TWI274868B - Apparatus inspecting printed solder - Google Patents

Apparatus inspecting printed solder Download PDF

Info

Publication number
TWI274868B
TWI274868B TW094109950A TW94109950A TWI274868B TW I274868 B TWI274868 B TW I274868B TW 094109950 A TW094109950 A TW 094109950A TW 94109950 A TW94109950 A TW 94109950A TW I274868 B TWI274868 B TW I274868B
Authority
TW
Taiwan
Prior art keywords
image data
image
design
data
information
Prior art date
Application number
TW094109950A
Other languages
Chinese (zh)
Other versions
TW200532190A (en
Inventor
Tsuyoshi Kimura
Osamu Takada
Katsuyuki Suzuki
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Publication of TW200532190A publication Critical patent/TW200532190A/en
Application granted granted Critical
Publication of TWI274868B publication Critical patent/TWI274868B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/10Segmentation; Edge detection
    • G06T7/136Segmentation; Edge detection involving thresholding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30152Solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • General Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Processing Or Creating Images (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

An inspection apparatus for a printed circuit board is provided, which overlaps and displays an outline data of the designed printed solder amount and the measured appearance image data and distinguishably displays ""where the printed solder is located,"" ""which test has been passed,"" and ""whether the test is passed or failed,"" to facilitate a failure examination, such as false determination results. According to the measured data, an evaluation object data generating section 3b generates a plurality of evaluation object data indicating the printed solder amount, and a determination device 4 determines a quality of the evaluation object data according to a set tolerance value. On the other hand, according to the measured data, a three-dimensional image data generating device 7 generates three-dimensional appearance image data of the printed solder. When the determination device yields a negative result, each of the failed evaluation objects is marked with different colors to display its designed image data, and these appearance image data and designed image data are overlapped and displayed by the display device 8.

Description

12748.68 九、發明說明: 【發明所屬之技術領域】 置,的檢麵 ,對電子構件核灯表面安裝的印刷電路板上 裝置等,進行乳狀焊劑印刷時所形成的印刷禪^ 伙&進仃;収,並對此印刷焊劑的形狀進行檢查。 特別是本發明在印刷㈣檢查的檢查結果存 下,可對印刷電路板的印刷焊劑之設計上的形狀:’ 基ΪΓ實際印刷焊劑時的印刷燁劑位置的外 研究。本發明是關於-種容易對這些 貝枓在頒示晝面中進行觀測和研究的技術。 — 【先前技術】 射:刷焊劑檢難置向1路板(町將印刷電路板只稱 =[電路板]。)照射光並败所接受的受光量(也稱作輝 又’表不光㈣度),制表示電路板表面的印刷焊劑位 的位移(包括高度)之測定資料。另外,在變換成作 示焊劑印^的印刷焊缝之要素的圖像資料(包=面 積、體積、高度、寬度或其他的形狀資料等種類。以下將 這些資料的部分或全部稱作[評價物件資料]。),並將此圖 像貧料與形成判定的基準之容許值進行比較的檢測裝置及 方法中,通過電路板印刷焊劑位置的圖案形狀、印刷焊劑 狀態、測定條件、雜訊、變換上述資料的條件等及它們的 組合’來企圖上述物件諸的正確生成是—個難點, 判斷此評價物件資料的判定裝置,有時會導致將合格品的 16249pifl.doc 7 1274868 =====猶㈣果(- 進行路板上 (以下稱作[外觀圖像資料])進行比較並解;,=料 之配將表示印刷ΐ路板上所設計的印刷位置 並列輸f俺示晝面上,使操作者可進行=像貝科同時 是,在以往的習知技術中,操作者在知道好揀判— 狀貧料等。)的評價物件資料進行敏,可ϋ 查口口貝,但當產生虛報等故障時, 如阿才欢 檢查的種類越多,檢測勞力及時損为析研究是 易產生研究錯誤之問題%間祕越大,從而存在容 例Λ:類好 j料等對應。)和評價物件資料進行比較,並進口狀 谷許值為設計上的計算值,但要在計算時的 =。 基準位置進行計算。例如,在某印刷焊劑位 叹置 劑量之面積的容許值,作為[比較其周圍 =席焊 位置的平均高度只高出設定高度之位置的;= ^249^0^00 8 12748.68 取。至少前述設定高度軸計算基準。 究的在軸示畫面進行觀察並對趣等進行調查研 研究。^輪ΐΐ上料算基準的位置也需要考慮並進行 時間損耗m2上_樣,檢查的種類越多檢查勞力及 :間她越大的仙,而且,也很可能形柄究錯誤的要 【發明内容】 設計ί : : ί二(岭表恤卩刷焊劑之 料Η和被測定之外觀_:重下 查的種類,使好_ 知,且依據檢 等的故障研究容易、隹L 從而可使虛報 計算基準的位署叮進订之技術。而且’藉由同時還將上述 更加容易進行視覺辨識地進行顯示,從而使故障研究 訊儲的’本發明的第1項包括:電路板資 上之印刷焊劑的設; 裝置(2),在又计貝訊進行儲存;測定 板的位置相對3;Γ與,檢查對像之前述印刷電路 :2):根據測定裝置輸出的前述測定資料,生成:4 印刷知劑的焊劑量之多數杜成表不被 定前述評板資戰 根據前述設計資訊,好壞:_立體圖像資料生成裂置(7〕, 、σ 生成表示被印刷焊劑的焊劑量之立體 l6249pifl>d〇c 9 1274868 的設計圖像資料,瓦奸姓义 之前述印刷電路板表面 述判定農置判定為祕,杜〜口1豕貝枓,另外,當前 圖像資料中的某一個,'生成料或前述外觀 件進行不同顯示之圖像資料顯干/定為否的評價物 圖像資料及設計圖像資料進行重;㈣。(8) ’將前述外觀 卞一ΐί發明的第2項中,包括順序儲存裝置(6),即對 逑判定為否之評價物件進行音 =述評價物件資料的種類和顯示顏色進行2且 此組合賦以優先順序並進行儲存。 、 對 tiff :前述立體圖像資料生成裳置採用對前述設 :3Γ1Β:對_]定裝置判定為否之位置在内的 :::的f胞高的前述優先順序,生成』 的頒不色的設計圖像資料之組成。 /在本發_第3項巾,前述輯資訊巾含有容許值和 在形成計算容許值時所形成的前述印刷電路板上的印刷焊 劑形狀之計异基準位置的位置資訊。前述判定裝置,對前 述容許值和前述評價物件資料進行比較,並進行好壞判 定。前述立體圖像生成裝置,接受前述位置資訊,並對相 當於前述設計圖像資料或外觀圖像資料之前述計算基準位 置的位置,賦以可識別的標識資訊,從而當在前述顯示裝 置上將前述設計圖像資料和外觀圖像資料進行重合顯示 時,能夠辨識前述計算基準位置。 ^ 16249pifl.doc 10 1274868 =路板表面的立體外觀圖像資二行 容易辨識哪個印刷焊劑位置為作者從顯不晝面 進而具有可效率良好且防止錯誤:二=:效果。 在顯示晝面上可根據ί究;=;擇顯示的組成,所以 研究。 素的重要性有選擇地進行識別 的尺=====::種顯示對容許值進行計算時 虛報等研究的操作者有效成’所以能夠向進行 圖像的哪個位置,從而促進研究的準確丁^究時應注視外觀 易懂特徵和優點能更明顯 明如下。例’观合所關式,作詳細說 【實施方式】 圖6為表示顯示例子的圖二置之組成的機能框圖。圖2〜 在圖1中,測定裝置2為例如 部2a及測定㈣2b _。_部^對由電= 16249pifl.doc 11 I2748.68 進订掃描亚對X軸、y軸的各方向照射雷射之雷射 Μ及接受來自電路板1的反射光之受光裝置。受光^、’ 焊劑面得到與位置相對應的受光量(光的強^從 f裝置2根據此位置、枝量,特進行了印刷 進行測定。雖然省略了作為雷射位移計的詳細動地 但作為原理,在同一申請人所申請 特開平3-则2號公報中有所說明。本相早期公開之 ,定處理部2b由於在後述的電路板f訊儲存 中儲存有包括設計作為檢測對像之電^置 位置或保護層位置等配置在内的 酉㈣依據配置圖對感測器部仏進行掃描測定,且J = ㈣雜的位置’將所檢_ = 里及/或叉先篁(光的強度)作為測定資料輸出。私 %路板⑽儲存裝置5儲存有作為對檢 板1進行設計時的設計#訊,朗於麵設[h路 劑位^等的配置圖,還有包含設計並計算 卜 形狀資料仙的設計資訊、根據此形狀資料所計ΐ=的 :其J在其計算中用於指示將前述形狀資料的哪:部:: 為基準進行計算之尺寸性計算基準位置 j刀作 電路板資訊輸入部9&預先被輸訊由 路板1進行設計時的配置圖,B私查物件之電 Ϊ:刷焊劑的保護層位置及形成位置:以: 爾1上的配置資訊(參照圖2的〔印刷電路 16249pifl.doc 12 1274868 圖100〕。)等。電路板!由於 ,特定的電路板識別資訊以有二= 格’在電源接通時進行顯示(庫;^寸^己錄表 並可以選擇其中的某個電路板卜、° ‘、、員不旦面.未圖示), 資料,與作為壞判定的容許值作為 些料值,是為了對好壞判定的種:=::子。這 高度差里(夂兰丁 、 、體知、南度、印刷焊劑的 及印刷烊=模 上沒有連接焊劑位置和 印刷焊劑i之各個種類(項目二定 位置進行準借、=進仃#异’並為各電路板1的每個辉劑 ❿ 定的基準之圖像的)辨識的資訊’為形成好壞判 只具:ΐ包括:具有上限、下限範圍的容許值, 二Γ?:使·面積、體積和高度等量的項目 且有乂σ限的關’向度差異、偏離和滲色模糊等只 具有—側的範圍,敎、橋接等只具有有無資訊。 性叶鮮位置f訊如上所述,為用於指示尺寸 在魏,射此尺寸性計算基準位置表示 值的计异中將前述形狀資料的哪—部分作為基 16249pifl.doc 13 12748.68 的Γ 示對某個位置之印刷焊劑的面積 面積’為在設計圖像的橫 二 ^也細積。圖2的計算基準位置(= 圖像資料生成裝置3包括測定資 件資料生成部3b。 測定之電路板1的焊劑部位的位置,和Him 4 :移量等的測定值,並將設定的參數作為間二;t 處理,且作㈣定㈣進行儲存 * 值化 置相對應’包括由高度和點組成 料位 接成線)。 夕貝科(在頒不時連 為評價物件資料,; 素的資料,盥上述容3=印!^劑位置的焊劑量之要 面積、體積括各辦劑位置的 刷焊劑二=位;: 消失,及印刷焊劑的橋滲 的評價物件資料進行判定 -、要秘一之電路板1 定,因電職㈣mm綠合進行判 另卜抑物件貝料生成部%首先對例如各個印刷 16249pifl.doc 14 1274868 ί劑:ΐ路園的高f求電路板1表面的基準高度。然 中的計算基準儲存的計算基準位置資訊 積作為印刷焊劑的S3” ’並將其基準高度的斷面 高度進行積分而料H 面積只與印刷焊劑的 度。這些印刷焊_面積 的回 置,形成評價祕純彳、“ 4及印刷焊劑位 離的判定物件)。 印刷焊劑之位置的資料,為偏 私灿判定裝置4接受上述圖像資料生成裝置3於如 物件資料,並將其與來自上述電路板的補 許值進行比較’判定各焊劑位置的好壞:子:置5二容 评價物件資料的種類,如上 乍為進仃判疋之 積、體積、高度、高度差里、偏離\=焊劑位置的面 全部。將各印刷焊劑位 :、:果的數值資訊104 ’作為檢查結果進行輸;= 边 判疋襞置4在容許值存在範圍的主 '而且, 和容許值進行比較,當評價物件^於,評價物件資料 定為否(NG)時’也可將否的;向二 谷許值範圍上限的方向上判定為 ^否’或在超過 例如在評價物件資料為印刷烊劑量的面積輸^ 面積狹小而超過容許值範圍的下 虽其 面積小〕這樣的結果。也可告而并、j疋為否亚輪出〔 圍時’判定為否並輸出〔面積大〕貝==出容許值的範 貝大〕違樣的結果。至少在顯 16249pifl.doc 15 1274868 要如圖2所示那樣至少顯示良 、否(0K、12748.68 IX. Description of the Invention: [Technical Fields of the Invention] The inspection surface, the printed circuit board mounted on the surface of the electronic component core lamp, and the like, are printed by the solder paste.收; receive, and check the shape of the printed flux. In particular, the present invention allows the design of the printed solder of the printed circuit board to be in the shape of the inspection result of the printing (4) inspection: 'Based on the external investigation of the position of the printing paste when the flux is actually printed. The present invention relates to a technique which is easy to observe and study these beetles in the presentation. — 【Prior Art】 Shot: Brushing the flux to the 1st board (the town will print the board only = [circuit board].) The amount of light received by the light is lost (also known as Hui and 'not only (4) Degree), the measurement data indicating the displacement (including height) of the printed solder bit on the surface of the board. In addition, it is converted into image data (package = area, volume, height, width, or other shape data) which is an element of the printed weld of the flux print. Some or all of these materials are referred to as [evaluation] In the detection device and method for comparing the image poor material with the allowable value of the determination criterion, the pattern shape of the solder material position, the printing flux state, the measurement condition, the noise, and the It is difficult to change the conditions of the above data and the combination thereof to attempt the correct generation of the above objects. The judgment device for judging the evaluation of the object data sometimes causes the qualified product to be 16249pifl.doc 7 1274868 ==== =Just (four) fruit (- on the road board (hereinafter referred to as [appearance image data]) to compare and solve;, = material match will indicate the printing position on the printed circuit board, parallel display f display In the past, in the conventional technology, the operator knows how to evaluate the object information, and can check the mouth and mouth. but When generating false failure, such as A more types of inspection only Huan, timely detect loss of labor for the study is the analysis of the problem of error prone study between secret% larger, so that there is capacity Example Λ: good class j corresponding to other materials. ) Compare with the evaluation object data, and the import value is the calculated value of the design, but it is calculated at the time of =. The reference position is calculated. For example, the allowable value of the area of the sigh dose in a printed solder is taken as [comparing the surrounding height = the average height of the soldering position is only higher than the set height; = ^249^0^00 8 12748.68. At least the aforementioned set height axis calculation reference. The research is carried out on the axis display screen and the research is conducted. ^The position of the rim loading calculation reference also needs to be considered and the time loss m2 is _ sample. The more types of inspections, the more labor is checked and the larger the sage is, the more likely it is that the shape is wrong. Contents] Design ί : : ί二 (Ling stencil 焊 焊 焊 焊 焊 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 重 重 重 重 重 重 重 重 重 重 重 重 重 重 重 重 重 重 重 重 重 重The technique of calculating the benchmark is based on the technology of the subscription, and 'the first item of the invention includes the circuit board by using the above-mentioned display that is more easily visually recognized. The printing flux is provided; the device (2) is stored in addition to the beta; the position of the measuring plate is relatively 3; and the printed circuit of the object is inspected for inspection: 2): based on the aforementioned measurement data output by the measuring device, generates: 4 The majority of the soldering dose of the printing agent is not determined. According to the above design information, good or bad: _ stereo image data is generated (7), σ generates a three-dimensional representation of the solder flux of the printed solder. L6249pifl>d〇c 9 12 The design image data of 74868, the surface of the aforementioned printed circuit board of the traitor of the traitor is judged as the secret of the farm, and the other is the one of the current image data. The image data of the evaluator and the design image data of the different display image data are weighted; (4). (8) 'In the second item of the invention, including the sequential storage The device (6), that is, the evaluation object for which the determination is YES, the sound, the type of the evaluation object data, and the display color are performed 2, and the combination is given priority and stored. Tiff: The stereoscopic image data is generated. In the above-mentioned setting: 3Γ1Β: the above-mentioned priority order of the f:cell of the ::: is determined by the position of the _] device, and the composition of the design image data of the color is generated. In the third item, the information sheet includes the allowable value and the position information of the difference reference position of the printed solder shape formed on the printed circuit board formed by the calculation of the allowable value. The determining means, the tolerance value And the foregoing The price object data is compared and judged as being good or bad. The stereoscopic image generating device receives the position information and assigns a position identifiable to the position of the calculation reference position corresponding to the design image data or the appearance image data. The identification information is such that when the design image data and the appearance image data are superimposed and displayed on the display device, the calculation reference position can be recognized. ^ 16249pifl.doc 10 1274868 = Stereoscopic image of the surface of the road surface The second line is easy to identify which printing flux position is the author from the face and then can be efficient and prevent errors: two =: effect. In the display of the surface can be based on the research; =; select the composition of the display, so study. The importance of the element is selectively determined by the ruler =====:: The type of display shows the operator who is studying the false value when the calculation of the allowable value is valid, so which position of the image can be made, thereby promoting the accuracy of the study. Ding should pay attention to the appearance of easy-to-understand features and advantages can be more clearly as follows. [Embodiment] FIG. 6 is a functional block diagram showing the composition of the second embodiment of the display example. Fig. 2 to Fig. 1 shows a measuring device 2 such as a portion 2a and a measuring (four) 2b _. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the light-receiving, the flux surface is obtained by the position of the light-receiving surface (the intensity of the light is measured by the f device 2 based on the position and the amount of the branch, and the measurement is performed. Although the detailed position of the laser displacement meter is omitted, The principle is described in the Japanese Patent Application Laid-Open No. Hei No. Hei No. Hei. No. 2, the disclosure of which is hereby incorporated by the present disclosure, the processing unit 2b is configured to include a design as a detection object in the storage of the circuit board to be described later.