CN115533734B - Grinding fluid flow control device and method for grinding machine - Google Patents

Grinding fluid flow control device and method for grinding machine Download PDF

Info

Publication number
CN115533734B
CN115533734B CN202211512692.9A CN202211512692A CN115533734B CN 115533734 B CN115533734 B CN 115533734B CN 202211512692 A CN202211512692 A CN 202211512692A CN 115533734 B CN115533734 B CN 115533734B
Authority
CN
China
Prior art keywords
grinding fluid
grinding
flow
threshold value
servo motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202211512692.9A
Other languages
Chinese (zh)
Other versions
CN115533734A (en
Inventor
徐建民
陈建松
郝建军
丁洁
李永斌
狄建兴
杨铁生
王亮
崔立志
宋学忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tangshan Guoxin Jingyuan Electronics Co ltd
Original Assignee
Tangshan Guoxin Jingyuan Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tangshan Guoxin Jingyuan Electronics Co ltd filed Critical Tangshan Guoxin Jingyuan Electronics Co ltd
Priority to CN202211512692.9A priority Critical patent/CN115533734B/en
Publication of CN115533734A publication Critical patent/CN115533734A/en
Application granted granted Critical
Publication of CN115533734B publication Critical patent/CN115533734B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

The device comprises a flow sensor, a flow controller, a servo motor and a regulating valve which are sequentially connected, a pressure sensor connected with the flow controller and a stirrer connected with the servo motor; the flow sensor is used for acquiring an actual flow value at the outlet of the grinding fluid; the pressure sensor is used for acquiring the pressure of the grinding fluid at the grinding fluid outlet on the inner wall of the grinding fluid pipeline; the flow control instrument is used for starting the servo motor based on the first threshold value, the actual flow value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline; the servo motor is used for driving the valve rod or the stirrer to rotate; the adjusting valve is arranged at the inlet of the grinding fluid pipeline and is used for adjusting the flow of the grinding fluid at the inlet of the grinding fluid pipeline; and the stirrer is arranged in the device for storing the grinding fluid and is used for stirring the grinding fluid. This application can guarantee that lapping liquid flow keeps invariable.

