TWI287277B - Semiconductor device including molded wireless exposed drain packaging - Google Patents

Semiconductor device including molded wireless exposed drain packaging Download PDF

Info

Publication number
TWI287277B
TWI287277B TW91121778A TW91121778A TWI287277B TW I287277 B TWI287277 B TW I287277B TW 91121778 A TW91121778 A TW 91121778A TW 91121778 A TW91121778 A TW 91121778A TW I287277 B TWI287277 B TW I287277B
Authority
TW
Taiwan
Prior art keywords
die
solder
pad
leadframe
drain
Prior art date
Application number
TW91121778A
Other languages
English (en)
Chinese (zh)
Inventor
Maria C Y Quinones
Consuelo N Tangpuz
Original Assignee
Fairchild Semiconductor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/963,049 external-priority patent/US6989588B2/en
Application filed by Fairchild Semiconductor filed Critical Fairchild Semiconductor
Application granted granted Critical
Publication of TWI287277B publication Critical patent/TWI287277B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW91121778A 2001-09-24 2002-09-23 Semiconductor device including molded wireless exposed drain packaging TWI287277B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/963,049 US6989588B2 (en) 2000-04-13 2001-09-24 Semiconductor device including molded wireless exposed drain packaging

Publications (1)

Publication Number Publication Date
TWI287277B true TWI287277B (en) 2007-09-21

Family

ID=27663751

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91121778A TWI287277B (en) 2001-09-24 2002-09-23 Semiconductor device including molded wireless exposed drain packaging

Country Status (2)

Country Link
JP (1) JP4424901B2 (ja)
TW (1) TWI287277B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4606376B2 (ja) * 2006-04-19 2011-01-05 日本インター株式会社 半導体装置
JP5072911B2 (ja) * 2009-07-02 2012-11-14 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JP4424901B2 (ja) 2010-03-03
JP2003204026A (ja) 2003-07-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees