TWI284582B - Controlled penetration subpad - Google Patents

Abstract

Provided is a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad. In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth to penetrate a porous bottom pad. [Prior Art] The tantalum wafer system is fabricated as a precursor for the production of microelectronic semiconductor components. The wafer is produced by cutting a cylindrical disk parallel to its main surface to produce a thin disk having a diameter of generally 20 to 30 cm. The resulting wafer must be polished to obtain a flat and planar surface suitable for forming electronic components to form an integrated wafer semiconductor device. In general, a 20-cm diameter wafer will produce 100 or more microprocessor chips. The design specifications of the integrated wafer are gradually being reduced, and the number of applied layers, such as different deposition orders, patterning, and etching of parts on the surface of the germanium, is increasing. Today's semiconductors typically break into up to 7 or 8 metal layers, and the design of the part is expected to contain more layers. The reduced specification of the circuit and the increased number of layers will result in more stringent requirements for the smoothness and planarity of germanium and semiconductor wafers throughout the wafer process, as uneven surfaces may compromise the patterning process and the overall circuit. Integrity 〇 The standard wafer polishing technique currently in use is to place the wafer on a generally disc-shaped rotating polishing pad that is mounted on a large rotating table. A chemical mechanical polishing (CMP) slurry is typically applied to the surface of the pad. The wafer is mounted in the fixed -4 - (2) 1284582 position with a carrier above the wafer as the pad and slurry are polished. Optical polishing techniques for polishing lenses, mirrors and other optical components 〇 A notable different approach is the so-called Linear Planarization (LPT), in which the polishing pad is attached to a support strip. A combination of the mat and the strap is described in EPU 696 495, which comprises a strip of a conventional flat polyamino resin polishing pad adhered to the underlying steel strip or other high strength material strip. A disadvantage of this prior art polishing pad is that the polishing pad typically contains seams. Delamination often occurs at the seams of the polishing pad. Furthermore, seams can damage the surface of the diffuser and limit the ability of the mat to polish the object to a high degree of planarity. A large mat made of two or more small mats will have one or more seams at the joint of the mat. See, for example, U.S. Patent No. 6,1 7 9 ; 990 (Z h ang et al.). Similarly, each time the end of the extension mat is joined into a strap, there is a seam at the seam of the strap. See, for example, W 0 0 1 /8 3 1 6 7 (Eppert et al.). One way to solve the seam problem is to directly form the polishing layer into the required specifications and shape. The method can be accomplished, for example, by casting a continuous, seamless polishing pad of the desired size. See, WO 99/06182 (Dudovicz et al.). Wafer polishing using rotating disc or seamless belt technology typically involves laminating a hard finish onto a rigid support. For example, a pallet under a rotating polishing disc typically contains steel, and a seamless polishing belt typically includes a stainless steel support strap. For this reason, it is often necessary to pry a soft, compressible underpad under the polishing layer. See, for example, U.S. Patent No. 5, 4 0 3, 2 28 (Pasch). When in use, the compressible bottom pad is sandwiched between the polishing layer and the steel support or the belt support (3) 1284582, so that the hard polishing layer is more conformable to the wafer surface. As in the prior art construction method, where the seam may be a problem, the polishing pad is applied to the steel plate or the stainless steel strip in the same manner using, for example, a double-sided tape attached to the compressible bottom pad. . It has been found that the compressible underpad is coated with a hardenable fluid such that the seamless polishing layer is produced directly on the compressible underpad. This will cause air to be transferred from the bottom pad to the hardenable fluid, which will create voids in the hardened polishing layer. Again, the fluid often penetrates to different depths across the bottom pad. Therefore, the thickness of the hardened polishing layer produced in the mat will be different, such as the thickness of the unpermeated portion of the underlying mat under the hardened polishing layer. The thickness variability of the polishing layer voids and the underlying mat material beneath the hardened polishing layer and the hardened polishing layer will result in relative variability in the compressibility of the polishing pad. As discussed previously with the seam problem, whether the polishing object is a silicon wafer, an optical part, or another object, if the polishing pad is not uniform in nature, it will limit the ability of the mat to impart uniform smoothness and planarity to the polishing material. Accordingly, there is a need for a polishing pad comprising a seamless polishing layer that substantially uniformly penetrates into the depth of the porous backing pad, and a method of making a seamless, porous bottom pad comprising a polishing pad from a hardenable fluid. SUMMARY OF THE INVENTION The present invention provides a method of making a seamless polishing pad that addresses the problem of uneven penetration of a hardenable fluid into a porous substrate. The present invention also provides a seamless polishing pad comprising a substantially uniform depth to penetrate the porous backing pad. -6 - (4) 1284582 More particularly, the present invention relates to a seamless polishing pad comprising a softer, compressible underpad located under a harder one. The seamless polishing comprising the application of a base pad coated with a hardenable fluid comprises an open area (i.e., the porous) prior to coating. According to the present invention, the open area of the underpad is not filled with fluid, or is substantially uniform across the underpad, and the present invention provides a seamless polishing seam coated with a porous bottom pad. A mat in which the depth of the polishing layer penetrates into the bottom pad is substantial. Again, the polishing pad is often substantially uniformly compressible. Applying a barrier layer prior to coating the underpad with a hardenable fluid will achieve a substantially uniform penetration depth. The barrier layer preferably has properties of: (a) good adhesion to the underpad and to the polishing layer, (b) penetration of the hardenable fluid into the underpad, and (c) inability to substantially compress the pad Sex. According to the method of the present invention, a seamless polishing pad comprising a deep uniform uniform seamless polishing layer impregnated into a porous bottom pad can be prepared (a) providing a porous bottom pad and (b) applying a barrier layer to the bottom pad And the hardened fluid coats the underlying pad of the coated barrier layer to form a seamless seam. In the same manner as the same material, but in addition to the polishing pad formed by the step (b) (ie, without the barrier layer), the polishing pad prepared according to the present method comprises a more uniform depth of penetration into the porous bottom pad. Floor. The same method as the #-material, but except for the light of the step (b); the polishing pad prepared according to the method of the present invention is usually a polishing layer polishing pad, and the bottom pad is subjected to hardness. Because the layer is not uniform until the bottom pad has the following texture to prevent the change of the bottom degree as follows = (c) polishing with a polishable layer polishing pad can be more uniform - -7 - (5) 1284582 compression. [Embodiment] Figs. 1 and 1a illustrate, in cross section, a polishing pad comprising a porous underlayer 3 and a polishing layer 4, wherein the polishing layer 4 has penetrated into the underlying pad to an uneven depth. The polishing pad is mounted on a substrate 1. In Figure 1, the depth of penetration of the entire mat is irregular. In Figure 1 a, the penetration depth is larger on the right side of the mat and smaller on the left side. In the second case, the properties of the polishing pad vary with the depth of penetration, and it is difficult to accurately and accurately prepare a seamless polishing pad having all of the desired properties. The present invention can solve this problem. The cross section of Figure 2 is illustrated as an embodiment of a jointless polishing pad. It is to be noted that the term "seamless polishing pad" as used herein refers to a seamless polishing disc and a seamless polishing belt. Moreover, the term "polished disc" generally refers to any polishing pad used on a rotating pallet, regardless of the shape of the mat. In other words, the term "polished disc" as used herein is not limited to polishing mats of such shapes, even though most of the