1278030 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種漿料高比例混合裝置及混合方法，尤 其是一種在半導體製造工程的CMP過程中，利用;/ 量控制，可以精確的混合比製造漿料並可供給的高比例^ 合裝置及混合方法。 •【先前技術】 ' 常在半導體製造卫程中’首先在基板上蒸鑛規定的 •膜，並反復進行曝光、顯像、蝕刻、蒸鍍等流程，且需要 以平坦化技術，對基板上所需部位進行平坦化，從而在其 上形成絕緣膜、金屬配線、絕緣（Is〇lati〇n )及溝槽 (Trench)等結構。 而在上述作為對基板上所需部位進行的平坦化技 參 術，就有化學機械研磨工程，該工程稱為CMP(Chemical1278030 IX. Description of the Invention: [Technical Field] The present invention relates to a slurry high-mixing device and a mixing method, in particular, in a CMP process of a semiconductor manufacturing process, using a quantity control to accurately mix ratios A high ratio of equipment and mixing methods for making the slurry and supplying it. • [Prior Art] 'Constantly in the semiconductor manufacturing process' firstly evaporates the specified film on the substrate, and repeats the processes of exposure, development, etching, evaporation, etc., and needs to be planarized on the substrate. The desired portion is planarized to form an insulating film, a metal wiring, an insulation (Is〇lati〇n), and a trench (Trench) thereon. In the above-mentioned planarization technique for the desired portion on the substrate, there is a chemical mechanical polishing process called CMP (Chemical).
Mechanical Polishing)工程。 最近，Ρϋ著LSI的高集成化、高性能化，對大晶片等 基板表面進行咼精度平坦化顯得很重要，因此CMp技術的 應用越來越廣泛。 CMP工程是在由化學液和研磨粒子所組成的漿料的化 學作用和研磨粒子的機械作用的共同作用下完成的。 上述聚料是首先在氫氧化鉀（Κ0Η)或氫氧化銨（丽4〇H) 等鹼性水溶液或含有表面活性劑的水中分散二氧化矽 5 1278030 (S i 〇2)、氧化銘（A12〇3)、二氧化鈽（Ce〇2)、金剛石等研 磨粒子形成微粒子分散液（源液漿料），再根據研磨物件， 混合表面活性劑及用以促進化學作用的過氧化氫溶液、石肖 • 酸鐵等氧化劑、以及包含各種添加劑的添加劑溶液來製備。 目前，用來製造CMP漿料的混合裝置，一般利用液位 -感測器等裝置進行對水和微粒子分散液、表面活性劑、氧 • 化劑及各種添加劑的計量，藉以將其用一定的比例混合。 > 但是，通過液位感測器等裝置進行的稀釋及混合，從 ' 結構上看其配管及配線等結構相當複雜，且因為液位元感 •測器的性能降低，需要進行定期維修，又因為使用次數的 增加引起精確度的下降，很難精確調整混合比例。 為改善上述利用液位感測器的混合裝置上存在的問 題，現又有一種技術是以稱重感測器（Load Ce 11)進行計 量。這一情況下不需要液位元感測器等裝置，從而配管及 配線變得簡單，可以任意調節稀釋比例，但在1 : 10的高 i 比例混合條件下，其計量精度也不能滿足技術要求。 【發明内容】 鑒於上述問題，本發明的目的是提供一種漿料高比例 混合裝置，其利用電子秤計量和流量控制計量，即使在1:10 以上的高比例條件下，也能完成高精度混合，且其配線等 結構並不複雜。 本發明的另一個目的是提供一種漿料高比例混合方 6 1278030 並通過流量控制 以上的高比例條 法，其利用電子秤分二個階段計量水量， 來a十里研磨粒子和添加劑，從而在1 : 1〇 件下也能完成精確混合。 為解決上述目的，本發明採用如下技術方案。 本發明提供的漿料高比例混合裝置，其包括· 一攪拌箱，在其内進行漿料的混合； 一去離子水供給管，盥上述撸 、 ，、上义攪拌相和去離子水供給源 運接，亚提供去離子水； —去離子水供給Μ ’設置在上述去離子水供給管上； 一去離子水供給輔助閥，在上述去離子水供給管上和 去離子水主閥並列設置； < 一電子祥，設置在上述游箱的下端，用以量測注入 攪拌箱的去離子水及漿料的量； 、多支添加劑供給管，分別接設於研磨粒子和提供各種 添加劑的添加劑供給源，並連接於上述攪拌箱；、 多個流量控制閥，分別設置在上述添加劑供給管上； 多個流量計，分別設置在上述添加劑供給管上； 一控制部，根據上述電子秤測出的測定值，來控制上 述去離子水供給主閥及去離子水供給輔助閥的開合，並根 據上述流量計的測定值，來控制流量控制閥的開合。 本發明提供的漿料高比例混合方法，包括如下步驟·· 輪入階段，輸入各種成分的設定值及/或混合比例、臨 界值、界限值、誤差範圍等； 1278030 去離子水供給開始階段，開啟設置在去離子水供給管 上的去離子水供給主閥和去離子供給辅助閥，上述去離子 水供給管用以提供去離子水； 去離子水測定階段，用電子秤測定注入到攪拌箱内的 去離子水量； 去離子水量比較階段，比較上述去離子水測定階段所 測出的測定值和設定值，如果設定值減去測定值大於上述 輸入階段中設定的臨界值，則返回去離子水測定階段； 主閥關閉階段，在上述去離子水測定階段中，如果設 定值減去測定值小於或等於上述輸入階段中設定的臨界 值，則關閉去離子水供給主閥； 微測階段，用電子秤測定注入到攪拌箱的去離子水量； 微量比較階段，如果上述輸入階段輸入的設定值減去 上述微測階段的測定值大於上述輸入階段設定的界限值， 則返回微測階段； 輔助閥關閉階段，在上述微量比較階段中，如果設定 值減去測定值小於或等於界限值，則關閉去離子水供給閥； 添加劑供給開始階段，在上述去離子水供給開始階段 之後進行，並開啟設置在每個添加劑供給管上的流量控制 閥’其中上述添加劑供給管用以供給研磨粒子及各種添加 劑； 流量測定階段，測定通過添加劑供給管的流量； 流量比較階段，比較在上述流量測定階段中測出的測 8 1278030 定值和設定值，如果設定值減去測定值大於上述輸入階段 中設定的誤差範圍，則返回流量測定階段； 流量關閉階段，在上述流量比較階段中，如果設定值 ' 減去測定值小於或等於誤差範圍，則關閉流量控制閥。 本發明漿料高比例混合裝置及混合方法，可採用1:10 ‘ 以上的高稀釋比（例如，1:50-1:100左右）來混合去離子 • 水和添加劑，以此製備聚料。 > 此外，本發明漿料高比例混合裝置，其同時利用用來 • 供給大量去離子水的去離子水供給主閥50和用來供給少 • 量去離子水的去離子水供給輔助閥51，因此不僅可以縮短 去離子水供給總體時間，還可以精確計量去離子水的供給 量。 還有，本發明漿料高比例混合裝置，通過具有+/-1% FS精度的流量計，計量少量添加的研磨粒子或各種添加劑 的供給量，並自動控制該供給量，因此可以很方便地調成 i 高精度的混合比例。 再有，本發明漿料高比例混合裝置可同時進行去離子 ^ 水的供給和研磨粒子或添加劑的供給過程，因此可大大縮 短漿料製備所需時間。 此外，本發明漿料高比例混合裝置由迴圈泵迴圈漿 料，並通過攪拌裝置進行攪拌，因此漿料的混合可達到全 面均勻、並減少攪拌所需時間。 另外，本發明漿料高比例混合裝置，可以不採用如液 9 1278030 位感測器等裝置，因此其配線變得簡單，無需因液位元感 測器的性能減退而進行定期維修，可以維持穩定的高精確 度。 【實施方式】 下面結合附圖，對本發明的漿料高比例混合裝置及混 合方法的較佳實施例進行詳細說明。 首先如圖1至圖3所示，本發明的漿料高比例混合裝 置包括： 攪拌箱2，在其内進行漿料的混合； 去離子水供給管60，與上述攪拌箱2和去離子水供給 源4連接，並提供去離子水； 去離子水供給主閥50，設置在上述去離子水供給管60 上； 去離子水供給輔助閥51，在上述去離子水供給管60 上，和上述去離子水主閥50並列設置； 電子秤30，設置在上述攪拌箱2的下端，用以測定注 入攪拌箱2的去離子水及漿料的量； 多支添加劑供給管62，分別接設於用以提供研磨粒子 和各種添加劑的添加劑供給源6，並連接於上述攪拌箱2 ; 多個流量控制閥52,分別設置在上述添加劑供給管62 上； 多個流量計32，分別設置在上述添加劑供給管62上； 1278030 控制部2〇’根據上述電子祥3〇測出的測定值 上述去離子水供給主㈣及絲子水供給獅閥5i y 合，並根據上述流量計32的測定值，來㈣ 開 52的開合。 夺工制間 本發明中上述去離子水供給源4供給的去離子 (deionizer water)是完全去除原水（谿俛幻中勺八呔 電解質之水，本發明中最好採用超純水，^的 CMP(Chemical Me—i PMishing)工程的高精確声待 另外’如圖1所示’上述攪拌箱2設有授拌 ^ ° 上述攪拌襄置10可以產生旋轉力，攪拌裝置 如馬達或旋轉氣缸等旋轉動力源12、連接於上述旋：: 源12軸上並可旋轉的旋轉轴16、接設於上述旋轉車由力 並用以獅供給到攪㈣2的絲子水及漿料_拌將^ 上述去離子水供給f 6()設置在上述去離子水供給 和上述擾拌箱2之間，並以—定深度設置在上 箱、 的内部。 見许相2 亦即，如果將上述去離子水供給管6〇的末端 在比㈣箱2中注人的去離子水表面（液面）更 ^ 樣即使將供給到上述㈣箱2的去離子水量設為最少，也 =:=:水供給管6〇供給的去離子水落賴 、子水表面（液面）而振盪去離子水的現象。 如果通過去離子水供給管6〇供給的去離子水落到授摔 1278〇3〇 :二中:離子水表面(液面）而振盪去離子水，就會在上 =:样3°計量的測定值上出現較大的誤差，因此;= 出精確的去離子水量。 +犯須I] 61上上述:去離子水供給辅助間51設置在去離子水分歧管 的上方Ί離子水分歧管61在上述去離子供給主闕50 供給離子水供給源4的方向）從上述絲子水 77歧’亚在上述去離子水供給m 50的下方（靠 近㈣箱2㈣向）與上述去離子水供給管6G合併。 