1289131 九、發明說明： 【發明所屬之技術領域】 本發明係關於板狀元件之封裝方法及封裝構造。 【先前技術】 為了物件之裝載及運送，諸如運送產品至客戶端等時， 物件需先在裝載端加以封裝工作，以使物件受到保護。另 一方面，物件需在運送終點加以拆封工作，俾取出物件。 當物件在運送中易受震動破壞時，特別需要設計出保護元 件之方法。 當待運送物件為一板狀元件時，下述方法可用以封裝該 元件（例如參見參考文件1 )，其並已為目前所使用者。 該方法包含下列步驟：放置一板狀元件於一支撐板上， 黏貼一壓感式黏著膠帶於該板狀元件之上表面上，並隨後 將該壓感式黏著膠帶自該板狀元件拉伸至該支撐板，以將 該板狀元件固定至該支撐板上。藉由該方法之實施，因該 板狀元件在運送中不會位移，故可確定欲運送之板狀元件 受到保護。1289131 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a packaging method and a package structure of a plate-like component. [Prior Art] For the loading and transportation of objects, such as transporting products to the client, etc., the objects need to be packaged at the loading end to protect the objects. On the other hand, the object needs to be unpacked at the end of the transport and the object removed. When an object is susceptible to vibration damage during transport, it is particularly desirable to design a method of protecting the component. When the item to be transported is a plate-like element, the following method can be used to encapsulate the element (see, for example, Reference 1), which is currently in use by the user. The method comprises the steps of: placing a plate-like component on a support plate, pasting a pressure-sensitive adhesive tape on the upper surface of the plate-shaped component, and then stretching the pressure-sensitive adhesive tape from the plate-shaped component; To the support plate to fix the plate-like member to the support plate. By the implementation of this method, since the plate-like member is not displaced during transportation, it can be determined that the plate-like member to be transported is protected.
[參考文件 1] JP 2002-337951 A 然而，由於壓感式黏著膠帶之黏貼係以人工方式為之， 故該等元件在裝載端時的封裝工作確需相當工時。此外， 當數個板狀元件共同受到固定時，板狀元件可能因板狀元 件之接觸面間產生位移或磨擦而受破壞。當板狀元件易如 上述遭受破壞，此時封裝工作需耗大量時間為之，因各板 狀元件必須加以逐一固定之故。再者，由於壓感式黏著膠 312XP/發明說明書(補件)/94-04/93139998 1289131 帶之拆卸需以人工方式以反方向仔細剝除，故運送終 拆封工作耗時約為封裝工作者之兩倍。此外，由於諸 感式黏著膠帶在出品時即為不可使用，故無用的生產 其可工作性受到負面影響。 鑑於上述問題，本發明之一目的即在於提供一種板 件之封裝方法及封裝構造，其中封裝及拆封工作的效 習用者為佳，同時板狀元件亦確定受到保護。 【發明内容】 本案發明人已進行勤勉的研究以檢視上述問題，結 現上述目的可藉由執行下述板狀元件之封裝方法及封 造而獲達成。本發明也因此研究心得而完成。 本發明之主要特徵如下所述： 〇)—種板狀元件之封裝方法，其包含透過一固持 持一板狀元件於一支撐板上，其中該固持片能固持及 與其以表面互相接觸的該板狀元件。 (2)—種板狀元件之封裝構造，其包含一支撐板及 持片，其中該固持片置於該支撐板上，且該固持片能 及放開與其以表面互相接觸的該板狀元件。 (3 )如第（2 )項之板狀元件之封裝構造，該固持片在 撐板上相對於該支撐板的中心係為不對稱設置。 (4 )如第（2 )項之板狀元件之封裝構造，複數個具有 持片之支撐板被層疊設置。 (5 )如第（4 )項之板狀元件之封裝構造，具有該固持 該等支撐板係透過介於相鄰支撐板之間之一具有一預 312XP/發明說明書(補件)/94-04/93139998 點之 多壓 將使 狀元 率較 果發 裝構 片固 放開 一固 固持 該支 該固 片之 定距 6 1289131 離之分隔件而層疊設置。 (6 )如第（2 )至（5 )項之任一項之板狀元件之封裝構造， 更包含一封裝體，該支撐板或該等支撐板儲存其中。 (7 )如第（1 )項之板狀元件之封裝方法，該固持片具有一 垂直固持強度，其值介於5xl(T4及ΙχΙΟΊ/πιπι2之間。 (8 )如第（1 )項之板狀元件之封裝方法，該固持片具有一 水平固持強度，其值介於7.5x10“至lxlin/inm2之間。 (9 )如第（1 )項之板狀元件之封裝方法，該固持片具有一 剝離強度，其值介於0. 01至〇· 8N/2 5mm之間。 (1 0 )如第（2 )項之板狀元件之封裝構造，該固持片具有 一垂直固持強度，其值介於5χ1(Γ4至lxliTW/mm2之間。 (1 1 )如第（2 )項之板狀元件之封裝構造，該固持片 具有一水平固持強度，其值介於7.5x10“至ΙχΙίΓΐ/ιηπι2 之間。 (1 2 )如第（2 )項之板狀元件之封裝構造，該固持片具有 一剝離強度，其值介於0· 0 1至0. 8N/2 5mm之間。 根據於第（1 )項之具體例中，當該板狀元件在受封裝時 被置於該固持片上之該支撐板上時，固持力作用於該板狀 元件及該固持片間的接觸面上，故該板狀元件被固持於該 支撐板上。因此，在該支撐板上之該板狀元件在運送期間 絕不因顫動或震動而位移。 在拆封該板狀元件之時，該板狀元件自該固持片上剝 離。該板狀元件因與該固持片間接觸面上所受剝離強度低 而易於自該固持片上剝離。 7 312XP/發明說明書(補件)/94-04/93139998 1289131 本案中「板狀元件」係代表一整體外形上狀似一板體的 元件，即「板狀元件」包含數個板狀元件之結合封裝體、 一單一待運送板狀元件及一經封裝之單一板狀元件。 根據於第（2 )項之具體例中，當該板狀元件在受封裝而 位於該固持片上之該支撐板上時，固持力作用於該板狀元 件及該固持片間之接觸面上，故該板狀元件被固持於該支 撐板上。