polishing pads used for rotating the pallets are actually disc-shaped. At the same time, it should be noted that although the polishing belt is continuous in its longitudinal direction, the polishing pad has a discrete perimeter, and the belt and the disc exhibit a uniform cross section. Thus, the illustration of a "polish pad" as described herein will properly illustrate the polishing belt and polishing disk embodiments of the present invention. As shown in Fig. 2, the elements of the seamless polishing pad are a porous bottom pad 3 and a seamless polishing layer 4, wherein the polishing layer 4 is formed by applying a hardenable fluid to the surface of the bottom pad 3. The polishing layer 4 has penetrated into the bottom pad 3 to a substantially uniform distance of -8 - (6) 1284582. Figure 2 also shows the components that are added to the substrate 1 and the adhesive-bonded polishing pad as needed. The disc substrate 1 is a supporting material such as a rotating pallet, but the belt substrate 1 is a rigid material such as stainless steel, and the belt is constructed in a cross-sectional manner in Fig. 3 to illustrate another alternative embodiment. The bottom pad 3, the polishing layer 4 and the substrate 1 are as shown in Fig. 2. In addition to the bottom pad 3 and the polishing layer 4, the polishing pad is included as a barrier layer 5 to which the barrier layer 5 is applied before the bottom pad 3 is hardened to flow the polishing layer 4. In this embodiment, the polishing layer 4 has penetrated into the bottom pad 3 for a substantially uniform distance. When the components are sequentially taken out, the bottom pad 3 may comprise any suitable material. Before being coated with the barrier layer 5 and/or the polishing layer 4, an open area, such as a hole, is included. Furthermore, it is generally preferred that the bottom pad be uniformly compressed. Suitable materials for the backing pad 3 are the polymer foams and fibers of the art. The bottom pad 3 preferably comprises non-woven, non-woven synthetic fibers and natural fibers comprising polyester polyurethane, polyolefin, fluoropolymer, cotton, wood. The material suitable for use as the bottom sill 3 is the 8 1 7 underpad material sold by Thomas (S υ η n y v a 1 e 5 C A). The representative dimensions of the underpad 3 are shown in Figures 2 and 3 in the relative relationship of the other components of the mat. Generally, the base pad 3 has a width equal to the width of the substrate 1. As mentioned above, the polishing belt is in the form of a continuous loop, whereas the polishing disc has a discrete perimeter. In the non-contact embodiment of U 2 , in the embodiment, the body coating of the illustrated additional component of the quilted polishing pad and the barrier layer 5 and the compressible bottom pad 3 should be substantially It can be seen that the woven material, the example, the polyamide, the material and the combination thereof are smaller than the longitudinal direction of the polishing width, and the polishing circle is - 9 · (7) 1284582 · In the embodiment, generally The length/diameter of the bottom pad 3 is also less than or equal to the length/diameter of the substrate i. Although the length of the bottom pad 3 can also be less than the length of the substrate 1, in the polishing belt embodiment, the length of the bottom pad 3 (measured by its inner circumference) is preferably substantially equal to the length of the substrate 1 (by Its outer circumference is measured). Although any suitable thickness can be used, the thickness of the bottom pad 3 is typically from about 0.001 to about 0.2, more typically from about 0.01 to about 0.1 inches, prior to application of the barrier layer 5 or the polishing layer 4. If the bottom pad is provided with an adhesive layer on the bottom surface and/or the surface, the thickness of the bottom pad does not include the thickness of the adhesive layer. Generally, the barrier layer 5 is a material whose viscosity is increased after being applied to the underpad 3. However, when applied to the underpad 3, any material having the following properties can be used as the barrier layer 5: (a) The barrier layer should be firmly adhered to the underpad 3 and the polishing layer 4, (b<) The barrier layer 5 should substantially prevent the polishing layer 4 from penetrating into the underpad through the barrier layer 5, and (c) the barrier layer 5 should not substantially alter the compressibility of the underpad 3. Although other adhesion modes are possible, it is preferred that the barrier layer 5 be adhered to the underpad 3 and the polishing layer 4 by chemical adhesion and/or mechanical entanglement interaction to promote a firm adhesion between the components of the polishing pad. . The chemical adhesion of the barrier layer depends on the composition of the underpad 3 and the polishing layer 4. Materials which can be firmly adhered to various components such as the underpad 3 and the polishing layer 4 are well known in the art. For example, if the bottom pad 3 comprises polyester fibers and the polishing layer 4 comprises a polyurethane, a polymer adhesive such as a polyurethane, a propylene, a methacrylic or a urethane A cyanoacrylate, vinyl, epoxy or styrene adhesive generally provides good chemical adhesion between the polymeric elements. Hot melt adhesive, contact adhesive, oxygen oxide adhesive-10- (8) 1284582* (acrylic), UV hardener, emulsifier (white glue), sealant (oxynitride, acrylic, amine) Carbamate, butyl rubber and polysulfide, etc.), modified phenol resin, plastisol (modified PV C dispersant), rubber adhesive (solution, emulsion), polyvinyl acetate (emulsifier) ), special adhesives (pressure sensitive adhesives, self-sealing adhesives, short-acting adhesives, heat sealants, foaming materials & woven adhesives, etc.) and sticker adhesives (resin adhesives, emulsion adhesives, etc.) Etc.) also applies. Polyurethane and acrylic adhesives are preferred. Another way to maximize chemical adhesion is to use a barrier layer 5 that can chemically bond the polishing layer 4. For example, if the barrier layer 5 and the hardenable fluid to be polished layer 4 initially contain reactive molecules, the hardenable flow body is applied to the barrier layer 5 before the barrier layer 5 is completely reacted. There may be interactions between the various components.

The surface topography has a textured underpad instead of a smooth underpad that can be used to maximize the interaction of mechanical entanglement. For example, a bottom mat comprising non-woven fibers can be used. In other words or incidentally, the surface of the underpad may be modified (e.g., by buffing, forming, embossing, cutting, scribing, etc.) to increase the texture. In a preferred embodiment, when the hardenable fluid is applied, the barrier layer 5 comprises a textured portion sufficient to flow through the bottom pad 3, but adhered to a material sufficient to conform to the texture of the underpad 3. Combinations of these properties can be found in a variety of materials, such as hardenable fluids, which can be applied at lower viscosities, but the viscosity increases rapidly after application. An adhesive having an increased viscosity after application, such as an adhesive to which a volatile solvent is applied, is suitable as the barrier layer 5. The examples include a polyurethane adhesive 'for example, D25 96H adhesive and D2 5 97 cross-linked U available from DELA -11 - (9) 1284582· Company (Ward Hill, ΜΑ), and Chemlok® 2 1 3 ° purchased by Lord® (Cary, NC) In other words or incidentally, the surface of the barrier layer 5 can be modified to increase the texture. The barrier layer 5 should substantially prevent the polishing layer 4 from penetrating into the underpad 3. It is therefore required that the barrier layer 5 be applied in a continuous layer without substantially leaving any open areas through which the polishing layer can contact the bottom pad 3 via the open area. Materials which can be applied in a continuous layer are well known to those skilled in the art. For example, it is generally suitable for the production of the barrier layer 5 as a polymer, for example, the polymeric adhesive 阻 barrier layer 5 should substantially change the compressibility of the underpad 3. Therefore, it is preferable that the barrier layer 15 is applied to the underpad 3 in such a manner that the barrier layer 5 penetrates into the underpad 3 to a substantially uniform depth. The application method is well known to those skilled in the art and includes spray coating, dip coating, doctor blade coating, roll doctor coating, extrusion, injection molding, and coating with high viscosity materials or coating in low viscosity fluids. The method, as the case requires, then passes the coated underpad through the kneading roller to further process the barrier layer 5 into the underpad 3. If the barrier layer 5 acts as a hardenable fluid, it should be applied in such a way that the entire underpad is flatly coated with the same viscosity. Although not common, the material used as the barrier layer 5 may have substantially the same compressibility as the underpad 3. In this case, even