1288042 九、發明說明： 【發明所屬之技術領域】 本發明係一種可以吸取已裁切完畢之半導體元件，再 將半導體元件放置於分配盤檢測之真空吸附裝置。 【先前技術】 電子元件之半導體元件在完成封褒之後係先置於第七 圖所示之基座（5 〇 )的切割台（5丄）上裁切，再以一 第六圖所示的吸附裝置（6 〇 )貼附於切钙二（5丄）表 面，啟動真空裝置（62)，即可以將切害^ (Η)上又 之半導體元件吸起，再移送放置於一分配盤上，以數位攝 影機操取半導體元件之影像，進行檢測，而吸附裝置（6 〇)及基座（50)均為金屬加工製成之平 加工誤差，以及安裝於工作台導致之 /為 ^ W r R η > ^ . 系積Α差，致使吸附 装置（6 〇 )底4之吸附部（6丄）以及基 切割台（5 1 )傾斜一角度而表面1 今叫，、、、/* A全貼合，當 之共同平面無法完全貼合時， 動真空裝置（6 2 ) 亦a因為吸附部（6 1 )與切割台（5 〇 1 )之間有 Pal 隙 而減弱吸力，無法順利吸取半導體元件。 ’、 然而’倘若為了提升基座（5 〇 )之 以及吸附褒置之吸附部（61)的上;(：二 加工精密度時’加工成本勢必會增加。 〃度而“ 【發明内容】 為了改善前述現有用以裁割半導髀 附裝置之間因為平行度不一 足之切割台與吸 …、沄顺利吸取半導體元件 1288042 ，以及倘若要提高平行度勢必增加成本之缺失，本發明之 主要技術手段在於提供一種以較低成本即可以使吸附裝置 • 及基座之切割台完全貼合，以順利吸取半導體元件之真处 吸附裝置。 一二 基於上述目的，本發明之主要技術手段在於提供一種 可自動調整角度之真空吸附裝置，該真空吸附裝置包括_ 用以固定於機台之懸吊台，以及一位於懸吊台下方之吸取 • 台，吸取台與懸吊台之間設有數個彈性裝置，該彈性裝置 係包括一穿置於懸吊台或吸取台上，並且固定於吸取台或 懸吊台上之導柱、以及一可以常態將吸取台往下推出的彈 性體，導柱與所穿置之物件之間並且具有一間隙。 本發明藉由實施上述技術手段，可獲得之具體效益為 1 ·確保吸取台可以與基座之切割台平貼，以順利 取半導體元件： • 當真空吸附裝置下降而使吸取台底部貼於基座之切割 口表面k，即可以藉由彈簧之推力而使吸取台緊貼於切割 台表面’又藉由導柱與所穿置之物件（懸吊台或吸取台） 之間具有間隙，倘吸取台與切割台之間略有一傾斜角度時 吸取σ即可以自動傾斜一角度，補償加工時平行度不佳 的狀況確保吸取台可與切割台貼合，順利吸取切割台上 之半導體元件。 2降低加工成本：由於本發明之吸取台具有自動補 仏加工块差的功效，故切割台表面及吸取台底面加工時的 5 1288042 平行度要求不需要太精密’以降低加工成本。 此外’本創作更進一步將導 ^ a、 乂肘導柱與所穿置之懸吊台（戋 者吸取台）之間呈錐形配合 ^ ¥柱猎由彈性裝置之彈 推頂而復位時，可以獲得導 平 ,^ v 于導正以確保吸取台（或者懸吊[Technical Field] The present invention is a vacuum adsorption device which can take a semiconductor element which has been cut and then place the semiconductor element on a distribution plate. [Prior Art] After completing the sealing, the semiconductor component of the electronic component is cut on a cutting table (5 丄) of the susceptor (5 〇) shown in the seventh figure, and then shown in a sixth figure. The adsorption device (6 〇) is attached to the surface of the cut calcium (5 丄), and the vacuum device (62) is activated, so that the semiconductor component on the smashed (Η) can be sucked up and then transferred to a distribution plate. The digital camera is used to take images of the semiconductor components for inspection, and the adsorption device (6 〇) and the susceptor (50) are both flat machining errors made by metal processing, and are mounted on the workbench to cause / W r R η > ^ . The enthalpy of the system is such that the adsorption section (6丄) of the bottom of the adsorption device (6 丄) and the base cutting table (5 1 ) are inclined at an angle and the surface 1 is called,,,, /* A Fully fitted, when the common plane cannot be completely fitted, the moving vacuum device (6 2 ) also a weakens the suction due to the gap between the adsorption portion (6 1 ) and the cutting table (5 〇 1 ), and cannot be smoothly sucked. Semiconductor component. ', However, 'in order to raise the pedestal (5 〇) and the adsorption part (61) of the adsorption device; (: The processing cost is bound to increase when the precision is two. 