TWI277142B - Substrate processing method and apparatus - Google Patents

Abstract

A substrate processing method and apparatus are provided to reduce substrate transfer apparatus wait time and improve substrate processing throughput by processing substrate positioning and substrate transporting in parallel. A substrate transfer apparatus (1) is configured in a single unit, a plural number of wafers W prior to notch alignment is transported at one time from a substrate accommodating container to a substrate alignment apparatus (22), and the plural number of notch aligned wafers is transported from the substrate alignment apparatus (22) to a boat (21). Two stages (upper and lower) of notch alignment units (4) and (5) that configure the substrate alignment apparatus (22) operate independently, and are capable of performing notch alignment, in total, on a number of wafers to be processed that is twice the number of wafers transported at one time by the substrate transfer apparatus (1). While notch alignment is being performed in the one notch alignment unit (4), notch aligned wafers W are transported by the substrate transfer apparatus from the other notch alignment unit (5) to the boat (21), and then wafers prior to notch alignment are transported from the substrate accommodating container to the other notch alignment unit (5).

Description

1277142 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) [Technical Fields of the Invention] The present invention relates to a substrate processing method and apparatus, and more particularly to an improvement of a substrate alignment device in a vertical transfer/transfer, thereby improving a substrate The efficiency of the transfer machine. [Knowledge technology; j In the conventional vertical diffusion CVD device, when the wafer in the tank is supplied to the boat, it is received: the substrate is stored in the 曰... The mouth is not arranged neatly. In the absence of the circle, the neatly arranged wafers are supplied, and the garnishes are arranged in the cans to make the cans "using the can opener"; the 曰 姑 亦 is also the wafer in the can: the can is transferred to the can Notch aligning device. Finish:: After the wafer transfer machine of one set, the loaded wafer boat is loaded into the reaction furnace to the wafer boat with the sT port, and the wafer is placed in a tank of two 25 pieces. Inside

The device is also made up of 5 pieces; 2; owed: 5 pieces of wafers. Because T is more: the machine is usually set in units of -, "and the person and the mouth are aligned with one piece and five pieces, and the mouth is aligned, so from the can;;: vertical diffusion, device. 5 gaps in the absence of alignment I: lack of alignment: the alignment device, the lack of ^ / / is - in the above-mentioned method ^ storm board processing device - use a base to the boat . The weight of the sequence is V: after the gap of 5 pieces is aligned with the delay/set of the same number 'for example, the piece is harder than the action' until the wafer is moved. [The invention is to be solved: the door; carried to the boat. W wafer board A:\90123575.ptd Page 5 1277142 V. Invention description (2) Transfer machine, and the position of the substrate which can handle the alignment of 盥1: the number of substrates with the same number of dies The transfer of the sequence to the substrate is aligned. The substrate transfer machine is used to align the substrate with the need to wait for the position alignment process. The board is transferred to the substrate position alignment device to process the next substrate in series, so the substrate transfer machine: is aligned with position because it becomes the throughput of the board processing. The temple 4 is very long. It cannot be improved. The purpose of the present invention is to provide the processing capacity of the substrate processing board alignment device and the clothing, and to improve the substrate transfer machine by improving the substrate. The flux of the 2 technology. :, can be used to hunt the substrate processing [the means to solve the problem] :: Patent 1 is the substrate transfer device for the substrate, used to make the gap or the hole with the other method: Transfer from the substrate storage container to the substrate. Alignment of the substrate is performed. The alignment device is used to align the notch or the hole or the substrate alignment device, and the number of substrates can be transferred. More than twice the substrate private carrier is aligned; the above substrate is aligned: = the notch or the hole pair: or the aligned substrate piece 匕 成为 becomes the person = the substrate is missing the machine - the second handling The number of substrates is one, and one is performed at the same time. The substrate transfer mode is set to perform the chipping of the substrate once or n: using the substrate position aligning device for performing the substrate number alignment of the substrate; and using the above-mentioned u substrate transfer machine m Substrate or substrate A:\90123575.ptd Page 6 1277142 V. Description of the invention (3) Storage container, aligning the above-mentioned notch or hole substrate with the device, or from the substrate before alignment The substrate is aligned to the substrate with the notch or the aperture aligned. The handling here refers to the broad meaning::: The above-mentioned boat. A place moves to another site 3 privately, that is, the substrate is moved from one substrate to another, and the action of I is included. In addition, the substrate is removed, or it will be moved to one of the other two. From the substrate loading field for the like. In addition, the term "parallel" refers to a generalized case where the action of the person 2 board is superimposed or overlapped in time 1 and the action is partially overlapped. In addition, in the case of overlap, the scope of the patent application is also included; The first method is a method in which the three types of substrates shown in the substrate storage capacity are transported to the substrate alignment, and the gap or the aperture is aligned in front of the quasi-operation (Fig. 3U), which is: The opposite hole alignment device aligns the notch or the hole Π method 运 from the substrate position, and the notch or the hole is aligned and moved into the bf plate to move to the boat to move the ancient 氺曰 ^ Gan 』 + Ai Jin set The method (Fig. 3 (b)), the third method 疋k substrate storage container transports the notch substrate alignment device, and the substrate aligned with the 刖 is aligned or aligned with the substrate The earthboard position aligning device transports the notch 1 to the day of the boat, and the method of notching the gap with the gap or the gap (Fig. 3(c)). n In order to align the position of the substrate π / the number of substrates to be transported on the substrate position J: 1 substrate transfer machine - sub-parts, independent action = : gap or hole alignment A mouth injury consists of the multiple parts of the wrn page 7 C: \2D-CODE\90-12\90123575.ptd 1277142 V. Invention Description (4) Notch or orifice alignment or orifice The number of pieces aligned. Or: port, as the above-mentioned substrate can be gapped or aligned with the hole = 2 to increase the position of the substrate alignment device to become the part before the addition of two: Ζ = response. In the latter case, the action at > means multiple: =: cannot act independently. : Interfering with each other, the slave action is 々^=Operation, the multiple parts are not even if there are ones in the multiple parts;; 'In the independent action: the parts are transferred by the substrate, and the middle is: For the other aspect of the invention, the method of the substrate is not possible. The maximum number of lines or holes aligned, the position of the substrate, the number of sheets that can be multiplied by more than the number of sheets, and the number of substrates that are transported at one time. ° In the 移 疋 疋 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在Bruises, in the space created Before the handling gap or orifice is aligned: Base::? For the range of interference, the time can be reduced, and the position of the substrate transfer machine can be aligned with the position of the second: the specified time rate, so as to improve the substrate processing. The second item of the patent scope is a substrate transfer machine for a substrate processing method, which is used for transferring a notch or an orifice before the substrate/loading device is transferred from the substrate storage container to the substrate alignment device: The alignment device moves the plurality of substrates aligned with the notches or apertures to: a plurality of substrate alignment devices that can be independently operated, and can be integrated

1277142 V. Description of invention (5)

Performing one of the substrate transfer devices to transfer the number of A-pieces of the substrate or the number of the holes aligned to the substrate one time or more, and in the plurality of substrate alignment devices, the position alignment device performs The above-mentioned substrate is notched/used with one substrate; the alignment of the holes on the substrate transfer machine is the same as the above: the substrate before the port is aligned, and the substrate is transferred to other substrate holes. Port ί! The position of the substrate is aligned with the device, the notch or the aligning plate is aligned with the substrate, and the above-mentioned boat is ordered from the milk. Λ, his substrate position alignment device is transferred to , and the substrate processing method also includes the three methods shown in FIG. The first type of opposite-facing aligning device performs the notch or the hole of the substrate. The slab is: the substrate which is aligned with the notch or the hole is transported to the substrate alignment device (Fig. 4(a)) ' The two methods are to use a substrate position to align with the dream, 隹ϋ | ^ line, take out the use of the ▲ into the substrate gap or the hole alignment, and the alignment of the substrate 2 Or the orifice pair -:iL: is transported to the boat (Fig. 4(b)), and the third method is to align the device to make the gap or the hole of the substrate, and the second method: The substrate alignment device will notch or align the plate, transport it to the boat, and transport the notch or aperture to the other substrate alignment device (Fig. 4 (〇). 4 A plurality of substrate alignment devices for vertical operation, so no: ί : ΐ : The substrate is aligned with the notch or the hole, and the beam is aligned with the gap or hole in the substrate. In the quasi-middle, the notch or the hole can be aligned with the front substrate, and the conveyance is not carried out. 1 Page 9 Φ C:\2D-CODE\90-12\90123575.ptd 1277142 V. Explain (6) $ other than the other holes when the orifice is aligned: Take == the plate is aligned with the notch or the hole of the device to carry it to the boat. Therefore, the substrate is alternately shifted. Take out the gap or the hole alignment two:; 曰 advance, transfer: [Crystal, so you can improve the base] for the sequential shift:: Patent model item 3 substrate processing party: 凊 patent scope 2 The substrate processing unit ['in the substrate transfer machine, from the above-mentioned 苴 夕 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Transfer to the above = = = gap or the front of the orifice is aligned with the handle, , , ''inner valley state, will, pre-installed. According to this hair; day win, two missing 3 =: = board position cycle The gap of the initial action or the base of the orifice before the alignment:: Turn: to the treatment: one substrate transfer machine can have the evening load, so the throughput of the treatment. π j Μ to the substrate to apply for patent scope 4 In the substrate processing method of item 2 of the substrate processing method, the above-mentioned notch or orifice alignment operation by the upper range is used, and the position is Aligning the above-mentioned notches or other pairs of apertures performed by the substrate alignment device. & In the present invention, the alignment of the substrate is used: !: part of the gap or aperture alignment, and utilization Other substrate alignment equipment is indispensable. Page 10 C:\2D-CODE\90-12\90123575.ptd 1277142 V. Invention description (7) f orifice alignment 'because it is repeated with partial repetition When the situation is compared, 仃 so when and not flux. Inch can further improve the substrate processing I" month patent range item 5 is a kind of substrate processing substrate transfer machine, used to 4 from the female eight have. 1 set of hanging L & & 丨 丨 妃 片 片 片 片 片 片 片 人 人 人 人 人 人 人 人 人 人 人 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ _ ^ aligning device, having a plurality of subordinate operating regions, ϋ 仃 仃 仃 仃 仃 仃 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Performing a 5-inch-line alignment with the gap or aperture of the substrate using an area of the above two IS1 b::隹-, By using the above-described substrate transfer machine, the substrate before the notch or the hole is aligned is transported to another area from the substrate storage container, or the other areas of the above-mentioned area are discharged or notched in the other area. The substrate aligned with the orifice is transported to the above-mentioned boat. The seed substrate processing method also includes the three methods shown in FIG. In the i-th method, the notch or the hole alignment of the substrate is performed by using one area, and the substrate before the notch or the hole is aligned to the other area in parallel (Fig. 5 (a)), the second type The method is to use the area of i to perform the gap or the alignment of the substrate, and in parallel with the substrate, the substrate or the aperture aligned with the other area is transported to the boat (Fig. 5(b)), the third type The method is to use j areas to enter the gap or the hole alignment of the substrate, and in parallel with the other, the substrate or the aperture aligned with the other area is transported to the wafer boat, and the gap or the hole is aligned. The substrate is transported to other areas (Fig. 5 (c)). According to the present invention, since the substrate position aligning device is provided with subordinate operation

1277142

EMBODIMENT OF THE INVENTION (8) When a plurality of regions, 仏, 、, 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 It can be stored from the substrate to the two sides of the mountain: 基板 The front of the area of the substrate, loaded everywhere eight times of the gap or the hole is aligned with the gap or hole alignment of the area: & field additional 'in- The area or its mouth alignment action, '_, can be loaded into the boat without interfering with the gap or the orifice plate, 'from 3:: the flux of the base taken out from the substrate alignment device. The waiting time of the salt-substrate transfer machine, and the improvement of the substrate processing: the substrate processing method of the sixth item of the mouthpiece and the bottom of the board according to Figure 5(c): specializing in the boat, and then from the above beauty The substrate with the handle = f is transported to the above-mentioned crystal substrate and transported to the above two, and the flat bar is aligned with the notch or the hole aligned with the front hole. According to the present invention, the substrate or the substrate can be transported, so that the σ can be used before the gap or the hole is aligned, and the substrate transfer machine can be effectively used. The flux. The substrate processing method of the fifth or sixth item of the patent range is the application board transfer method, and the above-mentioned one base substrate is transported to the above-mentioned anti-storage container by the above-mentioned 4th reverse processing method. Aligning the notch or the orifice with the front container and removing the notch & hole =:, the handling of the domain refers to the substrate before the substrate receiving opening is aligned, and the removed substrate is moved.

C:\2D-C0DE\90-12\90123575.ptd Page 12 1277142 V. INSTRUCTIONS (9) Ship to the vicinity of other areas mentioned above; and after alignment of the notches or openings of the substrate in one of the above areas' The substrate that has been transported to the vicinity of the other regions described above is taken out from the substrate storage container described above and loaded in the other regions described above. Such a substrate processing method includes the two methods shown in FIG. The first type is to use a region to perform the gap or the alignment of the substrate, and the side of the board is transported to the other area when the front or the front of the hole is aligned. Remove the notch or the hole in the storage container and align it with the substrate of the month, transport it to the vicinity of other areas, and then place the notch or the hole at the timing of loading the substrate in the other area to become the substrate of one area. After the notch or the hole is aligned (Fig. 6(a)). The first area is to make the gap or the hole of the substrate. 千 千 千 千 千 千 , 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千When the substrate before the port is conveyed to another area, the handling operation of the board is to take out the missing σ or hole = plate from the substrate storage container, and transport it to the vicinity of other areas. Timing of other areas, after the notch or the hole is aligned with the front notch or the hole is aligned (Fig. 6(b)). In the case of the substrate of the region, in the above-mentioned one region, since the substrate is pre-upper-notched or apertured from the substrate storage container: the substrate is loaded into the other regions described above, or the gap or the front of the opening is aligned or After the holes are aligned, in the state of the substrate or the substrate aligned with the holes in the area, the remaining areas of the substrate or the other areas of the substrate before the alignment of the holes are in the gap of the area Or the orifice is aligned so that when the substrate with the dry k is discharged, the substrate is loaded

1277142

V. Invention Description (ίο) #机,葬椐的椐I I, ', ',, 口 口 can more effectively use the substrate to move the hunter to meet the throughput of the substrate processing.基板 ft#,® (4) The substrate processing method shown in Figure 7 is as follows: 1 substrate transfer machine, used to transfer multiple substrates from:, other t domains: when the situation is compared 'can be quickly carried out in other The area is transported to the wafer boat; and the base is reversed to be more than double the number of mounted substrates;;: the plate of the two bases: the load: the gap of the substrate or the alignment of the holes; Using the substrate transfer machine described above, the substrate before the notch or the hole alignment is taken out from the substrate storage container, and the substrate is positioned as a region in a plurality of regions of the device; = Positioning the I-positioned area to make the gap or the hole alignment of the substrate 1 in the gap or the hole alignment of the above-mentioned one area, and use the above-mentioned substrate transfer machine 'from the above substrate receiving port Or the substrate facing the opening; the notch or the opening of the substrate in the above-mentioned area is aligned with the substrate which is finished to be taken out, and t is carried to the other areas mentioned above; in the other areas mentioned above: loading 1 in: on the ί Πί field to take out the gap or hole in the one area = upper 辻After the above-mentioned one of the areas is taken out, the substrate or the opening of the other area is referred to as the notch or the opening of the substrate, and the substrate of the face is transferred to the wafer boat. Μ ^The above-mentioned area is taken out.] When the substrate is removed from the substrate storage container by the substrate transplanter