上迷去離子水供給_ 5g__對來說流量多的大 述去離子水供給輔助閥51採用相對來說流量少的 上逑結構中，上述去離子水供給管5G則在剛開始需要 击離子水大量注入到授拌箱2時使用，而上述去離子水 則在已注滿1量以上的去離子水的情況下，需 要再精確注入去離子水時使用。 H、f上迷去料水主閥50和去離子水辅助閥51 斤才工制的流量比例大概設定為1:5以上。 ς如上所34，如果相去離子水主閥5G和去離子水輔助 控制供給到游箱2的去離子水量，就可以在-定量 去離子水總㈣85%左右以上）去離子水注滿之前， 開^去離子水供給㈣5G來提供大量的切子水，從而減 子纽人時間，在注滿—定量去料水之後，就關 才㈣子水主閥50 ’而僅以開啟去離子水辅助閥g 來提 12 .^/«030Mechanical Polishing) Engineering. Recently, with the high integration and high performance of LSI, it is important to flatten the surface of a large wafer and the like, so the application of CMp technology is more and more extensive. The CMP process is performed by the combined action of the chemical action of the slurry composed of the chemical liquid and the abrasive particles and the mechanical action of the abrasive particles. The above-mentioned polymer is first dispersed in an alkaline aqueous solution such as potassium hydroxide (Κ0Η) or ammonium hydroxide (Li 4〇H) or water containing a surfactant. 5 1278030 (S i 〇 2), oxidation Ming (A12 〇3), cerium oxide (Ce〇2), diamond and other abrasive particles form a fine particle dispersion (source liquid slurry), and then, according to the abrasive article, a surfactant and a hydrogen peroxide solution or stone for promoting chemical action An oxidizing agent such as xiao•acid iron, and an additive solution containing various additives are prepared. At present, a mixing device for manufacturing a CMP slurry generally uses a device such as a liquid level sensor to measure water and fine particle dispersions, a surfactant, an oxygenating agent, and various additives, thereby using a certain amount. Proportional mixing. > However, the dilution and mixing by a device such as a liquid level sensor are structurally complicated, and the structure such as piping and wiring is quite complicated, and since the performance of the liquid level sensor and the detector is lowered, regular maintenance is required. Also, because the increase in the number of uses causes a decrease in accuracy, it is difficult to precisely adjust the mixing ratio. In order to improve the above problems with the mixing device using the liquid level sensor, another technique is now to measure with a load cell (Load Ce 11). In this case, a device such as a liquid level sensor is not required, and piping and wiring are simplified, and the dilution ratio can be arbitrarily adjusted. However, under the condition of a high ratio of 1:10, the measurement accuracy cannot meet the technical requirements. . SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a high-mixing apparatus for slurry which utilizes electronic scale measurement and flow rate measurement, and can perform high-precision mixing even under a high ratio of 1:10 or more. And its wiring and other structures are not complicated. Another object of the present invention is to provide a high proportion mixing method of a slurry 6 1278030 and a flow rate control above the high ratio strip method, which uses an electronic scale to measure the amount of water in two stages, to agrave particles and additives, thereby : Accurate mixing can also be done under 1 condition. In order to solve the above object, the present invention adopts the following technical solutions. The slurry high-mixing device provided by the invention comprises: a stirring box in which the slurry is mixed; a deionized water supply pipe, the above-mentioned 撸, ,, the upper stirring phase and the deionized water supply source Transporting, sub-providing deionized water; - deionized water supply Μ 'disposed on the above-mentioned deionized water supply pipe; a deionized water supply auxiliary valve, and juxtaposed on the deionized water supply pipe and the deionized water main valve < an electronically located at the lower end of the above-mentioned swimming box for measuring the amount of deionized water and slurry injected into the stirring tank; and a plurality of additive supply pipes respectively connected to the abrasive particles and providing various additives An additive supply source connected to the stirring tank; a plurality of flow control valves respectively disposed on the additive supply pipe; a plurality of flow meters respectively disposed on the additive supply pipe; a control unit according to the electronic weighing The measured value is used to control the opening and closing of the deionized water supply main valve and the deionized water supply auxiliary valve, and the flow control valve is controlled according to the measured value of the flow meter Opening and closing. The high-mixing method of the slurry provided by the present