因此，該支撐板上的該板狀元件在運送期間絕不 因顫動或震動而位移。 在拆封該板狀元件之時，該板狀元件自該固持片上剝 離。該板狀元件因與該固持片間接觸面上所受剝離強度低 而易於自該固持片上剝離。 根據於第（3 )項之具體例中，該板狀元件與該固持片相 對於該板狀元件之中心呈不對稱接觸。在封裝該板狀元件 時，操作員先站立於該固持片存在之一側上。接著，為將 該板狀元件置於該支撐板上，該板狀元件之一部份被設以 與該支撐板之未設有該固持片的一部份相接觸。以此方式 為之時，該板狀元件可輕易置於該支撐板上。在拆封該板 狀元件時，操作員之手置於該板狀元件及該固持片之間， 藉以移除作用於該等接觸面上的固持力。因此，該板狀元 件可有效被拆封。 根據於第（4 )項之具體例中，由於該支撐板上可疊置板 狀元件，故每單位體積可運送的板狀元件數較多。 根據於第（5 )項之具體例中，該疊置之板狀元件可防止 因該等板狀元件間之磨擦而免受破壞，或在該板狀元件之 8 312XP/發明說明書(補件)/94-04/93139998 1289131 表面方向上受到力作用，由於介於該等支撐板間加以一預 定距離而疊置係容易的。 根據於第（6 )項之具體例中，該板狀元件或該等板狀元 件因該封裝而與外界環境隔離。 【實施方式】 現將參考附圖詳細說明本發明之具體例，但應了解的是 本發明並非解釋為受限於此。 [第一具體例] 圖1為本發明之第一具體例中封裝一板狀元件之封裝構 造之構成的平面示意圖。 根據第一具體例，該封裝構造包含一支撐板1，一待運 送之板狀元件P位於該支撐板1上。該板狀元件P可為一 大型極化板及一大型極化板之封裝元件。在本發明中，面 向一板狀元件之支撐板表面以面積大於板狀元件面積為更 佳。舉例而言，一 1 0 0 0 m m X 5 5 0 m m之矩形平板可被使用作為 支撐板1。支撐板1以為約5mm厚之硬板製成為更佳。該 硬板之例子包含塑膠板及紙板。 在本實施例中，二固持片2設於支撐板1之上表面上， 且每一固持片2具有一黏著層或一在其表面上具黏著特性 之層在其上放置有板狀元件P。該等固持片2之設置以使 與固持片2以表面接觸之板狀元件P得在一預定時間内維 持靜止不動、且板狀元件P可自固持片2上輕易剝離而不 損壞板狀元件P為佳。換言之，每一固持片2以具有高固 持強度及低剝離強度為佳。再者，固持與固持片2以表面 9 312XP/發明說明書(補件)/94-04/93139998 1289131 接觸之板狀元件p的固持強度以在剝離之後亦不降低為佳 即，固持片2以能重覆使用為佳。此外，固持片2之設置 狀元件P在被剝離時沒有黏著殘留物遺留在板狀元件P上 在本具體例中，固持片2較佳具有垂直固持強度 xl(T4 至 ΙχΙΟ^Ν/πιπι2 之間，並以介於 5xlO_3 至 5x10 之間為更佳。此外，固持片2較佳具有水平固持強 7. 5x1 (Γ4 至 1x1 (Γΐ/ιηπι2 之間，並以介於 5x1 0-3 至 6 1 (Γ2 N / m m2之間為更佳。此外，固持片2之剝離強度 除性）以介於0 . 0 1至0 · 8 N / 2 5 mm之間為較佳，並以 0.02至0.3N/25mm為更佳。舉例而言，「FIXFILM」 (Fujicopian有限公司製造）即為一較適合使用之固持片 在本具體例中，固持片2之設於支撐板1上的一 過支撐板1之中心部份為原則，且另一固持片2以 對於支撐板1中心部份的一側上為原則，以使與該 心部份上之固持片2平行。根據此構成，板狀元件 易加以剝離，同時固持片2之接觸面積仍可固定。 當附帶一提的是，固持片2之設置可不限於以上 所述者。在本發明中，固持片2以置於支撐板1上為 用以使板狀元件P靜止不動。舉例而言，固持片2 支撐板之非中心處上為佳，或以設於支撐板之對應 件P角落處之位置上為佳。再舉例言之，固持片2 支撐板1中心部份上為佳，或使固持片2設於支撐 部份的不對稱兩側上為佳。又再者，固持片2以非 對稱方式設置為佳。此外，固持片2以均勻設於支 312XP/發明說明書(補件)/94-04/93139998 :亦 .以使板 ..為佳。 介於5 '2 N / m m2 度介於 X (可移 介於 2 〇 者以通 設於相 置於中 P可更 具體例 ^較佳， 以設於 板狀元 以設於 板中心 對稱或 撐板上 10 1289131 為佳，以構成一能為板狀元件P所放置之區域；或固持片2以放 置於支撐板1整個表面上為佳。固持片2以呈帶狀及虛線形式為 佳，但，如前文所述各種不同型式皆可使用作為固持片2之配置。 根據本具體例之封裝構造的操作方式將說明於下。 封裝進行之時，操作員僅需將板狀元件P實質上置於支 撐板1之中心部份即可，此時板狀元件P與支撐板1上之 固持片2接觸，以使固持力作用於板狀元件P及固持片2 間之接觸面上，而板狀元件P之垂直向上位移及水平位移 會受該固持力的限制，故板狀元件P被固持於支撐板1上。 當支撐板1上之板狀元件P被運送時，作用於板狀元件 P上的固持力係對抗所發生之顫動或震動有效的。板狀元 件 P決不在支撐板1上移動。因此，板狀元件P可確定在 運送時受到保護。 當附帶一提的是，支撐板1可在拆封後再使用，以使另 一板狀元件P可置於該支撐板1上而受運送，因固持片2 係可重覆使用者。 根據此具體例之封裝構造中，封裝或拆封工作可藉對板 狀元件P之放置或剝離動作而達成。因此，較傳統方法省 去諸多人力，也因此可使封裝或拆封工作時間縮短。 該封裝構造之成本經濟，並在板狀元件P被拆封時不會 有廢棄物產生，因未使用壓感式黏著膠帶等消耗性材料。 再者，用以固定板狀元件P所需之區域僅有板狀元件P 之底表面，故傳統方法中所用壓感式黏著膠帶不與板狀元 件P之端表面及頂表面接觸。此外，完全未使用壓感式黏 11 312XP/發明說明書(補件)/94-04/93139998 1289131 著膠帶等可移除元件及消耗性材料，故支撐板1上唯一可 被移除者為板狀元件P，也因此板狀元件P之端表面等可 全不受破壞。 [第二具體例] 圖2為本發明之第二具體例之封裝構造之構成的平面示 意圖。 當附帶一提的是，本具體例相似於第一具體例之構成的 詳細說明將省略不說，而係以相同符號標示之。 在第二具體例之封裝構造中，複數個支撐板1在上方設 有固持片2。該等支撐板1之每一者皆具有複數個分隔件 3，該等分隔件3之設置以使該等呈層疊形式之支撐板1 彼此分開、且板狀元件P可分別適當置於該等支撐板1上 為原則，故每一分隔件3之距離大於每一板狀元件P之高 度，其中每一分隔件3之距離以足以避免每一板狀元件P 上之支撐板1與板狀元件P接觸為佳。此外，分隔件3以 設於每一支撐板1之周緣上為佳，以使支撐板1上之分隔 件3避免與支撐板1上之板狀元件P接觸。 第二具體例之封裝構造更具有一封裝體4，該等支樓板 1存置於其中，其中該封裝體4包含一封裝盒4a及一封裝 蓋4 b 〇 為進行封裝，一預定數目之板狀元件P被設於支撐板1 上。接著，所加之板狀元件P被設於封裝盒4 a中，而封裝 盒4a則為封裝蓋4b所覆蓋，該等層疊之板狀元件即藉此 設置存放於封裝體4中。 12 312XP/發明說明書(補件)/94-04/93139998 1289131 如上所述，僅對支撐板1加以此一堆疊動作，每一支樓 板1間即被加以一預定距離。再者，由於支撐板1得加以 層疊，故板狀元件P可在高密度條件下受運送。 此外，由於支撐板1存置於封裝體4中，故板狀元件P 可以一種易於運送之形式受運送，同時得與外界環境隔離。 當了解的是，本發明並不僅限於上述具體例，其可以加 以修改如下。 雖然第二具體例中每一支撐板1皆因具有分隔件3而得 互相分隔，但該等支撐板1只要得加以層疊即屬本發明之 範圍。