TW202218809A - Supplying system, test device and test method of polishing liquid - Google Patents

Abstract

The present application provides a polishing liquid supply system for supplying a polishing liquid for a test, comprising a liquid storage device, a supplying pipeline and a valve. The liquid storage device is for storage of a first polishing liquid. The supplying pipeline connects to the liquid storage device with one terminal and an outlet with another terminal. The terminal connecting to the liquid storage device is above another terminal connecting to the outlet. The valve is disposed on the supplying pipeline, and control the liquid supply by open or close the valve. By applying the system of the present application, the test of the first polishing liquid can be completed with higher efficiency and less cost. It prevents from test error caused by mixing the first polishing liquid and a polishing liquid originally applied in the CMP apparatus. The system is able to adjust the flow of the first polishing liquid within the supplying pipeline by the valve. The present application also provides a test device and a test method of polishing liquid.

Description

Grinding liquid supply system, grinding liquid testing device and grinding liquid testing method

The present invention relates to the technical field of semiconductor manufacturing, in particular to a polishing liquid supply system, a polishing liquid testing device and a polishing liquid testing method.

Chemical Mechanical Polish (CMP) is a process in which chemical reactions and mechanical friction work together. Generally, during the chemical mechanical polishing process, the polishing head applies a certain pressure to the back side of the wafer, so that the front side of the wafer is in close contact with the polishing pad. The grinding pad is adhered to the grinding disc, and at the same time, the grinding liquid is transported to the grinding pad through the grinding liquid supply pipeline, and is evenly distributed on the grinding pad by centrifugal force. When the grinding disc rotates under the drive of the motor, the grinding pad is driven to rotate, and the grinding head also moves correspondingly to drive the wafer to move, thus realizing the relative movement of the wafer and the grinding pad. In order to produce mechanical friction between the front side of the wafer and the polishing pad, so as to achieve the purpose of flattening the surface of the wafer.

The grinding liquid used in the grinding process generally contains chemical etchants and abrasive particles, and the chemical reaction between the chemical etchant and the surface to be ground generates softer materials that are easily removed, and then these softer substances are removed by mechanical friction. Grind the wafer front side to remove.

In the research and development of wafer grinding process, it is often necessary to test various new types of grinding fluids. When testing a new type of polishing liquid, there is a confusion between the new type of polishing liquid and the original polishing liquid, which in turn leads to the problem of deviation of the test results. At the same time, there is also the risk of the polishing liquid supply pipeline being contaminated by the new type of polishing liquid.

The purpose of the present invention is to provide a grinding liquid supply system, which can effectively avoid the confusion of the new grinding liquid and the original grinding liquid, and can also prevent the grinding liquid supply pipeline from being polluted by the new grinding liquid.

In order to achieve the above object, the present invention provides a grinding fluid supply system, comprising: a liquid storage device for storing the first grinding liquid; a liquid outlet pipe, one end is connected with the liquid storage device, the other end is provided with a liquid outlet, and the one end is higher than the other end; and, The on-off valve is arranged on the liquid outlet pipeline, and the on-off valve is opened or closed to control the on-off of the liquid outlet pipeline.

In one embodiment, a fixing unit is further included, the top surface of the fixing unit is used to carry the liquid outlet pipe and the liquid storage device, and a groove is provided on the bottom surface.

In one embodiment, the liquid storage device is a sealed tank; the polishing liquid supply system further includes: an air inlet pipe, through which gas is input to the liquid storage device; and, an intake valve, which is arranged on the intake duct, the air valve is opened or closed to control the gas input amount of the intake duct.

In one embodiment, the volume of the liquid storage device is 4 liters (L)-6L.

In one embodiment, the liquid storage device further defines a liquid replenishing port for replenishing the first polishing liquid for the liquid storage device.

In one embodiment, it further includes a flow regulating valve, which is arranged on the liquid outlet pipe.

In one embodiment, the intake valve and/or the on/off valve and/or the flow regulating valve are automatic valves.

In one embodiment, the intake valve and/or the on/off valve and/or the flow regulating valve are hand valves.

Correspondingly, the present invention also provides a grinding fluid testing device, comprising: using the grinding liquid supply system for providing the first grinding liquid; A grinding liquid conveying arm, the grinding liquid supply system is installed on the grinding liquid conveying arm through a groove; a grinding disc, arranged below the grinding liquid conveying arm; A polishing pad is arranged on the surface of the polishing disc.