Description

Grinding fluid flow control device and method for grinding machine
Technical Field
The application belongs to the technical field of wafer grinding, and particularly relates to a grinding fluid flow control device and method of a grinding machine.
Background
The photoelectric technology is a high and new enterprise technology for promoting national economy and social informatization technology and is also a technical basis for improving the traditional industry. With the rapid development of quartz resonators and oscillators, higher requirements are put on the surface grinding level of quartz wafers.
When the quartz wafer is ground by the grinding machine, the grinding fluid is one of four grinding factors, which plays a vital role in the levelness and the flatness of the surface of the ground wafer, the flow rate of the grinding fluid changes along with the loss of the grinding fluid in the grinding process, the flow rate of the grinding fluid is controlled, the flow of the grinding fluid is kept constant, the grinding fluid is saved, and the grinding consistency is improved.
In the prior art, the flow rate of the grinding fluid is controlled by a switch on the grinding fluid pipe, but the grinding flow rate is reduced along with the loss of the grinding fluid in the grinding process, and the grinding flow rate is unstable.
Disclosure of Invention
The embodiment of the application provides a device and a method for controlling the flow of grinding fluid of a grinding machine, so as to ensure that the flow of the grinding fluid is kept constant.
The application is realized by the following technical scheme:
in a first aspect, an embodiment of the present application provides a flow control device for grinding slurry of a grinding machine, including: the flow sensor, the flow controller, the servo motor and the regulating valve are connected in sequence, and the flow control device further comprises a pressure sensor connected with the flow controller and a stirrer connected with the servo motor.
And the flow sensor is arranged at the outlet of the grinding fluid pipeline and is used for acquiring the actual flow value at the outlet of the grinding fluid.
And the pressure sensor is arranged on the inner wall of the outlet of the grinding fluid pipeline and used for acquiring the pressure of the grinding fluid at the outlet of the grinding fluid on the inner wall of the grinding fluid pipeline.
And the flow control instrument is used for starting the servo motor based on a first threshold value, an actual flow value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline, and the first threshold value represents the flow of the grinding fluid required by grinding.
And the servo motor is used for driving the valve rod in the regulating valve or the stirrer to rotate.
And the regulating valve is arranged at the inlet of the grinding fluid pipeline and used for regulating the flow of the grinding fluid at the inlet of the grinding fluid pipeline.
And the stirrer is arranged in the device for storing the grinding fluid and is used for stirring the grinding fluid to ensure that the grinding sand in the grinding fluid is uniformly distributed.
With reference to the first aspect, in some possible implementations, the rotation angle of the valve stem ranges from 0 ° to 90 °.
With reference to the first aspect, in some possible implementations, when the actual flow value is greater than the first threshold value and the pressure of the slurry on the inner wall of the slurry pipeline increases, the servo motor is started to drive the valve rod to rotate, so that the valve rod rotates in a direction perpendicular to the slurry pipeline, and the opening of the adjusting valve decreases.
With reference to the first aspect, in some possible implementations, when the actual flow value is smaller than the first threshold value and the pressure of the slurry on the inner wall of the slurry pipeline decreases, the servo motor is started to drive the valve rod to rotate, so that the valve rod rotates in a direction parallel to the slurry pipeline, and the opening of the adjusting valve increases.
With reference to the first aspect, in some possible implementations, when the actual flow value is smaller than the first threshold value and the pressure of the polishing fluid on the inner wall of the polishing fluid pipeline is reduced, the servo motor is started to drive the agitator, and when the actual flow value is equal to the first threshold value and the pressure of the polishing fluid on the inner wall of the polishing fluid pipeline is unchanged, the servo motor is turned off.
With reference to the first aspect, in some possible implementations, when the actual flow value is equal to the first threshold value, and the pressure of the polishing liquid on the inner wall of the polishing liquid pipeline is unchanged, the servo motor is not started, the valve rod is not rotated, and the opening of the regulating valve is not changed.
With reference to the first aspect, in some possible implementations, the flow controller is a PID intelligent regulator; the regulating valve is an electric proportional regulating valve.