invention comprises the following steps: · the round-in stage, inputting the set value and/or the mixing ratio, the critical value, the limit value, the error range of the various components, etc.; 1278030 The beginning of the supply of deionized water, Turning on the deionized water supply main valve and the deionization supply auxiliary valve disposed on the deionized water supply pipe, the deionized water supply pipe is used to provide deionized water; the deionized water measuring stage is measured and injected into the stirring tank by the electronic scale The amount of deionized water; the measured value and the set value measured in the deionized water measurement phase are compared in the deionized water amount comparison stage, and the deionized water is returned if the set value minus the measured value is greater than the critical value set in the above input stage In the measurement phase; in the main valve closing phase, in the deionized water measurement phase, if the set value minus the measured value is less than or equal to the threshold set in the input phase, the deionized water is supplied to the main valve; The electronic scale measures the amount of deionized water injected into the mixing tank; in the micro comparison phase, if the input phase is input If the measured value minus the measured value in the above micro-measurement stage is greater than the limit value set in the above input stage, the micro-test stage is returned; in the auxiliary valve closing stage, in the above-mentioned micro-comparison stage, if the set value is subtracted from the measured value less than or equal to the limit value Turning off the deionized water supply valve; the additive supply start stage is performed after the start of the deionized water supply phase, and the flow control valve disposed on each of the additive supply pipes is opened, wherein the additive supply pipe is used to supply the abrasive particles and Various additives; in the flow measurement phase, the flow rate through the additive supply pipe is measured; in the flow comparison phase, the measured value and the set value measured in the above flow measurement phase are compared, if the set value minus the measured value is greater than the above input stage If the set error range is returned to the flow measurement phase; in the flow closure phase, if the set value minus the measured value is less than or equal to the error range, the flow control valve is closed. The slurry high-mixing device and the mixing method of the present invention can be prepared by mixing deionized water and additives with a high dilution ratio of 1:10 ‘ (for example, 1:50-1:100). Further, the slurry high-mixing apparatus of the present invention simultaneously supplies the main valve 50 and the deionized water supply auxiliary valve 51 for supplying a small amount of deionized water by using deionized water for supplying a large amount of deionized water. Therefore, not only can the total time of deionized water supply be shortened, but also the supply amount of deionized water can be accurately measured. Further, the slurry high-mixing apparatus of the present invention can measure the supply amount of a small amount of added abrasive particles or various additives by a flow meter having an accuracy of +/- 1% FS, and automatically control the supply amount, so that it can be conveniently Adjust to i high precision mixing ratio. Further, the slurry high-mixing apparatus of the present invention can simultaneously perform deionized water supply and abrasive particle or additive supply, thereby greatly reducing the time required for slurry preparation. Further, the slurry high-mixing apparatus of the present invention recirculates the slurry by the loop pump and agitates by the stirring means, so that the mixing of the slurry can be uniform throughout and the time required for stirring can be reduced. In addition, the slurry high-mixing device of the present invention can be used without a device such as a liquid 9 1278030-position sensor, so that the wiring is simplified, and it is not necessary to perform regular maintenance due to the performance degradation of the liquid level sensor, and can be maintained. Stable high precision. [Embodiment] Hereinafter, preferred embodiments of the slurry high-mixing apparatus and mixing method of the present invention will be described in detail with reference to the accompanying drawings. First, as shown in FIG. 1 to FIG. 3, the slurry high-mixing apparatus of the present invention comprises: a stirring tank 2 in which slurry mixing is performed; a