Correspondingly, the present invention also provides a grinding liquid testing method, characterized in that, the above grinding liquid testing device is adopted, comprising: The first grinding liquid is provided through the grinding liquid supply system, and the test wafer is subjected to a grinding test through the grinding pad and the first grinding liquid to obtain the first test result; A second grinding liquid is provided through the grinding liquid conveying arm, and the test wafer is subjected to a grinding test through the grinding pad and the second grinding liquid to obtain a second test result; By comparing the first test result and the second test result, the pros and cons of the first polishing liquid and the second polishing liquid are judged.

In one embodiment, providing the first polishing liquid through the polishing liquid supply system includes: Open the on-off valve to make the liquid outlet pipe conduct, and the first grinding liquid in the liquid storage device flows through the liquid outlet pipe and the liquid outlet to the polishing pad.

In one embodiment, the liquid storage device is a sealed tank body, and gas is input into the liquid storage device through an air inlet pipe, and the first grinding fluid provided by the grinding liquid supply system further includes: The gas input amount of the gas inlet pipe is controlled by the gas inlet valve, so as to control the flow rate of the first grinding liquid in the liquid outlet pipe.

In one embodiment, the flow regulating valve is disposed on the liquid outlet pipeline, and the supplying the first grinding fluid through the grinding fluid supply system further includes: The flow rate of the first grinding liquid in the liquid outlet pipeline is controlled by controlling the flow regulating valve.

In the polishing liquid supply system provided by the present invention, a liquid storage device is used to store the first polishing liquid, one end of a liquid outlet pipeline is connected to the liquid storage device, an on-off valve is arranged on the liquid outlet pipeline, and the on-off valve It is turned on or off to control the on-off of the liquid outlet pipeline. The other end of the liquid outlet pipe is provided with a liquid outlet, and the one end is higher than the other end. In this way, when the on-off valve is opened, the first grinding liquid in the liquid storage device will flow from the liquid storage device to the liquid outlet by itself under the action of gravity. In this way, the polishing liquid supply system of the present invention can drive the flow of the first polishing liquid without a power source, realize the supply of the first polishing liquid, and reduce the cost of the polishing liquid supply system.

In addition, the on-off valve adopts a hand valve, and the grinding fluid supply system does not need power supply and gas supply, and can complete the test of the first grinding fluid efficiently at a low cost.

In addition, the use of a grinding liquid supply system independent of the grinding liquid conveying pipe avoids the confusion of the grinding liquid caused by the use of the grinding liquid conveying pipe of the chemical mechanical polishing equipment for the first grinding liquid. The deviation of the test result of the first grinding liquid is prevented, and the first grinding liquid is also prevented from contaminating the grinding liquid conveying pipeline.

In addition, the flow rate of the first grinding liquid in the liquid outlet pipeline can be controlled by controlling the on-off valve to be fully opened or partially opened.

Correspondingly, the present invention also provides a polishing liquid testing device and a polishing liquid testing method.

The specific embodiments of the present invention will be described in more detail below with reference to the schematic diagrams. The advantages and features of the present invention will become more apparent from the following description. It should be noted that, the accompanying drawings are all in a very simplified form and in inaccurate scales, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention.

FIG. 1 is a schematic diagram of a chemical etching and polishing apparatus in this embodiment. As shown in FIG. 1 , the chemical etching polishing apparatus 100' includes a polishing head 110', a polishing disc 120', a polishing liquid delivery arm 140', a polishing liquid delivery pipe 150' and a polishing pad 130'. A pump 160' is provided on the grinding liquid conveying pipe 150', and part of the grinding liquid conveying pipe 150' is hidden in the grinding liquid conveying arm 140'. One end of the grinding liquid conveying pipe 150' located above the grinding disc 120' is provided with a liquid feeding port 141', and the other end of the grinding liquid conveying pipe 150' is connected to a grinding liquid storage tank 170'.