In a second aspect, embodiments of the present application provide a method for controlling a flow rate of an abrasive slurry in a grinding machine, including:
and acquiring an actual flow value at the grinding fluid outlet and the pressure of the grinding fluid at the grinding fluid outlet on the inner wall of the grinding fluid pipeline.
And obtaining the rotation direction of the valve rod based on the actual flow value and a first threshold value, wherein the first threshold value represents the flow of the grinding fluid required by grinding.
And starting a servo motor based on the rotation direction of the valve rod and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline, rotating the valve rod and controlling the flow of the grinding fluid of the grinding machine.
With reference to the second aspect, in some possible implementations, deriving the valve stem rotation direction based on the actual flow value and the first threshold value includes: when the actual flow value is larger than the first threshold value, the valve rod rotates towards the direction vertical to the grinding fluid pipeline, namely the opening degree of the regulating valve is reduced; when the actual flow value is smaller than the first threshold value, the valve rod rotates towards the direction parallel to the grinding fluid pipeline, namely the opening degree of the regulating valve is increased; when the actual flow value and the first threshold value are the same, the valve stem does not rotate.
With reference to the second aspect, in some possible implementations, a method for controlling a flow rate of an abrasive solution in a grinding machine further includes: and when the actual flow value is smaller than the first threshold value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline is reduced, starting the servo motor to drive the stirrer, and then, when the actual flow value is the same as the first threshold value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline is not changed, closing the servo motor.
It is to be understood that, the beneficial effects of the second aspect may refer to the relevant description in the first aspect, and are not described herein again.
Compared with the prior art, the embodiment of the application has the advantages that:
this application is through first threshold value, actual flow value and lapping liquid pressure, the lapping liquid flow that flows out to reality carries out the comprehensive determination, the pressure of lapping liquid can be along with the increase and the reduction that actual flow value corresponds and reduce, judge whether the lapping liquid flow that flows out actually produces the change through two parameters, actual flow value then compares with the flow of the required lapping liquid that first threshold value set for promptly, it needs servo motor drive governing valve rod in the valve to rotate to guarantee that the lapping liquid flow keeps invariable to confirm whether, lapping liquid has been saved to this method, can improve the grinding uniformity again.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the specification.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic view of an embodiment of an apparatus for controlling the flow of slurry in a polishing machine;
fig. 2 is a schematic flow chart illustrating a method for controlling the flow rate of the polishing slurry in the polishing machine according to an embodiment of the present disclosure.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to" determining "or" in response to detecting ". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".
Furthermore, in the description of the present application and the appended claims, the terms "first," "second," "third," and the like are used for distinguishing between descriptions and not necessarily for describing a relative importance or importance.
Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.
The photoelectric technology is a high and new enterprise technology for promoting national economy and social informatization technology and is also a technical basis for improving the traditional industry. With the rapid development of quartz resonators and oscillators, higher requirements are placed on the level of surface finish of quartz wafers.
When the quartz wafer is ground by the grinding machine, the grinding fluid is used as one of four grinding factors, which plays a crucial role in the levelness and the flatness of the surface of the ground wafer, the flow rate of the grinding fluid is changed along with the loss of the grinding fluid in the grinding process, the flow rate of the grinding fluid is controlled, the flow rate of the grinding fluid is kept constant, the grinding fluid is saved, and the grinding consistency is improved.
In the prior art, the flow rate of the grinding fluid is controlled by a switch on the grinding fluid pipe, but the grinding flow rate is reduced along with the loss of the grinding fluid in the grinding process, and the grinding flow rate is unstable. When the flow rate of the grinding fluid is reduced, the flow rate of the grinding fluid is increased by artificially controlling a switch on the grinding fluid pipe, and the consistency of the flow rate of the grinding fluid cannot be ensured.
In view of the above problems, fig. 1 is a schematic structural diagram of an apparatus for controlling the flow rate of grinding fluid in a grinder according to an embodiment of the present application, the apparatus including: the device comprises a flow sensor 101, a flow controller 102, a servo motor 103 and a regulating valve 104 which are connected in sequence, and further comprises a pressure sensor 105 connected with the flow controller 102 and a stirrer 106 connected with the servo motor 103.
And the flow sensor 101 is arranged at the outlet of the grinding fluid pipeline and used for acquiring an actual flow value at the outlet of the grinding fluid.
And the pressure sensor 105 is arranged on the inner wall of the outlet of the grinding fluid pipeline and is used for acquiring the pressure of the grinding fluid at the outlet of the grinding fluid on the inner wall of the grinding fluid pipeline.
And the flow controller 102 is used for starting the servo motor 103 based on a first threshold value, an actual flow value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline, wherein the first threshold value represents the flow of the grinding fluid required by grinding.
And a servo motor 103 for driving a valve rod or a stirrer 106 in the regulating valve 104 to rotate.
And the regulating valve 104 is arranged at the inlet of the grinding fluid pipeline and is used for regulating the flow of the grinding fluid at the inlet of the grinding fluid.
And the stirrer 106 is arranged in the device for storing the grinding fluid and is used for stirring the grinding fluid to ensure that the grinding sand in the grinding fluid is uniformly distributed.
The working process of the system is as follows: the flow sensor 101 transmits the acquired actual flow value to the flow controller 102, the pressure sensor 105 transmits the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline to the flow controller 102, the flow controller 102 judges whether to start the servo motor to drive the valve rod in the regulating valve 104 or the stirrer 106 to rotate according to a preset first threshold value, the actual flow value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline, and when the first threshold value is equal to the actual flow value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline is unchanged, the servo motor is closed.
Compared with the traditional mode of manually adjusting the valve rod, the system can more quickly keep the flow of the grinding liquid constant, save the grinding liquid, and also can avoid the condition that the actual flow value is inconsistent with the first threshold value for a long time, and the actual flow value is inconsistent with the first threshold value for a long time, so that the grinding degree of the surface of the grinding wafer is different, and the grinding consistency is reduced.
Illustratively, the range of rotation angles of the valve stem is 0 ° to 90 °.
Illustratively, when the actual flow value is larger than the first threshold value and the pressure of the polishing liquid on the inner wall of the polishing liquid pipeline is increased, the actual flow is larger than the flow of the polishing liquid required by polishing. At this time, the servo motor 103 can be started to drive the valve rod to rotate, so that the valve rod rotates towards the direction vertical to the grinding fluid pipeline, the opening of the regulating valve is reduced, and the flow rate of the grinding fluid entering the grinding fluid pipeline is reduced, so that the actual flow rate value is reduced.
Illustratively, when the actual flow value is smaller than the first threshold value and the pressure of the polishing liquid on the inner wall of the polishing liquid pipeline is reduced, the actual flow is smaller than the flow of the polishing liquid required for polishing. At this time, the servo motor 103 may be activated to drive the valve rod to rotate, so that the valve rod rotates in a direction parallel to the slurry pipeline, and the opening of the regulating valve is increased, thereby increasing the flow rate of the slurry entering the slurry pipeline and further increasing the actual flow rate value.
Illustratively, when the actual flow value is smaller than the first threshold value and the pressure of the polishing liquid on the inner wall of the polishing liquid pipeline is reduced, the actual flow is smaller than the flow of the polishing liquid required for polishing. At this time, the servo motor 103 may be activated to drive the agitator 105, and then the servo motor 103 may be deactivated when the actual flow value is equal to the first threshold value and the pressure of the slurry against the inner wall of the slurry conduit is not changed, thereby maintaining a constant actual flow value.
Specifically, when the actual flow value is smaller than the first threshold, the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline is reduced, and this occurs because the opening degree of the valve rod is not large enough, and the concentration of the grinding fluid is not high enough, and for a grinding fluid with a prepared concentration, the concentration is reduced to indicate that the grinding fluid generates a precipitate in a storage device, and the stirrer 105 needs to be started to uniformly distribute the precipitate (grinding sand), and then the actual flow value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline are observed.