舉例而言，支撐板1以疊置於一側壁部份具有凹溝 之封裝體中為佳，以利用該凹溝對支撐板1提供以導引及 支撐的功能。或者，可使用其它用以配置支撐板1之已知 結構。 根據本發明，封裝板狀元件所需之工作僅為將板狀元件 置於上方設有固持片之支撐板上，接著板狀元件即可確定 受到固定及保護。因此，本發明可達成大大節省封裝所用 勞力。 甚者，拆封板狀元件所需勞力僅為將板狀元件自支撐板 上支撐處剝離。因此，亦可達成大大節省拆封工作所用勞 力。 鑑於上述，封裝及拆封工作的效率可被提升，同時板狀 元件亦確定受到保護。此外，固持片之使用具準永久性， 也因此致力於降低傳統壓感式膠帶之使用所造成工業使用 上的浪費。 13 312XP/發明說明書(補件)/94-04/93139998 1289131 最後，本發明已針對特定具體例詳述如上，但熟習該項 技術者得在不違本發明之精神及範圍的條件下對本發明加 以改變或更動，該等改變或更動仍不脫離本發明之範圍， 本發明之精神及範圍將定義如下述之申請專利範圍中。 本申請案係基於2003年12月24日提申請之日本專利 申請案2003-427451，且該案之内容以參考形式併於本文 中 〇 【圖式簡單說明】 圖1為本發明第一具體例之封裝構造之構成之平面示意 圖。 圖2為本發明第二具體例之封裝構造之構成之平面示意 圖。 【主要元件符號說明】 1 支 撐 板 2 固 持 片 3 分 隔 件 4 封 裝 體 4 a 封 裝 盒 4b 封 裝 蓋 14 312XP/發明說明書(補件)/94-04/93139998[Reference Document 1] JP 2002-337951 A However, since the adhesion of the pressure-sensitive adhesive tape is manually performed, the packaging work of the components at the loading end requires considerable man-hours. Further, when a plurality of plate-like members are collectively fixed, the plate-like members may be damaged by displacement or friction between the contact faces of the plate-like members. When the plate-like component is easily damaged as described above, the packaging operation takes a lot of time, since the plate-like components must be fixed one by one. Furthermore, since the pressure-sensitive adhesive 312XP/invention manual (supplement)/94-04/93139998 1289131 is removed manually, it is manually stripped in the opposite direction, so the time required for the final unpacking is about the packaging work. Twice as many. In addition, since the adhesive adhesive tape is unusable at the time of production, the workability of useless production is negatively affected. In view of the above problems, it is an object of the present invention to provide a package method and package structure for a panel in which the effect of the package and unpacking work is preferred, and the plate member is also surely protected. SUMMARY OF THE INVENTION The inventors of the present invention have conducted diligent research to examine the above problems, and it has been found that the above object can be attained by performing the encapsulation method and sealing of the following plate-like members. The present invention has thus been completed with a study of the findings. The main features of the present invention are as follows: 〇) - a method of encapsulating a plate-like component, comprising: holding a plate-like component on a support plate through a holding, wherein the retaining piece can hold and contact the surface thereof Plate element. (2) a package structure of a plate-like component, comprising a support plate and a holding piece, wherein the holding piece is placed on the support plate, and the holding piece can release the plate-like element that is in contact with the surface thereof . (3) The package structure of the plate-like member of the item (2), wherein the holding piece is asymmetrically disposed on the stay relative to the center of the support plate. (4) The package structure of the plate-like member of the item (2), wherein a plurality of support plates having the sheets are stacked. (5) The package structure of the plate-like component of item (4), wherein the support plate is passed between one of the adjacent support plates and has