deionized water supply pipe 60, and the above-mentioned stirring tank 2 and deionized water. The supply source 4 is connected and supplied with deionized water; the deionized water is supplied to the main valve 50, and is disposed on the deionized water supply pipe 60; the deionized water supply auxiliary valve 51 is disposed on the deionized water supply pipe 60, and the above The deionized water main valve 50 is arranged side by side; the electronic scale 30 is disposed at the lower end of the agitating tank 2 for measuring the amount of deionized water and slurry injected into the stirring tank 2; the plurality of additive supply pipes 62 are respectively connected to An additive supply source 6 for supplying abrasive particles and various additives, and connected to the agitation tank 2; a plurality of flow control valves 52 respectively disposed on the additive supply pipe 62; a plurality of flow meters 32 respectively disposed on the additive The supply pipe 62; 1278030 control unit 2'' according to the measured value measured by the electronic device, the deionized water supply main (4) and the silk water supply lion valve 5i y, according to the measured value of the flow meter 32, Come (four) Open the opening and closing of 52. In the present invention, the deionizer water supplied from the above-mentioned deionized water supply source 4 is completely removed from the raw water (the water of the scorpion scorpion scorpion electrolyte), and the ultra-pure water is preferably used in the present invention. The high precision acoustics of the CMP (Chemical Me-i PMishing) project is additionally 'as shown in Fig. 1'. The agitating tank 2 is provided with a mixing mechanism. The stirring device 10 can generate a rotating force, such as a motor or a rotating cylinder. The rotary power source 12 is connected to the above-mentioned rotary:: the rotary shaft 16 which is rotatable on the source 12 shaft, and the filament water and the slurry which are connected to the rotating vehicle by the force and supplied to the stir (four) 2 by the lion. The deionized water supply f 6 () is disposed between the above-mentioned deionized water supply and the above-mentioned scramble tank 2, and is disposed at a predetermined depth in the interior of the upper tank. See the phase 2, that is, if the above deionized water is to be used The end of the supply pipe 6〇 is more than the surface of the deionized water (liquid level) injected into the (four) tank 2, even if the amount of deionized water supplied to the above (4) tank 2 is set to the minimum, =:=: water supply pipe The deionized water supplied by 6〇 falls on the surface of the sub-water (liquid level) and oscillates deionized The phenomenon of water. If the deionized water supplied through the deionized water supply pipe 6〇 falls to the 1278〇3〇: 2: ion water surface (liquid surface) and oscillates the deionized water, it will be on the top =: sample 3 ° There is a large error in the measured value of the measurement, therefore; = the exact amount of deionized water. + I must be I] 61 above: Deionized water supply auxiliary room 51 is set above the deionized water manifold The branch pipe 61 is supplied from the above-described deionized water supply m 50 (near the (4) tank 2 (four) direction) to the deionized ion in the direction in which the deionized supply main enthalpy 50 is supplied to the ionized water supply source 4) The water supply pipe 6G is merged. The above-mentioned deionized water supply auxiliary valve 51 uses a relatively small flow rate in the upper crucible structure, and the deionized water supply tube 5G needs to strike ions at the beginning. When a large amount of water is injected into the mixing tank 2, the above-mentioned deionized water is used when it is filled with more than one deionized water, and it is necessary to accurately inject deionized water. H, f on the water main valve 50 and deionized water auxiliary valve 51 kg production system flow ratio is probably set to 1:5 or more. ςIf 34, if the phase ionized water main valve 5G and deionized water assist control the amount of deionized water supplied to the tank 2, it can be opened before the deionized water is filled in the total amount of deionized water (about 85%). ^Deionized water supply (4) 5G to provide a large amount of cut water, thus reducing the time of the new person, after filling-quantitatively removing the water, it is closed (4) the sub-water main valve 50' and only to open the deionized water auxiliary valve g To mention 12 .^/«030