Illustratively, when the actual flow value is equal to the first threshold value and the pressure of the polishing liquid on the inner wall of the polishing liquid pipeline is unchanged, the actual flow is equal to the flow of the polishing liquid required for polishing. At this time, the servo motor 103 may be controlled not to be activated, the valve stem may not be rotated, and the opening degree of the regulating valve 104 may not be changed, thereby maintaining a constant actual flow rate value.
Illustratively, the flow controller 102 is a PID intelligent regulator; the regulator valve 104 is an electric proportional regulator valve.
Specifically, in one embodiment, the flow sensor 101 is a detachable device in the polishing slurry pipeline, and the flow sensor 101 is cleaned and replaced once every 18 hours.
According to the grinding fluid flow control system of the grinding machine, the flow of the grinding fluid which flows out actually is comprehensively determined through the first threshold, the actual flow value and the grinding fluid pressure, the pressure of the grinding fluid can be correspondingly increased and decreased along with the increase and decrease of the actual flow value, whether the flow of the grinding fluid which flows out actually changes is judged through two parameters, the actual flow value is compared with the first threshold, namely the set required flow of the grinding fluid, and whether the valve rod in the regulating valve needs to be driven by the servo motor to rotate to ensure that the flow of the grinding fluid is kept constant or not is determined.
Fig. 2 is a schematic flow chart of a method for controlling the flow rate of the polishing slurry in the polishing machine according to an embodiment of the present disclosure, and referring to fig. 2, the method for controlling the flow rate of the polishing slurry in the polishing machine is described in detail as follows:
step 201, obtaining an actual flow value at the outlet of the grinding fluid and the pressure of the grinding fluid at the outlet of the grinding fluid on the inner wall of the grinding fluid pipeline.
And 202, obtaining the rotation direction of the valve rod based on the actual flow value and a first threshold value, wherein the first threshold value represents the flow of the grinding fluid required by grinding.
Illustratively, the obtaining the valve stem rotation direction based on the actual flow value and the first threshold value comprises: when the actual flow value is larger than the first threshold value, the valve rod rotates towards the direction vertical to the grinding fluid pipeline, namely the opening degree of the regulating valve is reduced; when the actual flow value is smaller than the first threshold value, the valve rod rotates towards the direction parallel to the grinding fluid pipeline, namely the opening degree of the regulating valve is increased; when the actual flow value and the first threshold value are the same, the valve stem does not rotate.
And step 203, starting a servo motor and rotating the valve rod based on the rotation direction of the valve rod and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline, so as to control the flow of the grinding fluid of the grinding machine.
Exemplary, the method for controlling the flow rate of the grinding fluid in the grinding machine further comprises: and when the actual flow value is smaller than a first threshold value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline is reduced, starting the servo motor to drive the stirrer, and then, when the actual flow value is the same as the first threshold value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline is not changed, closing the servo motor.
According to the method for controlling the grinding fluid flow of the grinding machine, the flow of the grinding fluid which flows out actually is comprehensively determined through the first threshold, the actual flow value and the grinding fluid pressure, the pressure of the grinding fluid can be correspondingly increased and decreased along with the increase and decrease of the actual flow value, whether the flow of the grinding fluid which flows out actually changes is judged through two parameters, the actual flow value is compared with the first threshold, namely the set required flow of the grinding fluid, and whether the servo motor is required to drive the valve rod in the regulating valve to rotate is determined to ensure that the flow of the grinding fluid is kept constant.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by functions and internal logic of the process, and should not constitute any limitation to the implementation process of the embodiments of the present application.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present application, and they should be construed as being included in the present application.