if the barrier layer 5 penetrates into the bottom pad to a different depth, the compressibility of the underpad is not substantially changed. Although the barrier layer 5 can be used in any suitable thickness, it is typically between about [micro] and about 0.2 inches thick, often between about 10 microns and -12 - (10) 1284582 and about 0.1 inches, more Often between about 0.001 and about 0.01 inches. The barrier layer 5 can penetrate the bottom pad 3 to any suitable depth. However, since the barrier layer 5 is less compressible than the underpad 3, and because the function of the underpad 3 in the polishing pad is to provide a buffer for the object to be polished, it is generally preferred that the barrier layer 5 only penetrates into the bottom pad. Limited extent. Further, in order to maximize the adhesion, it is generally preferred that the barrier layer 5 penetrate at least a certain distance into the bottom pad 3. For example, the barrier layer 5 can penetrate the bottom pad 3 to a height of about · to about 0 〇 2 inches. If it is acceptable or necessary to reduce the buffering effect, the barrier layer 5 can penetrate into the bottom pad 3 a little deeper and even penetrate into the bottom of the bottom pad 3 at all times. Fig. 4 illustrates, in cross section, the barrier layer 5 penetrates into the underpad 3 to reach about half of the polishing pad. Figure 4a shows the barrier layer 5 in a cross-sectional manner - infiltrating the polishing pad of the bottom pad 3. By choosing the nature of the barrier layer 5 and the depth of penetration, it can be tailored to the degree of cushioning provided by the polishing pad. The seamless polishing layer 4 comprises a hardenable fluid applied to the bottom pad 3. The hardenable fluid can be applied directly to the backing pad 3 (e.g., the embodiment of Figure 2) or to the bottom pad 3 of the coated barrier layer 5 (e.g., the embodiment of Figure 3). By "hardenable fluid" is meant a fluid that is sufficiently flowable to apply the fluid flatly to the underpad 3, and that the hardenable fluid provides a solid, durable, seamless polishing layer. In general, the hardenable fluid can comprise one or more reactive molecules (eg, 'prepolymers, monomers, resins, oligomers, etc.) and one or more reactive initiators that can be used in the hardenable fluid. Agent (for example, polymerization initiator, curing agent, catalyst, hardener, etc.). Alternatively, light and/or heat can be used to initiate the reaction. The reactive molecule and the reaction initiator may optionally be dissolved in a suitable solvent. The hardenable-13-(11) 1284582" fluid contains one or more of the required fluidity and curability characteristics at the beginning of the reaction, as well as the firmness, durability and seamlessness required after complete reaction. Reactive molecule. The hardenable fluid may optionally contain one or more molecules that are not reactive. For example, a polymer which can be suspended or dissolved in a suitable solvent and applied to the underpad 3. Depending on the contact with the underpad 3 and/or the barrier layer 5, the polymer can be precipitated to produce a polishing layer 4. The polishing layer 4 should also be firmly adhered to the underpad 3 (e.g., Figure 2) And/or adhering to the barrier layer 5 (e.g., the embodiment of Figure 3), so the polishing pad can prevent delamination during use. With regard to the barrier layer 5 described above, the delamination can suppress the chemical adhesion and the mechanical entanglement and interaction between the polishing layer 4 and the underpad 3 and/or the barrier layer 5 to a maximum. The polishing layer 4 is applied in the same strategy and technique as described above. The polishing pad preferably prevents delamination from reaching the polishing layer 4 from the bottom pad 3 and/or the barrier layer 5 without destroying the integrity of the layers. In other words, the cohesive force of one or more of the polishing pads (the underpad 3, the seamless polishing layer 4, and optionally the barrier layer 5) will fail before the adhesion of the components is broken. . The endurance of the polishing belt against delamination can be tested in the following manner. The polishing belt can be run on the belt roller unit shown in Figure 5. For example, the belt can be run at approximately 300 feet per minute using a roller having a diameter of about 12 inches. At the same time, the surface of the polishing belt can be weighed by a urethane roller weighing about 1.25 lbs and stopped on the belt surface when the belt is running. When the contact area of the roller is about 12 inches by 0.2 5 inches, the applied pressure -14 - (12) 1284582 is about 40 p s i . Finally, a liquid such as water or a C 浆 slurry can be continuously poured over the entire width of the belt at a rate of about 1 liter per minute. The polishing belt preferably operates on the apparatus for at least about 50 hours without revealing signs of delamination (i.e., no gaps are formed between the belt elements). More preferably, the polishing belt runs for at least about 75 hours without revealing signs of delamination. Preferably, the polishing belt is operated for at least about 1000 hours without revealing delamination. The seamless polishing layer 4 preferably comprises a solid or porous polyurethane such as a polyurethane having a S h 〇re - D hardness of about 1 〇 to 90, although other suitable hardnesses are also be usable. The hardenable fluid used to produce the polishing layer 4 preferably comprises a polyurethane and a curing agent for the polyurethane. Alternatively, the polishing layer 4 can comprise any thermoset or thermoplastic polymer, copolymer or blend having desirable properties such as sufficient flexibility, abrasion resistance, and water and chemical resistance. Possible polymer examples include, but are not limited to, polyurea resins, polyamines, polyesters, polycarbonates, polyethers, polyacrylates, polymethacrylates, substituted ethylene polymers, polypropylene oximes Amines, polyacrylonitriles, polyketones, polyoxyalkylenes, saturated and unsaturated polymeric hydrocarbons, fluoropolymers, and epoxy resins. A preferred method of producing the seamless polishing layer 4 by coating the bottom pad 3 with a hardenable fluid (whether or not the barrier layer 5 is present) is a mold. As is known to those skilled in the art, casting involves involving a mold that is hardened with a hardenable fluid. Molds are typically filled by an open top or through injection points at the bottom and/or sides. One of the particularly useful molds is that the mold combines the polishing layer 4 with the substrate 1 to produce a continuous outer surface of the polishing pad, allowing the continuous outer surface to be coated and -15-(13) 1284582. substantially sealing the underpad 3 penetrates with waterproof parts. Therefore, the underpad 3 is protected from contact with corrosive slurries for chemical mechanical polishing of germanium or semiconductor wafers. If a certain part of the underpad becomes wet, the compressibility changes. If the corrosive slurry degrades the underpad, the compressibility of the underpad may change further. If the slurry deteriorates the interlayer adhesion of the polishing pad, for example, the adhesive 2 is deteriorated, delamination may occur. Preferably, the method of using a mold, which is applied to all areas of the underpad 3 at the same time, is rapidly and continuously applied. In this way, the potential crisis of uneven penetration into the underpad 3 will be alleviated. In other words or incidentally, the time to combine the reactive molecules and the reaction initiator can be equal to the time at which the hardenable fluid is applied to any particular portion of the underpad. Further, the properties of the hardenable fluid, (e.g., composition, temperature, etc.) can be modified to ensure that the viscosity of the hardenable fluid is not substantially increased during application to the underpad. These molding methods can also be used to prepare polishing pads with or without barrier layer 5 (e.g., shown in Figures 2 and 3). The polishing pad prepared according to the above molding method includes a depth which penetrates into the porous underlayer to a depth which is more uniform than that of the polishing pad which is made of the same material, but is used in a different molding method. Further, the polishing pad prepared according to the above molding method and the polishing pad made of the same material generally have improved compression uniformity, but different molding methods are used. Other methods suitable for coating the underpad 3 with a hardenable fluid to produce the polishing layer 4 include reactive injection molding, spray coating, foam blowing, foam coating, compression molding, and extrusion. Regarding the above-described casting method for forming the polishing layer 4, each of these methods can be used to coat and seal the bottom pad 3 to prevent water penetration of -16 - (14) 1284582. Before, during or after the formation of the polishing layer 4, the seamless polishing layer 4 can be modified to provide optimum polishing performance. The polishing layer* may partially or entirely comprise a porous or microporous structure. The microporous structure can be formed by any suitable technique, such as blowing, foaming, adding hollow micro-ingredients, pelletizing, and the like. The polishing layer 4 may comprise at least one layer of partially melted polymeric particles' or two or more thermoplastic polymers of different melting points. The honed particles or fibers may be added to the polishing layer 4. In addition, the polishing surface may contain micro or large textures, grooves or discontinuities. The polished side may comprise areas of hard and soft polymers, may contain transparent and opaque materials, or may contain raised and lowered features. The polishing surface can be formed with a groove (e.g., extending in the direction in which the belt travels) to dispense and shift the egg hair and abrasive particles during the polishing process and reduce slippage to achieve a more uniform relationship between the polishing layer and the polishing article. contact. The prize fluid can be removed from the recess using any suitable method, including but not limited to the use of one or more high pressure water jets, a rotating fine brush or a rigid non-metallic tip pen (e.g., ceramic). As shown in Figures 2 and 3, the seamless polishing pad elements as desired are substrate 1 and adhesive 2. Any suitable adhesive can be used, such as a pressure sensitive adhesive. For example, UHA 8 79 1 sold by Avery Dennison (Pasadena, CA) can be used to adhere the bottom pad 3 to the substrate 1. For example, many commercially available underpads are provided with a suitable adhesive backing layer, such as the 817 bottom pad material from Thomas West, Inc. (Sunnyvale, CA). In the embodiment of the polishing disc, the substrate 1 can be the rotating pallet itself. In this example, the bottom of the bottom pad 3 can be adhered via the adhesive 2 to the surface of the rotating tray -17 - (15) 1284582 to be used. Alternatively, substrate 1 can be any flat support material such as a polymeric or plastic sheet. In this case, the support material, rather than the bottom, will adhere to the surface of the rotating pallet to be used. Referring again to the belt embodiment, since the substrate 1 will contact the rotating & mechanical roller during operation, it is preferred that the substrate 1 contain a permanent material such as stainless steel. When measured on the inner circumference of the belt loop, the belt substrate is generally 1 to 4 meters long (hanging J between 1 · 5 and 3 meters) ' 0 · 1 to 1 meter wide (often 〇 · 2 to 〇 6 meters) And 0.01 to 0.6 cm thick. The inner surface of the substrate 1 may be adhered with an attached protective layer such as a polyethylene inner material to protect the substrate 1 and the hard body of the polishing apparatus. The seamless polishing pad can be used to fabricate any type of material or layer in any of the different polishing steps of the semi-conductor. Typical materials to be polished include, but are not limited to, tantalum, polycrystalline germanium, hafnium oxide, low-k dielectric materials, molybdenum, nitrified giant, copper, tungsten, and aluminum. Polishing pads can be designed to selectively polish certain materials without damaging other materials, polishing different materials at similar rates, or specifically processing with certain specified types of slurries and solutions. The seamless polishing pad of the present invention can be used in other industries such as polishing and planarizing disk drives, optical planes and mirrors. Seamless seam pads are especially suitable for chemical-mechanical polishing of tantalum and semiconductor wafers. The "seamless polishing pad" as described above comprises a polishing layer 4 which is substantially uniform in depth to the bottom pad 3. The uniformity of the polishing layer 4 (and/or barrier layer 5) penetrating into the bottom pad 3 can be measured in the following manner, which is provided with a permeability variation factor (PVF). Roughly, the polishing pad is cut open and the cross section is viewed by a microscope (designed at at least 30X magnification) with a caliper penetration depth of -18-(16) 1284582* for twin measurement. The depth of penetration is measured by the surface of the bottom pad (i.e., the surface to which the hardenable fluid is applied). Because the osmotic inhomogeneity may be caused by the viscosity change of the hardenable fluid during the application of the hardenable fluid to the underpad (ie, the material is applied deeper when the viscosity is lower than when the material is applied at a higher viscosity) It is therefore necessary to measure the representative distribution of the underpad portions that are coated with the hardenable fluid at the beginning, in the middle and finally. For example, if the polishing pad is applied from one side to the bottom pad, continuously across the bottom pad, and finally at the opposite edge, representative measurements should be made from one side to the other at equal distances. Again, at least 40 measurements should be taken to systematically evaluate the entire area of the polishing pad. For example, if the polishing pad is applied from one side to the other and the distance between the sides and the v is 1 inch, the cross-sections of the four equal intervals perpendicular to the edge can be measured, along each cross-section. 1 inch measurement is made every 1 inch. Using the measurements taken, (a) pick up up to 2.5% of the measurement 値 (the maximum penetration of the polishing layer) and a minimum of 2.5% of the measurement 値 (the minimum penetration of the polishing layer), (b) from the highest existing The PVF is calculated by measuring 値 minus the existing minimum measured enthalpy, and (c) dividing the resulting enthalpy by the average thickness of the underpad. However, if 40 measurements are taken, Bjj (a) discards the highest measured 値 and the lowest measured 値, and (b) subtracts the existing minimum measured 由 from the existing highest measured 値 (the second highest measured 原来 in the original combination) (the second lowest measured enthalpy in the original combination), and (c) the resulting enthalpy divided by the average thickness of the underpad. The PVF was obtained by multiplying the obtained enthalpy by 100%. The PVF of the polishing layer 4 is preferably less than about 75%. The polishing layer 4 - 19 - (17) 1284582 · PVF is more preferably less than about 50%. The PVF of the polishing layer 4 is more preferably less than about 25%. The PVF of the polishing layer 4 is more preferably less than about 10%. The P V F of the polishing layer 4 is more preferably less than about 5%. The P V F of the polishing layer 4 is preferably less than about 1%. The PVF of the barrier layer 5 is preferably about 75% or less. The P V F of the barrier layer 5 is more preferably about 50% or less. The P V F of the barrier layer 5 is more preferably about 25% or less. The PVF of the barrier layer 5 is more preferably about 10% or less. The PVF of the barrier layer 5 is more preferably about 5% or less. The PVF of the barrier layer 5 is preferably equal to or less than about 1%. The seamless polishing pad often has substantially uniform compressibility. One way to measure the homogeneity of compressibility is to measure the peak hardness tester. Four equally spaced 2 x 2 inch samples were cut from the area of the polishing pad that was first coated with a hardenable fluid. Four equally spaced 2 x 2 inch samples were then cut from the area of the polishing pad that was finally coated with the hardenable fluid. Hardness testers can be made using Shore A, B, C or D specifications, such as those manufactured by Rex Gauge (Buffalo Grove, IL). Five samples of each 2 x 2 inch were measured and each spike was recorded. A total of 40 data points were obtained. Calculate the mean and standard deviation of the enthalpy measured by 40 durometers, then multiply the standard deviation by 6, divide by the average deviation, and multiply by 100% to calculate the in-belt inhomogeneity (WIBNU). The hardness meter WIBNU of the polishing pad is preferably about 10% or less. The hardness tester WIBNU of the polishing pad is preferably about 9% or less. The hardness gauge WIBNU of the polishing pad is more preferably about 8% or less. The hardness of the polishing pad WIBNU is more preferably about 7% or less. Hardness tester for polishing pad -20- (18) 1284582* WIBNU is more preferably about 6% or less. The hardness meter of the polishing pad WIBNU is preferably about 5% or less. Another method of measuring the uniformity of compressibility is to measure the stress at -0.1 单 5 unit strain. Three equally spaced 2 x 2 inch samples were cut from the polishing pad area previously coated with a hardenable fluid. Three equally spaced 2 x 2 inch samples were then cut from the polishing pad area that was finally coated with the hardenable fluid. Compressible stress strain data for each sample was generated using the following experimental conditions. With the substrate 1 side down, each sample was placed on a 6 inch diameter static plate. The surface of the sample