C:\2D-CODE\90-12\90I23575.ptd Page 14 V. Description of the invention (11) The sequence is the timing when the 2-port or orifice is aligned. Align the notch or the hole in one area, take the next gap from the substrate storage container or the hole before the alignment = ^ After the gap or the hole of one area is aligned, the 11 notch or the hole is aligned The front substrate is loaded into other areas, and after F, the area is taken out in the area, and the substrate is removed. After removing from one area, it is in the other; ί::: Alignment, in the other areas, the gap or the hole is aligned with the alignment f. The substrate is loaded on the wafer boat, so the substrate is in the subordinate operation of the substrate, and the substrate can be reduced to improve the substrate processing. Transfer machine's preparation: Qing 1 special Taiwan's Fan A circumference / poverty 9 items is a kind of substrate processing device 'characterized by a plate storage container shifting>> loading board 1 for the use of multiple substrates Transfer from the base to the boat; multiple: plate:: device' or aligning the device from the substrate with one of the above-mentioned bases, aligning the device with her, for independent alignment; and control; In the notch or aperture device of the plurality of substrates, 1 is aligned with a substrate Arranging the alignment or the alignment of the apertures, and placing the gaps of the substrate in parallel with the other substrates is placed on the substrate 4, and the substrates of the second:::: substrate are placed and aligned. The configuration of the notch or the aperture alignment is used to properly implement the above invention. 'It can be used in accordance with the scope of the patent application. The item is a substrate processing device'. Features: 15 pages # C:\2D-C0DE\ 90-12\90123575.ptd 1277142 V. Inventive Note (12) It is equipped with one set, which is transferred from the substrate storage container by 1' loading n' to transfer the multiple substrates to the wafer boat. Aligning the skirt, or aligning from the substrate, using one of the above substrates to transfer two sets 'having a plurality of regions for port alignment; and controlling the slits or holes of the plurality of substrates Using the substrate transfer device of the above-mentioned plurality of regions in the above-mentioned plurality of regions, the substrate is aligned with the substrate before the alignment or the hole is aligned with the substrate to the substrate storage container. Other areas of the 嗲1彳5 玄, which are discharged from the other areas mentioned above, or the substrate Shipped to Shangcheng Xi B & the gap or hole in his area is aligned with the 晶* at the l-boat. Youji" «The structure used to properly implement the above = Mingshi' can be used simply [inventive content specific Explanation] Before explaining the form of the device, the action of the device is used to explain this: = 2 Use Figure 8 to illustrate the comparison of the conventional examples. In the specific example of the substrate processing method of Fig. 8, there are three pairs of substrate positions provided; Fig. _ shows the number of times or the number of holes or holes in the hole, and the carrier sheet with the substrate transfer machine is provided with the number of sheets transported by the transfer machine/specific example 1. Fig. 8 (β) shows a specific example 2 in which only the number of units is provided with a notch indicating the alignment device. In the case of the substrate in Fig. 8 (A) to (C), the substrate position alignment device of the two substrates is mounted on the substrate. The white arrow is aligned with the entry arrow in the device. The arrow pointing toward the substrate alignment device indicates the base.

C:\2D-CODE\90-12\90123575.ptd Page 16 1277142 - Face _ V. Invention Description (13) The meaning of the board is removed" means that the notch or the hole is aligned with the vertical alignment device. Action, "Thinking. (b) indicates the base plate of the upper section: "Upload" means that the substrate loader is set to I, and "Uploaded" means that the substrate is aligned from the substrate of the slave, and "Crystal loading" means Take: The device removes the base position alignment device of the lower part of the base. (C) The position of the substrate loaded to the lower stage is aligned. The "Bulster" indicates the substrate condition, and the oblique line indicates the operation. The operation of the non-multiple load is shown in Figure 8 (8) (bc). To:: When using the substrate transfer machine to transport the substrate, it is because of the smashing action. There is one, so the handling steps are eroded ’’, and the soil board private carrier is only the most efficient. 4 Use the following steps (1) to (4) to become (1) remove the notch or the hole from the substrate alignment device. When the notch or the hole is not removed from the substrate alignment device: the next gap or The substrate is aligned with the front substrate, and the device is aligned with the substrate substrate. Not to be ashamed of this (2) loading the substrate with the notch or the aperture aligned to the wafer boat when the notch or the hole taken out from the substrate alignment device is loaded in the state of the substrate transfer machine, because at = The substrate is removed from the notch or the substrate aligned with the aperture is loaded into the wafer boat. , > clothing

C:\2D-CODE\90-12\90l23575.ptd A new substrate is placed, so it is not possible to carry the next gap or the soil substrate. In order to be able to carry it, it is necessary to remove the material from the substrate 1 = 1277142

1277142 V. INSTRUCTIONS (15) ΐ: ΐ: The alignment of the substrate of the quasi-device or the lower section is aligned with the aperture of the skirt. Since the 忒 不会 does not interfere with each other, any of the above actions can be performed. As a result, it is possible to reduce the substrate transfer/the temple to be used, and the throughput of the substrate transfer board can be effectively utilized. As shown in Figure 8 (B), in the right disk # # α k 仂 w μ μ ^ ^ There are the same number of pieces as the number of carriers carried by the private carrier J: In the example 'because it is not parallel processing It is a tandem process, so if the σ or the hole σ is aligned without going through all the movements from (1) to (4). As a result, the flux cannot be increased. As shown in Fig. 8(C), in the state in which the state in which the energy can be left in the -section can be used, the substrate of the notch d can be enlarged in other sections, so that the substrate in the upper and lower sections is aligned with the other substrate. Carry out the loading action 2 of (4);:: Exit = mouth = intermittent, can be used to carry out the (2) boat loading action and (3 ::: hole: this can be the second and later gaps [Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described. In this case, a notch is used as a center of a substrate, and a mouth is detected, and a notch is detected. It is not limited to 5 pieces, as long as it is a plurality of pieces, it can be any. However, Fig. 1 shows the substrate position aligning device of the present embodiment = type on page 19 1 C:\2D-C0DE\90-12\90123575. Ptd 1277142 V. Description of Invention (16) Appearance of the CVD apparatus, and Fig. 2 is a plan view of Fig. 1. As shown in Fig. 1, the vertical diffusion CVD apparatus has an approximately rectangular outer cover 2. 0. The reaction furnace 6 is provided in the crucible, and is heated by a heater to form a film on the wafer W. For accommodating a plurality of wafers w in a plurality of sections 'inserted into the reaction furnace 6 for processing; a boat exchange device 7 for + exchange of the wafer boat 21; a boat elevator 丨! The boat 21 is lifted and lowered to insert and extract the wafer boat 21 into the reaction furnace 6; the substrate alignment device 22 is used to perform the gap alignment before inserting the plurality of wafers into the wafer boat 21; One set of substrate transfer machine 1 for displacing the surface of the substrate from the substrate storage container (not shown) with the substrate alignment container 2 2 and the substrate alignment device 2 2 will be missing: 2 used to ΥΛ? w - transfer to the boat 21; and the transfer machine is raised and lowered, 栻z is used to lift the substrate transfer machine 1. The quasi-alignment device 22 is stacked by the top and bottom The notch aligning portion 5 is configured to transmit the gap between the notch aligning portion 4 and the lower portion of the upper portion of the upper portion of the Y, and then the movable load can be reversed:: the number of wafers to be transported is doubled. Figure 9 shows the position of the wafer of 2 times and 仃. ^ ^ % ^ ^ ^# f ?a'?b The center of the arc is the position where the boat 121 is inserted into the eve of the ^^. Boat 2&qu Ot; issued by the boat force 丄 = Lu 6 = 'transfer from the inner plate of the reaction furnace 6 transfer to the boat 21, the left end of the arc is the base right end is the boat retreat position G position Α 'the opposite side of the circle The mountain cover 11 b of the circular boat lift η shown on the arc lifting platform (1) is set on the 20th page of the crystal boat C:\2D-CODE\90-12\90l23575.ptd