Please refer to FIG. 1 , the polishing process using the chemical etching and polishing apparatus 100 ′ includes: after inverting the wafer by 180 degrees, using the polishing head 110 ′ to adsorb the back of the wafer, and then using the front side of the wafer to face down The grinding fluid is placed between the grinding head 110' and the grinding pad 130'; the grinding fluid delivery pipeline is used to transport the grinding fluid to the grinding pad 130', and the grinding fluid is used to communicate with the wafer surface material. A chemical reaction occurs to convert insoluble substances into soluble substances, or soften high hardness substances. The grinding pad 130' is detachably disposed on the upper surface of the grinding disc 120' (generally adhered to the upper surface of the grinding disc 120'). The grinding disc 120' rotates to drive the grinding pad 130' to rotate, and then Using the relative motion between the polishing pad 130' and the polishing head 110', that is, the difference in the linear velocity between the two, the ultra-fine solid abrasive particles are forced to grind the protruding points on the surface of the wafer, so as to achieve crystallinity. The purpose of round surface flattening.

In the research and development of the chemical mechanical polishing process of wafers, it is often necessary to test various new polishing slurries. However, the supply of the polishing slurry requires a complete slurry supply system to support, and also requires a certain site space, as well as a supporting water supply system, Power supply system and gas supply system, therefore, adding a new supply system requires a relatively high cost and cost.

FIG. 2 is a schematic diagram of the flow direction of the grinding liquid conveying pipeline in this embodiment. As shown in Figures 1 and 2, when testing the new type of grinding, the new type of grinding liquid needs to be temporarily stored in the grinding liquid storage tank 170', and driven by the pump 160', and then flows through the grinding liquid conveying pipe 150', and then flows from the grinding liquid to the grinding liquid. The delivery arm 140' flows out. Therefore, the new type of polishing liquid and the old polishing liquid have the problem of sharing the polishing liquid conveying pipe 150'. Since the old grinding fluid will remain in the grinding fluid conveying pipeline 150', there is bound to be a possibility that the new grinding fluid may be confused with the old grinding fluid, resulting in deviations in the test results of the new grinding fluid. Based on this, when testing the new type of grinding fluid, if the grinding fluid conveying pipeline 150' that comes with the production equipment is used for supply, it is bound to spend a relatively high cost to thoroughly clean the grinding fluid conveying pipeline 150' to remove the grinding fluid transportation. Old slurry in pipe 150'. However, even this does not guarantee the absolute elimination of the risk of mixing up the new slurry with the old one.

Furthermore, when the new type of grinding fluid is connected to the grinding fluid delivery pipeline 150', there is also the problem that the new type of grinding fluid contaminates the grinding fluid delivery pipeline 150'. The grinding fluid brings the risk of contamination, and when the production is resumed after the test, the old grinding fluid is mixed with the new grinding fluid and the grinding effect is affected.

Based on this, an embodiment of the present invention provides a polishing liquid supply system 200 , which includes a liquid storage device 210 , a liquid outlet pipeline 220 and an on-off valve 230 .

FIG. 3 is a schematic structural diagram of a polishing liquid supply system in this embodiment. As shown in FIG. 3 , the liquid storage device 210 is a tank with a cylindrical shape, and the shape of the tank may also be a square cylinder or other polygonal cylinder, which is not limited herein. The liquid storage device 210 can be made of metal or plastic. The liquid outlet pipeline 220 includes a vertical section and a horizontal section. The vertical section is used to connect with the liquid storage device 210. The on-off valve 230 can be arranged on the horizontal section. It should be known that the on-off valve 230 It can also be arranged on the vertical segment. The grinding fluid supply system may also be provided with a casing, which generally wraps the liquid outlet pipe 220 , so that the liquid storage device 210 , the liquid outlet pipe 220 and the on-off valve 230 form a structural whole.

The liquid storage device 210 is used to store the first polishing liquid, and the first polishing liquid is a new type of polishing liquid for testing. One end of the liquid outlet pipe 220 is connected to the liquid storage device 210 , and the other end of the liquid outlet pipe 220 is provided with a liquid outlet 221 , and the one end is higher than the other end. In this way, the first polishing liquid in the liquid storage device 210 will flow from the liquid storage device 210 to the liquid outlet 221 by itself under the action of gravity. In this way, the polishing liquid supply system 200 of the present invention can drive the first polishing liquid to flow without a power source, realize the supply of a new type of polishing liquid, and reduce the cost of the polishing liquid supply system 200 . Moreover, the use of the grinding liquid supply system 200 independent of the chemical mechanical polishing equipment also avoids the new grinding liquid (ie the first grinding liquid) caused by the use of the grinding liquid conveying pipe 150' of the chemical etching grinding equipment 100'. liquid) is confused with the old grinding liquid. The test result of the first polishing liquid can be prevented from being deviated, and at the same time, the first polishing liquid can be prevented from contaminating the polishing liquid conveying pipeline 150'.