was then recessed into a 0.5 inch diameter load plate. The test was suitably carried out on a MTS 2/G (MTS Systems, Minneqpolis, MN) test machine equipped with a 10 kN load cell. The experiment was carried out under the displacement control of a fixed displacement rate of K 0 10 inches/minute. During the experiment, each sample was compressed to a predetermined displacement, and then the load was removed. The force and displacement of the upper load plate were recorded as A function of time. The forces and displacements are then converted to engineering stresses and strains by the following equation: fiaa^o where • F = applied force (lbf) • A〇 = cross-sectional area of the top load plate (in square inches • d = displacement of the top load plate • L 〇 = initial sample thickness (inches) -21 - (19) 1284582 Record the stress of each sample at -Ο·05 unit strain. Calculate the average and standard deviation of 6 samples, The in-belt inhomogeneity (WIBNU) is calculated by dividing the standard deviation by the average deviation and multiplying by 100%. The stress/strain WIBNU of the polishing pad is preferably about 35% or less. The stress/strain of the polishing pad WIBNU More preferably, it is about 3% by weight or less. The stress/strain WIBNU of the polishing pad is more preferably about 25% or less. The stress/strain WIBNU of the polishing pad is more preferably about 20% or less. Stress/strain WIBNU More preferably, it is about 15% or less. The stress/strain WIBNU of the polishing pad is preferably about 1% or less. As described above, although it is generally desired to produce a polishing pad having substantially uniform compressibility, it is not This is always the case. Sometimes it is desirable to produce a polishing pad with predictable uneven compressibility. For example, it may be desirable to make a pad that is thicker and has a thinner portion of the various portions of the polishing pad. And including some of the thinner portions and other portions of the thicker polishing layer. However, it is more preferred that the polishing layer 4 penetrates into the uneven bottom pad 3 to a uniform depth (measured by the surface of the bottom pad, rather than by a flat Bottom measurement). The present invention will make such a customized shape more precise and consistent. Deliberately changing the compressibility of the polishing pad can achieve the desired mixing polishing performance 'for example, from the center to the edge of the wafer. In other words, the invention is not limited to a flat, rectangular bottom pad. The PVF of the polishing pad can be measured by dividing the penetration depth by the average thickness of the bottom pad, preferably corresponding to the above amplitude. In the method of the invention, a seamless polishing pad can be prepared by the following steps: (a) providing a porous underpad, (b) applying a barrier layer to the underpad, and (c) coating with a hardenable fluid The underlayer of the barrier layer is coated to form a -22-(20) 1284582 seamless polishing layer. The seamless polishing pad can also be provided by (a) providing the substrate by the following steps, and (b) providing the porous material A bottom pad is adhered to the substrate, (c) a layer is applied to the bottom pad', and (d) the early layer of the bottom layer is coated with a hardenable fluid to form a seamless polishing layer. The following steps can also be prepared: (a) providing a porous bottom pad, (b) applying a barrier layer to the bottom pad, and (c) bonding the underlying pad of the coated barrier layer to the substrate, (d) The bottom layer of the coated barrier layer is coated with a hardenable fluid to form a slit polishing layer. The seamless polishing pad can also be prepared by providing the porous bottom pad, (b) applying a barrier layer to the bottom pad, and (c) coating the bottom layer of the coated barrier with a fluidized fluid. To form a seamless polishing and (d) to adhere the bottom layer coated with the polishing layer and the barrier layer to the substrate. A polishing pad ("the polishing pad") commissioned according to one of the above methods comprises a polishing layer which penetrates into the depth of the porous substrate to penetrate the depth of the polishing layer into a pad made of the same material according to the same method. More uniform, but the step of applying a barrier layer ("the same light pad but no barrier layer") is dispensed with. The degree of improvement in penetration depth uniformity is measured by the following steps: (a) the PVF of the polishing layer of the polishing pad of the present invention minus the same polishing pad but without the barrier layer, and (b) The resulting result is divided by the PVF of the same polishing pad but the polished layer of the barrier layer. The degree of improvement of the polishing layer of the polishing pad of the present invention is preferably about 1% or more. The degree of improvement of the PVF of the polishing pad of the present invention is more preferably about 30% or more. The polishing layer of the polishing pad has a PVF improvement of more than about 50%. The improvement of the pvf of the polishing layer of the polishing pad of the present invention: the barrier barrier is applied and not connected. (a) The hard layer can be polished, and the polishing pad of the invention pad can be infiltrated by the permeable layer containing PVF. Equal to ^ 23 - (21) 1284582 is preferably greater than or equal to about 7 〇%. The degree of improvement of the PV F of the polishing layer of the polishing pad of the present invention is more preferably about 9 大于 % or more. The degree of improvement of the PVF of the polishing layer of the polishing pad of the present invention is preferably about 99% or more. A polishing pad (" polishing pad of the present invention") prepared according to the method of the present invention generally has improved uniformity of compressibility compared to a polishing pad made of the same material according to the same method, and the step (b) is omitted. ("The same polishing pad but no barrier layer"). The degree of improvement in the uniformity of compressibility can be prepared by the following steps: (a) subtracting the hardness meter WIBNU of the same polishing pad without the barrier layer from the hardness tester WIBNU of the polishing pad of the present invention, and (b) The result is divided by the hardness tester WIBNU of the polishing pad without the barrier layer. The degree of improvement of the hardness tester WIBNU of the polishing pad of the present invention is preferably greater than about λ by about 5%. The degree of improvement of the hardness meter WI B N U of the polishing pad of the present invention is more than about 15%. The hardness of the polishing pad of the present invention, WIBNU, is more preferably about 30 or more. . The degree of improvement of the hardness meter WIBNU of the polishing pad of the present invention is more preferably about 45% or more. The degree of improvement of the hardness meter W I B N U of the polishing pad of the present invention is more preferably about 55% or more. The degree of improvement of the hardness meter WIBNU of the polishing pad of the present invention is preferably about 65% or more. The degree of improvement in uniformity of compressibility can also be measured by the following steps: (a) subtracting the stress/strain WIBNU of the same polishing pad without the barrier layer from the stress/strain WIBNU of the polishing pad of the present invention, and ( b) Dividing the results obtained by the stress/strain W1BNU of the polishing pad without the barrier layer. The degree of improvement of the stress/strain WIBNU of the polishing pad of the present invention is preferably greater than or equal to about 10 ° /. . The stress/strain WIBNU of the polishing pad of the present invention is improved by -24 - (22) 1284582. The degree is more preferably about 25% or more. The degree of improvement of the stress/strain WIBNU of the polishing pad of the present invention is more preferably about 40% or more. The degree of improvement of the stress/strain WIBNU of the polishing pad of the present invention is more preferably greater than about 55 %. The degree of improvement of the stress/strain w I B N U of the polishing pad of the present invention is more preferably about 70% or more. The degree of improvement of the stress/strain WIBNU of the polishing pad of the present invention is preferably about 85% or more. Example 1 A polishing belt was produced by casting a polyurethane on a commercially available underlay material which was stacked on a seamless stainless steel belt. The seamless stainless steel strip (substrate 1) is about 94 inches long, 13 inches wide, and 0.02 inches thick. The seamless stainless steel belt in this embodiment was obtained from Belt T e h c η ο 1 〇 g i e s (A g a w a m, M A ). The bottom pad 3 in this embodiment was obtained from Thomas West Company (Sunny vale, CA). The bottom pad is marketed at 8 1 7 . This material is a yellow, non-woven material impregnated with a soft, elastic composition. The underpad material is porous and compressible despite impregnation. One of the bottom pad materials is laminated with a rubber-based pressure-sensitive adhesive. The resulting bottom pad is a rectangular block that is approximately 12 inches wide and 3 1 · 25 inches long. The bottom pad together with the adhesive has a thickness of about 0.028 inches, wherein the underlayer is about 0.022 inches thick and the adhesive layer is about 0.006 inches thick. Three bottom pads were attached to the outer surface of the non-mirror steel strip using the adhesive underlayer (adhesive 2). The underpad is placed approximately centered between the edges of the stainless steel, leaving approximately 5 inches of exposed steel along both sides. If necessary, place and trim the three bottom -25- (23) 1284582 pads between the ends of the sheets. 