1277142 — V. Description of invention (17) 2 1 below, when the crystal is ~ ^ sealed the lower part of the reaction furnace 6, σ. When the person comes into the reaction furnace 6, the airtight type is dense: outside, in the outer grass 2. The left side of the opener 13 is used to open and close the lid of the wafer w that is stored in the can, and the lid is opened and closed by the lid of the wafer 7 that is stored in the can, and the transferer Lifter 2... 1, is placed on the side of the wafer loading/unloading: port a), and can be transferred one side at a time (in Figure 2, the left carrier 1 is taken out together from the tank 5) Wafer W. The substrate is loaded onto the left side of the outer cover 20 _^2 missing before the alignment of the crystal ", carrying Ϊ 4, pick up 5 pieces of the gap aligned with the f crystal or 5 ' from the gap pair From the quasi-portion to the wafer boat at the wafer transfer position A: 2: 'Load and load it and load it into the notch alignment portion 4, 5 1蛊, take out the wafer W, and move the port alignment portion 4, 5 Take out the crystal „ carry it 乍 ^ for transfer. In addition, the lack of is also known as transfer. Operation of loading the boat into the boat 2 1 The two boats 21 and 21 of the boat exchange device 7 are respectively arranged at A, c = work = the first member is empty 2 via the substrate position aligning device 22 Carry out the notch, the crucible can be 1 = take = the gap is aligned with the crystal, fill = 2 = rational 'set, 1 ^ liter rise, load into the reaction furnace 6 Θ by "specify" 匕 Lu Hao in the reactor 6 During the processing, it is located at:: Arm: to the heart position, take out another notch alignment from the can. 曰曰0W, use the substrate alignment device 22 to perform the notch alignment, and page 21 C:\2D- C0DE\90·12\90I23575.ptd 1277142

V. Description of the Invention (18) Transfer to the boat 21 to fill the boat 21. (a) After the completion of the crystal boat load by the reaction furnace 6 is made to drop to the B position, the boat is rotated by the boat: 1 rotation, and the clean air delivery portion 16 is used for cooling (four) to reach the retracted position C 'profit (b) The wafer boat 21 filled up by the wafer W during the cooling is lifted by the gap of the arm*, and is loaded into the reaction furnace 6 to borrow the position. During the processing of the furnace, the wafer W, which is cooled at the C position by the rotating arm 7b to the 丨丨诘A, is returned to the tank. 'Remove the processing at the A position. ή: The substrate position alignment device 22 taken out of the 进行 is used to perform a notch pair 1 new Japanese yen W 'transfer to the take-out 21' to fill the boat twenty one. And the round of the work of the boat and then repeat the operation of (a) ~ (d). The side cleaning cloth: 20 behind the boat exchange device 7 is disposed in two thin cleaning units 8 in the outer cover 20 Γ t ^ out ^ 16 . Further, the exhaust fans 9 and 10 are provided. J 乂 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 设有 设有 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 另外 另外 另外 另外 另外 另外 另外 另外 另外 另外The drive motor 3 as a drive source for the elevator is also sighed. The substrate alignment device 22 is described above. In the second embodiment, the alignment device 22 has two types, that is, the pattern 1, which is operated upward. And the mouth alignment parts operate independently of each other; and the type 2, the subordinates proceed

C:\2D-C0DE\90·12\90123575.ptd Page 22 1277142 V. Invention Description (19) Figure 13 shows the type! The appearance of the substrate alignment device. The type is formed by two vertical notches 3 (^, _ (corresponding to the two notch alignment portions 4 and 5) of the plurality of wafers. The function of the = is used in the gap of one side. When the quasi-device 3〇a (3〇b) performs wafer W notch alignment, the 'twisted' is transferred to the other one. The other one is used for the notch alignment device 3: the two-notch aligned wafer W Transfer to the boat ❶ A) Take out the two notch aligning devices 3 〇A, 3〇B of the same structure into the upper section, and the notch aligning device 3 of the upper and lower sections 3, 3〇b can be sharded - The gap is aligned. Here, instead of simultaneously: the feeders m, _' are used alternately. :: Description. Transfer the 5 pieces of crystals to the upper section (the lower device m' is loaded on each turntable 3〇7. Make each two pairs of pairs = rotate, use the optical sensor 311 to detect the missing σ, so that the notch pair = finger疋 Location (In addition, during this period, 5 wafers are aligned to the device 3. 趵. When 5 pieces are all in the turntable m to complete the gap 2': use the substrate transfer machine i from the upper section of the gap The quasi-device 3 〇w, 5 pieces are taken out together and transported to the wafer boat 21 (in addition, the notch aligning device 30B of the movable mouth segment performs the wafer notch alignment operation. Perform the same operation as the previous paragraph. π alignment 'Transfer the wafer w after the gap is aligned to the wafer boat?! 仃5 The detailed structure of the structure and operation of this device is as described later. The feature is that the two gap aligning devices 3〇A, 3〇B are independent. Therefore, when a notch aligning device 3〇A (3〇B) is aligned in the gap,

C:\2D-C0DE\90-12\90123575.ptd Page 23 1277142 V. INSTRUCTIONS (20) The wafer can be transferred from the wafer boat to another notch alignment device 3(10) (30A), and The aligning device 3 〇 β ( 〇 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到The areas 4〇Α, 4〇β (corresponding to the two notch alignment portions 4, 5) together with the gaps of the plurality of wafers are aligned. In one of the regions 40, the wafer is not aligned. In parallel with this, the wafer transfer operation is performed in the other area 40Β, and after the gap alignment in the square area is completed, the wafer is transferred to the other area 40Β, and is taken out in one area 4 〇ΑThe wafer is not aligned with the gap, and then the gap of the wafer is aligned in the other area 40,, and θθ is parallel thereto, and the wafer w that has been aligned with the removed gap is transferred to the wafer boat 2j. ;, the notch aligning device 40 becomes a device using one device, and the number of the substrate is one for the substrate transfer device 1 The number of wafers to be transported is 2 俨 曰 之 。 。 。 。 。 。 。 。 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本〇4 rotation, the gap alignment is performed by the order of the sub-films. The wafer is supported by the pole 1〇5 to support the rotation. After the gap alignment is completed, the upper pole is used to hold the gap. f wafer W retreat, from the bottom of the wafer? According to the sequence of the next slab, used to carry out the gap of 5 pieces of the gap. Support pole 1 〇 5, holding the pole 丨 construction can correspond to 1 The wafer % of the wafer. When used, the portion where the gap is aligned is divided into upper and lower regions 40A, 40B, and the two regions 4 (u, 40B are not used simultaneously) but alternately used. 2 regions 4〇a, for the individual order, the gap alignment of the cymbal is performed once. First, use the substrate to transfer C:\2D-CODE\90-12\90123575.ptd Page 24 1277142 V. Invention description (21) ί : 5/ piece of 曰曰 曰曰 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运Position, external school f: The device 1 1 6 detects the gap, so that the notch is aligned at the designated RH, during which the substrate transfer machine 11 uses the substrate transfer machine 11 to make a gap to the carrying operation of the day f. All of the sheets are supported by the support pole 105. The chip is then placed in the area of the lower section. Each of the sheets 66 is used to transfer the wafer W from the upper section 40A, May. , 1 枷u station a Λ parallel, in the lower section of the area, domain ^ and clothes loaded to the boat. In alignment with the gaps of the five pieces of the movement, the wafer W is transferred to the wafer boat 21 in the same manner as the operation of the second unit 40A. The characteristic of the type 2 is that 2 a, 、, 卩 卩 亦 亦 亦 亦 亦 亦 亦 亦 亦 亦 亦 , 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此It is advantageous to have a wafer surface for other areas. For the teaching of the six 乂犄 'combination is easy and easy to teach, etc., one time from the turntable 3 〇 7 = easy = face, the structure of the type 1 is difficult for the wafer, in contrast, holding the crystal The visual confirmation of the circular support state is round w, because the structure of the lower part of the wafer w is easy to support the crystal with the support pole 1〇5, and the teaching can also be sweaty, so the visual support state of the wafer is confirmed, Λ匕 easier i隹;. In addition, in Fig. 20, the rush is entered. The calculation processing device is configured to be connected by a computer having a calculation unit and a memory component or a substrate transfer machine 1 , a member 5 1 and a keyboard 52 , and each of the data. Tube B can communicate, according to the application from the keyboard 52, special processing, used to control the substrate transfer machine! , C:\2D-CODE\90-12\90123575.ptd Page 25 1277142 —---- V. Description of the invention (22) The heating state of the reactor is 5 3, the position of the substrate is aligned with the loading, and the boat lift 1 , the boat exchange device j, the transfer machine lift fan gas Θ, 1 〇, and the can open, the thin cleaning unit 8, the row will be described below using the above. Type: The action. In the case of the first one, the substrate position of each of the notches is aligned. The movement of the substrate transfer machine that is ordered is 曰= indicates the operation of the substrate position of the use type 对0 private load. In Fig. 9, the upper=set % gap alignment and alignment device operation status, and the substrate 4(a) indicates the position of the upper segment, and the middle line #the upper segment is aligned with the position: And the working condition of the substrate transfer machine to the lower section. In the figure of the operation of the substrate transfer machine, the "upward transfer" and the "transfer from the can to the substrate transfer machine" respectively indicate that the "grain transfer of the === crystal and the removal of the notch in the canister" Alignment with the operation of the substrate transfer machine notch alignment device BS "Transport and loading into the lower section of the notch alignment device" "Transfer to the boat" means "action from the boat".兮箅 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准Horizontally placed away from the device 13 to open the cover' using the substrate transfer machine! Take it out and carry it to I::::2 and take it out. In the upper section, the gap is aligned with the garment 3 〇A. In the gap notch alignment, the can opener 13 is used to hit the cover.