a pre-312XP/invention specification (supplement)/94- 04/93139998 The pressure of the point will make the element rate lower than that of the fruiting device. The fixing distance of the piece is 6 1289131. (6) The package structure of the plate member according to any one of (2) to (5), further comprising a package in which the support plate or the support plates are stored. (7) The method of encapsulating a plate-like component according to item (1), wherein the holding piece has a vertical holding strength, and the value is between 5xl (T4 and ΙχΙΟΊ/πιπι2. (8) as in item (1) The method of encapsulating a plate-like component, the holding piece has a horizontal holding strength, and the value is between 7.5 x 10" and lxlin/inm2. (9) The packaging method of the plate-shaped component according to the item (1), the holding piece Having a peeling strength, the value of which is between 0.01 and 〇·8N/2 5mm. (10) The package structure of the plate-like component of item (2), the holding piece has a vertical holding strength, The value is between 5χ1 (Γ4 to lxliTW/mm2. (1 1 ) The package structure of the plate-shaped component of item (2), the holding piece has a horizontal holding strength, and the value is between 7.5×10” to ΙχΙίΓΐ/ (1 2) The package structure of the plate-like component of the item (2), the holding piece has a peeling strength, and the value is between 0·0 1 and 0. 8N/2 5 mm. In a specific example of the item (1), when the plate member is placed on the support plate on the holding sheet when being packaged, a holding force acts on the plate element And the contact surface between the holding sheets, so that the plate-like member is held on the support plate. Therefore, the plate-like member on the support plate is never displaced by vibration or vibration during transportation. In the case of the plate member, the plate member is peeled off from the holding sheet. The plate member is easily peeled off from the holding sheet due to the low peeling strength on the contact surface with the holding sheet. 7 312XP/Invention Manual ()) /94-04/93139998 1289131 "Plate-like element" in this case represents an element that looks like a plate in its overall shape, that is, a "plate-like element" consists of a combination of several plate-like elements, a single Carrying a plate-like component and a packaged single plate-shaped component. According to the specific example of the item (2), when the plate-shaped component is packaged and located on the support plate on the holding piece, a holding force acts on the support plate The plate-like member and the contact surface between the holding sheets are supported on the supporting plate. Therefore, the plate-like member on the supporting plate is never displaced by vibration or vibration during transportation. Unpacking the plate element When the plate-shaped member is peeled off from the holding sheet, the plate-shaped member is easily peeled off from the holding sheet due to the low peeling strength on the contact surface with the holding sheet. According to the specific example of the item (3), The plate member and the holding piece are in asymmetric contact with respect to a center of the plate member. When the plate member is packaged, the operator