〇 3 to ο . 〇 6 inches clearance. Place the stainless steel and bottom pad laminate on the inside edge of the cylindrical mold. The mold system is constructed as a two concentric cylinder on the substrate. The top end of the mold is opened, and the injection portion is passed up through the substrate. The temperature required to mold the mold containing the stainless steel and the backing laminate to the mold was preheated in an oven. Once the mold has reached the desired temperature, immediately inject the hardenable fluid - polyfe-based formic acid vinegar (available from Crompton, Inc., \4 iddlebury, CT, AD IP RENE ® LF 7 5 0 0) and diamine hardener ( A mixture of Ethacure 3 00 (E3 0 0) manufactured by Albemarle (Bat ο n R ouge, LA). Moulding and hardening conditions, including the amount of hardener, force completion temperature and processing time, follow Crompton The company provides guidelines for the LF 7 5 0D and E3 00 product data sheets. The polishing layer 4 will cure within a few minutes after the mold is filled. After about 1 〇 to 15 minutes, the parts are removed from the mold and placed in an oven to complete the hardening process. After the part is completely hardened, the oven is removed and cooled to room temperature for further processing through a series of secondary operations required to trim the part to the desired final size. The resulting polishing belt has grooves and Buffered superficially seamless polishing layer. The entire thickness is 0.085 to 0.091 inches, including a polishing layer with a thickness of 0.03 7 to 0.043 inches. Cut the finished belt into small pieces and use different small pieces for qualitative The separation test is used to measure the penetration depth and is used to generate compressive stress-strain data. The qualitative peel test indicates that the bond between the polishing layer and the bottom pad is extremely strong; the polishing layer cannot be peeled off from the bottom pad without damaging the agglomeration of the bottom pad itself. 26 - (24) 1284582 Penetration depth measurement by checking the cross section at each of four different positions around the length of the belt at approximately 90 degrees, taking 1 position across the width of the belt Therefore, a total of 4 different positions were inspected. Each sample block was about 0.5 inches long. The depth of the polishing material penetrated into the underlayer was measured with a microscope and caliper set at 30x magnification because there was a large amount of variation in each sample. Therefore, the maximum and minimum penetration depth of each of the 44 sample blocks was recorded, resulting in a total of 8 8 measured enthalpy. The maximum and minimum measurement enthalpies of each sample were averaged to obtain a representative penetration depth 每个 for each sample. The maximum penetration rate is determined by arranging 44 representative numbers from the largest to the smallest, and then rejecting the highest 2.5% and the lowest 2 · 5 % of the number, and then determining the effective penetration range. This step will eliminate 1 highest number and 1 lowest number, leaving 42 numbers to determine the effective penetration. Once the effective penetration is determined, the effective penetration can be divided by the bottom. The permeation variation factor is calculated by the average thickness of the underlayer. The variation factor of the sample with large variation in penetration depth is larger, and the variation factor of the sample with more uniform penetration depth is smaller. The permeability variation factor of the belt in this example (PV F ) 66%. The durometer was measured with a 2 x 2 inch sample cut from the belt. Four samples were cut from the 3 inch wide portion of the top edge of the belt and four samples were cut from the 3 inch wide portion of the bottom edge of the belt. This sample was placed 2 to inches along each edge compartment. The top refers to the edge of the top end of the mold during casting and the bottom refers to the edge of the belt at the bottom of the mold during casting. The durometer was measured using the S h 〇 r e C specification manufactured by Rex G a u g e. Each 2x2 inch sample was measured 5 times, each time a spike was recorded. Therefore, in the present example -27 - (25) 1284582, a total of 4 data points are recorded for the belt. Calculate the mean deviation and standard deviation of 40 S h o r e C measurements ,, then multiply the standard deviation by 6 times and then divide by the average to calculate the in-band non-uniformity (W IB N U). The belt in this example is measured with a peak Shore C hardness tester to obtain WIBNU (6s) = 9·90/〇. Six 2 x 2 inch samples were additionally cut from the belt for compression testing. Three samples were taken near the top edge and three were taken from the bottom edge of the belt. The compressive stress-strain data for each sample was generated using the following experimental conditions. Each sample was tested for compression with the stainless steel side of the sample facing down on a 6-inch diameter stationary plate and the upper surface of the sample was recessed into a 0.5-inch diameter load plate. The test was carried out on an MTS 2/G test machine equipped with a 10 kN load cell. The experiment was carried out under displacement control of a fixed displacement rate of 0·0 10 inches/minute. During the experiment, each sample was compressed to a predetermined displacement and then the load was removed. The force and displacement of the upper load cell are recorded as a function of time. The forces and displacements are then converted to engineering stresses and strains by the following equation:

FI 丨· , 10,000 , • F = applied force (lbf) • A 〇 = cross-sectional area of the top load plate (in square inches) • d = displacement of the top load plate • LG = initial sample thickness (inches) - 28 - (26) 1284582 Record the stress of each sample at -0.05 unit strain. The average and standard deviation of the 6 samples were calculated, and the in-belt inhomogeneity (W IB N U) was calculated by dividing the standard deviation by the average deviation and multiplying by 100%. The belt in the present embodiment was obtained as 〇 〇 I 5 unit strain at w I B N U (1 s) = 37%. The above measurement 値 indicates that the polishing material unevenly penetrates into the underlayer to cause variable compressibility and durometer measurement. Furthermore, other properties can be inferred in a logical manner, such as dynamic mechanical properties, and the points around the belt are also different, resulting in a non-uniform cross section. Example 2 The method of Example 1 was repeated using different non-woven materials as the underpad 3. In the present embodiment, a non-woven material called .AQUILINETM and manufactured by TEXON International (Leicester, England) was laminated on the side containing the same rubber-based pressure-sensitive adhesive 2 used in Example 1. Aquilinetm materials contain non-woven polyester fibers and impregnated materials that are far less than Thonias West's 8]7 materials. When the two different underpad materials were compared using a microscope or SEM, the AQUILINEtm material showed much more open cell structure and a higher degree of porosity than the 817 material. Cut the AQUILINETM bottom pad into rectangular blocks approximately 12 inches wide and 31.25 inches long. The bottom pad together with the adhesive has a thickness of about 0.038 inches, wherein the bottom layer is about 0.032 inches thick and the adhesive layer is about 6 inches thick. Next, the bottom mat was laminated to the stainless steel strip substrate 1 in the same manner as described in Example 1, a mold was prepared, the polishing layer 4 was cast, and a polishing belt was formed. The entire thickness is 0.085 to 0.091 inches, which includes a polishing layer having a thickness of 〇27 ‘ >29-1284582' (27) to 0.03 3 inches. Cutting the finished belt and performing the same test as described in Example 1 for the different sample numbers and techniques mentioned below. The bismuth peel test indicates that the bond between the polishing layer and the bottom pad is extremely strong; the polishing layer cannot be bottomed. The mat is peeled off without damaging the agglomeration of the underpad itself. Penetration depth measurements were made at 77 different locations around the belt, taking 