〃度" [Content of the invention] The present invention is directed to improving the aforementioned cutting table and suction for the cutting of the semi-conductive device, because the parallelism is not sufficient, and the semiconductor component 1288082 is smoothly sucked, and if the parallelism is to be increased, the cost is increased, and the main technique of the present invention The method is to provide a real adsorption device capable of smoothly absorbing the semiconductor device with the cutting device of the adsorption device and the pedestal at a lower cost. The second technical solution of the present invention is to provide a A vacuum adsorption device capable of automatically adjusting an angle, the vacuum adsorption device comprising: a suspension table for fixing to the machine table, and a suction table at the lower side of the suspension table, and a plurality of elasticity between the suction table and the suspension table The device includes a guide post that is placed on the suspension table or the suction table and is fixed to the suction table or the suspension table, and An elastomer which can be pushed out from the suction table in a normal state, and a gap between the guide post and the object to be worn and has a gap. The specific benefit obtained by the present invention by implementing the above technical means is 1. Ensure that the suction table can be The cutting table of the pedestal is flatly attached to smoothly take the semiconductor component: • When the vacuum suction device is lowered and the bottom of the suction table is attached to the surface k of the cutting surface of the base, the suction table can be closely attached to the cutting by the thrust of the spring The surface of the table has a gap between the guide post and the object to be worn (suspension table or suction table). If there is a slight inclination between the suction table and the cutting table, the σ can be automatically tilted by an angle to compensate The situation of poor parallelism during processing ensures that the suction table can be attached to the cutting table to smoothly absorb the semiconductor components on the cutting table. 2 Reduce the processing cost: Since the suction table of the present invention has the effect of automatically repairing the processing block difference, cutting The surface of the table and the bottom surface of the suction table are 5 1288042. The parallelism requirements do not need to be too precise 'to reduce the processing cost. In addition' this creation will further guide the a The column is tapered with the hanging platform (the pick-up table). When the column is hung by the elastic device, the guide can be obtained, and the guide can be guided to ensure the suction table. (or hanging
台）可以回復到正確位置。 T 【實施方式】 請參閱第一圖所示，係本發明真空吸附裝置（i 〇 ) 與基座（4 Q )之立體外觀示意圖，真空吸附|置（工〇 )係包括一藉以固定於機台之懸吊台（1丄）、一以可升 降狀安裝於懸吊台（1丄）下方之吸取台2) 、^於 懸吊台（1 1 )與吸取台（i 2 )之間的數個彈性裝^ 2 0 )，其中，吸取台（χ 2 )底部設有與基座（* 〇 ) 之切割台（4 1 )相應設置之吸附部（1 〇 n、 、丄z U )，吸取台 (1 2 )頂部設有與吸附部（χ 2 〇 )相連通之真空裝置 (30)，啟動真空裝置（30)可以在吸附部（丄2〇 )產生吸力，以吸取切割台（4 i )上之半導體元件（圖 中未示）’所述之彈性裝置（2 0 )係設吸取台（丄2 )° 及懸吊台（1 1)四隅。 晴參閱第二及四圖所示，所述之彈性裝置（ 、〈2 0 )係 包括一設於懸吊台（11) (11A)及吸取台（12) (12A)之間的導柱（21)、一穿置於導桂（2ι) 上’並且常態將吸取台（1 2 ) ( 1 2 A )朝下施了η /别下推頂之彈 性體（2 2 )，導柱（2 1 )係固定於吸取台f Ί 、 、丄ζ )或 者懸吊台（1 1 A )上，另一端則相對穿置於懸吊台（工 6 1288042 1 )或者懸吊台（i 2 A)上，導柱（2丄）與所穿置之 物件之間具有間隙，故當真空吸附裝置（丄〇 )(丄〇 a )如第二、五圖所示下降貼附於基座（4 0 ) 了頁面時，吸 ° 1 1 2 A )即受力而往上推頂，並且壓縮彈 性體（2 2 )，藉由彈性體（2 2 )之彈力使吸取台（丄 ;)(1 2 A)壓制於切割台（4工）表面，而由於導柱 2 1 )與所穿置的物件〔懸吊台（丄丄）或者吸取台（ 2 A )〕之間略有間隙，因此，吸取台（1 2 )( 1 2 A )可以自動調整傾斜角度，使吸附部（丄2 〇 )(工2 ? 