TWI821561B - Chemical-mechanical polishing pad with textured platen adhesive and an affixing method thereof - Google Patents

Chemical-mechanical polishing pad with textured platen adhesive and an affixing method thereof Download PDF

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TWI821561B
TWI821561B TW109114682A TW109114682A TWI821561B TW I821561 B TWI821561 B TW I821561B TW 109114682 A TW109114682 A TW 109114682A TW 109114682 A TW109114682 A TW 109114682A TW I821561 B TWI821561 B TW I821561B
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Taiwan
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polishing pad
pad
adhesive
polishing
layer
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TW109114682A
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Chinese (zh)
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TW202102337A (en
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保羅 安德里 萊夫芮
傑森 茱伊特
艾瑞克 艾肯貝姆
霍蘭德 霍奇斯
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美商Cmc材料股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A chemical-mechanical polishing pad comprising a removable platen adhesive comprising a textured surface. A method of using the polishing pad to eliminate or reduce the occurrence of spot balding on the surface of the polishing pad.

Description

具有紋理化之平板黏著劑之化學機械研磨墊及貼附彼之方法 Chemical mechanical polishing pad with textured plate adhesive and method of attaching same

本發明係關於一種化學機械研磨墊及一種將該化學機械研磨墊貼附至平板表面之方法。 The present invention relates to a chemical mechanical polishing pad and a method of attaching the chemical mechanical polishing pad to a flat surface.

積體電路通常藉由將導電層、半導體層或絕緣層依序沈積於矽晶圓上而形成於基板上。多種製造過程需要對基板上之層進行平坦化。例如,對於某些應用,例如研磨金屬層以在圖案化層之溝槽中形成通孔、插塞及線,對覆蓋層進行平坦化直至圖案化層之頂部表面暴露。在其他應用中,例如平坦化用於光微影之介電層,研磨覆蓋層直至在底層上方保持所需厚度。化學機械研磨(CMP)為一種可接受之平坦化方法。此平坦化方法通常需要將基板安裝於載具頭(carrier head)上。通常將基板之暴露表面抵靠旋轉研磨墊置放。載具頭在基板上提供可控制負載以將其推向研磨墊。通常將研磨液體,諸如具有研磨粒子之漿料供應至研磨墊之表面。 Integrated circuits are typically formed on a substrate by sequentially depositing conductive, semiconductor, or insulating layers on a silicon wafer. Various manufacturing processes require planarization of layers on a substrate. For example, for some applications, such as grinding a metal layer to form vias, plugs, and lines in trenches of a patterned layer, the overlay is planarized until the top surface of the patterned layer is exposed. In other applications, such as planarizing dielectric layers for photolithography, the overlay is polished until the desired thickness is maintained above the underlying layer. Chemical mechanical polishing (CMP) is an acceptable planarization method. This planarization method usually requires mounting the substrate on a carrier head. Typically the exposed surface of the substrate is placed against a rotating polishing pad. The carrier head provides a controllable load on the substrate to push it toward the polishing pad. A polishing liquid, such as a slurry with polishing particles, is typically supplied to the surface of the polishing pad.

研磨墊通常藉由擠壓、模製、澆鑄或燒結聚胺基甲酸酯材料製成。在模製之情況下,例如藉由射出模製可一次製得一個研磨墊。在澆鑄之情況下,澆鑄液體前驅體且將其固化成餅狀物,隨後將其切成獨立墊片。此等墊片接著可機械加工至最終厚度。凹槽可機械加工於研磨表面中或可形成為射出模製製程之部分。Polishing pads are typically made from extruded, molded, cast or sintered polyurethane materials. In the case of molding, one polishing pad can be produced at a time, for example by injection molding. In the case of casting, the liquid precursor is cast and solidified into a cake, which is then cut into individual gaskets. These gaskets can then be machined to final thickness. Grooves can be machined into the abrasive surface or can be formed as part of the injection molding process.

研磨墊可為多層或堆疊墊。多層墊可具有黏著至剛性層或直接黏著至下墊層或基層之研磨墊層。使用黏著劑,通常諸如熱熔黏著劑之永久性黏著劑將研磨層與剛性層或下墊層黏著在一起。剛性層或下墊層具有與黏著至研磨層或堆疊之表面相對之表面,且此表面通常具有用於將墊黏著至研磨工具之平板之黏著劑。此平板黏著劑相對於平板之表面及下墊層之表面通常為臨時或可移除式黏著劑。臨時黏著劑之組成為重要的考慮因素,因為黏著劑必須在研磨漿料中之化學物質及所產生之熱可能使黏著劑降解之研磨製程期間保持研磨墊固定於平板。臨時黏著劑亦必須允許在一定數目之研磨步驟之後仍容易移除磨損墊。Polishing pads can be multi-layered or stacked pads. Multilayer pads may have an abrasive pad layer adhered to a rigid layer or directly adhered to an underlying layer or base layer. An adhesive, usually a permanent adhesive such as a hot melt adhesive, is used to bond the abrasive layer to the rigid layer or underlying layer. The rigid layer or underlying layer has a surface opposite the surface that adheres to the abrasive layer or stack, and this surface typically has an adhesive for adhering the pad to the flat plate of the abrasive tool. The plate adhesive is usually a temporary or removable adhesive relative to the surface of the plate and the surface of the underlying layer. The composition of the temporary adhesive is an important consideration because the adhesive must keep the polishing pad fixed to the plate during the polishing process where the chemicals in the polishing slurry and the heat generated may degrade the adhesive. The temporary adhesive must also allow easy removal of the wear pad after a certain number of grinding steps.