St、、藉以在計量㈣ 相對多的、、ώ旦日^測出精確的流量值，並且可以減少在供給 /”L里日守可能會發生的偏差。 根據需要，上述電子秤30可採用n 以下的稱重感測w: w.1-〇.〇lg 抹狄t述電子秤3G設置錢拌箱2的下端，由此計量向授 相20注入的去離子水或者漿料重量。 量為=’用以製造CMP 1程中研錢的去離子水供給流 UFS，I鐘I0 —撤左右，如使用流量計時，其精度為仏 偏、，夕*此當使用每分鐘最高流量達2〇e的流量計時，其 偏ί '達+/— 2G()ee ’這將大大降低其精度。為減少這種 精度約:;,rt鐘最㈣量為1咖繼量計，則其 、 CC’但此時去離子水的供給時間會增加2〇倍。 向授本電子科30 ’其可以高度的精確度計量 /的去離子水及漿料，本發明同時還使用去 二子水供給主_ 5()和去離子水供給輔助閥5卜在達到+ 计總量的90%左右前，就進行大量供給，而在其後，僅= 過去離子水輔助闊5丨以少量緩慢供給祕子水，並進行’ 量，因此可同時滿足精度的提高和去離子水供給時間的縮 短。 、、百 上述添加劑供給源6為多個並列設置，以讓可以分別 供給各種添加劑即二氧化石夕（SiQ〇、氧化紹⑺他）、二 氧化鈽（Ce〇2)、金剛石等研磨粒子、氫氧化鉀（丽）或 13 1278030 氫氧化銨（NH4〇H)等的驗性水溶液、表面活性劑、以及用 以促進化學作用的過氧化氫水或硝酸鐵等氧化劑，以使這 些研磨粒子和添加劑按一定比例混合在去離子水中，從而 4 製造研磨漿。 例如，並列置設用以供給研磨粒子的添加劑供給源6、 -用以供給鹼性水溶液的添加劑供給源6、用以供給表面活 . 性劑的添加劑供給源6、用以提供氧化劑的添加劑供給源 ，6。 • 上述每個添加劑供給源6分別接設上述添加劑供給管 • 62，由此可分別把各種添加劑供到攪拌箱2。 如圖1所示，也可在每個添加劑供給管62上分別設置 開關閥54,用以和上述流量控制閥52另行進行開關動作。 如圖3所示，上述控制部2 0接收由上述電子样3 0、流 量計32傳送的測定信號（測定值）。 並且，由上述控制裝置20向上述流量控制閥52發送 ► 根據上述測定信號（測定值）所作出的控制信號。 4 上述流量控制閥52連接有流量控制部42,上述流量控 制部42根據上述控制部20的控制信號，調節流量控制閥 52的開度。 如圖1及圖2所示，上述流量控制部42包括流量指示 調節計 44 和電氣比例閥 （Electro-pneumatic Proportional Valve) 46，上述流量指示調節計44用以比 較上述流量計32測出的流量值和設定值，來確定控制輸出 14 1278030 值；而上述電氣比例閥46用以將上述控制輸出值轉換為氣 壓，以調節流量控制閥52的開度。 • 上述流量計32最好具有+/- 1%FS精度，藉以準確地計 _ 量以少量（微小比例）添加的添加劑。 上述流量控制部42可以是控制部20的一部分，也可 . 以作為單獨的裝置，附加設置在控制部20。 另外如圖1所示，上述每個電氣比例閥46分別接設有 _ 空氣供給管72，上述空氣供給管72連接於以規定的氣壓 • 提供潔淨空氣的壓縮空氣供給源8。 - 上述空氣供給管72上設置有如球閥等止回閥76和如 調節閥等壓力控制閥74。 此外，如圖3所示，上述去離子水供給主閥50及/或 去離子水輔助閥51亦可設由控制部20自動控制。 例如，上述去離子水供給主閥50及/或去離子水供給 輔助閥51上也可以接設流量控制部40，以此通過開度的 > 調節來控制所供應的流量。此時，以流量控制閥52構成上 • 述去離子水供給主閥50及去離子水供給輔助閥51，並最 _ 好是另行設置開關閥54，用以開合去離子水供給管60及 去離子水分歧管61。 還有如圖3所示，上述控制部20可以連接攪拌裝置10。 此外為了促進攪拌及混合並使其混合均勻，如圖1所 示，上述攪拌箱2可接設有用以迴圈注入到其内的去離子 水和漿料的迴圈泵90及迴圈管92。 15 1278030 根據需要’可以在上述迴圈管92上設置開關閥94和 電磁閥9 6。 下面詳細說明利用本發明漿料高比例混合裝置，以j : 的高比例混合去離子水和添加劑，來製造漿料的漿料高 比例混合方法。 圖4表示本發明漿料高比例混合方法的一實施例，其 包括如下步驟： > 輸入階段S10 ,輸入各成分的設定值及/或混合比例、 臨界值、界限值、誤差範圍等； 去離子水供給開始階段S20,啟開設置在去離子水供給 官60上的去離子水供給主閥50和去離子供給辅助閥51 ; 去離子水測定階段S30，用電子秤30測定注入攪拌箱 2内的去離子水量； 去離子水量比較階段S40,比較上述去離子水測定階段 丨S30所測出的測定值和設定值，如果設定值減去測定值大 於上述輸入階段S10設定的臨界值，則返回所去離子水測 定階段S30; 主閥關閉階段S50，在上述去離子水測定階段以〇中， 如果設定值減去測定值小於或等於臨界值，則關閉去離子 水供給主閥50 ; 微測階段S6G，用電子秤3G測定注入到擾掉箱2的去 離子水量； 微量比較階段S7G，如果在上述ipM S1() 16 1278030 ， 設定值減去上述微測階段S60的測定值大於上述輸入階段 S10中設定的界限值，則返回微測階段S60 ; • 輔助閥關閉階段S80,在上述微量比較階段S70中，如 . 果設定值減去測定值小於或等於界限值，則關閉去離子水 供給輔助閥51 ; ， 添加劑供給開始階段S90’在上述去離子水供給開始階 \ 段S20之後開始進行，並啟開流量控制閥52，上述流量控 Φ 制閥52分別設置在上述用以供給研磨粒子及各種添加劑 • 的每一個添加劑供給管62上； • 流量測定階段S92，測定通過添加劑供給管62的流量； 流量比較階段S94,比較上述流量測定階段S92的測定 值和設定值，如果設定值減去測定值大於上述輸入階段S10 5又定的誤差範圍，則返回流量測定階段別2 ; 流量關閉階段S96，在上述流量比較階段S94中，如果 • 設定值減去測定值小於或等於誤差範圍，則關閉流量控制 閥52。 如圖4所示，上述添加劑供給開始階段S9〇可以在上 述主閥關閉階段S50之後立即進行，或者如圖5所示，上 述添加劑供給開始階段S90亦可在去離子水供給開始階段 S20之後，和微測階段S3〇同時進行。 上述添加劑供給開始階段S90還可在開始給攪拌箱2 供給去離子水之後，通過和去離子水供給獨立的過程進 行’並在完成上述流量關閉階段S96之後，以獨立於去離 17 1278030 子水供給的過程，進行研磨粒子或添加劑的供給過程。 上述添加劑供給開始階段S90到上述流量關閉階段 S96，可以同時進行研磨粒子和其他各種添加劑的供給，也 可逐一依次反復進行。 在上述流量測定階段S92,通過分別設置在每個添加叫 供給管62上的流量計32來測定向上述攪拌箱2供給的& 量。 在上述流量比較階段S94，通過設置在上述控制部如 及/或流量控制部42的流量指示調節計44，比較上述流量 計32所測出的測定值和上述輸入階段sl〇中輸入的設定 值，來確定控制輸出值，並利用電氣比例閥46調節流量= 制閥52的開度，上述電氣比例閥46可根據上述控制輪出 值轉換由壓縮空氣供給源8通過空氣供給管72供給的氣 壓。 在上述輸入階段sl〇中，把漿料製備中所需要的去離 子水買、去離子水和研磨粒子或各種添加劑的混合比例、 研磨粒子或各種添加劑的量等資料登錄到控制部2〇中。 並且在上述輸入階段S10中，設定並輸入臨界值和將 上述電子秤30的誤差範圍等計在其内的界限值（對去離子 水里的精度），上述臨界值對應於一定比例（例如 之内的比例）的去離子水總量。 ' 在上速階段S10中，如果將臨界值設定得過高，會導 致過早地關_來供給大量去離子水的去離子水供給二閥 18 伐 1278030 50，因此去離子水的供給需要很長時間。 而如果將臨界值設定得過低，會導致用來提供大量去 • 離子水的去離子水供給主閥50關閉過慢，因此由於對流動 ' 液面不易進行精確測定，導致電子秤30所測出的資料不精 石萑’而在液面穩定時測出的貧料^則有時會超過設定值^ • 去離子水供給輔助閥51有可能根本起不到任何作用。 • 此外，在上述輸入階段S10中考慮上述流量計3 2的誤 > 差範圍，將研磨粒子或各種添加劑的界限值（精度）作為 • 誤差範圍來設定並輸入到控制部。 • 上述輸入階段S10之後的過程可通過上述控制部20來 自動控制。 上述控制部20及/或流量控制部40、42可採用微處理 器、PLC系統等。 以上說明的是本發明漿料高比例混合裝置及混合方法 的較佳實施例，而本發明的保護範圍並不限於上述内容， > 可以在申請專利範圍和說明書及其附圖範圍内進行各種變 化及修飾，這種變化及修飾應屬於本發明的保護範圍内。 【圖式簡單說明】 圖一是本發明漿料高比例混合裝置一實施例的配管示 意圖。 圖二是本發明漿料高比例混合裝置一實施例中流量控 制部的局部配管放大示意圖。 19 1278030 圖三是本發明漿料高比例混合裝置一實施例中控制部 的控制過程框圖。 圖四是本發明漿料高比例混合方法一實施例的流程 圖。 圖五是本發明漿料高比例混合方法另一實施例的流程 圖0 【主要元件符號說明】 2、攪拌箱 6、添加劑供給源 10、攪拌裝置 14、攪拌槳葉 20、控制部 3 2、流量計 44、流量指示調節計 50、去離子水供給主閥 52、流量控制閥 60、去離子水供給管 6 2、添加劑供給管 74、壓力控制閥 90、迴圈泵 94、開關閥 S10、輸入階段St, by which the accurate flow value is measured in the measurement (four), and the daytime, and the deviation that may occur in the supply/"L can be reduced. The electronic scale 30 can be used as needed. The following weighing sensing w: w.1-〇.