刀口（ 4 1 )之間完全貼合，確保吸附部（1 =二(厂0A)可以產生將切割台（41)上之半導 體凡件吸起的吸力。Taiwan) can return to the correct position. T [Embodiment] Please refer to the first figure, which is a schematic diagram of the three-dimensional appearance of the vacuum adsorption device (i 〇) and the susceptor (4 Q ) of the present invention, and the vacuum adsorption|setting (work) system includes a fixed machine The suspension table (1丄) of the table, the suction table 2) which is mounted under the suspension table (1丄), and the suspension table (1 1 ) and the suction table (i 2 ) a plurality of elastic fittings 2 0 ), wherein the bottom of the suction table (χ 2 ) is provided with an adsorption portion (1 〇n, 丄z U ) corresponding to the cutting table (4 1 ) of the base (* 〇), The top of the suction table (1 2 ) is provided with a vacuum device (30) connected to the adsorption portion (χ 2 〇), and the startup vacuum device (30) can generate suction force at the adsorption portion (丄2〇) to suck the cutting table (4) The elastic device (20) of the above-mentioned semiconductor component (not shown) is provided with a suction table (丄2)° and a suspension table (1 1). As shown in Figures 2 and 4, the elastic device (, <20) includes a guide post (between the suspension table (11) (11A) and the suction table (12) (12A). 21), one placed on the guide gui (2ι)' and the normal state will suck the table (1 2 ) ( 1 2 A ) downwards η / do not push down the top of the elastic body (2 2), the guide column (2 1) fixed on the suction table f Ί , 丄ζ ) or the suspension table ( 1 1 A ), and the other end is placed opposite to the suspension table (Work 6 1288042 1 ) or the suspension table (i 2 A) Above, there is a gap between the guide post (2丄) and the object to be worn, so when the vacuum adsorption device (丄〇) is lowered as shown in the second and fifth figures, it is attached to the base (40). When the page is pressed, suction 1 1 2 A) is pushed upwards by force, and the elastic body (2 2 ) is compressed, and the suction table (丄;) is made by the elastic force of the elastic body (2 2 ) (1 2 A) pressing on the surface of the cutting table (4 work), and because of the slight gap between the guide post 2 1 ) and the object to be placed [suspension table (丄丄) or suction table ( 2 A ), The table (1 2 ) ( 1 2 A ) can automatically adjust the tilt angle to make the adsorption section ( 2 billion) between (2 ENGINEERING? Edge (41) is completely bonded, to ensure suction unit (1 = bis (plant 0A) may create a suction on the cutting table half (41) where the guide member is sucked up.