The on-off valve 230 is disposed on the liquid outlet pipe 220 , and the on-off valve 230 is opened or closed to control the on-off of the liquid outlet pipe 220 . When the on-off valve 230 is opened, the first grinding liquid will flow from the liquid storage device 210 to the liquid outlet 221 through the liquid outlet pipe 220 by itself under the action of gravity. When the on-off valve 230 is closed, the liquid outlet pipe 220 is blocked, and the first grinding liquid stops flowing out of the liquid outlet 221 .

It should be known that when the on-off valve 230 is fully opened or partially opened, the flow rate of the first grinding fluid in the liquid outlet pipeline 220 will be directly affected. Based on this, the flow rate of the first grinding liquid in the liquid outlet pipeline 220 can be controlled by controlling the on-off valve 230 to be fully opened or partially opened.

FIG. 4 is a schematic structural diagram of another polishing liquid supply system in this embodiment. As shown in FIG. 4 , as an optional embodiment of the present invention, the liquid storage device 210 is a sealed tank. The polishing liquid supply system 200 further includes an air inlet pipe 240 , and gas is input into the liquid storage device 210 through the air inlet pipe 240 . The intake duct 240 includes a horizontal section and a vertical section. Further, an intake valve 241 is provided on the intake pipe 240 , and the intake valve is disposed in the horizontal section of the intake pipe 240 for controlling the gas input amount of the intake pipe 240 . Further, the intake valve 241 is disposed at the end of the intake duct 240 to facilitate manual operation of the intake valve.

It should be understood that since the liquid storage device 210 is a sealed tank, due to the effect of atmospheric pressure, if no gas is input into the liquid storage device 210, the first grinding liquid in the liquid storage device 210 cannot flow out, Based on this, by controlling the opening or closing of the intake valve 241 so that the intake conduit 240 can be turned on or off, to control whether the intake conduit 220 is entering the gas into the liquid storage device 210, further to control whether the first grinding liquid can flow out from the liquid storage device 210 .

Furthermore, by controlling the gas inlet valve 241 to be fully opened or partially opened to control the gas input amount of the gas inlet pipe 240, to control the outflow amount of the first grinding liquid in the liquid storage device 210, thereby indirectly. The flow rate of the first grinding liquid in the liquid outlet pipe 220 is controlled.

In one embodiment, the volume of the liquid storage device 210 is 4 liters (L)-6 L. It should be known that the liquid storage device 210 is used to store the first polishing liquid. If the capacity of the liquid storage device 210 is too large, the polishing liquid supply system 200 will be too bulky, not easy to carry, and not conducive to all The installation of the polishing liquid supply system 200 is described. If the capacity of the liquid storage device 210 is too small, the first grinding liquid stored in the liquid storage device 210 will be too small, and the first grinding liquid will be insufficient to support one or more grinding tests, resulting in During the grinding test, the liquid storage device 210 needs to be replaced frequently to add the first grinding fluid, which is not conducive to the test of the first grinding fluid. Considering the above two aspects, preferably, the volume of the liquid storage device 210 in the present invention is 4L-6L. According to the applicant's statistics, the volume of the liquid storage device 210 is 5L, which can meet the supply of polishing liquid for 10 test wafers.

In one embodiment, the liquid storage device 210 further defines a liquid replenishing port (not shown in FIG. 4 ) for replenishing the first polishing liquid to the liquid storage device 210 . The liquid replenishing port may be disposed at the top of the liquid storage device 210, so that the injection of the first grinding liquid can be facilitated. It should be known that the position of the liquid refilling port is not limited to the top of the liquid storage device 210, but can also be set at a position near the top of the side of the liquid storage device 210, and can also be set according to the experience of those skilled in the art. This is not too restrictive. It should be understood that if the test quantity of the test wafers in the grinding test is greater than 10, in order to maintain the continuity of the grinding test, frequently replacing the liquid storage device 210 to supplement the first grinding liquid will affect the test efficiency. Therefore, the liquid storage device 210 is further provided with a liquid replenishing port, so that the first grinding liquid can be replenished into the liquid storage device 210 at any time during the grinding test, so as to improve the test efficiency.