〇lg The electronic scale 3G is set to the lower end of the mixing tank 2, thereby metering the weight of the deionized water or slurry injected into the phase 20. = 'Used to make CMP 1 process in the deionized water supply flow UFS, I clock I0 - to withdraw left and right, if using a flow meter, its accuracy is 仏 bias, * * When using the maximum flow per minute up to 2 〇e When the flowmeter, its bias 'up to + / - 2G () ee 'this will greatly reduce its accuracy. To reduce this accuracy about:;, rt clock most (four) amount is 1 calorie meter, then its, CC' However, at this time, the supply time of deionized water will increase by 2 times. To the teaching electronic department 30 'which can measure the deionized water and slurry with high accuracy, the present invention also uses the deionized water supply to the main _ 5 () and the deionized water supply auxiliary valve 5, before reaching about 90% of the total amount of the meter, a large amount of supply is performed, and thereafter, only = The deionized water assists the wide 5 丨 to supply the secret water slowly, and performs the 'quantity, so the accuracy can be improved and the deionized water supply time can be shortened at the same time. The above-mentioned additive supply source 6 is arranged in parallel. So that it can supply various additives, namely, silica dioxide (SiQ〇, oxidized (7) him), cerium oxide (Ce〇2), abrasive particles such as diamond, potassium hydroxide (Li) or 13 1278030 ammonium hydroxide (NH4).验H), etc., an aqueous solution, a surfactant, and an oxidizing agent such as hydrogen peroxide water or iron nitrate to promote chemical action, so that the abrasive particles and additives are mixed in deionized water in a certain ratio, thereby producing grinding For example, an additive supply source 6 for supplying abrasive particles, an additive supply source 6 for supplying an alkaline aqueous solution, an additive supply source 6 for supplying a surface active agent, and an additive for supplying an oxidant are provided. Additive supply source, 6. • Each of the additive supply sources 6 described above is respectively connected to the additive supply pipe 62, thereby supplying various additives to the stirring. 2. As shown in Fig. 1, an opening and closing valve 54 may be respectively disposed on each of the additive supply pipes 62 for separately performing a switching operation with the flow rate control valve 52. As shown in Fig. 3, the control unit 20 receives The measurement signal (measured value) transmitted from the electronic sample 30 and the flow meter 32. The control device 20 transmits a control signal to the flow rate control valve 52 based on the measurement signal (measured value). The control valve 52 is connected to the flow rate control unit 42, and the flow rate control unit 42 adjusts the opening degree of the flow rate control valve 52 based on the control signal of the control unit 20. As shown in Figs. 1 and 2, the flow rate control unit 42 includes a flow rate indication. a regulator 44 and an electric proportional valve (Electro-pneumatic Proportional Valve) 46, wherein the flow indicating regulator 44 is configured to compare the flow rate value and the set value measured by the flow meter 32 to determine a control output 14 1278030 value; and the electrical ratio The valve 46 is configured to convert the above control output value into air pressure to adjust the opening of the flow control valve 52. • The flow meter 32 described above preferably has an accuracy of +/- 1% FS to accurately quantify the additive added in small amounts (small proportions). The flow rate control unit 42 may be part of the control unit 20, or may be provided as a separate device in the control unit 20. Further, as shown in Fig. 1, each of the electric proportional valves 46 is connected to an air supply pipe 72 which is connected to a compressed air supply source 8 which supplies clean air at a predetermined air pressure. - The air supply pipe 72 is provided with a check valve 76 such as a ball valve and a pressure control valve 74 such as a regulating valve. Further, as shown in Fig. 3, the deionized water supply main valve 50 and/or the deionized water auxiliary valve 51 may be automatically controlled by the control unit 20. For example, the flow rate control unit 40 may be connected to the deionized water supply main valve 50 and/or the deionized water supply auxiliary valve 51, whereby the supplied flow rate is controlled by the opening > adjustment. At this time, the flow control valve 52 constitutes the deionized water supply main valve 50 and the deionized water supply auxiliary valve 51, and most preferably, the on-off valve 54 is separately provided for opening and closing the deionized water supply pipe 60 and Deionized water manifold 61. Further, as shown in FIG. 3, the control unit 20 may be connected to the stirring device 10. Further, in order to promote agitation and mixing and to uniformly mix them, as shown in FIG. 1, the agitation tank 2 may be provided with a loop pump 90 and a loop tube 92 for deionized water and slurry injected into the loop. . 15 1278030 The on-off valve 94 and the solenoid valve 96 can be provided on the above-mentioned return pipe 92 as needed. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a high-scale mixing method of a slurry for producing a slurry by mixing deionized water and an additive in a high ratio of j: using the slurry high-mixing apparatus of the present invention will be described in detail. Figure 4 is a view showing an embodiment of the slurry high-mixing method of the present invention, comprising the steps of: > inputting stage S10, inputting the set value and/or mixing ratio, threshold value, limit value, error range, etc. of each component; The ionized water supply start stage S20, the deionized water supply main valve 50 and the deionization supply auxiliary valve 51 provided on the deionized water supply officer 60 are opened; the deionized water measurement stage S30, and the injection agitator 2 is measured by the electronic scale 30 The amount of deionized water in the deionized water amount comparison stage S40, comparing the measured value and the set value measured in the deionized water measuring stage 丨S30, if the set value minus the measured value is greater than the critical value set by the input stage S10, Returning to the deionized water measuring stage S30; the main valve closing stage S50, in the above deionized water measuring stage, if the set value minus the measured value is less than or equal to the critical value, the deionized water is supplied to the main valve 50; In the measuring stage S6G, the amount of deionized water injected into the disturbing box 2 is measured by the electronic scale 3G; the micro comparison stage S7G, if in the above ipM S1() 16 1278030, the set value is subtracted from the above micro If the measured value of the stage S60 is greater than the limit value set in the input stage S10, the process returns to the micro-measurement stage S60; • the auxiliary valve closing stage S80, in the above-mentioned micro-comparison stage S70, if the set value is subtracted from the measured value is less than or equal to The threshold value is turned off, and the deionized water supply auxiliary valve 51 is closed; the additive supply start stage S90' is started after the above-described deionized water supply start stage/segment S20, and the flow control valve 52 is opened, and the flow rate control Φ valve 52 is opened. Each of the additive supply pipes 62 for supplying the abrasive particles and various additives is provided; • The flow rate measurement step S92 measures the flow rate through the additive supply pipe 62; and the flow rate comparison phase S94 compares the measurement of the flow rate measurement phase S92. The value and the set value are returned to the flow measurement stage 2 if the set value minus the measured value is greater than the error range determined by the input stage S10 5; the flow closing stage S96, in the flow comparison stage S94, if the set value is decreased When the measured value is less than or equal to the error range, the flow control valve 52 is closed. As shown in FIG. 4, the additive supply start phase S9〇 may be performed immediately after the main valve closing phase S50, or as shown in FIG. 5, the additive supply start phase S90 may be after the deionized water supply start phase S20, Simultaneously with the micro-measurement stage S3〇. The above-described additive supply start phase S90 may also be performed by a separate process from the deionized water supply after the start of supplying the deionized water to the agitation tank 2, and after completing the above-described flow shut-down phase S96, independently from the removal of the 17 1278030 sub-water The process of supplying, the process of supplying abrasive particles or additives. In the above-described additive supply start stage S90 to the flow rate closing stage S96, the supply of the abrasive particles and various other additives may be simultaneously performed, or may be repeated one by one. In the flow rate measurement step S92, the amount supplied to the agitation tank 2 is measured by the flow meter 32 provided in each of the supply pipes 62. In the flow rate comparison step S94, the flow rate indicating regulator 44 provided in the control unit, for example, and/or the flow rate control unit 42, compares the measured value measured by the flow meter 32 with the set value input in the input stage sl1. To determine the control output value, and to adjust the flow rate = the opening degree of the valve 52 by the electric proportional valve 46, the electric