在研磨製程期間調節研磨墊之研磨表面。調節或修整對維持恆定研磨表面之均一研磨效能至關重要。在研磨製程期間,研磨層之研磨表面磨損,形成釉面或缺乏微紋理之非所需光滑表面。調節步驟通常藉由以下操作來達成:用下壓力在整個墊之研磨表面上拖動調節盤,從而以機械方式研磨墊表面,藉此移除碎屑且形成微紋理。調節盤通常具有由內嵌金剛石粒子構成之表面,該等粒子切割墊表面以產生微突點且更新研磨紋理。此調節過程係必需的,但會因自表面移除墊材料而縮短墊壽命。由於調節過程自研磨表面研磨材料,且墊材料研磨與下壓力成比例,所以墊相對於平板表面之高度差異將在整個研磨層之表面產生不均勻研磨。因此,需要高度或平坦度之均一性以達成整個墊表面之均一磨損。Adjust the polishing surface of the polishing pad during the polishing process. Adjustment or dressing is essential to maintain uniform grinding performance on a constant grinding surface. During the grinding process, the grinding surface of the grinding layer wears away, forming a glaze or an undesirably smooth surface lacking micro-texture. The conditioning step is typically accomplished by mechanically abrading the pad surface by dragging a conditioning disc across the pad's abrasive surface with downward pressure, thereby removing debris and creating microtexture. The dial typically has a surface made of embedded diamond particles that cut into the pad surface to create micro-protrusions and renew the abrasive texture. This conditioning process is necessary but shortens pad life by removing pad material from the surface. Since the adjustment process abrades the material from the grinding surface, and the pad material grinding is proportional to the downforce, the height difference of the pad relative to the flat surface will produce uneven grinding on the surface of the entire grinding layer. Therefore, uniformity of height or flatness is required to achieve uniform wear across the entire pad surface.

多層研磨墊之剛性層可為堆疊墊中之中間層或最底層。替代地,下墊層可為最底層。在任一情況下,研磨墊設計將有所變化且將經設計以解決研磨製程需求。例如,剛性層或下墊層可視研磨需求而在可壓縮性及硬度方面變化。具有黏著至硬剛性層或下墊層之較軟研磨層之研磨墊為此項技術中所熟知。另外,具有較軟、較易壓縮之下墊層之研磨墊亦為已知的且對於某些研磨程序具有優勢。本發明人已觀測到,較軟、較易壓縮之下墊層可能在墊黏著至平板表面時難以使其完全平坦。因此,需要發現一種具有較軟、較難壓縮之背襯層之改良研磨墊,其將容易地黏著至平板表面且為平坦的。The rigid layer of a multi-layer polishing pad can be the middle layer or the lowest layer in the stacked pads. Alternatively, the underlying layer may be the bottom layer. In either case, the polishing pad design will vary and will be designed to address the polishing process needs. For example, the rigid layer or underlying layer may vary in compressibility and hardness depending on grinding requirements. Polishing pads having a softer polishing layer adhered to a hard rigid layer or an underlying layer are well known in the art. Additionally, polishing pads with softer, more compressible underlying layers are also known and may be advantageous for certain polishing procedures. The inventors have observed that softer, more compressible pads may have difficulty keeping the pad completely flat as it adheres to the flat surface. Therefore, there is a need to find an improved polishing pad with a softer, less compressible backing layer that will adhere easily to the flat surface and be flat.

本發明提供一種包含可移除式平板黏著劑之研磨墊,其中該黏著劑具有紋理化表面。本發明亦提供一種包含具有研磨表面及與研磨表面相對之背面之研磨墊主體的化學機械研磨墊,其中可移除式平板黏著劑固定至背面,該平板黏著劑具有紋理化表面。The present invention provides a polishing pad including a removable flat adhesive, wherein the adhesive has a textured surface. The present invention also provides a chemical mechanical polishing pad including a polishing pad body having a polishing surface and a backside opposite the polishing surface, wherein a removable plate adhesive is secured to the backside, the plate adhesive having a textured surface.

本發明進一步提供一種包含附著至背襯層之研磨層的研磨墊,該研磨層具有研磨表面,該背襯層具有與研磨表面相對之表面,平板黏著劑固定至與研磨表面相對之背襯層表面,其中平板黏著劑具有紋理化表面。The present invention further provides a polishing pad comprising a polishing layer attached to a backing layer, the polishing layer having a polishing surface, the backing layer having a surface opposite the polishing surface, and a plate adhesive fixed to the backing layer opposite the polishing surface Surface, where the flat adhesive has a textured surface.

本發明進一步提供具有剛性較低之主體的化學機械研磨墊,其包含固定至研磨墊表面之紋理化平板黏著劑。The present invention further provides chemical mechanical polishing pads having a less rigid body that includes a textured plate adhesive affixed to the polishing pad surface.

本發明進一步提供一種將化學機械研磨墊貼附至平板表面之方法,其包含:(a)將具有紋理化表面之平板黏著劑固定至研磨墊,(b)藉由將平板黏著劑之紋理化表面按壓至平板表面來將研磨墊附著至平板表面,其中平板黏著劑之紋理化表面允許空氣逸出而不被截留於平板表面與研磨墊之間。The present invention further provides a method of attaching a chemical mechanical polishing pad to a flat surface, which includes: (a) fixing a flat adhesive with a textured surface to the polishing pad, (b) by texturing the flat adhesive The surface is pressed to the plate surface to adhere the polishing pad to the plate surface, where the textured surface of the plate adhesive allows air to escape without being trapped between the plate surface and the polishing pad.

本發明進一步提供一種將具有剛性較低之主體的化學機械研磨墊貼附至平板表面之方法,其包含:(a)將具有紋理化表面之平板黏著劑固定至研磨墊,(b)藉由將平板黏著劑之紋理化表面按壓至平板表面來將研磨墊附接至平板表面,其中平板黏著劑之紋理化表面允許空氣逸出而不被截留於平板表面與研磨墊之間。The present invention further provides a method of attaching a chemical mechanical polishing pad with a less rigid body to a flat plate surface, which includes: (a) fixing a flat plate adhesive with a textured surface to the polishing pad, (b) by The polishing pad is attached to the plate surface by pressing the textured surface of the plate adhesive to the plate surface, where the textured surface of the plate adhesive allows air to escape without being trapped between the plate surface and the polishing pad.

本發明提供一種具有紋理化、可移除式平板黏著劑之研磨墊。紋理化平板黏著劑可包含防止出現禿點及過早墊磨損之凹槽或微通道。本發明亦提供一種藉由使用包含可移除式紋理化平板黏著劑之研磨墊防止在研磨墊中出現禿點及過早墊磨損之方法。 The present invention provides a polishing pad with textured, removable plate adhesive. Textured slab adhesives can include grooves or microchannels to prevent bald spots and premature pad wear. The present invention also provides a method of preventing bald spots in the polishing pad and premature pad wear by using a polishing pad containing a removable textured plate adhesive.

本發明之研磨墊可為整體墊或多層墊。當研磨墊為多層墊時,墊可由2個或更多個與黏著劑結合在一起之層組成。具有多層之墊亦可具有整體構造,其中多層經由一體式界面彼此共價結合。在一些實施例中,如本文中所揭示,墊為整體且因此具有一體式界面,層經由該一體式界面彼此共價結合。 The polishing pad of the present invention can be a solid pad or a multi-layer pad. When the polishing pad is a multi-layer pad, the pad may be composed of 2 or more layers bonded together with an adhesive. Pads with multiple layers can also have a monolithic construction, where the layers are covalently bonded to each other via an integral interface. In some embodiments, as disclosed herein, the pad is monolithic and therefore has an integral interface via which the layers are covalently bonded to each other.

本發明之多層研磨墊可包含黏著至剛性背襯層及/或至下墊層之研磨層。在一些實施例中,本發明之研磨墊將包含黏著至剛性背襯(亦稱作基底)層之研磨層(亦稱作頂部片層),該背襯層黏著至下墊層。在其他實施例中,研磨層黏著至下墊層。在又其他實施例中,研磨層在無下墊層之情況下黏著至剛性背襯層。The multi-layer polishing pad of the present invention may include a polishing layer adhered to a rigid backing layer and/or to an underlying layer. In some embodiments, the polishing pads of the present invention will include a polishing layer (also called a top sheet) adhered to a rigid backing (also called a base) layer, which is adhered to an underlying layer. In other embodiments, the abrasive layer adheres to the underlying layer. In yet other embodiments, the abrasive layer is adhered to the rigid backing layer without an underlying layer.

在其他實施例中,如本文所揭示之整體研磨墊定義為具有單層均一材料或均質組合物之研磨墊。在一實施例中,均質主體由熱固性封閉氣室式聚胺基甲酸酯材料構成。在本發明之情形下,術語「均質」用於指示熱固性封閉氣室式聚胺基甲酸酯材料之組成在整個主體之組成中為不變的。例如,在一實施例中,術語「均質」不包括由例如浸漬毛氈或多層不同材料之組合物(複合物)構成之研磨墊主體。In other embodiments, a monolithic polishing pad as disclosed herein is defined as a polishing pad having a single layer of uniform material or homogeneous composition. In one embodiment, the homogeneous body is constructed from a thermoset closed cell polyurethane material. In the context of the present invention, the term "homogeneous" is used to indicate that the composition of the thermoset closed cell polyurethane material is constant throughout the composition of the body. For example, in one embodiment, the term "homogeneous" does not include a polishing pad body composed of, for example, impregnated felt or a composition (composite) of multiple layers of different materials.

不管研磨墊為整體單層墊或多層墊,研磨墊將由研磨表面及與研磨表面相對之背面組成。與研磨表面相對之背面將為將含有本發明之紋理化平板黏著劑,由此將研磨墊固定(例如,黏著)至研磨工具之平板之表面。Regardless of whether the polishing pad is a solid single-layer pad or a multi-layer pad, the polishing pad will consist of a polishing surface and a backside opposite the polishing surface. The backside opposite the grinding surface will contain the textured plate adhesive of the present invention, thereby securing (eg, adhering) the polishing pad to the surface of the plate of the grinding tool.

在一實施例中,術語「熱固性」用於指示不可逆固化之聚合物材料,例如藉由固化將材料前驅體不可逆變化成難熔、不溶性聚合物網狀物。例如,在一實施例中,術語「熱固性」不包括由例如「熱塑性塑料」材料或「熱塑性物」構成之研磨墊,其為由在加熱時變成液態且在充分冷卻時返回至極玻璃態之聚合物構成之彼等材料。應注意,由熱固性材料製成之研磨墊通常自低分子量前驅體反應以在化學反應中形成聚合物而製造,而由熱塑性材料製成之墊通常藉由加熱預先存在之聚合物以引起相變而製造,從而使得在物理製程中形成研磨墊。可基於其穩定熱及機械特性、對化學環境之抗性及抗磨性傾向來選擇用於製造本文中所描述之研磨墊之聚胺基甲酸酯熱固性聚合物。In one embodiment, the term "thermoset" is used to refer to polymeric materials that are irreversibly cured, such as by curing to irreversibly transform a material precursor into a refractory, insoluble polymer network. For example, in one embodiment, the term "thermoset" does not include polishing pads composed of materials such as "thermoplastics" or "thermoplastics," which are polymers that become liquid when heated and return to an extremely glassy state when sufficiently cooled. The materials out of which things are composed. It should be noted that polishing pads made from thermoset materials are usually made from low molecular weight precursors that react to form polymers in a chemical reaction, while pads made from thermoplastic materials are usually made by heating a pre-existing polymer to induce a phase change. and manufacturing, thereby forming the polishing pad in a physical process. Polyurethane thermoset polymers used to make the polishing pads described herein may be selected based on their stable thermal and mechanical properties, resistance to chemical environments, and tendency to resist abrasion.

本發明可包括作為研磨墊之部分的下墊。可使用任何適合之下墊,例如下墊可包括聚胺基甲酸酯發泡體下墊、浸漬毛氈下墊、微孔聚胺基甲酸酯下墊及燒結胺基甲酸酯下墊。下墊視情況包含凹槽、通道、中空部分、窗、孔及類似物。下墊可藉由任何適合之手段貼附至研磨層。例如,研磨層及下墊可經由黏著劑貼附或可經由焊合或類似技術附著。The present invention may include an underpad as part of a polishing pad. Any suitable underlayment may be used, for example, the underlayment may include a polyurethane foam underlayment, an impregnated felt underlayment, a microporous polyurethane underlayment, and a sintered urethane underlayment. The underlying pad may optionally contain grooves, channels, hollows, windows, holes and the like. The underlying pad can be attached to the abrasive layer by any suitable means. For example, the abrasive layer and underlying pad may be attached via an adhesive or may be attached via welding or similar techniques.