酉 (4) of the position of the power supply or the position of the protective layer, etc. (4) Scanning the sensor part according to the configuration diagram, and J = (4) the position of the miscellaneous ' will be checked _ = and / or fork 篁 ( The intensity of the light is output as the measurement data. The storage device 5 of the private % road board (10) stores the design information for designing the inspection board 1 , and is arranged in the configuration of the [h road agent level ^, etc. Design and calculate the design information of the shape data, according to the shape data =: J is used in the calculation to indicate which part of the shape data::: Calculate the reference position for the dimensional calculation of the reference j knife for board information input section 9&Amp; pre-transmission of the layout of the design of the road board 1 design, B private inspection of the object: brush protective layer position and formation position: to: 1 configuration information (refer to Figure 2 [printing Circuit 16249pifl.doc 12 1274868 Figure 100].) etc. Board! Because, the specific board identification information is displayed with two = grid ' when the power is turned on (library; ^ inch ^ recorded table and can choose One of the circuit boards, ° ', and the members are not. (not shown), the data, and the allowable value as a bad judgment as the material value, is the kind of judgment for good or bad: =:: child. In the height difference (夂兰丁, 知知,南度, printing flux and printing 烊=there is no connection between the soldering position and the printing flux i (the project is fixed at the position of the second position, = 仃##' And the information for identifying the image of the reference for each of the brighteners of each of the boards 1 is a good or bad judgment: ΐ includes: an allowable value having an upper limit and a lower limit range, Projects of area, volume, and height, etc., with a difference in 'σ limits, deviation, and seepage Blur and so on have only the side range, 敎, bridging, etc. only have the presence or absence of information. The position of the fresh leaf position is as described above, and is used to indicate the size in Wei, and the difference in the value of the reference position is calculated. Which part of the aforementioned shape data is used as the base 16249pifl.doc 13 12748.68 indicates that the area area of the printed solder at a certain position is also a thin product in the horizontal direction of the design image. The calculated reference position of Fig. 2 (= The image data generating device 3 includes a measurement component data generating unit 3b. The measured position of the solder portion of the circuit board 1 and the measured value such as the amount of shift of Him 4 are set, and the set parameters are treated as two; (4) Set (4) for storage * The value of the corresponding 'includes the height and the point composed of the material level into a line).夕贝科 (in the case of the evaluation of the object data from time to time;; the information of the prime, the above-mentioned capacity 3 = printed! ^ the location of the welding dose of the area, the volume of the brush containing two places of the agent; =: Disappearance, and the evaluation of the material information of the bridge flux of the printed solder is judged - and the circuit board of the secret one is determined, and the electric power (four) mm green is judged to be the other object, and the material generation part is first, for example, each printing 16249pifl.doc 14 1274868 ί: The height of the road park is the reference height of the surface of the board 1. The calculated reference position of the calculation base is stored as the S3" ' of the printed solder and the height of the section height of the reference height is integrated. The area of the material H is only related to the degree of printing flux. The return of these printed areas _ area forms an evaluation object, "4 and the determination of