first stands on one side of the holding piece. Next, the plate element is The member is placed on the support plate, and a portion of the plate member is disposed to be in contact with a portion of the support plate not provided with the holding piece. In this manner, the plate member can be easily Placed on the support plate. When the plate-like member is unsealed, an operator's hand is placed between the plate-like member and the holding member to remove the holding force acting on the contact faces. Therefore, the plate member can be effectively unsealed. According to the specific example of the item (4), since the plate-like members can be stacked on the support plate, the number of plate-like members that can be transported per unit volume is large. According to the specific example of the item (5), the stacked plate-like member can be prevented from being damaged by the friction between the plate-like members, or in the plate-shaped member 8 312XP / invention manual (repair) ) /94-04/93139998 1289131 The force is applied in the surface direction, and it is easy to stack due to a predetermined distance between the support plates. According to the specific example of the item (6), the plate-like member or the plate-like members are isolated from the external environment by the package. [Embodiment] Specific examples of the present invention will be described in detail with reference to the drawings, but it should be understood that the invention is not construed as being limited thereto. [First Specific Example] Fig. 1 is a plan view showing the constitution of a package structure in which a plate-like member is packaged in a first specific example of the present invention. According to a first specific example, the package structure comprises a support plate 1 on which a plate-like element P to be transported is placed. The plate member P can be a package member of a large polarizing plate and a large polarizing plate. In the present invention, the surface of the support plate facing a plate-like member is preferably larger in area than the plate-like member. For example, a rectangular plate of 1 0 0 m m X 5 5 0 m can be used as the support plate 1. The support plate 1 is preferably made of a hard plate of about 5 mm thick. Examples of the hard board include plastic sheets and cardboard. In this embodiment, the two holding sheets 2 are disposed on the upper surface of the support plate 1, and each of the holding sheets 2 has an adhesive layer or a layer having an adhesive property on the surface thereof, and a plate-like member P is placed thereon. . The holding sheets 2 are disposed such that the plate-like member P in surface contact with the holding sheet 2 is kept stationary for a predetermined time, and the plate-like member P can be easily peeled off from the holding sheet 2 without damaging the plate-like member. P is better. In other words, each of the holding sheets 2 preferably has a high holding strength and a low peeling strength. Further, the holding strength of the plate-like member p which is in contact with the holding sheet 2 in contact with the surface 9 312XP/invention specification (supplement)/94-04/93139998 1289131 is preferably not reduced after peeling, that is, the holding sheet 2 is It is better to be able to use it repeatedly. Further, the set member P of the holding sheet 2 is left without the adhesive residue on the plate member P when it is peeled off. In this embodiment, the holding sheet 2 preferably has a vertical holding strength x1 (T4 to ΙχΙΟ^Ν/πιπι2). More preferably, the holding sheet 2 preferably has a horizontal holding strength of 7. 