proportional valve 46 can convert the air pressure supplied from the compressed air supply source 8 through the air supply pipe 72 according to the above control wheel output value. . In the above input stage sl〇, the deionized water, the deionized water and the abrasive particles or the mixing ratio of the various additives, the amount of the abrasive particles or various additives, which are required for the preparation of the slurry, are registered in the control unit 2 . Further, in the input stage S10, a threshold value and a limit value (accuracy in deionized water) in which the error range of the electronic scale 30 is counted and the like are set and input, and the threshold value corresponds to a certain ratio (for example, The ratio of the inside) the total amount of deionized water. ' In the upper speed stage S10, if the threshold is set too high, it will lead to premature shutdown _ to supply a large amount of deionized water to the deionized water supply two valves 18 1278030 50, so the supply of deionized water needs to be very Long time. If the threshold is set too low, the deionized water supply main valve 50 for providing a large amount of deionized water is turned off too slowly, so that the electronic scale 30 is measured because it is difficult to accurately measure the flow 'liquid level. The information obtained is not fine stone 萑 'and the poor material measured when the liquid level is stable sometimes exceeds the set value ^ • The deionized water supply auxiliary valve 51 may not have any effect at all. In addition, in the input stage S10, the error range of the flow meter 3 2 is considered, and the limit value (accuracy) of the abrasive particles or various additives is set as the error range and input to the control unit. • The process after the above input stage S10 can be automatically controlled by the above-described control unit 20. The control unit 20 and/or the flow rate control units 40 and 42 may be a microprocessor, a PLC system or the like. The above description is a preferred embodiment of the slurry high-mixing device and the mixing method of the present invention, and the scope of protection of the present invention is not limited to the above, > various types can be carried out within the scope of the patent application and the specification and the drawings thereof. Variations and modifications, such variations and modifications are intended to fall within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a piping schematic of an embodiment of a slurry high-mixing apparatus of the present invention. Fig. 2 is an enlarged schematic view showing the partial piping of the flow rate control unit in an embodiment of the slurry high-mixing apparatus of the present invention. 19 1278030 Fig. 3 is a block diagram showing the control process of the control unit in an embodiment of the slurry high-mixing apparatus of the present invention. Fig. 4 is a flow chart showing an embodiment of the slurry high-mixing method of the present invention. Figure 5 is a flow chart of another embodiment of the slurry high-mixing method of the present invention. [Main element symbol description] 2. The stirring tank 6, the additive supply source 10, the stirring device 14, the stirring blade 20, and the control portion 3 2. The flow meter 44, the flow rate indicating regulator 50, the deionized water supply main valve 52, the flow control valve 60, the deionized water supply pipe 6, the additive supply pipe 74, the pressure control valve 90, the circulation pump 94, the on-off valve S10, Input stage
4、去離子水供給源 8、壓縮空氣供給源 12、旋轉動力源 16、旋轉軸 30、電子秤 42、流量控制部 46、電氣比例閥 51、去離子供給輔助閥 54、開關閥 61、去離子水分歧管 72、空氣供給管 7 6、止回閥 92、迴圈管 96、電磁閥 S20、去離子水供給開始階段 20 1278030 S30、去離子水測定階段 S50、主閥關閉階段 S70、微量比較階段 S90、添加劑供給開始階段 S94、流量比較階段 S40、去離子水量比較階段 S60、微測階段 S80、輔助閥關閉階段 S92、流量測定階段 S96、流量關閉階段。4. Deionized water supply source 8, compressed air supply source 12, rotary power source 16, rotating shaft 30, electronic scale 42, flow control unit 46, electric proportional valve 51, deionization supply auxiliary valve 54, switching valve 61, Ion water branch pipe 72, air supply pipe 76, check valve 92, loop pipe 96, solenoid valve S20, deionized water supply start stage 20 1278030 S30, deionized water measurement stage S50, main valve closing stage S70, trace amount Comparison stage S90, additive supply start stage S94, flow rate comparison stage S40, deionized water quantity comparison stage S60, micro measurement stage S80, auxiliary valve closing stage S92, flow rate measurement stage S96, and flow rate closing stage.
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