the position of the printed solder." The information on the position of the printed solder is received by the image data generating device 3 in the image data generating device 3, and compared with the patch value from the circuit board to determine the position of each solder: : Set the value of the object data of the 5th and 2nd capacity evaluations, as shown above, the volume, height, height difference, and deviation from the \= flux position. The value information of each of the printing fluxes::: fruit is 104' as the result of the inspection; = the main character of the range of the allowable value is set to 4; and compared with the allowable value, when the evaluation object is evaluated, When the object data is set to No (NG), it may be no; it is judged as "No" in the direction of the upper limit of the range of the two valleys, or is smaller than the area of the area where the object data is printed, for example. The result is smaller than the allowable value range, although the area is small. It is also possible to sue, and if it is a sub-in turn, the result of the round-off is judged to be no and the output [area is large] == the margin of the allowable value] is the result of the violation. At least 16249pifl.doc 15 1274868 should show at least good, no (0K, as shown in Figure 2)

示I置8上,要如圖2 NG)的判定結果1〇6。 順序儲存裝置6使評價物件資料的每 ,、優先順序相對應地進行儲存。圖3所: μ、,及用於在判定裝i 4判定為否的印刷焊劑位置上,依 據判定的種類進行識別顯示之順序判定部7c組成。 外觀圖像資料生成部7a根據測定裝置2輸出的鱼電 路板1上的印刷焊劑部位的位置對應之位移量及受光^等 测定資料,生成用於顯示能夠把握所印刷焊劑的^觀^狀 之圖像的外觀圖像資料,並進行輸出。例如,圖4、5、6 $部的明亮部分為外觀圖像資料(下側發黑的部分是根'據 堍計圖像資料的部分。這些圖被重合顯示。)。這樣,外觀 圖像資料為一種被稱作所謂的立體3D圖像資料f這種 $圖像資料在觀察是否產生虛報時,或調查產生^位置 時,可用於從顯示晝面把握所印刷焊劑的外觀形狀。 外觀圖像資料是用於表示電路板1的整體外觀的,也 可部分地形成例如用於表示預想出現虛報之印刷焊劑位置 I6249pifl.doc 16 1274868When I is set to 8, it is determined by the result of Fig. 2 NG). The sequential storage device 6 stores each of the evaluation object data in accordance with the priority order. In Fig. 3, the sequence determining unit 7c for identifying and displaying the position of the printing flux for determining whether or not the determination is negative is determined based on the type of the determination. The appearance image data generating unit 7a generates measurement information for indicating that the printed solder can be grasped based on the displacement amount and the light receiving data corresponding to the position of the printing flux portion on the fish circuit board 1 output from the measuring device 2. Appearance image data of the image and output. For example, the bright portion of the parts of Figures 4, 5, and 6 is the appearance image data (the blackened portion on the lower side is the portion of the root image data. These images are superimposed.). In this way, the appearance image data is a kind of so-called stereoscopic 3D image data f such that the image data can be used to grasp the printed solder from the display surface when observing whether or not a false report is generated or when the position is generated by the investigation. Appearance shape. The appearance image data is used to indicate the overall appearance of the circuit board 1, and may also be partially formed, for example, to indicate the position of the printed solder which is expected to be false. I6249pifl.doc 16 1274868