Claims (10)

1. A lapping machine slurry flow control device, comprising: the device comprises a flow sensor, a flow controller, a servo motor and an adjusting valve which are sequentially connected, and also comprises a pressure sensor connected with the flow controller and a stirrer connected with the servo motor;
the flow sensor is arranged at the outlet of the grinding fluid pipeline and is used for acquiring an actual flow value at the outlet of the grinding fluid pipeline;
the pressure sensor is arranged on the inner wall of the outlet of the grinding fluid pipeline and used for acquiring the pressure of the grinding fluid at the outlet of the grinding fluid on the inner wall of the grinding fluid pipeline;
the flow controller is used for starting a servo motor based on a first threshold value, the actual flow value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline, wherein the first threshold value represents the flow of the grinding fluid required by grinding;
the servo motor is used for driving the valve rod in the regulating valve or the stirrer to rotate;
the regulating valve is arranged at the inlet of the grinding fluid pipeline and is used for regulating the flow of the grinding fluid at the inlet of the grinding fluid pipeline;
the stirrer is arranged in the device for storing the grinding fluid and is used for stirring the grinding fluid to ensure that the grinding sand in the grinding fluid is uniformly distributed.
2. The grinder abrasive flow control device of claim 1, wherein the valve stem has a rotation angle in a range of 0 ° to 90 °.
3. The apparatus for controlling the flow of grinding fluid in a grinding machine according to claim 1, wherein when the actual flow value is larger than the first threshold value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipe is increased, the servo motor is activated to rotate the valve rod, so that the valve rod is rotated in a direction perpendicular to the grinding fluid pipe and the opening of the regulating valve is decreased.
4. The apparatus for controlling the flow of grinding fluid in a grinding machine according to claim 1, wherein when the actual flow value is smaller than the first threshold value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipe is reduced, the servo motor is activated to rotate the valve rod, so that the valve rod is rotated in a direction parallel to the grinding fluid pipe and the opening of the regulating valve is increased.
5. The apparatus for controlling the flow of a grinding fluid in a grinding machine according to claim 1, wherein said servo motor is activated when the pressure of the grinding fluid on the inner wall of the grinding fluid pipe is reduced when said actual flow value is smaller than said first threshold value, and said agitator is driven, and thereafter said servo motor is deactivated when the pressure of the grinding fluid on the inner wall of the grinding fluid pipe is unchanged when said actual flow value is equal to said first threshold value.
6. The apparatus for controlling the flow of an abrasive liquid in a grinding machine according to claim 1, wherein when the actual flow value is equal to the first threshold value and the pressure of the abrasive liquid on the inner wall of the abrasive pipe is not changed, the servo motor is not activated, the valve stem is not rotated, and the opening of the control valve is not changed.
7. A grinder slurry flow control device as claimed in claim 1, wherein the flow controller is a PID intelligent regulator; the regulating valve is an electric proportional regulating valve.
8. A grinder abrasive flow control method, characterized in that the grinder abrasive flow control method is implemented based on the grinder abrasive flow control device according to any one of claims 1 to 7, comprising:
acquiring an actual flow value at a grinding fluid outlet and a grinding fluid pressure at the grinding fluid outlet;
obtaining the rotation direction of the valve rod based on the actual flow value and a first threshold value, wherein the first threshold value represents the flow of the grinding fluid required by grinding;
and starting a servo motor based on the rotation direction of the valve rod and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline, rotating the valve rod, and controlling the flow of the grinding fluid of the grinding machine.
9. A method of controlling the flow of grinding slurry in a grinding mill according to claim 8, wherein said deriving the valve stem rotation direction based on said actual flow value and a first threshold value comprises:
when the actual flow value is larger than the first threshold value, the valve rod rotates towards the direction vertical to the grinding fluid pipeline, namely the opening degree of the regulating valve is reduced;
when the actual flow value is smaller than the first threshold value, the valve rod rotates towards the direction parallel to the grinding fluid pipeline, namely the opening degree of the regulating valve is increased;
when the actual flow value is the same as the first threshold value, the valve rod does not rotate.
10. The method of controlling the flow of grinding slurry in a grinding mill according to claim 8, further comprising:
and when the actual flow value is smaller than the first threshold value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline is reduced, starting the servo motor to drive the stirrer, and then, when the actual flow value is the same as the first threshold value and the pressure of the grinding fluid on the inner wall of the grinding fluid pipeline is not changed, closing the servo motor.
CN202211512692.9A 2022-11-30 2022-11-30 Grinding fluid flow control device and method for grinding machine Active CN115533734B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211512692.9A CN115533734B (en) 2022-11-30 2022-11-30 Grinding fluid flow control device and method for grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211512692.9A CN115533734B (en) 2022-11-30 2022-11-30 Grinding fluid flow control device and method for grinding machine