_SSI C:\2D-CODE\90-12\90123575.ptd Page 26

4, the goods description (23) will 曰曰:: speak the substrate \ carrier 1 from the tank to take the next five wafers - from the wood and loaded into the T segment gap alignment device 30β. Into the 缺口 就 就 缺口 缺口 对准 对准 对准 ( ( ( ( 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准The gap alignment can also be transferred to the gap of the lower section in the upper section and the mouth alignment device: two in two. For example, 'the head can be aligned with j to transfer the substrate and the upper section is completed. ^ Α ^ μ ^ μ 日日® W, transferred to the boat 2 1. After transfer, / with the substrate transfer machine] Take the tank from the tank: War: Round, transfer it to the upper section of the material The next five crystals of the ram are loaded into the boat and transferred to the upper section, and placed in the upper section. The wafer W is displaced by 3 〇β in the alignment. ^疋Using the lower section The gap alignment is alternately performed, and at the same time, the transfer of the upper and lower sections of the transfer machine 1 to the wafer boat 21' and the cornice are aligned in parallel, using the substrate 3 Ο Β. Loaded into the notch aligning device 3 () A, not the conventional action shown in Figure 1 're-transfer the next wafer string to be strictly aligned to be aligned The devices 30A, 3〇β do not need to be shark=, but use two notch rows for parallel processing. Therefore, the position of the substrate is aligned, and the number of slices can be increased when the alignment process is completed, and the position of the ::; Align the throughput of the processing capability board. After waiting for the specified gate 4, the base time 'the nick of the conventional shifter to the boat 21' can be improved. When compared with the conventional one, 15 pieces of the type 1 are 25 pieces. The number of wafers of the wafer W that has been aligned with the substrate processing can be improved by nearly 70 1277142 for Wentong I.

Figure ίο Alignment of the substrate to the operation of the upper device. The substrate is transferred to the notch. The crystal plate transfer and loading table are not shown in the lower part of the area. In the case where the transfer machine alignment area is not "the action of the rounding of the machine from the position of the substrate to the wafer type 2 device. In Fig. 10, the upper line (a) indicates the device. The working condition of the upper section and the action content of the substrate transfer machine, the middle line (b) indicates the working condition of the substrate alignment field, and the area of the lower substrate of the substrate transfer machine and the lower line (c) indicate that only the wire is removed. The condition of the substrate transfer machine.

Figure ^ 'The substrate removal before the gap alignment indicates that the wafer is removed from the wafer before the gap is aligned and the vicinity of the wafer is transported." Remove the notch alignment from the notch alignment area. In addition, "loading into the boat" means "the operation of the wafer conveyed by the notch taken out by the base notch alignment area".

First, the lid is opened by the can opener 13 and the first five wafers W are taken out from the can with the substrate transfer machine 1 in a horizontal position, and transported and loaded to the upper portion 4A. The gap alignment is performed there. In the gap alignment of the upper stage, the lid is opened by the can opener 丨3, and the next five wafers are taken out from the can by the substrate transfer machine 1, and transported to the vicinity of the lower section 40B, Wait until the gap 40 of the upper section is completed before the gap of the wafer W is aligned. After the area 40A of the upper stage completes the initial gap alignment, the substrate transfer machine 1 waiting in the vicinity of the area 4 0 B of the lower stage is used to align the gap with the front crystal.

C:\2D-CODE\90-12\90123575.ptd Page 28 1277142 V. INSTRUCTIONS (25) The circle W is loaded into the area of the lower section 4 〇 B. After the loading, the wafer transfer machine 1 is used to take out the wafer W in the upper portion 40A from the upper portion 40A to complete the notch alignment. After taking out, use the area of the lower section 4〇B for the alignment of the gap. In the gap alignment of the lower stage, the substrate transfer machine 1 is used to convey and load the wafer w which has been taken out from the upper portion 4 Ο A to the wafer boat 1 . After loading, the substrate transfer device 1 takes out the next five wafers before the notch is aligned from the can, and transports it to the vicinity of the upper region 4 〇a, and completes the wafer in the lower region 40B. Wait until the gap is aligned. When the area 40B of the lower stage is aligned, the substrate transfer machine 1 waiting in the vicinity of the upper stage 4 Ο A is used, and the next gap is aligned with the front 曰 ' w to the upper area 40A. After the loading, the substrate W is moved from the lower region 4〇B, and the wafer W in which the notch gap is aligned is taken out in the lower region 4〇β. Then, it is alternated in the same way, and in the absence of the lower region 4 Ο B, the gap is aligned with the wafer before the gap is aligned with the wafer W, or between the upper region 40A, that is, The wafer W after the notch circle W is loaded to the gap alignment area is not performed. The working rate of using this type of transfer machine 1 will be reduced

The gap of the upper section 4〇A is aligned with α, and at the same time, the gap is transported and loaded into the boat 21, and the can is transported to the gap alignment area and the lower section 40. Notch Pair: 〖In the period of alignment, the notch is aligned with the front spear from the notch alignment area. When compared with the type 1 , the meaning _ , but when compared with the conventional one shown in Figure 11 ^

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1277142 V. INSTRUCTIONS (26) The vehicle is hit because the position of the substrate transfer machine is aligned. The number of processing powers is reduced by 0, so the gap is aligned with the load. After passing the above-mentioned designation s2, it is possible to improve the substrate processing and transfer to the crystal boat engraving. When compared with the conventional one, the piece 'and the example is... the number of pieces is 15 Type! The implementation form can be improved by nearly 40%. From the completion of the process, the other side is only looking for - the gap of the square can be aligned with the gap of the upper section, the sub-standard, but because of the type 1

Independent action, so as shown in the figure below, the notch alignment device 30B of the lower part of the mouth can be completed, and it is not necessary to wait until the timing of the gap is improved. The actual gap is aligned... so that the gap is sorrowful because of the use? △ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Alignment with the clothes will be described below in the specific description of the 'type and action. [Configuration and operation of the configuration of the notch aligning device of the formula 1 and the type 2 (Fig. 13 to Fig. 14) In the substrate position aligning device of the type 1 "because the t device 30A and the lower portion of the notch are aligned with f The gap of the slave is aligned with the heart of the upper section "...the structure is the same, so only the structure of the substrate is aligned in January, and the device is positioned in a manner that does not touch the s-gate method" using 5 contacts corresponding to the number of wafers. : The detection of the wafer of 5 wafers of the round. J 乂b sheet together as shown in Figure 13, the gap aligning device of the upper section 3〇a box has sheds 301, 5 of 5 sections, please. Square 2 =

Page 30 C:\2D-CODE\90-12\90123575.ptd 1277142 V. INSTRUCTIONS (27) t f is open frame. On the 5 sheds 3 (H~3 0 5, respectively, the center of rotation - 13⁄4 -> / η η η μ ^ and the turntable 3 0 7 are installed. Each turntable 3 Ο 7 can be used independently for rotation and drive mechanism There are a timing belt 308 and a motor 309. The four corners of each of the sheds 5 are cut away, and the entrance and exit of the wafer 丨〇4 are formed there. w Only the surface of the turntable 307 is outside the circumference # to support Outside the wafer: loosely mounted, install 3 support pins 310' at approximately 120. intervals sni, n, ". In addition, at each shed end 31ί) on the opposite side of the wafer input port, install Form] optical sensor 311, which is ^

31 1 〕 word open / film wafer outside the periphery 'inserted into the optical sensor Han 22" 2 to be able to detect the gap of each wafer separately. σ U's direct service than the loaded tip 31〇 Support becomes from the turntable 3〇7 outside:::出=方, wafer 1 〇4 outside the perimeter! 〇4 b protrudes to the 卩m dog out to the evening f side 'used to make the turntable m and optical sensor II Mouth 2:7: The method outside the circumference 丄 so the crystal (4) 4 can be unrestricted 3 is not lacking = the phase interference can be carried out by the valley and the high speed. 4, the alignment is in the stacking into 5 stages of the turntable 30 7 In the outer circumference, the leather is set to be freely movable up and down. It is set up in parallel with the upper pole 321 axis of the square 2 and 1 pole.

It is set to be a wrist shape, and is oriented at a certain distance in the longitudinal direction toward the center of rotation to hold the wafer. In Fig. 3, the outer circumference of the wafer is overlapped with the support tip 31 provided on the turntable 3 07. The support tip 322 is depicted as a support tip 3 2 2 that is constructed to tilt the tip 3 1 0, and to hold the wafer.

V. INSTRUCTION OF THE INVENTION (28) The three upper poles 321 are mounted on the base 232, the sheds 301 to 30 5, and the base 323 is formed on each of the lowermost teeth and the lower plate 3 0 6 The space between them. The pedestal 323 moves down by =3〇5. Hold up _ only for lifting, not into the two cylinders and = line: With the rise of the upper pole 321 , holding the support tip 322 is only 1 outside. At the Ministry of Information, the Japanese yen from the substrate support tip 31Q was held. Was taken up ~ 曰 曰 曰 由 由 由 由 由 由 由 由 由 321 321 321 321 321 321 321 321 321曰曰«经下: Use the flow chart of Figure U to illustrate the steps of the substrate alignment device with the above. 5 pieces of Jinci: f substrate transfer machine 1 put 5 wafers into the gap alignment parameter = A. And loading it on the support pins 31 of each turntable 3〇7 (step 2 clothes make each turntable 307 rotate independently, and use each light port (step 4〇3) to align the notch in the designated position two steps; 4〇4). After completing all 5 stages, the board transfer machine 1 is aligned from the substrate; out: μ μ salt: 5 the two tips 310 overlap at the notch position, because the support tip 310 blocks the optical port, so the gap position cannot be detected. . In addition, for the positional deviation f^ ii, the turntable 307 is rotated, so that the support tip 310 is turned over, and the temple f 3 1 0 comes to the entrance light path of the substrate transfer machine 1 harm. In the support of the tip 3 1 〇 blocking optical sensor 3 11 avoidance, - 22 use the upper pole 321 to temporarily hold the wafer to retreat, ♦ test wide f to prevent overlap with the support tip 10. In addition, in the position alignment of the tip of the 3 1 0 is the obstacle of the entry of the scorpion 1277142 V, invention description (29): pass m 7: after the mouth is aligned, the wafer is temporarily held up to retreat, "Displace the reversal 30 7 to release the entry path of the recorder. The day of the ΪΪ1 state is to use the support tip 310 set on the turntable 307 to support the outer circumference of the yen, Wei Wei ffl you silk L and poetry ^^ , ik ' $ π makes the tamping red, non-contact detection of the gap of the wafer, riding it in line. In addition, used to shovel A q -^ ^ 307 , Λ Λ; ί J ; ^3 0 9 ^ ^'s response. Therefore, not "to its: the influence of ®" can be listed individually, so the gap is. Limit 'because it can be lined up together and the speed is very fast. In addition, the type 1 is the upper and lower arrangement 2 △ the mouth alignment device, and the rotation of the F π 4 port σ individual rotation mode

For the + table, the gap between the upper and lower sections is aligned with the 妒 + + λα yiA circle, and the gaps are alternately aligned. The parent supply is aligned with the crystal 0, and the order is transferred to the boat. m quasi-and wafer transfer. Therefore, if the erroneous alignment is performed, the 妳赍 佶 I 』 白 白 白 在 在 在 在 在 在 在 在 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口 缺口The +η钿 准 Γ 下 下 下 下 下 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为The structure and operation of the type 2 (Fig. 15 to Fig. 19) are composed of one vertical notch aligning device - the detection of the next ten pieces is horizontally arranged, and the motor for one port can be divided into the alignment detecting portion; : 1 of the port, but the use of the bit. Dimensional area, two areas alternate Figure 15 疋 Type 2 substrate alignment alignment. The notch aligning device 4nnt and the oblique view, FIG. 16 is a sill sill 4 U having a pedestal j 〇] 102, and is provided on the pedestal 101 bn A pressing U1, and the susceptor 1 having a % shape is freely movable up and down; And turntable 1〇3, was

1277142 V. DESCRIPTION OF THE INVENTION (30) The same free rotation is provided above the annular base 102. The 隹σ 丨〇1 becomes a multi-chip wafer 104 which is multiplexed (in the figure, the outer peripheral portion of the support substrate is 〇4]3, and the angle of the yoke is horizontally), the direction Keep a certain interval. In the laminated state, the support poles 1 〇 5 in the vertical direction are arranged to be distributed around the cymbal motor 106 to reversibly rotate the turret 丨〇 3 = as the rotary drive portion, the direction of which is set parallel to the rotation axis of the turret U The edge portion 2 has a substantially semicircular pole 1 0 5 and is provided with a support tip facing the turntable 丨〇 3; a square support and a support shape, and the support tip 1 〇 7 serves as a substrate support portion to protrude into the long inner side to become a wrist pitch. It is used to support the wafer 104 from the lower side to support the wafer 104. The holder 105 is supported to be horizontally displaced. Therefore, the rotation of the crystal stage 103 is rotated. In addition, ^j is used in the pedestal (8) to make the turntable in the support station 108. The motor 106 is further supported by the main body support mechanism of the type 2, and the H5 is supported by the tip 1〇7, and 104, and the wafer 104 is formed from the gap. In the order of the rounds i M tl, , and in order, the tops of the tops are held by the three tops that are set to be freely plucked (the direction of the head a). In addition, 妯嫉L 々 rises and the substrate supports the drop, and the wafer 104 that returns to its deduction is lowered by the upper pole, =7. At this time, only the pedestal 1 〇 2 of the upper pole 110 is raised and the pole is not rotated, so the wafer 104 is on the 34th page C:\2D-CDDE\90-12\90123575.ptd 1277142 V. Invention Note (31) The angular position in the circumferential direction is fixed. In the upper pole 1 1 〇, the support tip 1 1 1 protrudes toward the center of rotation to form a wrist shape. The support tip 1 1 1 serves as a substrate stopping portion, and the length direction is a certain distance between the pieces to support the wafer 1 0 4 The outer circumference is 1 0 4 b, thereby holding the wafer 1 〇4. As shown in the figure, the support tip 1 1 1 is provided with a plurality of intervals (one in this case) corresponding to the number of wafers 4 . The use of the three poles of the 丨丨〇 被 被 被 被 被 被 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达The intervals are distributed in the peripheral portion of the susceptor 2, and the direction of the setting is parallel to the rotational axis of the turntable 丨〇3. _ The lifting movement is performed by sliding the guide 1 1 4 provided between the pedestal 丨〇 and the base 丨〇 2 . In addition, the upper pole is set in a standing state so as to be able to advance and retreat in accordance with the radial direction (arrow b direction), and when the wafer cassette 4 is rotated, 'retracting back without interfering with the support pole 105, When the hand is held, W enters the support tip 1 to reach the outer periphery of the substrate 丨〇 4b. Therefore, the main structure of the substrate retracting mechanism in which each of the upper poles 110 is mounted on the corresponding air cylinder 115° of the base 102 includes the above-mentioned base 102, the upper pole 110, and the support tip 111. Air cylinder 115 and motor 112 〇

Further, the sensor poles 11 7 are provided in the notch position aligning device 40, and have optical sensing means 116 for detecting the notches 104a supported by the five wafer 104 of the substrate supporting tip 107. The sensor pole 117 is set to be freely advanced and retracted in a radial direction (arrow C direction) in the same direction as the upper pole 11 ,. When detecting the notch 1 〇 4a of the wafer 104, the optical sensation of advancement丨丨6 is not connected