等的賴。而且,也可為能触㈣轉物的辨 亚進灯减不。例如在外觀圖像資料為3 :向 下,將圖像顯示位置指定部9c所指的情況 定資料,從測定資料儲存部3a中讀出置的測 三維座標上生成3D圖像資料,另外如方被=方=的 由使3維練向此方向進行㈣,叫3D圖^料=藉Waiting for it. Moreover, it is also possible to reduce the sub-induction of the (four) reversal. For example, when the appearance image data is 3: downward, the data indicated by the image display position specifying unit 9c is determined, and 3D image data is generated from the measured three-dimensional coordinates read from the measurement data storage unit 3a, and The square is = square = the 3D training is carried out in this direction (4), called 3D map = material = borrow

旋轉。對3D圖像資料的製作及其顯示,一般性軟^ 普及,省略其詳細說明。 —已、! 設計圖像資料生成部7b生成雖然與外觀圖像資 利用相同的方法被生成的,但路板資訊儲存 所儲存的電路板1的設計上敝置圖之印刷 積、位置等,進行了理論性計算之立體設計圖像資料 照圖、2的〔設計圖像108〕。)。屆時在判定裝置4使判^ 結果為〔否〕的情況下,形成設計圖像的顏色為順序判= 部7 c所通知之顏色的設計圖像資料,且(圖2的a (淺色) 為NG的位置,B (深色)為οκ的位置)在電路板資訊儲 存I置5中,如在其判定種類中存在計算基準位置資訊, 則使根據此資§fL之計异基準位置的設計圖像資料,形成可 區別於其他顏色之顏色的資料(在進行顯示時,可作為計 算基準位置標識使用)。另外,也可將此計算基準位置標識 賦以外觀圖像資料。 因此,當在顯示裝置8上進行顯示時,設計圖像資料 在被判定為否(NG)的位置,整體以順序判定部7c所通 知的顏色進行顯示,而計算基準位置標識以另外的顏色進 17 16249pifi.d〇c 1274868 行顯示。當然,判定裝置4判定為良 順序判定部議定,而以固定的特==序= 裝置6中沒有的顏色為佳。)生成。Μ在顺序儲存 另外,設計圖像資料生成部 的範圍、方向,與前述外觀圖像資料 ^ ^ ;' 置指定部ί所f定之印刷焊劑位置的^及方向Rotate. The production and display of 3D image data are generally soft and popular, and detailed descriptions thereof are omitted. - Yes,! The design image data generating unit 7b generates the same method as that of the external image data, but the printed circuit board 1 stores the printed product, the position, and the like of the design of the circuit board 1. The calculated three-dimensional design image data map, 2 [design image 108]. ). When the determination device 4 makes the result of the determination to "NO", the design image data of the color of the design image is notified by the order judgment portion 7c, and (a (light color) of Fig. 2) For the position of NG, B (dark) is the position of οκ). In the board information storage I, 5, if there is calculation of the reference position information in the judgment type, the reference position according to the §fL is calculated. Design image data to form a material that can be distinguished from the colors of other colors (when used for display, it can be used as a calculation reference position indicator). Alternatively, this calculation reference position identification can be assigned to the appearance image data. Therefore, when the display is performed on the display device 8, the design image data is displayed at the position judged as NO (NG), and the overall color is displayed in the color notified by the order determining portion 7c, and the calculated reference position mark is entered in another color. 17 16249pifi.d〇c 1274868 Line display. Of course, the determination means 4 determines that the good order determination unit agrees, and it is preferable that the color is not fixed in the fixed special == order. )generate.顺序Sequential storage In addition, the range and direction of the design image data generating unit, and the appearance and image direction of the printed image at the specified image data ^ ^ ;

^ ^ ;因此,設計圖傻杳袓 生成部7b將圖像顯示位置指㈣%所衫 置範圍的収資料,從狀資料儲存部如中讀出並 而且,也可使立體設計圖像資料只為無面(或透明)且立 體的框架’顏色被塗在此框架上。 順序判定部7c在判定裝置4的判定為否的情況下, 接受此狀了的印刷焊舰置、狀的麵·定結果(也 可包含對容許值的範圍之否的方向),並根據這些資訊且參 照順序儲存裝置6,決定欺為否之印刷焊劑位置和應顯 示的順序和純,並通知輯目像#料成部%。、 ’貝示衣置8具有頻示控制部,且其顯示控制部預先儲 存各種顯示格式⑷如參顧2),並向此格式巾分配來自 判定裝置4的判定結果、數值龍、來自電路板儲存裝置 5的印刷焊劑位置的配置圖、及來自立體圖像資料生成裝 置-1、的圖像_讀,且進賴示。顯示控辦絲自立體圖 ,貝料生成裝置7的外顧像資料、輯圖像資料以 异基準位置的標識,進行重合顯示。 16249pifl.doc 18 1274868 圖4〜圖6為顯示裝署s 〕之、、、吉果的例子,圖5是關 乂成〔面積小 的例子6是關於面積的判定中立為〔否〕 基準位置的圖示。圖4〜圖6 ^兄月各許值的計算 際上為彩色圖像。