Continuing to refer to FIG. 4 , in one embodiment, the polishing liquid supply system 200 further includes a flow regulating valve 250 disposed on the liquid outlet pipe 220 . The flow regulating valve 250 is an intuitive and simple flow regulating and controlling device, and the flow regulating valve 250 can be used in the liquid outlet pipeline 220 to directly set the flow according to the demand. Therefore, in a preferred embodiment of the present invention, the flow rate of the first grinding liquid in the liquid outlet pipe 220 can be adjusted by adjusting the flow rate regulating valve 250 .

In one embodiment, the intake valve 241 and/or the on/off valve 230 and/or the flow regulating valve 250 are automatic valves. The automatic valve is controlled by power and signals from the control system of the chemical etch grinding apparatus 100'. By adjusting the diameter of the air inlet pipe 240 and/or the liquid outlet pipe 220, the purpose of adjusting the flow rate of the first grinding liquid is achieved.

In one embodiment, the intake valve 241 , the on-off valve 230 and the flow regulating valve 250 are all hand valves. Those skilled in the art can master the switching timing of the hand valve, and manually complete the valve adjustment. By adjusting the cross-sectional area of the inlet pipe 240 and/or the liquid outlet pipe 220, the purpose of adjusting the flow rate of the first grinding fluid is achieved. Those skilled in the art manually operate the hand valve to adjust the flow rate of the first polishing liquid, so that a temporary supply of a small amount of the first polishing liquid can be realized without an additional software system. At the same time, the polishing liquid supply system 200 may not need power supply and gas supply, and can efficiently complete the test of the new polishing liquid at a relatively low cost.

In an embodiment of the present invention, the polishing liquid supply system 200 is installed on the polishing liquid conveying arm 140', for example, a cable tie is used to tie the liquid outlet pipe 220 to the polishing liquid conveying arm 140'.

In another embodiment of the present invention, a support frame is provided on the chemical etching and polishing apparatus 100', and the polishing liquid supply system 200 is installed on the support frame.

4, in another embodiment of the present invention, the polishing liquid supply system 200 further includes a fixing unit 260, and the top surface of the fixing unit 260 is used to carry the liquid outlet pipe 220 and the liquid storage In the device 210, the bottom surface is provided with a groove for fixing. The groove fits the polishing liquid conveying arm 140 ′, and when the fixing unit 260 is engaged with the polishing liquid conveying arm 140 ′ through the groove, the polishing liquid supply system 200 can be stabilized It is erected on the polishing liquid conveying arm 140'. Providing the fixing unit 260 facilitates the installation or removal of the polishing liquid supply system 200, and also facilitates cleaning and replacement of parts.

It should be understood that when the grinding test needs to be performed, the grinding liquid supply system 200 is inserted into the grinding liquid conveying arm 140 ′ through the groove of the fixing unit 260 , because the position of the liquid outlet 221 and the grinding liquid conveying The liquid feeding ports 141 ′ on the arm 140 ′ are similar, which can better simulate the situation that the first polishing liquid flows out from the liquid feeding ports 141 ′ on the polishing liquid feeding arm 140 ′.

Correspondingly, an embodiment of the present invention also provides an abrasive liquid testing device.

FIG. 5 is a schematic structural diagram of the polishing liquid testing device in this embodiment. As shown in FIG. 5 , the polishing liquid testing device 300 adopts the polishing liquid supply system 200 for providing the first polishing liquid. The polishing liquid testing device 300 further includes a polishing liquid conveying arm 140 , and the polishing liquid supply system 200 is installed on the polishing liquid conveying arm 140 through a groove. The polishing liquid testing device 300 further includes a polishing disc 120, which is disposed under the polishing liquid conveying arm 140 for carrying the polishing pad 130 and the test wafer. The polishing pad 130 is disposed on the surface of the polishing disc 120 . The polishing liquid supply system 200 disposed on the polishing liquid conveying arm 140 can transport the first polishing liquid to the polishing pad 130 .

Correspondingly, an embodiment of the present invention also provides a method for testing an abrasive liquid.

FIG. 6 is a flow chart of the polishing liquid testing method in this embodiment. As shown in Figure 6, the grinding liquid testing method adopts the grinding liquid testing device 300, which includes the following steps: Step S001: provide the first grinding liquid by the grinding liquid supply system 200, carry out the grinding test to the test wafer by the grinding pad 130 and the first grinding liquid, and obtain the first test result; Step S002: the second lapping liquid is provided by lapping liquid conveying arm 140, and the test wafer is subjected to a grinding test by the lapping pad 130 and the second lapping liquid, and the second test result is obtained; Step S003: by comparing the first test result and the second test result, to judge the pros and cons of the first grinding fluid and the second grinding fluid.