1277142 V. INSTRUCTION OF THE INVENTION (32) The touch is close to the outer peripheral portion mb of the substrate, and when it is not detected, it is retracted so as not to interfere with the support pole 1 〇 5. Here, the support pole 105, holding the pole, the action relationship of the sensor pole 丨丨7 is when the support pole 105 is free to rotate (only limited to the upper pole 11 〇 back, does not interfere with the support pole 1 At 05 o'clock, τ advances and retreats or moves up, and in contrast, when the upper pole 110 is not rotated, it advances and retreats and moves up and down. Then the sensing pole 1 1 7 can only advance and retreat. Further, the positional relationship between each other is such that the support pole 105 and the upper pole 11 are arranged in a concentric shape, and the support pole 105 is approximately 9 inches. 9, 〇. 18〇. The spacing is disposed opposite the circumference i' of the periphery of the wafer, and the upper pole 110 is substantially 120. The equal intervals are arranged on the circumference of the circle supporting the outer side of the pole 1〇5. Open 180 in front of the slope of the drawing. Between the two support poles 105, the input and exit of the wafer 104 are formed, and the black arrow indicates the entry direction, and the opposite direction is the take-out direction of the wafer 104. The sensor pole 117 is disposed on the opposite side of the input/output port of the wafer 1〇4, and serves as a rotating shaft of the ferrule turntable 103. The sensor pole 117 is provided on the opposite side so as not to hinder the investment. The five wafers 1 () 4 are loaded by the substrate transfer machine 1 (Fig. 1, Fig. 2) in the horizontally placed state, or are taken out from the notch alignment device 40. Figure 17 shows the relationship between the upper pole 11 晶圆 and the wafer 104. Here, the air cylinder 11 fixed to the susceptor 102 is operated, and the upper pole 11 is advanced to the wafer 104 side (in the radial direction inner side). The susceptor 1 〇 2 is raised by the motor mechanism 12 via the slide mechanism 113 for raising the upper pole n ,, and the wafer 1 〇 4 can be held in the vertical direction by holding the support tip 111.

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Page 36 1277142 V. Description of Invention (33) To detect the notch, put 5 wafers 104 into the notch alignment device, and after loading the substrate support tip 104, first, rotate the support electrode 105 by 180 °. The notch detection region of the wafer 104 (between two support poles of 180 ° open) is brought close to the sensor pole 11 7 . Then, the air cylinder 122 mounted on the support table 1 2 1 (fixed to the pedestal 101) is operated to move the sensor pole 11 7 (Fig. 18 (a)) at the retracted position in the direction of the arrow, thereby The optical sensor 116 is fed into the outer periphery 10b of the wafer 104 (Fig. 18(b)). In this state, when the wafer crucible 4 is rotated by a certain angle, the outer peripheral portion 1 〇 4 b of the wafer 104 passes through the gap 1 2 3 between the light-emitting element 1 16 a and the light-receiving element 11 6 b, so It is possible to detect the presence or absence of a gap. Use from motor j 〇 6

The position 仏 / then the angle signal of the encoder can be used to detect the angular position of the notch. The notch angular position of each wafer 丨〇 4 is memorized in a memory device which is not shown in the figure. After the position of the notch angle is detected, the retraction of the sensor pole 117 is retracted before the action is held (Fig. 18(a)). In the state where the sensor is inserted, when the wafer is held up, since the sensor and the wafer do not interfere with each other, interference can be avoided. :: FIG. 19 will be used to illustrate the wafer alignment having the above-described configuration, and the wafer used to represent the five wafers together for the wafers, the one-under month/g gap alignment completed wafer (The slanted line indicates the wafer 1U4 - the order of the people _ pieces.

1 04" (Slanted line ^ Ding-^ 疋 疋 疋 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 The bottom of the strong... support tip 1U slide into each wafer 1〇4; ~, in addition, as shown in Figure 19 (b), use slip

1277142 V. INSTRUCTION OF THE INVENTION (34) The moving mechanism 113 raises the support tip ln, and the wafer 104 of the wafer is held up, so that 1 is left, and the first one is the first one. From,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The position data is aligned with 3 1 9 ( c ) = - and 〇 4a from the bottom. After the alignment of the second piece is completed, as shown in Fig. 19(c), the support is used to support the tip. The same as the third, fourth, Chu ς p Wi〇4 holding 捍 斟 斟 M 4 connected to the 5 brothers, the sequence of repeating 仃 对准 alignment and holding. Figure 19(d) shows the use of the upper pole 11() to hold the last wafer 丨〇4 on the top of the support pole. The support tip m is transferred to the support tip (1). At the moment of the above operation, the gaps of all the wafers are changed to ί04". After the continuous operation, the three support poles 105 are required to repeat the gap alignment operation, so they leave. Specified? Position before detection). Therefore, the turntable 103 is rotated here to make ^ 〇 5! to the designated position state. Secondly, make the upper pole 110 drop, so that the 5 wafers 1 〇 4 full set P male Xi 1 μ 1 1 handle ancient pick / J 攸 上 support the tip lli back to support the pole 1 〇 5 base temple tip 7 . After returning, hold the pole i J 〇 back side. In this state, when the support pole 1〇5 is screwed down. Day; round 1 2 outside to return to the original - take it up. Five wafers 1〇4 were taken out from the notch 4U by the substrate transfer machine. This type 2 is composed of a support pole and a top pole, and the number of sheets can be 1 (^, the number of pieces is set to (4). The present and the 0-day type 2 1277142 5. Description of the invention _ "~~~ - Similarly, the first five wafers are loaded in the area of the upper portion of the support pole 40 A, and the gap alignment is performed. After the gap alignment of the upper portion is completed, the next five crystals which are taken out in advance by the transfer machine are used. Circle, transfer to the support pole: slave area 40B, gap alignment. In addition, in the upper section of the area 4〇a ^ into the mouth of the 5 wafers, in the lower section of the area 4 〇 β lack Before the alignment, take it out by the substrate transfer machine and transfer it to the boat. In the case of the gap aligning device, the wafer of the upper or lower section of the gap is aligned with the finished wafer. Transfer to the area of the wafer circle to carry out the movement. Therefore, the transfer time of the bypass can be shortened. In addition, the type 2 is structurally, and the position of the substrate is only 1 for the chemical mechanism. A motor can be used, so the drive can be: inter-structured, thereby reducing the cost of the device. In addition to the above-described embodiment, the makeup is operated from the notch to the standing section, but it is also possible to divide the substrate position aligning device into two upper and lower sections toward the second of the θ from the second to the upper side. In addition, the position can be used for the farm. It can also be used for two or more horizontal sections. It can also be used for more than three sections. The port is aligned with the load: Ϊ r ϊ Τ ί The form of the gap is aligned with the device m 4 ί ί The number of turns is the same, but it can be different. The shift is taken as a reference. When the actual transfer is made, the door is transferred to the notch alignment device. Device shift = transfer time is 6 seconds, the gap of 5 wafers is 6 seconds in the circle and the program 2 is 35 seconds. The % of the volume is about 19 seconds in the type 1

1277142

V. INSTRUCTIONS (36) In addition, the invention can also be used in the substrate of the substrate of Fig. 15. With the substrate transfer machine, even if a plurality of units are placed, the port is aligned or transferred to the wafer boat. ^=The next wafer is missing. In the case of the twin boat, The effect is very large. Align with the gap of the next processed wafer. 2 = In the round processing, an implicit effect that looks effective can be performed. Actual ^: is carried to the boat, so the present invention can be referred to as *there is a case where the **^t double boat, and the second offset shortens the transfer time.疋 在 疋 疋 疋 疋 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第Not used. [Inventive Effect] According to the present invention, the substrate is moved and the substrate is transported in parallel with the efficiency of the substrate, thereby improving the substrate sound. The reduction in time can improve the work of the Fudan [Description of the component number].