上述係關於本發明之彈性裝置（2 〇 ) I 詳細結構及動作述及如后： 要構成^ 請復參閱第二、二^所+筏敌士拉 ，吸取A。9、—圖所不係為本發明之第-種實施例 及取口（ 1 2 )之頂部設有一結合 …。板（1 2 5 )與懸吊台（工丄） f ( 1 ? R Λ 3相對設有同軸之 牙孔（126) (110)，所述之導 於懸吊台（11)之穿孔（110)，其J1):牙置 向凹入之螺孔，葬 紝人诚h r ^ °卩並且自又有軸 過結合板（1 9 R、 ’）由下而上穿 低、丄2 5 )之穿孔（1 2 6 ) a破 1 )底部，進而#、# 再螺設於導柱（2 進而使導柱（2 1 )形成固定 5 )而穿置於縣吊厶 〜口否板（1 2 …甲台（1 1 )穿孔（1 Ί 柱（2 1 )夕了石* 丄丄0 )之型態，導 貝4設一徑向突出的擋止部 4 2 10)1 1288042 吸取台（1 2 )懸吊於懸吊台（丄丄）下方，彈性體（2 2 )則穿置於導柱（2工）上並且頂撐於懸吊台（丄丄） 與結合板（1 2 5 )之間，當吸取台（丄2 )底部受到往 上推頂之力時"及取台（丄2 )即連同導柱（2丄）往上 移動。 此外’彈性裝置（2 〇 )又進一步包括一套設於導柱 (2 1 )與懸吊台（丄丄）穿孔（丄丄〇 )之間的襯套（ > 23)轉見套（23)與導柱（21)外周壁之間略具有 間隙襯套（2 3 )與導柱（2 1 )的播止部（2 1 〇 )底4之間呈往上漸擴的錐形配合，當釋去推力而使吸取 台（1 2 )及導柱（2工）下降時，即會藉由該錐形設計 形成自動定位之導正效果，使導柱（2丄）與概套（2 3 )位於同中〜’確保吸取台（1 2 )回復到正確位置。 前述本發明第一種實施型態係將彈性裝置（2 〇 )之 導柱（2 1 )固定吸取台（工2 )頂部，而穿置於懸吊台 丨 （1 1)内，另如第四、五圖所示為本發明之另一種實施 例，係將彈性裝置（2 〇 )反向設置，亦即，將導柱（2 1 )之擋止部（2 1 〇 )設於底部，將導柱（2丄）由下 而上穿置於吸取台（12A)之結合板（i25)的穿孔 (1 2 6 A )，另以一結合螺栓（丄2 7 )由上而下穿過 懸吊台（1 1 A )之穿孔（：[；[0 )，而將導柱（2工） 螺設固定於懸吊台（1 1 A )底部，導柱（2丄）與一穿 置於結合板（1 2 5 )穿孔（i 2 6 A )的槪套（2 3 A )呈錐形配合，導柱（2 !)與襯套（2 3 A )之間略具 8 1288042 有間隙’真空吸附裝置（i 0 A)如第五圖所 ， 使吸取台（1 2 A )因為接觸到基座（4 〇 )的切 4 1 )而受到往上頂樓之力時，吸取台（1 2 ° : 著導柱（川上升，並且由於導柱（21)與 1 2 A )之間略具有間隙，使吸取 ^ . 、丄八）可以調整 …、又，以補償加工時之誤差，確保吸附部（Ί )與基座（4 0 )之切割台（4 i )纟面貼合。 月1J述一種實施例當中，是將彈性裂置的彈 it j；4： Al t ^ 賤# 设於 導柱外，纟亦可以與導柱分開設置，而直 及吸取台之間。 π懸吊台 【圖式簡單說明】 第一圖係本發明與基座的立體外觀示意圖。 第二圖係本發明之平面局部剖面示意圖。 第三圖係本發明下降與基座表 面示意圖。 了t干面局部剖 。第四圖係本發明第二種實施例的平面局部剖面示意圖 第五圖係本發明第二種實施例與基 局部剖面示意圖。 貼。之平面 弟六圖係現有用以裁切半導體元件之基座的 不意圖。 奴外觀 圖 第七圖係現有吸附裝置與基座貼合之平面示意 【主要元件符號說明】 (1 〇 ) ( 1 0 A )真空吸附裝置 9 1288042 (11)(1 (110)( (12) ( 1 (12 0)( (12 5)( (12 6)( (2 0 )彈性 (2 1 0 )擋 (23) ( 2 (30) (6 (40) (5 (41) (5 (6 0 )吸附 A )懸吊台 1 0 A )穿孔 A )吸取台 2 0 A )吸附部 2 5 A )結合板 2 6 A )穿孔 置 （21)導柱 部 （2 2 )彈性體 A )襯套 )真空裝置 )基座 )切割台 置 （6 1 )吸附部 10The above detailed structure and operation of the elastic device (2 〇) I of the present invention are as follows: To form a ^ Please refer to the second, second, and 筏 筏 筏 , , , 吸 吸. 9. The figure is not the first embodiment of the present invention and a combination of the top of the mouthpiece (12). The plate (1 2 5 ) and the suspension table (worker) f ( 1 ? R Λ 3 are oppositely provided with a coaxial hole (126) (110), which is guided by the perforation of the suspension table (11) (110) ), J1): the tooth is placed in the concave screw hole, the burial person is hr ^ ° 卩 and since the shaft has a combined plate (1 9 R, ') from the bottom up, 丄 2 5) Perforation (1 2 6 ) a break 1) bottom, and then #, # snails are placed on the guide post (2 and then the guide post (2 1 ) is fixed 5) and placed in the county condolence ~ mouth plate (1 2 ...A table (1 1 ) perforated (1 Ί column (2 1 ) 了 * stone * 丄丄 0) type, the guide shell 4 is provided with a radially protruding stop 4 2 10) 1 1288042 suction table (1 2) Suspended under the suspension table (丄丄), the elastic body (2 2 ) is placed on the guide column (2 work) and supported on the suspension table (丄丄) and the combined plate (1 2 5 ) Between when the bottom of the suction table (丄2) is pushed upwards, " and take the table (丄2) and move up with the guide post (2丄). In addition, the 'elastic device (2 〇) further includes a set of bushings (> 23) between the guide post (2 1 ) and the suspension (丄丄) perforation (丄丄〇). ) a tapered fit between the outer peripheral wall of the guide post (21) and the bottom portion 4 of the guide post (2 1 ) with a gap between the bushing (2 3 ) and the bottom portion 4 of the guide post (2 1 ). When the thrust is released and the suction table (12) and the guide column (2 work) are lowered, the guiding effect of the