Publications (2)

Publication Number Publication Date
CN115533734A CN115533734A (en) 2022-12-30
CN115533734B true CN115533734B (en) 2023-02-14

Family

ID=84722593

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211512692.9A Active CN115533734B (en) 2022-11-30 2022-11-30 Grinding fluid flow control device and method for grinding machine

Country Status (1)

Country Link
CN (1) CN115533734B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183341B1 (en) * 1999-02-09 2001-02-06 Strasbaugh, Inc. Slurry pump control system
TW558482B (en) * 2001-12-19 2003-10-21 Winbond Electronics Corp System and method for in-situ monitoring slurry flow rate during a chemical mechanical polishing process
CN102240976A (en) * 2011-05-20 2011-11-16 清华大学 Chemically mechanical polishing grinding fluid conveying system and chemically mechanical polishing grinding device
CN209590647U (en) * 2019-04-12 2019-11-05 青岛鑫嘉星电子科技股份有限公司 Grind flow quantity closed-loop control system
CN112405355A (en) * 2020-11-12 2021-02-26 上海新昇半导体科技有限公司 Polishing liquid supply system, polishing liquid testing device and polishing liquid testing method
CN113953967A (en) * 2021-08-11 2022-01-21 晶芯成(北京)科技有限公司 Grinding equipment and fluid flow control method thereof
CN215942584U (en) * 2021-02-22 2022-03-04 和舰芯片制造(苏州)股份有限公司 Install grinder of flow monitoring additional

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183341B1 (en) * 1999-02-09 2001-02-06 Strasbaugh, Inc. Slurry pump control system
TW558482B (en) * 2001-12-19 2003-10-21 Winbond Electronics Corp System and method for in-situ monitoring slurry flow rate during a chemical mechanical polishing process
CN102240976A (en) * 2011-05-20 2011-11-16 清华大学 Chemically mechanical polishing grinding fluid conveying system and chemically mechanical polishing grinding device
CN209590647U (en) * 2019-04-12 2019-11-05 青岛鑫嘉星电子科技股份有限公司 Grind flow quantity closed-loop control system
CN112405355A (en) * 2020-11-12 2021-02-26 上海新昇半导体科技有限公司 Polishing liquid supply system, polishing liquid testing device and polishing liquid testing method
CN215942584U (en) * 2021-02-22 2022-03-04 和舰芯片制造(苏州)股份有限公司 Install grinder of flow monitoring additional
CN113953967A (en) * 2021-08-11 2022-01-21 晶芯成(北京)科技有限公司 Grinding equipment and fluid flow control method thereof

Also Published As

Publication number Publication date
CN115533734A (en) 2022-12-30

Similar Documents

Publication Publication Date Title
CN100560296C (en) Stablize the Magnetorheologicai polishing liquid EGR of polishing fluid performance in the time of can growing
US6732017B2 (en) System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
US20090042482A1 (en) Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer
US6338671B1 (en) Apparatus for supplying polishing liquid
US20050026547A1 (en) Semiconductor processor control systems, semiconductor processor systems, and systems configured to provide a semiconductor workpiece process fluid
CN115533734B (en) Grinding fluid flow control device and method for grinding machine
WO2005113194A1 (en) Method and apparatus for measuring and controlling solids composition of a magnetorheological fluid
US20020045412A1 (en) Method for supplying slurry to polishing apparatus
JPH04343663A (en) Cylinder grinding device
CN112677314B (en) Slurry premixing control method
JP4004795B2 (en) Polishing fluid supply device
JP2002540518A (en) Pressure fluctuation damping system
US20030131938A1 (en) Apparatus for preparing and supplying slurry for CMP apparatus
JP4179448B2 (en) Abrasive circulation supply method
CN110744439B (en) Processing technology of high-stability substrate
TW202200307A (en) Semiconductor substrate polishing with polishing pad temperature control
JPH02250771A (en) Grinder for semiconductor wafer
CN114121647A (en) Method for improving chemical mechanical polishing efficiency
TW202218809A (en) Supplying system, test device and test method of polishing liquid
KR100431714B1 (en) Apparatus for controlling quantity of flow in the slurry supply system
CN214346261U (en) Separant tank capable of automatically proportioning
KR101122536B1 (en) Slurry supply system for cmp apparatus
CN115400845A (en) Automatic method and system for production process of lithium iron phosphate sanding single machine
CN108789163A (en) A kind of silicon chip back side polishing device and polishing method
CN206614404U (en) A kind of sapphire grinder

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant