CN203125329U - Polishing liquid supply device for polishing equipment of chemical machinery - Google Patents
Polishing liquid supply device for polishing equipment of chemical machinery Download PDFInfo
- Publication number
- CN203125329U CN203125329U CN 201320023394 CN201320023394U CN203125329U CN 203125329 U CN203125329 U CN 203125329U CN 201320023394 CN201320023394 CN 201320023394 CN 201320023394 U CN201320023394 U CN 201320023394U CN 203125329 U CN203125329 U CN 203125329U
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- polishing fluid
- polishing liquid
- storage tank
- polishing
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a polishing liquid supply device for polishing equipment of chemical machinery. The polishing liquid supply device comprises a three-way electromagnetic valve, a flow meter, a polishing liquid storing tank, a mixing motor, a mixing vane, a coil pipe, a liquid level sensing device and a temperature measuring device, wherein the three-way electromagnetic valve is communicated with a deionizing water conveying pipe and a polishing liquid conveying pipe, the flow meter is communicated with a three-way electromagnetic valve output pipe, the polishing liquid storing tank is communicated with the flow meter, the mixing motor is arranged above the polishing liquid storing tank, the mixing vane is driven by the mixing motor, the coil pipe is arranged in the polishing liquid storing tank and used for cooling, the polishing liquid storing tank is communicated with a material to be polished through an output pipe, the mixing motor is controlled by a variable-frequency governor, and a heat-preserving layer is arranged on the outer side of the polishing liquid storing tank. The concentration of needed polishing liquid is proportioned due to the fact that the flow meter controls amount of polishing liquid and deionizing water, and the mixing motor evenly mixes the polishing liquid and the deionizing water. The concentration of the polishing liquid can be automatically proportioned, and temperature of cooling liquid in the coil pipe can be adjusted through arrangement of the temperature-measuring device so that the temperature can be constant.
Description
Technical field
The utility model relates to the polishing fluid feeding mechanism on the chemical-mechanical polisher of semiconductor crystal wafer, adopts the chemical-mechanical polisher of this device when wafer is polished, and can obtain the polishing fluid of finite concentration and uniform temperature.
Background technology
Chemically mechanical polishing (CMP) is a kind of to semi-conducting material or the substrate of other types of material carries out planarization or the method for polishing.Be widely used in integrated circuit (IC) manufacturing industry.Chemically mechanical polishing is the mechanical grinding double action in conjunction with the corrosion of chemical solution in the polishing fluid and abrasive particle, makes silicon wafer obtain high flatness and a technology of flatness.The concentration of polishing fluid and temperature are the principal elements that influences chemical reaction velocity, for flatness and the flatness that guarantees silicon chip surface, chemical reaction velocity in the polishing process must be consistent with mechanism speed, if chemical reaction velocity is greater than mechanism speed, to cause the silicon chip surface seriously corroded, remove inhomogeneous, thereby make quality of finish descend, otherwise, to cause silicon chip surface to scratch, influence the silicon chip surface quality.Therefore, in polishing process, must accurately control concentration and the temperature of polishing fluid.Chemical-mechanical polisher to the requirement of clean room than higher, unsuitable artificial deallocation than and the concentration of control polishing fluid.So, press for a kind of device of the polishing fluid of proportioning easily concentration to reduce the use cost of clean room.
The utility model content
The utility model provides a kind of polishing fluid feeding mechanism that can accurately control polishing fluid concentration and temperature easily.
For solving the problems of the technologies described above technical solution adopted in the utility model be: a kind of polishing fluid feeding mechanism for chemical-mechanical polisher, its key technology is: it comprises the three-way magnetic valve that is communicated with deionized water carrier pipe and polishing fluid carrier pipe, the flowmeter that is communicated with the three-way electrovalve efferent duct, with the polishing fluid storage tank of flowmeter via pipeline connection, be located at the stirring motor of polishing fluid storage tank top, stirring vane by the stirring motor driving, be located at the coil pipe that is used for cooling in the polishing fluid storage tank, last liquid level sensing device, following liquid level sensing device and temperature measuring equipment, described polishing fluid storage tank is communicated to polished material by efferent duct; Described stirring motor is controlled via variable-frequency governor, and described polishing fluid storage tank outside is provided with heat-insulation layer.
Described three-way magnetic valve is three-position valve, and right position connects the polishing fluid carrier pipe, and position, a left side connects the deionized water carrier pipe, closes during meta.
Described stirring vane is located at below the polishing fluid liquid level.
Described temperature measuring equipment is installed in the bottom of storage tank.
The beneficial effect that adopts technique scheme to produce is: the utility model comes the concentration of the required polishing fluid of proportioning by the amount of flowmeter control polishing fluid and deionized water, by stirring motor polishing fluid and deionized water is mixed; The polishing fluid for preparing is equipped with liquid level sensing device by a polishing fluid storage tank storage that indicates scale in the polishing fluid storage tank, can control the capacity of polishing fluid; The utility model can be according to different needs automatic mixing polishing fluid concentration, and regulate the temperature of cooling fluid in the coil pipe by the temperature measuring equipment that arranges, and to keep the constant of temperature, polishing fluid storage tank outside is provided with heat-insulation layer, can prevent that temperature from descending fast; Described stirring motor is controlled by variable-frequency governor, can regulate mixing speed as required flexibly, improves mixing effect.
Description of drawings
Fig. 1 is the apparatus structure schematic diagram of utility model for this reason;
Wherein, 101, three-way magnetic valve; 102, flowmeter; 103, stirring motor; 104, coil pipe; 105, stirring vane; 106, polishing fluid storage tank; 107, go up liquid level sensor; 108, following liquid level sensor; 109, temperature measuring equipment; 110, deionized water carrier pipe; 111, polishing fluid storage tank; 112, efferent duct; 113, variable-frequency governor.
The specific embodiment
Below in conjunction with the drawings and specific embodiments the utility model is elaborated:
Referring to accompanying drawing 1, the utility model comprises the three-way magnetic valve 101 that is communicated with deionized water carrier pipe 110 and polishing fluid carrier pipe 111, the flowmeter 102 that is communicated with three-way electrovalve 101 efferent ducts, with the polishing fluid storage tank 106 that have scale of flowmeter 102 via pipeline connection, be located at the stirring motor 103 of polishing fluid storage tank 106 tops, stirring vane 105 by stirring motor 103 drivings, be located at the coil pipe 104 that is used for cooling in the polishing fluid storage tank 106, last liquid level sensing device 107, following liquid level sensing device 108 and temperature measuring equipment 109, described polishing fluid storage tank 106 is communicated to polished material by efferent duct 112; Described stirring motor 103 is via variable-frequency governor 113 control, like this can be convenient stir control, described polishing fluid storage tank 106 outsides are provided with heat-insulation layer.Described liquid level sensing device, following liquid level sensing device, temperature measuring equipment and the magnetic valves etc. gone up all are connected with a control device.Described flowmeter 102 is used for measuring the flow of the liquid that flows into storage tank with the concentration of preparation polishing fluid.Be connected with the cooling fluid of uniform temperature in the described coil pipe 104, be used for setting the temperature of storage tank polishing fluid, and make it to keep constant.Last liquid level sensing device 107, following liquid level sensing device 108 can limit the liquid level of polishing fluid in the polishing fluid storage tank 106, when the polishing fluid storage tank reaches heap(ed) capacity, last liquid level sensing device 107 sends signal to control device, control device makes magnetic valve 101 be in meta, stops to prepare polishing fluid.When polishing fluid storage tank 106 reached minimum capacity, following liquid level sensor 108 sent signal to control device, the arrestment running, and make magnetic valve 101 be in right position, prepare polishing fluid again.
Described three-way magnetic valve 101 is three-position valve, and right position connects polishing fluid carrier pipe 111, and position, a left side connects deionized water carrier pipe 110, closes during meta.
Described stirring vane 105 is located at below the polishing fluid liquid level.When the preparation polishing fluid, the stirring vane rotation makes polishing fluid evenly mix with deionized water.
Described temperature measuring equipment 109 is installed in the bottom of storage tank 106, is used for the variations in temperature of monitoring storage tank polishing fluid, and to control device, control device is regulated the temperature of cooling fluid according to value of feedback with measurement feedback, thereby controls the temperature of polishing fluid.
During the utility model work, three-way magnetic valve 101 is used for switching the liquid that flows into storage tank, and 101 metas are closed, and right bit stream is gone into polishing fluid, and left bit stream is gone into deionized water.If flowmeter 102 measurement of discharges are q, then the influent amount is
(t is the time) can prepare the concentration of polishing fluid by controlling the amount that flows into polishing fluid and deionized water.The volume of polishing fluid storage tank 106 is according to the instructions for use of chemical-mechanical polisher design, and control device can be according to last liquid level sensing device 107, the signal of liquid level sensing device 108 is controlled the switching of three-way magnetic valve 101 and made that polishing fluid maintains in the spendable scope in the polishing fluid storage tank down.Polishing fluid variation of temperature in the temperature measuring equipment 109 monitoring storage tanks, in control device, control device is regulated the temperature of cooling fluid according to measured value with measurement feedback, thereby controls the temperature of polishing fluid.The temperature of polishing fluid is controlled by coil pipe, and the temperature measuring equipment in the storage tank carries back temperature signal the control device of coil circuit to form the closed-loop control of polishing fluid temperature.
Claims (4)
1. polishing fluid feeding mechanism that is used for chemical-mechanical polisher, it is characterized in that: it comprises the three-way magnetic valve (101) that is communicated with deionized water carrier pipe (110) and polishing fluid carrier pipe (111), the flowmeter (102) that is communicated with three-way electrovalve (101) efferent duct, with the polishing fluid storage tank (106) that have scale of flowmeter (102) via pipeline connection, be located at the stirring motor (103) of polishing fluid storage tank (106) top, stirring vane (105) by stirring motor (103) driving, be located at the coil pipe (104) that is used for cooling in the polishing fluid storage tank (106), last liquid level sensing device (107), following liquid level sensing device (108) and temperature measuring equipment (109), described polishing fluid storage tank (106) is communicated to polished material by efferent duct (112); Described stirring motor (103) is via variable-frequency governor (113) control, and described polishing fluid storage tank (106) outside is provided with heat-insulation layer.
2. the polishing fluid feeding mechanism for chemical-mechanical polisher according to claim 1, it is characterized in that: described three-way magnetic valve (101) is three-position valve, right position connects polishing fluid carrier pipe (111), and position, a left side connects deionized water carrier pipe (110), closes during meta.
3. the polishing fluid feeding mechanism for chemical-mechanical polisher according to claim 1, it is characterized in that: described stirring vane (105) is located at below the polishing fluid liquid level.
4. the described polishing fluid feeding mechanism for chemical-mechanical polisher of claim 1, it is characterized in that: described temperature measuring equipment (109) is installed in the bottom of storage tank (106).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320023394 CN203125329U (en) | 2013-01-17 | 2013-01-17 | Polishing liquid supply device for polishing equipment of chemical machinery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320023394 CN203125329U (en) | 2013-01-17 | 2013-01-17 | Polishing liquid supply device for polishing equipment of chemical machinery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203125329U true CN203125329U (en) | 2013-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320023394 Expired - Fee Related CN203125329U (en) | 2013-01-17 | 2013-01-17 | Polishing liquid supply device for polishing equipment of chemical machinery |
Country Status (1)
| Country | Link |
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| CN (1) | CN203125329U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107520759A (en) * | 2016-06-21 | 2017-12-29 | 上海新昇半导体科技有限公司 | A kind of polishing solution supplying system and method |
| CN108637913A (en) * | 2018-06-06 | 2018-10-12 | 蚌埠国显科技有限公司 | A kind of polishing machine central liquid supply system |
| CN108789163A (en) * | 2018-05-30 | 2018-11-13 | 郑州合晶硅材料有限公司 | A kind of silicon chip back side polishing device and polishing method |
| CN114699941A (en) * | 2022-03-14 | 2022-07-05 | 长鑫存储技术有限公司 | Liquid mixing device, supply system and supply method |
| CN115155410A (en) * | 2022-06-30 | 2022-10-11 | 西安奕斯伟材料科技有限公司 | Polishing solution storage and mixing arrangement |
-
2013
- 2013-01-17 CN CN 201320023394 patent/CN203125329U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107520759A (en) * | 2016-06-21 | 2017-12-29 | 上海新昇半导体科技有限公司 | A kind of polishing solution supplying system and method |
| CN108789163A (en) * | 2018-05-30 | 2018-11-13 | 郑州合晶硅材料有限公司 | A kind of silicon chip back side polishing device and polishing method |
| CN108637913A (en) * | 2018-06-06 | 2018-10-12 | 蚌埠国显科技有限公司 | A kind of polishing machine central liquid supply system |
| CN108637913B (en) * | 2018-06-06 | 2024-01-16 | 蚌埠国显科技有限公司 | Centralized liquid supply system of polishing machine |
| CN114699941A (en) * | 2022-03-14 | 2022-07-05 | 长鑫存储技术有限公司 | Liquid mixing device, supply system and supply method |
| CN115155410A (en) * | 2022-06-30 | 2022-10-11 | 西安奕斯伟材料科技有限公司 | Polishing solution storage and mixing arrangement |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 Termination date: 20150117 |
|
| EXPY | Termination of patent right or utility model |