automatic positioning is formed by the tapered design, so that the guide post (2丄) and the guide sleeve (2) 3) Located in the same ~ ~ Make sure the suction station (1 2) returns to the correct position. In the first embodiment of the present invention, the guide post (2 1 ) of the elastic device (2 )) is fixed to the top of the suction table (Work 2), and is placed in the suspension table (1 1), and 4 and 5 are another embodiment of the present invention, in which the elastic device (2 〇) is reversely disposed, that is, the stopper portion (2 1 〇) of the guide post (2 1 ) is disposed at the bottom. Pass the guide post (2丄) through the perforation (1 2 6 A) of the bonding plate (i25) of the suction table (12A) from bottom to top, and pass through the top and bottom with a coupling bolt (丄2 7) Perforation of the suspension table (1 1 A) (:[;[0), and the guide column (2 work) is screwed to the bottom of the suspension table (1 1 A), and the guide column (2丄) and a through hole The ferrule (2 3 A ) of the perforated plate (1 2 5 ) is tapered, and the guide post (2!) and the bushing (2 3 A ) have a slight gap between the 12 1288042 'The vacuum adsorption device (i 0 A), as shown in the fifth figure, allows the suction table (1 2 A) to be subjected to the force of the top floor due to contact with the pedestal (4 )). 2 ° : Guide column (the rise of the river, and due to the slight difference between the guide column (21) and 1 2 A) The gap is such that the suction can be adjusted, and the error in the machining can be compensated to ensure that the suction portion (Ί) and the cutting table (4 i ) of the base (40) fit together. In an embodiment of the present invention, the elastically splitting springs j; 4: Al t ^ 贱# are disposed outside the guide post, and the crucible can also be disposed separately from the guide post and directly between the suction stages. π Suspension Table [Simplified Description of the Drawings] The first drawing is a schematic view of the three-dimensional appearance of the present invention and the susceptor. The second drawing is a schematic partial cross-sectional view of the present invention. The third figure is a schematic view of the descending and pedestal surface of the present invention. Partial section of the t dry surface. 4 is a plan partial cross-sectional view of a second embodiment of the present invention. FIG. 5 is a partial cross-sectional view showing a second embodiment of the present invention. paste. The plane of the sixth figure is not intended to cut the base of the semiconductor component. The seventh picture of the slave appearance is the plane diagram of the existing adsorption device and the base. [Main component symbol description] (1 〇) (1 0 A) Vacuum adsorption device 9 1288042 (11) (1 (110) (12) ( 1 (12 0)( (12 5)( (12 6)( (2 0 ) elastic (2 1 0 )) (23) ( 2 (30) (6 (40) (5 (41) (5 (6) 0) Adsorption A) Suspension table 1 0 A) Perforation A) Suction table 2 0 A) Adsorption section 2 5 A) Bonding plate 2 6 A) Perforation (21) Guide post (2 2 ) Elastomer A ) Lining Set) vacuum device) base) cutting table (6 1 ) adsorption unit 10