In the polishing liquid testing method of the present invention, the second polishing liquid is an old polishing liquid. Since the used polishing test devices are the same, the used polishing pads 130 are the same. That is, the polishing test conditions for the first polishing liquid and the second polishing liquid are the same. Based on this, the deviation caused by different grinding test conditions can be minimized. At the same time, the grinding liquid supply system 200 is used to provide the first grinding liquid for grinding test, and the first test result is obtained. The grinding liquid conveying arm 140 is used to provide the second grinding liquid to carry out the grinding test, and the second test result is obtained. The deviation caused by the confusion of the first polishing liquid and the second polishing liquid can be further avoided. Finally, by comparing the first test result and the second test result, the pros and cons of the first polishing liquid and the second polishing liquid can be intuitively judged.

Further, in step S001, providing the first grinding liquid through the grinding liquid supply system 200 includes: opening the on-off valve 230, so that the liquid outlet pipe 220 is connected, and the first grinding liquid in the liquid storage device 210 flows through the outlet. The liquid pipeline 220 and the liquid outlet 221 flow onto the polishing pad 130 . The first polishing liquid cooperates with the polishing pad 130 to polish the test wafer. In addition, the flow rate of the first grinding fluid in the liquid outlet pipeline 220 can be controlled by controlling the on-off valve 230 to be fully opened or partially opened.

Further, in step S001, the liquid storage device 210 is a sealed tank body, and gas is input to the liquid storage device 210 through the air inlet pipe 240, and the first grinding liquid provided by the grinding liquid supply system 200 also includes: The gas valve 241 controls the gas input amount of the gas inlet pipe 240 to control the flow rate of the first grinding liquid in the liquid outlet pipe 220 . In order to keep a reasonable supply amount of the first polishing liquid on the polishing pad 130 .

Further, in step S001, the flow regulating valve 250 is arranged on the liquid outlet pipeline 220, and supplying the first polishing liquid through the polishing liquid supply system 200 further includes: controlling the liquid outlet by controlling the flow regulating valve 250 The flow rate of the first grinding liquid in the pipeline 220. Further, a reasonable supply amount of the first polishing liquid on the polishing pad 130 is maintained.

To sum up, an embodiment of the present invention provides a polishing liquid supply system, which includes a liquid storage device, a liquid outlet pipeline and an on-off valve. The liquid storage device is used to store the first grinding liquid, one end of the liquid outlet pipeline is connected to the liquid storage device, the other end of the liquid outlet pipeline is provided with a liquid outlet, and the one end is higher than the other end. In this way, under the action of gravity, the first grinding liquid in the liquid storage device will flow from the liquid storage device to the liquid outlet by itself. In this way, the grinding liquid supply system of the present invention can drive the flow of the first grinding liquid without a power source, can reduce the cost of the grinding liquid supply system, and can realize the supply of new grinding liquid at a small cost, which is conducive to efficient Complete the test of the new slurry, at the same time, the slurry supply system does not need power supply and air supply. Moreover, the use of a grinding liquid supply system independent of the grinding liquid conveying pipe also avoids the mixing of the grinding liquid caused by the use of the grinding liquid conveying pipe of the chemical etching grinding equipment for the first grinding liquid. In addition, the deviation of the test results of the first grinding liquid is avoided, and the contamination of the grinding liquid conveying pipe by the first grinding liquid is also avoided. The on-off valve is arranged on the liquid outlet pipe, and the on-off valve is opened or closed to control the on-off of the liquid outlet pipe. Moreover, the flow rate of the first grinding liquid in the liquid outlet pipeline can be controlled by controlling the on-off valve to be fully opened or partially opened. Correspondingly, the present invention also provides a polishing liquid testing device and a polishing liquid testing method.

The above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any person skilled in the art, within the scope of not departing from the technical solution of the present invention, makes any form of equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, and does not depart from the technical solution of the present invention. content still falls within the protection scope of the present invention.

100': Chemical Etching Grinding Equipment 110': Grinding head 120': Grinding disc 130': polishing pad 140': Grinding fluid delivery arm 141': liquid delivery port 150': Grinding liquid delivery pipeline 160': Pump 170': Grinding Fluid Storage Tank

120: Grinding disc 130: Grinding pad 140: Grinding liquid delivery arm

120: Grinding disc 130: Grinding pad 140: Grinding liquid delivery arm

200: Grinding fluid supply system 210: Liquid storage device 220: Outlet pipe 221: Liquid outlet 230: On-off valve 240: Intake duct 241: Intake valve 250: Flow control valve 260: Fixed unit

300: Grinding liquid testing device

FIG. 1 is a schematic diagram of a chemical etching and polishing apparatus in an embodiment of the present invention.

FIG. 2 is a schematic diagram of the flow direction of the grinding liquid conveying pipeline in the embodiment of the present invention.

FIG. 3 is a schematic structural diagram of a polishing liquid supply system in an embodiment of the present invention.

FIG. 4 is a schematic structural diagram of another polishing liquid supply system in an embodiment of the present invention.

FIG. 5 is a schematic structural diagram of a polishing liquid testing device in an embodiment of the present invention.

FIG. 6 is a flow chart of a method for testing a polishing liquid in an embodiment of the present invention.

200: Grinding fluid supply system

210: Liquid storage device

220: Outlet pipe

221: Liquid outlet

230: On-off valve

240: Intake duct

241: Intake valve

250: Flow control valve

260: Fixed unit

Claims (10)

An abrasive fluid supply system for supplying abrasive fluid for testing, including: a liquid storage device for storing the first grinding liquid; a liquid outlet pipe, one end is connected with the liquid storage device, the other end is provided with a liquid outlet, and the one end is higher than the other end; and, The on-off valve is arranged on the liquid outlet pipeline, and the on-off valve is opened or closed to control the on-off of the liquid outlet pipeline. The polishing liquid supply system according to claim 1, further comprising a fixing unit, the top surface of the fixing unit is used to carry the liquid outlet pipeline and the liquid storage device, and a groove is provided on the bottom surface. The polishing liquid supply system according to item 2 of the scope of the application, wherein the liquid storage device is a sealed tank; The grinding fluid supply system also includes: an air inlet pipe, through which gas is input to the liquid storage device; and, an intake valve, which is arranged on the intake duct, the air valve is opened or closed to control the gas input amount of the intake duct. The polishing liquid supply system according to claim 3, wherein the volume of the liquid storage device is 4 liters (L)-6 L. The polishing liquid supply system according to claim 4, wherein the liquid storage device is further provided with a liquid replenishing port for replenishing the first polishing liquid for the liquid storage device. The polishing liquid supply system according to item 2 of the patent application scope further comprises a flow regulating valve, which is arranged on the liquid outlet pipe. A grinding fluid testing device, comprising: The polishing liquid supply system according to any one of items 1 to 8 of the scope of the application for providing the first polishing liquid; a grinding liquid conveying arm, the grinding liquid supply system is installed on the grinding liquid conveying arm; a grinding disc, arranged below the grinding liquid conveying arm; and A polishing pad is arranged on the surface of the polishing disc. A grinding liquid testing method, using the grinding liquid testing device as described in item 7 of the patent application, comprising: The first grinding liquid is provided by the grinding liquid supply system, and the test wafer is subjected to a grinding test through the grinding pad and the first grinding liquid to obtain the first test result; A second grinding liquid is provided through the grinding liquid conveying arm, and the test wafer is subjected to a grinding test through the grinding pad and the second grinding liquid to obtain a second test result; By comparing the first test result and the second test result, the pros and cons of the first polishing liquid and the second polishing liquid are judged. The method for testing polishing liquid as described in item 8 of the patent application scope, wherein providing the first polishing liquid through the polishing liquid supply system comprises: Open the on-off valve to make the liquid outlet pipe conduct, and the first grinding liquid in the liquid storage device flows through the liquid outlet pipe and the liquid outlet to the polishing pad. The method for testing polishing liquid according to item 9 of the scope of the application, wherein the liquid storage device is a sealed tank, gas is input into the liquid storage device through an air inlet pipe, and the first polishing liquid is provided through a polishing liquid supply system Also includes: The gas input amount of the gas inlet pipe is controlled by the gas inlet valve, so as to control the flow rate of the first grinding liquid in the liquid outlet pipe.

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