5x1 (Γ4 to 1x1 (Γΐ/ιηπι2, and between 5x1 0-3 to 6) 1 (more preferably between Γ2 N / m m2. Further, the peel strength of the holding sheet 2 is despicable) is preferably between 0.01 and 0 · 8 N / 2 5 mm, and is 0.02 to 0.3N/25mm is more preferable. For example, "FIXFILM" (manufactured by Fujicopian Co., Ltd.) is a more suitable holding piece. In this specific example, an over-support of the holding piece 2 on the support plate 1 is provided. The central portion of the plate 1 is a principle, and the other holding piece 2 is on the side opposite to the central portion of the support plate 1 so as to be parallel to the holding piece 2 on the core portion. According to this configuration, the plate element The piece is easily peeled off, and the contact area of the holding piece 2 can still be fixed. When it is mentioned that the setting of the holding piece 2 can be The present invention is limited to the above. In the present invention, the holding sheet 2 is placed on the support plate 1 for holding the plate-like member P stationary. For example, the holding piece 2 is preferably not at the center of the support plate, or Preferably, it is disposed at a corner of the corresponding piece P of the support plate. For example, the holding piece 2 is preferably supported on the central portion of the support plate 1, or the holding piece 2 is disposed on the asymmetric sides of the supporting portion. Further, the holding piece 2 is preferably arranged in an asymmetric manner. In addition, the holding piece 2 is uniformly disposed on the branch 312XP/invention specification (supplement)/94-04/93139998: also to make the board. It is better. Between 5 '2 N / m m2 degrees between X (can be moved between 2 以 to be placed in the phase P can be more specific example ^ is better, set in the plate element to be set Preferably, the plate center symmetry or the support plate 10 1289131 is formed to form a region where the plate member P is placed; or the retaining sheet 2 is preferably placed on the entire surface of the support plate 1. The holding sheet 2 is in the form of a strip and The dotted line form is preferred, but various configurations as described above may be used as the configuration of the holding sheet 2. The package structure according to this specific example The operation mode will be described below. When the package is being carried out, the operator only needs to place the plate element P substantially in the central portion of the support plate 1, and the plate member P and the support plate 1 are held. The sheet 2 is in contact so that the holding force acts on the contact surface between the plate member P and the holding sheet 2, and the vertical upward displacement and the horizontal displacement of the plate member P are limited by the holding force, so the plate member P is It is held on the support plate 1. When the plate-like member P on the support plate 1 is transported, the holding force acting on the plate-like member P is effective against the occurrence of chattering or vibration. The plate member P never moves on the support plate 1. Therefore, the plate member P can be determined to be protected at the time of transportation. Incidentally, the support plate 1 can be used after being unsealed so that the other plate member P can be placed on the support plate 1 to be transported, since the holding piece 2 can be repeated to the user. According to the package structure of this specific example, the encapsulation or unsealing work can be achieved by the placement or peeling action of the plate-like member P. Therefore, it saves a lot of manpower compared to the conventional method, and thus can shorten the working time of packaging or unpacking. This package structure is economical and does not cause waste when the plate-shaped element P is unsealed, since a consumable material such as a pressure-sensitive adhesive tape is not used. Further, the area required for fixing the plate-like member P is only the bottom surface of the plate-like member P, so that the pressure-sensitive adhesive tape used in the conventional method does not come into contact with the end surface and the top surface of the plate-like member P. In addition, the pressure-sensitive adhesive 11 312XP / invention manual (supplement) / 94-04/93139998 1289131 is not used with removable components such as tape and consumable materials, so the only one that can be removed on the support plate 1 is the plate. The element P, and thus the end surface of the plate element P, etc., can be completely unbroken. [Second Specific Example] Fig. 2 is a plan view showing the configuration of a package structure of a second specific example of the present invention. It is to be noted that the detailed description of the specific embodiment similar to the constitution of the first embodiment will be omitted and the same reference numerals will be used. In the package structure of the second specific example, a plurality of support plates 1 are provided with a holding piece 2 on the upper side. Each of the support plates 1 has a plurality of partition members 3 disposed such that the support plates 1 in a stacked form are separated from each other, and the plate-like members P can be appropriately placed respectively. The support plate 1 is on the principle, so the distance of each partition member 3 is greater than the height of each plate member P, wherein the distance between each partition member 3 is sufficient to avoid the support plate 1 and the plate element on each plate member P. Piece P contact is preferred. Further, the partition member 3 is preferably provided on the periphery of each of the support plates 1 so that the partition member 3 on the support plate 1 is prevented from coming into contact with the plate-like member P on the support plate 1. The package structure of the second embodiment further includes a package 4, wherein the package 1 is disposed therein, wherein the package 4 includes a package 4a and a package cover 4b for packaging, a predetermined number of plate elements The piece P is provided on the support plate 1. Next, the plate-like member P is placed in the package 4a, and the package 4a is covered by the package cover 4b, and the stacked plate-like members are thereby stored in the package 4. 