C:\2D-CODE\90-12\90123575.ptd 40th stomach 1 substrate transfer machine 4 upper notch alignment part 5 lower notch alignment part 21 boat 2 2 notch alignment device 1277142 Fig. 1 is a vertical diffusion appearance view of the embodiment having a notch device. Fig. 2 of the CVD apparatus is a vertical diffusion plan view of the embodiment having a notch device. Fig. 3 (a) to (c) are explanatory views of the method of the present invention. 4(a) to (c) are explanatory views of the method of the present invention. Fig. 5 (a) to (c) are explanatory views of the method of the present invention. Fig. 6 (a) to (b) are explanatory views of the method of the present invention. Figure 7 is an explanatory diagram of the method of the present invention. (a) to (U) of FIG. 8(A), (a), (bc) and (c) of FIG. 8(B), and (a) to (d) of FIG. 8(c) are the contents of the present invention. Detailed illustration. Fig. 9 (a) to (c) are explanatory views for explaining the operation in the case where the notch aligning device of the type 1 shown in Fig. 15 is used. Fig. 10 (a) to (c) are explanatory views of the operation in the case where the notch aligning device of the type 2 shown in Fig. 17 is not used in the case of the squeezing-m buckle. Fig. 1 (b) and (c) are explanatory diagrams for the operation when the central M (7) water meter is used without the conventional missing alignment device. Fig. 12 (a) to (c) are explanatory diagrams showing an example of a change operation in the case where the notch alignment device of the type 1 is not used for the wood table. Figure 1 3 is the appearance of the gap between the grievances and the grievances of the J (Jillow 罝 [Form 1]. Figure 14 is a flow chart showing the steps of the operation of the substrate-level alignment device of the pattern of the main VIII. Fig. 15 is a front view of the substrate alignment device of the second embodiment. Fig. 16 is a front view of the substrate alignment device of the second embodiment. Cutout.

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Claims (1)

1277142 Patent Application No. 1: A substrate processing method comprising: one substrate transfer machine for transporting a notch or an orifice to a front plate from a substrate storage container to a substrate position once The base substrate alignment device can carry the notch or aperture pair or from the wafer boat; and the moon substrate to the substrate alignment device, which can be done! The number of the substrate of the substrate transfer device of the substrate transfer device is not more than the number of the substrate: the hole: the number of the substrates on which the substrate alignment is performed once by the substrate alignment device is set to be The number of substrates or one substrate to be transported; m~ times and the following operations are performed simultaneously: = the substrate alignment device for setting the number of substrates of the notches or holes of the substrate in this manner is used for performing And: the notch or the aperture is aligned; and the 杳 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用The device, or the substrate alignment device from the substrate, transports the substrate with the notch or the aperture to the wafer boat. A substrate processing method comprising: one substrate transfer machine for transferring a plurality of sheets before the notch or the aperture to the substrate storage container from the substrate storage container to the substrate position Aligning the device, or the substrate alignment device transfers the plurality of substrates aligned with the notches or apertures to the wafer boat, and C:\2D-OODE\90-12\90123575.ptd Page 43 1277142 VI. The scope of application for patents can be independently operated on multiple substrates. The substrate transfer machine of this one-cut # //4 clothes, can In the opposite alignment device in which the total number of substrates of the number of substrates or the number of the substrates of the substrate is more than doubled, the gap or the aperture of the substrate is placed in the substrate by using a substrate position. Simultaneously, the M t: escape substrate storage container before the above-mentioned one substrate transfer machine port or orifice alignment is used, and the substrate is placed in the substrate, and the substrate is placed on the substrate. From the other substrate position; pre-installed]:;;=Applicable 3: Shen Shen special substrate processing method, in which, in the interest, will be used: other base ν Λ: quasi- Λ 准The substrate, #loaded to η, 曰ί ί or the aperture pair: the substrate before the aperture is aligned, and transferred to the other: the board 4 is as follows: the substrate processing method of the second aspect of the patent scope, wherein Using i:i; the above-mentioned notch or aperture of the position aligning device is aligned with the above-mentioned gap of the (4) quasi-device 5 · A substrate processing method, which is characterized in that it has a nano-capacitor=transportation board, a board alignment device, or a substrate alignment device, page 44_C:\2D-CX) DE \90-J2\90123575.ptd 1277142 6. The patent application scope is transferred to the boat; and the substrate alignment device is female & p -4- hh ^ ^ ^ 1 ', and there are many areas where the genus is running. The substrate can be moved by one person. The number of substrates that are sub-transported is more than double the number of substrates to be shunted or aligned. In one of the plurality of areas, a region of the substrate is not nicked; the alignment of the 丨 mouth is simultaneously performed; and the substrate private carrier having the hole 1:1 is removed from the substrate storage container. Transfer the substrate of the "Li Cai" to another area, or remove the substrate from the other areas mentioned above, and transport it to the area of the boat to make the gap or the hole aligned. The substrate processing method of the fifth aspect of the patent scope, wherein the substrate transfer device will be the other The domain is discharged in the other areas of the δ 玄 进行 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 δ δ δ δ δ δ δ δ δ δ δ 7. The substrate processing method of claim 5, wherein the substrate processing method of the fifth or sixth aspect of the invention, wherein: the substrate transfer device of the substrate is used, and the substrate 1 is removed from the substrate storage container. The transport to the other areas mentioned above refers to the reverse of the tj: the container is taken out of the gap or the front of the orifice is aligned, and the removed substrate is transported to the vicinity of the other areas; and the gap of the substrate of the area is λίίί Or the orifice is aligned, and the substrate in the vicinity of the other region is loaded from the substrate in the other region. 1277142 VI. Patent Application No. 8 · A kind of substrate processing method, one set of A p is characterized by: The upper σ i coil transfer machine is transported to the substrate position by the nano container, and the substrate of the strong slab is once. Carrying and transporting from the substrate to the wafer boat; and/or placing the device, or aligning the position of the substrate with the substrate, and arranging the slabs of the slabs, and the slabs of the slabs The number of the above-mentioned sheets can be combined with the number of pieces of the substrate which is multiplied by one time, or the number of the substrates is doubled. a carrier, taking out a notch or an aperture from the substrate storage container, and aligning the substrate with the substrate and loading the removed substrate into one of a plurality of regions of the substrate alignment device The substrate is notched or aligned by a region of the substrate alignment device; in the gap or aperture alignment of the above region, the substrate transfer device is used; Remove the next gap or hole in the storage container Aligning the substrate before the alignment; after the gap or the hole of the substrate in the one area is aligned, the substrate or the hole which is taken out is aligned with the substrate before being loaded into the other area; in the other areas After loading, the substrate having the notch or the aperture aligned in the one area is taken out from the above-mentioned area; after being taken out from the above-mentioned area, the other area is used to perform the gap or the hole alignment of the substrate, and In the gap or orifice alignment of the other regions, the substrate taken out from the one region is transported to the wafer boat. C:\2D-CODE\90-12\90123575.ptd Page 46 1277142 VI. Patent application scope 9 · A substrate processing equipment Jin, Gan 1 t A &# _ / Its characteristics are: 1 The substrate private carrier is used to transfer the container to the substrate position to receive the wafer from the substrate; to position the dry coating, or to transfer multiple substrates from the substrate alignment device In the device, the multi-month independent feed lamp that is transferred by the substrate transfer machine is controlled by the above-mentioned one control device, and is aligned with the upper and lower substrates, and the substrate is aligned with the device. ::: The second substrate is placed or the substrate is transferred to the substrate before the alignment of the substrate is aligned with the substrate. The dry clothes are placed in a wide processing device with a notch or an orifice aligned, and are characterized in that: the nano container is transferred to the substrate position, and the substrate is placed on the substrate: the wafer is received from the substrate; The clothing, or the substrate aligning device is transferred from the substrate aligning device, and the smattering area is used to perform the notch or hole of the plurality of substrates using the above-mentioned one base. The mouth is aligned; and the domain is made into a 7VV line using the substrate transfer machine of one of the above-mentioned plurality of areas - using the above-mentioned mouth-inclination-Γ > I α The substrate storage container is transported to the other area by the notch or the hole's soil, and the 排出& if jl # area is discharged from the J: the area is from the 4th and the 疋 will be the other The above-mentioned boat, the notch or the aligned substrate is transported to the substrate C:\2D-CODE\90-12\90l23575.ptd Page 47 wiw