1 position across the width of the belt at 7 different locations around the length of the belt. The depth of penetration observed here in each 0.5 inch long sample was more uniform than that observed in Example 1, so that only one representative permeation measurement was recorded per sample and only one representative permeation measurement was recorded. In this embodiment, a total of 4 points are discarded to determine the effective penetration amplitude. The belt in this example had a vPVF of 91%. A durometer measurement 値 (8 sample) and a compressive stress strain measurement 値 (6 sample) were obtained in the same manner as described in Example 1. The belt in this example will measure the WIB N (6 s ) = 1 5 ° / 〇 and - 0 · 0 5 unit strain of the stress of the peak S h 〇 r e C hardness tester WIBNU (1 s) = 83%. The above measurement indicates that the polishing material unevenly penetrates into the underlayer and causes variable compressibility and durometer measurement. In addition, other properties, such as dynamic mechanical properties, can be inferred in a logical manner, and the points around the belt are also different, resulting in a non-uniform cross section. The variability here is greater than that of Example 1. [Embodiment 3] In the present embodiment, the method of Example 2 was repeated except that the barrier layer 5-30-(28) 1284582· was applied to the AQUILINETM undercus material before casting the polishing layer 4. Before the pressure-sensitive adhesive is deposited on the other side of the non-woven material, the polyurethane adhesive composition (D 2 5 9 6 Η adhesive and D2 5 9 7 cross-linked) is firstly treated by a roll doctor technique. The agent is applied to the side of the non-woven material to obtain a barrier layer. The barrier layer material forms an extremely thin film on the upper surface of the non-woven material, mating with the texture and topography of the non-woven material and substantially sealing the upper surface of the underlayer. The qualitative peel test, the penetration test, the hardness test and the compression test use only one belt. Other polishing belts were prepared in the same manner for the stacking integrity of the belt roller unit illustrated in Figure 5. The qualitative peel test indicates that the bond between the polishing layer and the bottom pad is extremely strong; the polishing layer cannot be peeled off from the bottom pad without damaging the agglomeration of the bottom pad itself. Further, a plurality of belts such as the 'this embodiment are operated on the belt roller device, as exemplified in Fig. 5, to check the integrity of the stack under dynamic and wet conditions. The belt runs at approximately 300 feet per minute on a roller of approximately 12 inches in diameter (100, 1 1). At the same time, by the urethane roller, weigh about 125 pounds, located above one of the rollers (10), continuously running through the belt to create a clamping force, continuously pressing the surface of the polishing belt . The contact area of the upper roller and the upper surface of the belt was about 12 inches by 0.25 inches, whereby the applied pressure was about 40 p si. The water is poured over the entire width of the belt at a rate of about 1 liter per minute. After 6 hours of operation, the polishing belt did not show signs of delamination, i.e., no visible gaps were formed between the layers of the belt. The depth of the polishing layer 4 and the barrier layer 5 infiltrated into the underpad 3 was measured as described in Example 1, and P V F was calculated. The polishing layer 4 does not penetrate the barrier layer 5 -31 - (29) 1284582. The barrier layer 5 contains a uniform penetration depth between about 〇 〇 〇 2 and about 〇 〇 〇 4 inches. In other words, the polishing layer has a ρ V F of less than about 1%, and the barrier layer has a PVF of about 6%. Figures 6 and 6a illustrate substantially uniform osmotic enthalpy degrees. Figures 6 and 6a show a scanning electron microscope (S E Μ) photograph of a representative cross section of the polishing belt. The durometer measurement 値 (8 samples '5 measurements per sample) and compressive stress strain measurement 6 (6 samples) were obtained in the same manner as described in Example 1. The belt in this example will measure the WIBNU (6s) = 11% of the peak Shore C hardness tester and the WIBNU (ls) = 11% of the stress of -0.05 unit strain. The polishing pad of the barrier layer 5 of the present embodiment has improved uniformity compared to the polishing pad of Embodiment 2 without the barrier layer 5, but the polishing pad of Embodiment 2 is not polished by the same material and according to the present embodiment. The pad is made in the same way. In other words, the PVF of the polishing layer 4 is improved by at least about 99% [(91-1)/91] (note that if the PVF of the barrier layer 5 is improved by at least about 93% compared to Example 2 [(9b6)/ 91]), the peak 311 〇 "(: hardness tester \ ^ 181 ^ 11 improved by at least about 6 7% [(15-5) / 15], -0.05 unit strain of stress WIBNU improvement of at least about 87% [(83 -1 1)/83] In addition, other properties, such as dynamic mechanical properties, can be inferred in a logical manner, and the belts of the present embodiment are more uniform around the belt as compared with the polishing belts of Examples 1 and 2. It is noted that such an increase in uniformity is achieved while maintaining the desired adhesion between the polishing layer 4 and the underpad 3. Example 4 - 32 - (30) 1284582 The same material is used and illustrated in accordance with Example 3. The same method is used to prepare the densely saturated underpad material, except for the following. In this embodiment, the AQUILINETM underpad 3 is passed through a bath containing the same barrier layer to densely mount the barrier layer material. The bottom pad of the barrier layer is first hardened by the HLI which clamps the roller and stacks the rubber adhesive on one side of the bottom. Although the barrier layer 5 Enter the entire thickness of the bottom pad, but the bottom pad is still porous and more compressible than the solid material. It is believed that the bottom pad will expand and become porous when the pinch roll is exposed. However, the barrier layer 5 can still prevent the polishing layer 4 from penetrating into the bottom pad 3. If the PVF and WIBNU are measured according to the method in Embodiment 3, it is expected that the PVF of the polishing layer 4 and the barrier layer 5 will be less than about 1%, and the peak Shore C hardness tester The WIBNU of the stress of the WIBNU and -0·05 unit strains will be less than about 5% and less than about 10%, respectively. In other words, it is expected that the polishing pad of the barrier layer 5 of the present embodiment has no polishing barrier ratio 5 The polishing pad of Example 2 has improved uniformity, but the polishing pad of Example 2 is not made of the same material and according to the same method of the polishing pad of the present embodiment. In other words, it is expected that the polishing layer 4 has a PVF improvement of at least about 9. 9 % (the improvement is at least about 9 9 % based on the PVF of barrier layer 5), the peak S h 〇re C hardness tester WIBNU is improved by at least about 67%, and the stress at -5 单位5 unit strain The WI BNU is improved by at least about 8 8 %. Embodiment 5 The method of Embodiment 1 is repeated, but this embodiment Except that the barrier layer 5 is applied to the underpad 3 before casting the polishing layer 4. In other words, a thin layer of the acrylic adhesive, Cheml ok® 213, is uniformly brushed before the casting of -33-(31) 1284582. Applying to the surface of the underpad for about 30 minutes. The bottom pad 5 penetrates the bottom pad 3 to a depth of from about 0.001 inches to about 0.002 inches. The polishing layer 4 does not penetrate the barrier layer into the underpad. The polishing layer cannot be separated from the underlying layer without damaging the agglomeration of the underlying pad. The PVF of the barrier layer is about 4.5%. If PVF and WIBNU are measured by the method of Example 3, it is expected that the PVF of the polishing layer 4 and the barrier layer 5 will be less than about 1% and less than about 5°/, respectively. And the WI B N U of the WIBNU and -0.05 unit strain stress of the spike Shore C durometer will be less than about 5% and less than about 10%, respectively. In other words, it is expected that the polishing pad of the barrier layer 5 of the present embodiment has improved uniformity than the polishing pad of Embodiment 1 without the barrier layer 5: but the polishing pad of Embodiment 1 is not made by the same phase. The material was produced in the same manner as the polishing pad of the present embodiment. In other words, it is expected that the PVF of the polishing layer 4 is improved by at least about 9% (while the improvement is at least about 99% based on the PVF of the barrier layer 5), and the peak S h 〇re C hardness tester WIBNU is improved by at least about 5 The WIBNU improvement of the stress at 0 %, - 0 · 0 5 unit strain is at least about 70%. Example 6 A bottom sheet material similar to that described in Example 1 was obtained from Thomas West Co., Ltd. (S u η n y v a 1 e, C A) to obtain a rectangular sheet of 8 1 7 underlay material. However, in addition to the rubber-based pressure-sensitive adhesive applied to the bottom surface, these bottom pads are applied to the upper surface as a barrier layer 5 with a pressure-sensitive adhesive (PSA). The PSA on the upper surface is used for the lining of the 8 1 7 mat to the polyurethane polishing pad, such as the IC available from R 〇 de 1 (N ea 1· k, DE)] 0 0 0 Polishing pad - 34 - (32) 1284582 'Double-sided tape. The bottom pad 3 was fixed to the stainless steel tape substrate I, and the cast polishing layer 4' was dedicated to the manufacture of the finished polishing belt described in Example 1. However, sometimes the polishing layer 4, the underlying pad 3 and the barrier layer 5 are easily delaminated from each other during mechanical removal, or sometimes during actual use, which makes the double-sided tape uncomfortable. Used as a barrier layer 5' for use with other components of the polishing pad. EXAMPLE 7 This example will illustrate the use of five different polyurethane emulsions as barrier layer 5. Different emulsions, W-240, W-253, W-290 and W-5 05, all taken from CW Itc 〇 (G reenwich, CT), were manually applied to individual 4 x 12 inch bottom pads 3 (817 of Example 1) and dried overnight in an oven. The barrier layer 5 substantially matches the surface topography of the bottom pad 3. Then, the same urethane polishing layer 4 used in Example 1 was poured on the bottom pad of each of the applied barrier layers to harden the polishing layer 4. Each polishing pad member is made to resist delamination firmly. Check the penetration of each polished crucible. In each of the polishing crucibles, the polishing layer 4 penetrates into the barrier layer 5, but does not exceed. In the polishing pad made of w - 2 4 0 emulsion, the polishing layer 4 will penetrate into the bottom pad 3 to reach about 〇 〇 〇 1 to about 〇 〇 〇 3 inches depth variation. In the polishing pad made of W - 2 5 3, W - 2 90 and W - 5 0 5 emulsion, the polishing layer 4 penetrates into the bottom pad 3 to reach about 〇. 〇 至1 to about 〇. 〇 〇 2 inch depth variation. Example 8 - 35 - (33) 1284582 This example will explain the use of the barrier layer 5 applied as a mixture of a reactive molecule and a reaction initiator for the reactive molecule. The urethane prepolymer (ADIPRENE® L100) and the block hardened UCAYTUR® 31), both obtained from Crompton (Middlebury, CT), mixed together, then 4 X 12 inch AQUILINETM bottom pad 3 on. The mixture was machined into the bottom pad using a heavy steel roll bar. The same hardenable fluid used in Example 1 was poured over the bottom pad of the coated barrier layer and placed in an oven to initiate and complete the hardening procedure. Cut the last piece and check the penetration. None of the polishing layer 4 penetrates the barrier layer 5, and the barrier layer itself permeates to a range of 0.015 to 0.020 inches. The adhesion between the layers is extremely good. Example 9 An entire belt was first prepared by impregnating the composition of the prepolymer and the hardener with a base pad of 181, and the composition of the prepolymer and the hardener was formulated to have a hardness of 30 shore A. The 30A formulation was mixed and manually applied to the bottom pad after the bottom pad had been secured to the stainless steel strip. Catalyze the 30 A formulation to harden it in the oven for a short time. Once the material was converted to a solid, the polishing layer was cast according to the method of Example]. The final belt has a 3 〇 A barrier layer that penetrates 100% into the bottom pad. This is consistent at all locations around the belt. No penetration amplitude is interpreted as no variation factor. Example 1 〇 A spray pad was used to act as a barrier layer to make a smaller pad -36 - (34) 1284582 sub-and the entire belt. A thin and thick spray urethane coating acts as a barrier layer and exhibits an effect and blocks the polishing layer from penetrating into the underpad. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a polishing pad, illustrating the problem that the polishing layer does not uniformly penetrate into the bottom pad; Fig. a is another cross-sectional view of the polishing pad, indicating that the polishing layer does not uniformly penetrate into the bottom pad 2 is a cross-sectional view of a polishing pad of the present invention; FIG. 3 is a cross-sectional view of another polishing pad embodiment of the present invention; and FIG. 4 is a cross-sectional view of another polishing pad embodiment of the present invention. Figure 4a is a cross-sectional view of another polishing pad embodiment of the present invention; Figure 5 illustrates a belt roller apparatus that can be used to test the delamination resistance of a polishing belt; and Figure 6 illustrates a scanning type of a polishing pad cross section of the present invention. Electron Microscope (SEM) photograph; Figure 6a illustrates a scanning electron microscope (SE Μ) photograph of the cross section of the polishing pad of the present invention. Component comparison table 1 Substrate 2 Adhesive 3 Porous bottom pad 4 Polished layer -37 - (35) 1284582 5 Barrier layer 5 Polishing belt/pad 6 Circulating pump 7 Water 8 Pressure roller 9 Drip multi-head tube 10 Tension roller 11 drive roller -38-

Claims (1)

1284582 (1) Picking up, patent application scope Attachment 2A: Patent application No. 92 1 1 5743 Patent application scope Replacement of the Republic of China 95 January 1 π day correction 1. A seamless polishing pad comprising: a porous underlayer (3) comprising a seamless polishing layer (4), wherein the polishing layer is a hardenable fluid cast on the underlayer, the hardenable fluid infiltrating the underlayer to substantially uniform The depth of the belt, and the in-belt non-uniformity of the cushion compressibility measured by the durometer is less than 10%. 2. The seamless polishing pad of claim 1, wherein the seamless polishing layer (4) is a hardenable fluid comprising at least one reactive molecule and at least one anti-initiator. 3. The seamless polishing pad of claim 1, wherein the seamless polishing layer (4) is a hardenable fluid comprising a polymer dissolved in a solvent. 4. The seamless polishing pad of claim 1, wherein the seamless polishing layer (4) is cast on the bottom pad (3) and hardened. 5. A method of manufacturing a seamless polishing pad, comprising: providing a porous underlayer (3); and disposing a seamless polishing layer (4) thereon, wherein the seamless polishing layer (4) The porous underlayer (3) is infiltrated to a substantially uniform depth. 6. The method of manufacturing a seamless polishing pad according to claim 5, further comprising: placing a barrier layer (5) on the seamless polishing layer (4) and the underlayer (3) 1284582 (2) The gap between the barrier layer (5) and the seamless polishing layer (4) penetrates into the underlayer to a substantially uniform depth. 7. The method of manufacturing a seamless polishing pad according to claim 5, wherein the seamless polishing layer (4) is coated or cast on the underlayer (3). A method of manufacturing a seamless polishing pad according to item 6 wherein the seamless polishing layer (4) is cast on the barrier layer (5). 9. The method of manufacturing a seamless polishing pad according to claim 5, further comprising: placing the underlayer (3) in a mold, and the underlayer (3) may be configured to have a resistance a barrier layer (5); and heating the mold to a predetermined temperature and casting the hardenable fluid onto the bottom pad (3) or the barrier layer (5) via the top opening or through the injection portion A polishing layer (3) is formed which penetrates the underlayer (3) to a substantially uniform depth. 10. A method of manufacturing a seamless polishing pad, comprising: stacking a backing layer (3) on an outwardly facing surface of a seamless stainless steel strip (5) to form a laminate; placing the laminate a cylindrical mold having an injection portion and heating the mold to a predetermined temperature; injecting a hardenable fluid into the mold and casting the fluid onto the underlayer (3), thereby forming a penetration into the underlayer ( 3) A polishing layer (4) of substantially uniform depth. 1 1 . The method of manufacturing a seamless polishing pad according to claim 10, the method of -2-1284582 (3), wherein the underlayer (3) is a non-woven fabric. 12. The method of manufacturing a seamless polishing pad according to claim 1, further comprising: placing a barrier layer (5) on the underlayer (3) before casting the polishing layer (4) Between the polishing layer (4) and the polishing layer (4). 1 3 . The manufacturer of the seamless polishing pad according to claim 11 wherein the barrier layer (5) is a polyurethane adhesive composition applied by a roll doctor technique. 14. The manufacturer of the seamless polishing pad according to the first aspect of the patent application, wherein the hardenable fluid is a mixture of a polyurethane resin and a diamine hardener.