研磨墊之剛度可影響由在墊安裝期間由截留空氣造成墊形成氣泡之傾向。較厚墊往往剛性較高,但亦有其他因素,諸如所用材料或背襯層之使用。與剛性較低之墊相比,剛性墊往往截留較少氣泡,且因此不易出現禿點。然而,所有研磨墊均能夠在安裝期間形成截留氣泡。剛性較低之墊往往容易地形成截留氣泡,且因此極易於出現禿點。如本文所用,研磨墊之剛度為整個墊之剛度,無論其為多層墊或均一墊。墊中之剛度可藉由任何適合之方法量測。例如,可使用應力應變通用測試儀。應力應變通用測試儀量測使較長且較大之墊樣品(例如12吋×5吋樣品)偏轉所需之力。測試墊樣品可包含頂墊、下墊、黏著劑層以及離型襯墊。偏轉通常為大約2至3吋。使用此等大尺寸以便接近模擬墊安裝製程。The stiffness of the polishing pad can affect the pad's tendency to form bubbles caused by trapped air during pad installation. Thicker pads tend to be more rigid, but there are other factors as well, such as the materials used or the backing layer used. Rigid pads tend to trap fewer air bubbles and are therefore less prone to bald spots than less rigid pads. However, all polishing pads are capable of forming trapped air bubbles during installation. Less rigid pads tend to form trapped air bubbles easily and are therefore more prone to bald spots. As used herein, the stiffness of a polishing pad is the stiffness of the entire pad, whether it is a multi-layer pad or a uniform pad. The stiffness in the pad can be measured by any suitable method. For example, a universal stress strain tester can be used. The Universal Stress Strain Tester measures the force required to deflect a longer and larger pad sample (such as a 12" x 5" sample). Test pad samples may include top pads, bottom pads, adhesive layers, and release liners. Deflection is typically about 2 to 3 inches. Use these large dimensions to approximate the analog pad mounting process.

如本文所用,剛性較低之墊定義為使墊樣品偏轉所需之力與對照墊樣品相比較低的墊。As used herein, a less stiff pad is defined as a pad that requires a lower force to deflect a pad sample compared to a control pad sample.

本發明之研磨墊包含可移除式或臨時黏著劑,例如壓敏平板黏著劑。可移除式壓敏平板黏著劑層促進整體或多層化學機械研磨墊或墊堆疊於研磨機器上之安裝。本發明之平板黏著劑可為任何適合之材料。平板黏著劑較佳對通常用於化學機械研磨製程中之熱及化學物質具有抗性。例如,黏著劑應維持黏著特性且不使研磨墊在化學機械研磨製程期間自平板表面脫離。The polishing pad of the present invention includes a removable or temporary adhesive, such as a pressure-sensitive plate adhesive. A removable pressure-sensitive flat adhesive layer facilitates the installation of monolithic or multi-layer chemical mechanical polishing pads or pad stacks on polishing machines. The flat panel adhesive of the present invention can be any suitable material. The plate adhesive is preferably resistant to the heat and chemicals commonly used in chemical mechanical polishing processes. For example, the adhesive should maintain adhesive properties and not cause the polishing pad to detach from the plate surface during the chemical mechanical polishing process.

本發明亦提供各種轉移膠帶(亦稱為雙側黏著膠帶),其包括平板黏著劑及墊黏著劑。轉移膠帶包含載體膜上之一或多個黏著劑之層及用於各黏著劑面之襯墊,諸如離型襯墊。在某些實施例中,轉移膠帶在膠帶之一側上具有永久型黏著劑且在相對側上具有含槽平板黏著劑。此實施例描繪於圖2及圖3中。在其他實施例中,轉移膠帶在兩側上均可具有相同黏著劑,但僅平板側將具有含槽或紋理化表面。The present invention also provides various transfer tapes (also known as double-sided adhesive tapes), including flat adhesives and pad adhesives. Transfer tapes include one or more layers of adhesive on a carrier film and a liner, such as a release liner, for each adhesive side. In some embodiments, the transfer tape has a permanent adhesive on one side of the tape and a grooved flat adhesive on the opposite side. This embodiment is depicted in Figures 2 and 3. In other embodiments, the transfer tape can have the same adhesive on both sides, but only the flat side will have a grooved or textured surface.

轉移膠帶之載體膜可為任何適合之材料。例如,載體膜可為聚對苯二甲酸乙二酯(PET)。另外,載體膜可具有任何適合之厚度。例如,載體膜之厚度可為約0.5 mil至約2.0 mil。The carrier film of the transfer tape can be any suitable material. For example, the carrier film may be polyethylene terephthalate (PET). Additionally, the carrier film can have any suitable thickness. For example, the thickness of the carrier film can be from about 0.5 mil to about 2.0 mil.

離型襯墊可為任何適合之材料及厚度。例如,離型襯墊可為聚酯材料且可具有約2 mil至約5 mil之厚度。在本發明之一實施例中,離型襯墊經紋理化或具有溝槽以使得離型襯墊上之圖案壓印於黏著劑上,且黏著劑在移除離型襯墊後至少暫時保持藉由離型襯墊壓印之凹槽或紋理之形狀。在此實施例中,恰好在研磨墊安裝於平板上之前,將該墊之離型襯墊移除。The release liner can be of any suitable material and thickness. For example, the release liner can be a polyester material and can have a thickness of about 2 mil to about 5 mil. In one embodiment of the invention, the release liner is textured or grooved so that the pattern on the release liner is imprinted on the adhesive, and the adhesive remains at least temporarily after the release liner is removed. The shape of the grooves or textures embossed by the release liner. In this embodiment, the release liner of the polishing pad is removed just before the pad is mounted on the plate.

本發明之微通道可採用各種形狀或圖案。微通道一般由黏著劑中產生微結構化表面之結構形成。結構可圍繞黏著劑表面隨機置放或置放於規則紋理化圖案中。The microchannels of the present invention can adopt various shapes or patterns. Microchannels are generally formed by structures in the adhesive that create a microstructured surface. Structures can be placed randomly around the adhesive surface or placed in regular textured patterns.

離型襯墊上之紋理化圖案可為防止空氣在安裝期間被截留在研磨墊下方之任何適合圖案。例如,離型襯墊中之圖案可為由XY圖案組成之微通道圖案。替代地,圖案可為由一系列連接之蜂巢、金剛石形狀或其他幾何設計產生之微通道。微通道之尺寸可為任何適合之尺寸,其限制條件為微通道允許空氣在研磨墊之安裝期間逸出。例如,通道深度可在約5 μm至約250 μm之範圍內。例如,通道深度可為約5 μm或更大、約10 μm或更大、約15 μm或更大、約20 μm或更大、約25 μm或更大、約30 μm或更大、約40 μm或更大。例如,通道深度可為約250 μm或更小,例如約200 μm或更小、約150 μm或更小、約100 μm或更小、約50 μm或更小。較佳地,通道深度在約20 μm至約50 μm範圍內。微通道可具有任何適合之間距。通道之間距與將不會被截留之氣泡之最大尺寸相關。通道間距可為約0.1 mm或更大,例如0.2 mm或更大、0.5 mm或更大、1.0 mm或更大、5 mm或更大。通道間距可為約10 mm或更小,例如8 mm或更小、7 mm或更小、6 mm或更小。在一個實施例中,通道間距在1 mm至5 mm範圍內。The textured pattern on the release liner can be any suitable pattern that prevents air from being trapped beneath the polishing pad during installation. For example, the pattern in the release liner can be a microchannel pattern consisting of an XY pattern. Alternatively, the pattern may be microchannels created by a series of connected honeycombs, diamond shapes, or other geometric designs. The size of the microchannels can be any suitable size, with the limitation that the microchannels allow air to escape during installation of the polishing pad. For example, channel depth may range from about 5 μm to about 250 μm. For example, the channel depth can be about 5 μm or greater, about 10 μm or greater, about 15 μm or greater, about 20 μm or greater, about 25 μm or greater, about 30 μm or greater, about 40 μm or larger. For example, the channel depth may be about 250 μm or less, such as about 200 μm or less, about 150 μm or less, about 100 μm or less, about 50 μm or less. Preferably, the channel depth ranges from about 20 μm to about 50 μm. The microchannels can have any suitable spacing. The distance between channels is related to the maximum size of the bubble that will not be trapped. The channel spacing may be about 0.1 mm or greater, such as 0.2 mm or greater, 0.5 mm or greater, 1.0 mm or greater, 5 mm or greater. The channel spacing may be about 10 mm or less, such as 8 mm or less, 7 mm or less, 6 mm or less. In one embodiment, the channel spacing is in the range of 1 mm to 5 mm.

平板黏著劑可為允許研磨墊在磨損時容易移除但在研磨操作期間將研磨墊牢固地固持在適當位置的任何適合之可移除式黏著劑材料。例如,平板黏著劑可為丙烯酸系樹脂黏著劑、基於橡膠之黏著劑、胺基甲酸酯樹脂黏著劑或矽樹脂黏著劑。此等黏著劑一般為低黏性、可移除式黏著劑。The plate adhesive can be any suitable removable adhesive material that allows the polishing pad to be easily removed when worn but holds the polishing pad securely in place during the polishing operation. For example, the slab adhesive may be an acrylic resin adhesive, a rubber-based adhesive, a urethane resin adhesive, or a silicone resin adhesive. These adhesives are generally low-tack, removable adhesives.

通常,黏著劑在併入於轉移膠帶中時呈厚度為約0.5 mil至約20 mil,且更特定言之約1.0 mil至約10 mil之單一均勻及連續層之形式。本發明標的物亦包括經圖案化黏著劑及多層黏著劑在轉移膠帶中之用途。Typically, the adhesive when incorporated into the transfer tape is in the form of a single uniform and continuous layer having a thickness of about 0.5 mil to about 20 mil, and more specifically about 1.0 mil to about 10 mil. The subject matter of the present invention also includes the use of patterned adhesives and multi-layer adhesives in transfer tapes.

可使用雙塗佈膠帶在層壓步驟中將平板黏著劑施用至研磨墊。適合之雙塗佈膠帶包括3M 456CR、3M 442F及Avery 8603。將雙塗佈膠帶層壓至墊表面之方法為熟知的。可藉由使用任何適合之層壓機器,例如AGL層壓機(Advanced Greig Laminators公司, DeForest, Wisconsin)且根據供應商所建議之方法將雙塗佈膠帶層壓至研磨墊。Double coated tape can be used to apply slab adhesive to the polishing pad during the lamination step. Suitable double-coated tapes include 3M 456CR, 3M 442F and Avery 8603. The method of laminating double coated tape to the pad surface is well known. The dual-coated tape can be laminated to the polishing pad by using any suitable laminating machine, such as an AGL laminator (Advanced Greig Laminators, Inc., DeForest, Wisconsin) and following the supplier's recommended method.

紋理化表面(例如,微通道)可藉由用結構直接壓印壓敏黏著劑層而形成。替代地,可首先壓印襯墊或背襯,且隨後用壓敏黏著劑塗佈以將結構賦予至黏著劑。膜可層壓或結合至與紋理化表面特徵相對之黏著層之一側。Textured surfaces (eg, microchannels) can be formed by directly imprinting a pressure-sensitive adhesive layer with a structure. Alternatively, the liner or backing can be embossed first and then coated with a pressure-sensitive adhesive to impart structure to the adhesive. The film may be laminated or bonded to the side of the adhesive layer opposite the textured surface features.

本發明之一個優勢為提供具有紋理化表面之平板黏著劑背襯研磨墊,從而使得適用於空氣釋放之路徑形成於平板黏著劑中。紋理或微通道將路徑界定至研磨之周邊,其准許空氣在平板黏著劑層與平板之表面之間流動。在一個實施例中,微通道路徑極接近但不在周邊處終止。在此實施例中,仍准許空氣逸出且無空氣被截留於研磨墊與平板之間。One advantage of the present invention is to provide a flat adhesive-backed polishing pad with a textured surface such that paths suitable for air release are formed in the flat adhesive. Textures or microchannels define paths to the perimeter of the grind, which allow air to flow between the adhesive layer of the plate and the surface of the plate. In one embodiment, the microchannel path terminates very close to, but not at, the perimeter. In this embodiment, air is still allowed to escape and no air is trapped between the polishing pad and plate.

在最終將研磨墊施用至平板後,本發明之微通道至少部分消失,以便提供所需黏著。微通道至少部分消失之能力視微通道之形狀及黏著劑之流變性而定。After final application of the polishing pad to the plate, the microchannels of the present invention at least partially disappear to provide the desired adhesion. The ability to at least partially disappear a microchannel depends on the shape of the microchannel and the rheology of the adhesive.

在離型襯墊已移除之後微通道平板黏著劑維持微通道之能力稱為通道壽命。例如,具有長通道壽命之黏著劑將在移除離型襯墊之後及可能甚至在已將研磨墊施用至平板表面之後維持微通道結構長達數分鐘。本發明之研磨墊較佳具有足以維持通道結構直至在安裝期間將研磨墊按壓向平板表面上的長通道壽命。在此等條件下,空氣將在安置墊期間逸出,但安裝後,在墊末端處將不存在可能允許研磨漿料或水進入墊下部之開放通道。The ability of the microchannel plate adhesive to maintain the microchannels after the release liner has been removed is called channel life. For example, an adhesive with long channel life will maintain the microchannel structure for several minutes after the release liner is removed and possibly even after the polishing pad has been applied to the plate surface. The polishing pads of the present invention preferably have a channel life long enough to maintain the channel structure until the polishing pad is pressed against the flat surface during installation. Under these conditions, air will escape during pad placement, but after installation, there will be no open channels at the pad ends that could allow abrasive slurry or water to enter the underside of the pad.

本發明提供一種避免由禿點造成之過早磨損之化學機械研磨墊。本發明之研磨墊包含用以將墊黏著至平板之可移除式黏著劑,且該黏著劑具有紋理表面從而使得可安裝研磨墊而不截留空氣。在安裝過程期間發生在平板表面與研磨墊之間的經截留空氣在研磨表面中導致凸起。黏著劑之紋理化表面引起較少空氣被截留或無空氣被截留。The present invention provides a chemical mechanical polishing pad that avoids premature wear caused by bald spots. The polishing pad of the present invention includes a removable adhesive used to adhere the pad to a flat plate, and the adhesive has a textured surface so that the polishing pad can be installed without trapping air. The trapped air that occurs between the plate surface and the polishing pad during the installation process causes bulges in the polishing surface. The textured surface of the adhesive causes less or no air to be trapped.

以下實施例進一步說明本發明,但理所當然不應解釋為以任何方式限制其範疇。 實例1The following examples further illustrate the invention, but of course should not be construed as limiting its scope in any way. Example 1

此實例展現不同厚度及組成之研磨墊之剛度差異。This example shows the difference in stiffness of polishing pads of different thicknesses and compositions.

使用墊偏轉測試來測試各種研磨墊材料之剛度。測試使用測試墊之部分切成尺寸長度為12.5吋且寬度為5.5吋之矩形形狀。將測試墊部分安裝於在應力應變模式下操作之通用測試儀(Test Resources, Shakopee, MN)上,其能夠量測使測試墊樣品彎曲3吋所需的力。測試各測試條帶5次且將結果一起平均化。Use the pad deflection test to test the stiffness of various polishing pad materials. The test uses a portion of the test pad cut into a rectangular shape with a length of 12.5 inches and a width of 5.5 inches. The test pad portion was mounted on a universal tester (Test Resources, Shakopee, MN) operating in stress-strain mode, which was capable of measuring the force required to bend the test pad sample 3 inches. Each test strip was tested 5 times and the results were averaged together.

偏轉測試之結果展示於表1中。結果指示較厚墊及具有剛性下墊或背襯層之墊具有偏轉三吋所需之較高力,且因此被視為剛性較高。下墊之厚度加頂墊之厚度之差值減去總厚度為在下墊與頂墊之間的黏著劑層之厚度。 表1.各種墊之比較性剛度量測. 墊樣品 下墊 平板黏著劑 頂墊厚度 (mil) 總墊厚度(mil) 平均最大力 (lbf) 1 30 mil 平坦,可移除式 65 110 0.40 2 30 mil 微通道 65 110 0.45 3 30 mil 平坦,低黏性 65 110 0.35 4  30 mil,緻密型 平坦,可移除式 65 110 0.40 5 15 mil 平坦,可移除式 65 105 0.22 6 15 mil 平坦,可移除式 65 105 0.22 7 15 mil 平坦,可移除式 65 105 0.26 8 30 mil 平坦,可移除式 100 145 1.02 9 平坦,極低黏性 130 135 0.67 10 Suba4,剛性,(IC1010) 平坦,可移除式 80 140 0.80 實例2The results of the deflection test are shown in Table 1. The results indicate that thicker pads and pads with a rigid underlay or backing layer have higher forces required to deflect three inches and are therefore considered stiffer. The difference between the thickness of the bottom pad and the thickness of the top pad minus the total thickness is the thickness of the adhesive layer between the bottom pad and the top pad. Table 1. Comparative stiffness measurements of various pads. pad sample lower pad Flat adhesive Top pad thickness(mil) Total pad thickness (mil) Average maximum force (lbf) 1 30 mil flat, removable 65 110 0.40 2 30 mil microchannel 65 110 0.45 3 30 mil Flat, low viscosity 65 110 0.35 4 30 mil, dense type flat, removable 65 110 0.40 5 15 mil flat, removable 65 105 0.22 6 15 mil flat, removable 65 105 0.22 7 15 mil flat, removable 65 105 0.26 8 30 mil flat, removable 100 145 1.02 9 without Flat, very low viscosity 130 135 0.67 10 Suba4, rigid, (IC1010) flat, removable 80 140 0.80 Example 2

此實例表明在侵襲性研磨條件下,微通道黏著劑對墊磨損之影響。This example demonstrates the effect of microchannel adhesive on pad wear under aggressive polishing conditions.

使用不同平板黏著劑比較相同研磨墊。E6088研磨墊(Cabot Microelectronics, Aurora IL)經微通道黏著劑(2B)或經平坦黏著劑(2A及2C)層壓。經不同組態之E6088墊之剛度表明於實例1中。作為比較例,使用市售研磨墊IC1010(Rohm and Haas Electronic Materials)。IC1010之剛度展示於實例1中。IC1010為所測試之墊材料中剛性最高的。Comparing the same polishing pad using different plate adhesives. E6088 polishing pads (Cabot Microelectronics, Aurora IL) were laminated with microchannel adhesive (2B) or with flat adhesive (2A and 2C). The stiffness of E6088 pads in different configurations is demonstrated in Example 1. As a comparative example, commercially available polishing pad IC1010 (Rohm and Haas Electronic Materials) was used. The stiffness of IC1010 is shown in Example 1. IC1010 is the stiffest of the pad materials tested.

使用市售基於二氧化矽之研磨漿料D9228(Cabot Microelectronics)及TEOS毯覆式晶圓在以下條件下測試研磨墊。研磨測試使用CTS研磨機模型AP 300(Creative Technology Solutions),其使用120 rpm之平板速度,4 psi之研磨下壓力,其中漿料進料速率為250毫升/分鐘。在12lbf之壓力下用市售CMP金剛石調節劑調節墊。各墊用於研磨4至5小時,接著進行磨損分析。視覺上檢查墊之研磨表面上之磨損。過度磨損區域(例如,無凹槽結構可見之區域)計數為禿點(禿點計數),且記錄墊禿點之數目。圖1展示被視為禿點計數之可見墊磨損的實例。The polishing pads were tested under the following conditions using commercially available silica-based polishing slurry D9228 (Cabot Microelectronics) and TEOS blanket wafers. The grinding test used a CTS grinder model AP 300 (Creative Technology Solutions), which used a plate speed of 120 rpm, a grinding pressure of 4 psi, and a slurry feed rate of 250 ml/min. Condition the pads with commercially available CMP diamond conditioner at a pressure of 12 lbf. Each pad was used for grinding for 4 to 5 hours, followed by wear analysis. Visually inspect the pad for wear on the abrasive surface. Areas of excessive wear (eg, areas where no groove structure is visible) are counted as bald spots (bald spot count), and the number of pad bald spots is recorded. Figure 1 shows an example of visible pad wear that is considered a bald spot count.

以下表2展示測試墊之墊禿點計數。如表中顯而易見,具有微通道黏著劑之E6088墊不具有禿點,而具有平坦黏著劑之相同墊具有顯著增加之彼數目,伴隨有6個禿點。另外,具有剛性下墊之E6088墊亦展示無禿點。 表2.各種研磨墊之禿點計數. 研磨墊 描述 禿點計數 IC1010,市售墊 剛性墊,平坦黏著劑 0 2A 剛性較低之墊,30 mil下墊,平坦黏著劑 6 2B 剛性較低之墊,30 mil下墊,微通道黏著劑 0 2C 剛性墊,緻密型30 mil下墊,平坦黏著劑 0 Table 2 below shows the bald spot counts of the test pads. As evident from the table, the E6088 pad with microchannel adhesive has no bald spots, while the same pad with flat adhesive has a significantly increased number of these, with 6 bald spots. In addition, the E6088 pad with a rigid bottom pad also showed no bald spots. Table 2. Count of bald spots on various polishing pads. polishing pad describe bald spot count IC1010, commercially available pad Rigid pad, flat adhesive 0 2A Less rigid pad, 30 mil underpad, flat adhesive 6 2B Less rigid pad, 30 mil underpad, microchannel adhesive 0 2C Rigid pad, dense 30 mil underpad, flat adhesive 0

如自此實例中所呈現之資料顯而易見,剛性較低且具有平坦黏著劑之研磨墊(2A)具有禿點之問題。使用具有微通道之黏著劑防止剛性較低之研磨墊(2B)中出現禿點缺陷。 實例3As is apparent from the data presented in this example, the less rigid polishing pad (2A) with flat adhesive has problems with bald spots. Use an adhesive with microchannels to prevent bald spot defects in less rigid polishing pads (2B). Example 3

此實例闡述在模擬加速磨損條件下微通道黏著劑對墊禿點之影響。This example illustrates the effect of microchannel adhesive on pad bald spots under simulated accelerated wear conditions.

根據偏轉測試測定為剛性較低之研磨墊經非紋理化之可移除式平板黏著劑或微通道平板黏著劑層壓。另外,剛性研磨墊經非紋理化之可移除式平板黏著劑及微通道平板黏著劑層壓。剛性研磨墊安裝於平板上,該平板與通常使用相比較少關注。進行此操作以增加在安裝期間截留氣泡之可能性。切割機器為移除墊頂部層之約0.020''均勻深度之電腦數值控制切割機器(諸如Multicam CNC切割機器)。此測試提供加速磨損測試以鑑別由於截留空氣在研磨墊與平板之間鼓泡所致之禿點區域。Polishing pads that are less rigid as determined by deflection testing are laminated with non-textured removable plate adhesive or microchannel plate adhesive. In addition, rigid polishing pads are laminated with non-textured removable plate adhesive and microchannel plate adhesive. Rigid polishing pads are mounted on a flat plate that requires less attention than is normally used. Do this to increase the likelihood of air bubbles becoming trapped during installation. The cutting machine is a computer numerically controlled cutting machine (such as a Multicam CNC cutting machine) that removes a uniform depth of approximately 0.020" of the top layer of the pad. This test provides an accelerated wear test to identify bald areas caused by trapped air bubbling between the polishing pad and plate.

加速測試之結果與研磨測試之結果相同。微通道平板黏著劑消除剛性較低之墊中之禿點問題或在較少關注下安裝之較高剛性墊之問題。The results of the accelerated test were the same as those of the grinding test. Microchannel plate adhesive eliminates the problem of bald spots in less rigid pads or the problem of higher stiffness pads installed with less attention.

本文中所引用之所有參考文獻,包括公開案、專利申請案及專利均特此以引用之方式併入本文中,該引用程度就如同個別及特定地指示各參考文獻以引用之方式併入且全文闡述於本文中一般。All references, including publications, patent applications, and patents cited herein are hereby incorporated by reference to the same extent as if each reference was individually and specifically indicated to be incorporated by reference and in its entirety. Set forth in this article generally.

除非本文另外指示或明顯與上下文相矛盾,否則在描述本發明之上下文中(尤其在以下申請專利範圍之上下文中),使用術語「一(a/an)」及「該」及類似指示物應理解為涵蓋單數及多數兩者。除非另外指出,否則術語「包含」、「具有」、「包括」及「含有」應解釋為開放式術語(亦即,意謂「包括但不限於」)。除非另外指示,否則本文中值範圍之列舉僅意欲充當個別提及屬於該範圍內之各獨立值的簡寫方法,且各獨立值併入至本說明書中,如同在本文中個別列舉一般。除非本文另外指示或另外明顯與上下文矛盾,否則本文所述之所有方法均可以任何適合次序進行。除非另外主張,否則使用本文所提供之任何及所有實例或例示性語言(例如「諸如」)僅意欲更好地闡明本發明且不對本發明之範疇造成限制。本說明書中之語言不應理解為指示實踐本發明所必需之任何未主張要素。 本發明之較佳實施例描述於本文中,包括本發明人已知用於進行本發明之最佳模式。在閱讀前述描述之後,彼等較佳實施例之變化對於彼等一般熟習此項技術者可變得顯而易見。本發明人期望熟習此項技術者適當時採用此類變化,且本發明人意欲以不同於本文中特定所述之其他方式來實踐本發明。因此,若適用法律允許,則本發明包括隨附於本文之申請專利範圍中所敍述之標的物之所有修改及等效物。此外,除非本文另外指示或另外明顯與上下文矛盾,否則本發明涵蓋上述要素在其所有可能變化中之任何組合。Unless otherwise indicated herein or otherwise clearly contradicted by context, use of the terms "a/an" and "the" and similar referents in the context of describing the invention (especially in the context of the following claims) shall It is understood to cover both the singular and the plurality. Unless otherwise indicated, the terms "includes," "has," "includes," and "contains" should be construed as open-ended terms (i.e., meaning "including, but not limited to"). Unless otherwise indicated, recitations of value ranges herein are intended only as a shorthand way of referring individually to each individual value falling within that range, and each individual value is incorporated into this specification as if individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (eg, "such as") provided herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention unless otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention. Preferred embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention. After reading the foregoing description, variations of the preferred embodiments will become apparent to those of ordinary skill in the art. The inventors expect those skilled in the art to employ such variations as appropriate, and the inventors intend the invention to be practiced otherwise than as specifically described herein. Accordingly, where permitted by applicable law, this invention is intended to include all modifications and equivalents of the subject matter recited in the claims appended hereto. Furthermore, any combination of the above-described elements in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context.

101:研磨層/頂墊 102:黏著劑層 103:下墊 104:永久性下墊黏著劑 105:黏著劑背襯層 106:可移除式平板黏著劑 107:離型襯墊 108:具有紋理化表面之離型襯墊101: Grinding layer/top pad 102: Adhesive layer 103: Lower pad 104:Permanent underlay adhesive 105: Adhesive backing layer 106:Removable tablet adhesive 107:Release liner 108: Release liner with textured surface

圖1說明凹槽研磨表面上之禿點(spot balding)的實例。 Figure 1 illustrates an example of spot balding on a groove grinding surface.

圖2描繪本發明之研磨墊之組態的一個實施例。 Figure 2 depicts one embodiment of the configuration of the polishing pad of the present invention.

圖3描繪平板黏著劑層之分解圖,其展示平板黏著劑中由離型襯墊之紋理化表面形成的微通道之形成。Figure 3 depicts an exploded view of a flat panel adhesive layer showing the formation of microchannels in the flat panel adhesive formed by the textured surface of the release liner.

104:永久性下墊黏著劑 104:Permanent underlay adhesive

105:黏著劑背襯層 105: Adhesive backing layer

106:可移除式平板黏著劑 106:Removable tablet adhesive

108:具有紋理化表面之離型襯墊 108: Release liner with textured surface

Claims (10)

一種化學機械研磨墊,其包含:包含研磨表面之研磨墊、與該研磨表面相對之背面、附著至該背面之平板黏著劑,其中該平板黏著劑具有紋理化表面,且包含可移除式黏著劑,其中該研磨墊為多層研磨墊,其中該多層研磨墊包含研磨層及背襯層,其中該多層研磨墊可視情況包含下墊層,且其中該研磨墊為剛性較低之墊,定義為使用12"長×5"寬之樣品條帶在3吋偏轉下具有0.4 lbf或更小之負載。 A chemical mechanical polishing pad, which includes: a polishing pad including a polishing surface, a backside opposite to the polishing surface, and a flat adhesive attached to the backside, wherein the flat adhesive has a textured surface and includes a removable adhesive agent, wherein the polishing pad is a multi-layer polishing pad, wherein the multi-layer polishing pad includes a polishing layer and a backing layer, wherein the multi-layer polishing pad optionally includes an underlying layer, and wherein the polishing pad is a pad with lower rigidity, defined as Use a 12" long x 5" wide sample strip with a load of 0.4 lbf or less at 3 inches of deflection. 如請求項1之研磨墊,其中該平板黏著劑之紋理化表面包含微通道紋理。 The polishing pad of claim 1, wherein the textured surface of the plate adhesive includes a microchannel texture. 如請求項2之研磨墊,其中該微通道紋理包含XY圖案。 The polishing pad of claim 2, wherein the microchannel texture includes an XY pattern. 如請求項2之研磨墊,其中該微通道紋理係由幾何形狀形成。 The polishing pad of claim 2, wherein the microchannel texture is formed by geometric shapes. 如請求項1至4中任一項之研磨墊,其中該研磨墊具有整體結構。 The polishing pad of any one of claims 1 to 4, wherein the polishing pad has an integral structure. 如請求項2之研磨墊,其中該等微通道之通道深度為5μm至250μm。 Such as the polishing pad of claim 2, wherein the channel depth of the microchannels is 5 μm to 250 μm. 如請求項6之研磨墊,其中該通道深度為20μm至50μm。 The polishing pad of claim 6, wherein the channel depth is 20 μm to 50 μm. 如請求項2之研磨墊,其中該通道間距為0.1mm至10mm。 Such as the polishing pad of claim 2, wherein the channel spacing is 0.1mm to 10mm. 如請求項8之研磨墊,其中該通道間距為1mm至5mm。 Such as the polishing pad of claim 8, wherein the channel spacing is 1 mm to 5 mm. 一種將化學機械研磨墊貼附至平板表面之方法,其包含:(a)將具有紋理化表面之平板黏著劑層固定至該研磨墊,(b)藉由將該平板黏著劑之紋理化表面按壓至該平板表面來將該研磨墊附著至該平板表面,其中該平板黏著劑之紋理化表面允許空氣逸出且不被截留於該平板表面與該研磨墊之間,其中該研磨墊為來自請求項1至9中任一項之墊。 A method of attaching a chemical mechanical polishing pad to a flat surface, which includes: (a) fixing a flat adhesive layer with a textured surface to the polishing pad, (b) by attaching the textured surface of the flat adhesive to the polishing pad Pressing to the plate surface adheres the polishing pad to the plate surface, wherein the textured surface of the plate adhesive allows air to escape and not be trapped between the plate surface and the polishing pad, wherein the polishing pad is from Any one of claims 1 to 9.
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