12 312XP/Invention Manual (Supplement)/94-04/93139998 1289131 As described above, only the support plate 1 is subjected to this stacking action, and each of the floor panels 1 is placed at a predetermined distance. Further, since the support plates 1 are laminated, the plate-like members P can be transported under high density conditions. Further, since the support plate 1 is stored in the package 4, the plate-like member P can be transported in an easily transportable form while being isolated from the external environment. It is to be understood that the present invention is not limited to the specific examples described above, and may be modified as follows. Although each of the support plates 1 in the second embodiment is separated from each other by having the partition member 3, it is within the scope of the present invention that the support plates 1 are laminated. For example, it is preferable that the support plate 1 is stacked in a package having a groove in a side wall portion to provide a function of guiding and supporting the support plate 1 by the groove. Alternatively, other known structures for arranging the support plate 1 can be used. According to the present invention, the required work for encapsulating the plate-like member is only to place the plate-like member on the support plate on which the holding piece is provided, and then the plate-like member can be surely fixed and protected. Therefore, the present invention can achieve a labor saving that greatly saves packaging. In addition, the labor required to unpack the plate-like member is only to peel off the plate-like member from the support on the support plate. Therefore, it is also possible to achieve labor that greatly saves the unpacking work. In view of the above, the efficiency of the packaging and unpacking work can be improved, and the plate-like components are surely protected. In addition, the use of the holding sheet is quasi-permanent, and is therefore aimed at reducing the waste of industrial use caused by the use of the conventional pressure-sensitive adhesive tape. 13 312XP/Invention Manual (SUPPLEMENT)/94-04/93139998 1289131 Finally, the present invention has been described above in detail with reference to the specific embodiments, but those skilled in the art can practice the invention without departing from the spirit and scope of the invention. The spirit and scope of the present invention will be defined in the scope of the claims below, without departing from the scope of the invention. The present application is based on Japanese Patent Application No. 2003-427451 filed on Dec. 24, 2003, the content of which is hereby incorporated by reference in A schematic plan view of the construction of the package structure. Fig. 2 is a plan view showing the configuration of a package structure according to a second specific example of the present invention. [Main component symbol description] 1 support plate 2 holding piece 3 partitions 4 package body 4 a package box 4b package cover 14 312XP / invention manual (supplement) /94-04/93139998