鰭片 (3 1 B )散熱鰭片 (31C)貫孔 (3 3 C )散熱續片 (3 0 D )中散熱片(3 2 D )穿孔(3 2 E )穿孔 (3 1 E )散熱鰭片 (4 0 )燈桿 (5 1 )熱管散熱片The second figure is a cross-sectional view of the embodiment of the present invention. The third figure is a cross-sectional view of the second embodiment of the wearer of the present invention. The fourth picture is the invention of the present invention Chu Chu-uf} The four-dimensional appearance of the four-dimensional embodiment of the four-dimensional appearance of the fourth embodiment of the present invention 楚 楚 ^ ° a 罘 贯 罘 施 施 立体 立体 立体 立体 立体 立体 立体 立体 本 本 本The partial plan of the fourth embodiment of the fourth embodiment is a partial plan view of the lower heat sink. The eighth drawing is a perspective view of the fifth embodiment of the present invention. The ninth figure is a cross-sectional view of the structure of the existing lamp. (1 1) Thermal conduction platform (2 1 ) LED lamp; Package (3 1) Through hole (30A) Heat sink (30B) Heat sink (3 0 C) Lower heat sink (3 2 C) Perforated (3 4 C) Thick chain surface (3 1 D ) through hole (3 Ο E) on heat sink (30F) outer heat sink (3 1 F ) fixed column (50) loop heat pipe heat dissipation module (5 2 ) heat pipe heat absorption block 5 2 A) loop heat pipe evaporator [main component symbol description] (10) heat conduction seat (2 〇) illuminating device (3 〇) heat sink (3 2 ) light reflecting surface (3 1 A) heat sink fin (3 1 B) heat dissipation Fin (31C) through hole (3 3 C) heat sink (3 0 D) heat sink (3 2 D) perforation (3 2 E) perforation (3 1 E) heat sink fin (40) light pole ( 5 1) Heat pipe heat sink

13 1289183 . (5 3 )熱導管 (6 Ο )前支撐片 (6 1 )後支撐片 (6 1 2 )桿孔 (7 0 )散熱殼體 (7 2 )發光裝置 輝! @降(更)五替翁頁 炉㈣,痛祕 -------崎*·'**'一·..…:' Γ5 4 )貫孔 (6 0 1 )風孔 (6 1 1 )風孔 (6 2 )燈桿 (7 1 )燈桿 (7 3 ) LED 燈泡13 1289183 . (5 3 ) Heat pipe (6 Ο ) Front support piece (6 1 ) Rear support piece (6 1 2 ) Rod hole (7 0 ) Heat-dissipating case (7 2 ) Light-emitting device Hui! @降(more) Wudi Weng page furnace (four), pain secret ------- Saki * · '**' a.....:: Γ5 4) through hole (6 0 1) wind hole (6 1 1) wind hole ( 6 2) Light pole (7 1 ) Light pole (7 3 ) LED light bulb

1414

Claims (1)

1289183 ' 十、申請專利範圍: 1 ·一種具有多重疊層散熱結構之照明燈具,其包括: 至少一個導熱座,各導熱座的側壁形成有至少一個呈 階梯狀的導熱平台,於導熱座的一端部設有由若干led燈 泡所組成的發光裝置; ’ 至少一片散熱片,各散熱片形成有至少一個貫孔,貫 孔可供導熱座貫穿,並使各散熱片與導熱座的各導熱平台 相互固定與熱導通。 B 2 · —種具有多重疊層散熱結構之照明燈具,其包括: 至少一個導熱座,各導熱座的側壁形成有至少一個呈 階梯狀的導熱平台,於導熱座的一端部設有由若干LEd燈 泡所組成的發光裝置; 一下散熱片,其形成有至少一個貫孔; 至少一中散熱片,其相對於下散熱片的貫孔處形成有 貝孔’導熱座依序貫穿下散熱片的貫孔與中散熱片的貫 孔,亚使下散熱片與散熱片分別與導熱座的各導熱平台相 ’互固定且構成熱導通; 一上散熱片,其係固定於導熱座的另一端部處。 3如申明專利範圍第1或2項所述之具有多重疊層 月文…、、’&quot;構之知、明燈具,其中一散熱片的一侧面上固設有迴 路熱管散熱模組; 迴路熱管散熱模組具有一熱管散熱片、一個熱導管與 匕3有:¾路熱官洛發器的熱管吸熱塊體,轨管吸熱塊體 係固定且熱傳導於上散熱片上,熱管散熱片係固定於上散 1289183 熱片上; t &gt; /3 : 熱導營的-端係與迴路熱管 1 、,另—端係與熱管散熱六。。目連結並構成熱導 迴跋,β 、、 、邊、貼附連么士, 错以將前述之發光F署 μ以形成一熱管 散熱片; 置的UD燈泡之熱量導入熱管 忒熱導管,其内充灌有 路熱管蒗八 T /爪體’错由工柞4 Μ力、n 洛發器吸熱蒸發成蒸氣,姑* 作抓月豆在迴 處,冷凝成 、、&quot;’工,、、、‘管流至埶管散教片 經另-部分埶導管利用、…處排入空氣,液體則 刀热¥官利用迴路熱 路熱管蒸發哭内繼錶赦_…、X 口口 、毛細現象吸回迴 叩内龜績吸熱蒸發, 4 · t由μ * 循%迴路。 熱鱗片,並且該側面的。—側面突形成有若干散 5 ·如申請專利範圍第4 結構之押明燈1,#、斤这之八有多重疊層散熱 僻 &lt; /且具,该上散熱片與 古;:t # u t 月文…月之間的兩端分設 有一刖支U片與一後支撐片, 又 形成有若干風孔。 又保片刀別 6 .如申請專利範圍苐5項 , &lt;〜,夕重豐層散埶 結構之照明燈具,其中埶管啬勃μ从口 t … Y…g月文熱片的另一側面固設有外散 熱片。 7 ·如申請專利範圍第5項 貝所述之具有多重疊層散熱 結構之照明燈具,其中後支撐片的風孔之間形成有桿孔y 於桿孔處固設有一燈桿。 8 ·如申請專利範圍第1或2項所述之具有多重疊層 16 •1289183 (日修(更)正替 散熱結構之照明燈具,其中- …、片為^一平面狀的片^#。 g ·如申言月專利範圍第^ 丄或2項所述之具有多重疊声 散熱結構之照明燈具,其中各散執 .y 月文,Α片為一籍片狀的片體。 ! 〇 •如申請專利範圍第工或2項所述之具有多重疊 層散熱結構之照明燈具,其中各散熱片為弧狀彎折。 1 1 ·如申請專利範圍第9項所述之具有多重疊層散 Ά結構之照明燈具’其中散熱片相鄰於導熱座之發光裝置 的侧面為光反射面。 十一、圖式: 如次頁1289183 ' X. Patent application scope: 1 · A lighting fixture with multiple stacked heat dissipation structures, comprising: at least one heat conducting seat, the sidewalls of each heat conducting seat being formed with at least one stepped heat conducting platform at one end of the heat conducting seat The portion is provided with a light-emitting device composed of a plurality of led bulbs; 'at least one heat sink, each fin is formed with at least one through hole, the through hole is for the heat conducting seat to penetrate, and the heat conducting sheets of the heat sink and the heat conducting seat are mutually connected Fixed and thermally conductive. B 2 · A lighting fixture having a multi-layer heat dissipation structure, comprising: at least one heat conducting seat, the sidewall of each heat conducting seat is formed with at least one stepped heat conducting platform, and the LED is provided at one end of the heat conducting seat a light-emitting device composed of a light bulb; a lower heat sink formed with at least one through-hole; at least one heat-dissipating fin formed with a bell hole at a through-hole of the lower heat sink; the heat conducting seat sequentially penetrates the lower heat sink The through hole of the hole and the middle heat sink, the lower heat sink and the heat sink are respectively fixed with each heat conducting platform of the heat conducting seat and form a heat conduction; an upper heat sink is fixed at the other end of the heat conducting seat . 3, as claimed in claim 1 or 2, having a multi-layered monthly..., '&quot; structure, a light fixture, wherein one side of a heat sink is provided with a loop heat pipe cooling module; The heat pipe heat dissipation module has a heat pipe heat sink, a heat pipe and a heat pipe and a heat pipe block of the heat pipe of the 3⁄4 road heat. The heat pipe block system is fixed and heat is conducted on the upper heat sink, and the heat pipe heat sink is fixed on the heat pipe. On the 1829183 hot film; t &gt; /3: heat guide camp - end system and loop heat pipe 1, the other - end system and heat pipe cooling six. . The purpose of the connection is to form a thermal conductivity return, β, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The internal filling is filled with a heat pipe 蒗 eight T / claw body 'wrong by the work 柞 4 Μ force, n 洛 发 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸 吸,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The phenomenon sucks back into the inside of the turtle and absorbs heat, 4 · t by μ * by the % loop. Hot scales, and the side of the. - The side protrusion is formed with a plurality of 5s. The lightening lamp 1 of the 4th structure of the patent application scope, #, 斤的八有 multiple laminated heat sinking &lt; /, with the upper heat sink and the ancient;: t # ut A pair of U-pieces and a rear support piece are formed at both ends of the moon...month, and a plurality of wind holes are formed. Also protect the knife knives. 6. If the patent application scope is 苐5 items, &lt;~, 夕重丰层散埶结构的照明灯,的埶管啬博μ从口t... Y...g月文热片的其他An external heat sink is fixed on the side. 7. A lighting fixture having a multi-layer heat dissipation structure as described in claim 5, wherein a hole y is formed between the air holes of the rear support piece, and a light rod is fixed at the hole of the rod. 8 · As claimed in claim 1 or 2, there is a multi-layer 16 • 1289183 (the daylighting (more) replacement lighting fixture, wherein - ..., the sheet is a flat sheet ^ #. g · The lighting fixtures with multi-overlapping acoustic heat dissipation structure as described in the stipulations of the stipulations of the stipulations in the stipulations of the stipulations of the stipulations of the stipulations. A lighting fixture having a multi-layer heat dissipation structure as described in claim 2 or 2, wherein each of the fins is curved and bent. 1 1 · Multiple lamination as described in claim 9 The illuminating device of the Ά structure, wherein the side of the illuminating device adjacent to the heat conducting block is a light reflecting surface. XI. Schema: 17 .1289183 ψτ [〇η f^ g( φ i (!:17 .1289183 ψτ [〇η f^ g( φ i (!: 8383 12891831289183 第七圖Seventh map 1289183 七、指定代表圖: Φ 1〇 (} (一) 本案指定代表圖為:第(五)圖。 (二) 本代表圖之元件符號簡單說明: (1 0 )導熱座 (1 1 )導熱平台 (3 0 C )下散熱片 (31C)貫孔 (3 2 C )穿孔 (3 3 C )散熱鰭片 (3 0 D )中散熱片 (31D)貫孔 (3 2 D )穿孔 (3 0 E )上散熱片 | ( 3 2 E )穿孔 (3 0 F )外散熱片 (31F)固定柱 (5 0 )迴路熱管散熱模組 (5 1 )熱管散熱片 (5 2 )熱管吸熱塊體 (5 2 A )迴路熱管蒸發器 (5 3 )熱導管 (5 4 )貫孔 (6 0 )前支撐片 (6 0 1 )風孔 (6 1 )後支撐片 (6 1 1 )風孔 (6 1 2 )桿孔 (6 2 )燈桿 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式:1289183 VII. Designation of representative drawings: Φ 1〇(} (1) The representative representative figure of this case is: (5). (2) The symbol of the symbol of this representative figure is simple: (1 0) Thermal conduction seat (1 1 ) Platform (3 0 C) under heat sink (31C) through hole (3 2 C) perforated (3 3 C) heat sink fin (300 D) heat sink (31D) through hole (3 2 D) perforation (3 0 E) upper heat sink | ( 3 2 E ) perforated (3 0 F) outer heat sink (31F) fixed column (50) loop heat pipe cooling module (5 1) heat pipe heat sink (5 2) heat pipe heat absorbing block ( 5 2 A) loop heat pipe evaporator (5 3 ) heat pipe (5 4 ) through hole (60) front support piece (6 0 1 ) wind hole (6 1 ) rear support piece (6 1 1 ) wind hole (6 1 2) Rod hole (6 2 ) Light pole 8. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention:
TW94122673A 2005-07-05 2005-07-05 A lamp set with a multi-layer heat dissipation structure TWI289183B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10047946B2 (en) 2007-05-07 2018-08-14 Cree, Inc. Light fixtures and lighting devices

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Publication number Priority date Publication date Assignee Title
CN101614373A (en) * 2009-06-12 2009-12-30 吕大明 A kind of multi-blade wing type LED street lamp heat-dissipation lamp housing
TWI384172B (en) * 2009-09-21 2013-02-01 Pegatron Corp Light emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10047946B2 (en) 2007-05-07 2018-08-14 Cree, Inc. Light fixtures and lighting devices

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