圖4 二々為黑白圖像,但實^ ^ ; Therefore, the design drawing stupid generation unit 7b reads the data of the image display position (4)% of the shirting range, reads out from the data storage unit, and can also make the stereo design image data only A faceless (or transparent) and three-dimensional frame 'color is applied to this frame. When the determination by the determination device 4 is negative, the sequence determination unit 7c accepts the surface of the printed welding ship, and the result of the shape (may include the direction of the range of the allowable value), and based on these The information is referred to the sequential storage device 6, and the position of the printed solder and the order and purity to be displayed are determined, and the album image % is notified. The display device 8 has a frequency control unit, and the display control unit stores various display formats (4) in advance, as in the case of 2), and assigns the determination result from the determination device 4 to the format towel, the numerical value, from the circuit board. The layout of the printed solder material position of the storage device 5 and the image_read from the stereoscopic image data generating device-1 are shown. The self-stereoscopic image of the control wire is displayed, and the image of the external image of the bedding material generating device 7 and the image data of the album material are superimposed and displayed with the identification of the different reference position. 16249pifl.doc 18 1274868 Fig. 4 to Fig. 6 are examples showing the s, y, and yoshio of the installation s], and Fig. 5 is the illustration of the 面积 乂 [Example 6 where the area is small, and the determination of the area is neutral [No] . Figure 4 to Figure 6 ^ The calculation of the values of the brothers and months is a color image. Figure 4 is a black and white image, but

,,圖6的方形柱(立 设計圖像300、400、500,而0/+土媒°又叶圖像資料的 像為外觀圖像資料。圖4〜圖5雖狹的淺色圖 但可使從設計圖像露出的外觀圖像部分看出, 計圖像内所收納的外觀圖像部分為粉紅 示。在這裏,外觀圖像3〇2、搬、5 ^丁刀色减 部〜所判定的顏色,進行識別並顯示。月卜順序判定 如上所述,在利用判定裝置4判定為否的情 可不將判定為否之焊劑位置的設計圖像資料,而將 的外Ϊ圖像!料,利用順序狀部%所通知的顏 進仃頦不。…之,藉由使判定為否之位置的設 料或外觀圖像資料的某一個以可識別的顏色進行^員;,可 清楚地識別不同的部分。 〜'μ 而且,由圖6可知,表示實際上被印刷焊劑的焊劑量 之外觀圖像302 ’偏向設計圖像3〇〇的右側,其一部分(圖 6的橢圓柱的右側)超出設計圖像300。而且,如^圖6 所示那樣具有計算基準位置,則在哪裡進行判定可一:暸 然(如可使設計圖像為淺色或透明,則更加明確。)。 16249pifl.doc 19 1274868 操作裝置9具有電路板資訊輪入部如、優先順序指示 及圖像顯示位置指定部9e #,並具有分別執行的操 作鍵及此操作鍵的處理裝置。 電路板資訊輸入部9a為用於預先輸入包括形成檢查 物件的電路板i的配置圖並包括用於生成上述設計圖鮮 =設計值之設^資訊、上述容許值、上述的計算基準位 貝Λ ’且用於選定形成檢查物件的電路板i,並選定關 I:設計資訊、計算基準位置、容許值而進行輸入之 〜、下面,對利用上述訓的組成之U的主要動作進 仃。兄明(流程圖未綠示)。部分内容與上述說明相重複。 叶資^先1足操f襄置9的電路板資訊輸入部9a,將關於設 到‘二的設計之資訊儲存 路板貧訊儲存裝置5中。 步驟S1:將形成測定物件的電路板丨在測定臺上進行 ΐί壯作裝置9而使關於電路板1的表格輸出到 使=:ϊ=,且選擇相當的檢查物件的 収,並作綠移資料在測 3h,ci) 根據其基準高产,二路板11面的基準高度’⑵ 積作為印“面(計算基準位置)的斷面 面積求取,再將此面積只與印刷焊劑的 16249pifl.doc 20 a^74868 這些印刷焊劑的it積。印刷焊劑的高度為平均的高度。 置,作為坪二批積、體積、平均高度以及印刷焊劑的位 ^作物件資料發送關定裳置4。 v驟4 :判定駐m 判定。 1置舁容許值進行比較,並進行好壞 步驟5 :在本| , 且都為〔面積大〕H面積的判定和體積判定為否, 存裝置6,選擇相1 = = °順序判定部〜參照順序儲 淡青色且為順序丨Γ 順序。例如,決定面積大為 序體積小為紅色且為順序4。 部“指6定3=1成部7 b在圖像顯示位置指定 資料,並使判定^、°上’根據設計資訊生成設計圖像 青色,且位置的設計圖像資料為淡 之設計圖像資料#㈠述面積時的計算基準位置標識 .b ^ 貝科’並向顯不裝置8發送。告利用佴生,丨石广 指示部外選擇順序4的體積小時,ς;红田色利用優先順序 指定圖像顯示位置 "^料^成:觀圖像資料,並_示==存部 員示衣置8將根據設計圖像資 & 和根據外觀圖像資料的外觀圖像進行重合顯示:°又5圖像 眼于:色9及置8所顯—^ 的部位處於什麼:;,此面為[面積大] 定’並可對接近實物的外觀圖像二 16249pifl.doc 21 1274868 擊選指示部%調出圖3的顯示晝面,並點 擇鍵k擇順序4的體積小時,在步驟^ 像貧料生成部7b在圖像圖 圚、 隹圓像頒不位置指定部9c所指定的範 2據設計資訊生成設計圖像資料,且使判定 ;::ί:ΐΓ置的設計圖像資料為紅色。在這種情況 行注^並研究。、紅色的部位作為判定為體積小的部位,進 雖;、、;本毛明已以較佳實施例 限定本發明,任何孰習肤枯蓺去如 "〜、卫非用以 4σ r R ^ ^ …、白此技*者,在不脫離本發明之精神 範^、作些許之更動與潤飾’因此本發明之保護 ,1U視伽之申請專職圍所界定者為準。 【圖式簡單說明】 圖1為用於說明本發明之機能部件的圖示。 圖2所:為判定結果、配置圖、設計圖像的顯示例。 的種==為顯示判定為否時的優先順序、顏色、判定 像的為判定為〔面積小〕時的設計圖像及外觀圖 掬同f ^所^為〔位置偏離〕判定為否時的設計圖像及外 觀圖像的顯示例子。 準判定為〔面積小〕時的設計圖像、計算基 皁位置軚識及外觀圖像的顯示例子。 【主要元件符號說明】 1 ·電路板 16249pifl.doc 22 1274868 2:測定裝置 2a :感測器部 2b :測定處理部 3:圖像資料生成裝置 3a ·測定資料儲存部 3b ··評價物件資料生成部 4:判定裝置 5:電路板資訊儲存裝置 5a ·容許值 5b ··計算基準位置資訊 6:順序儲存裝置 7:立體圖像資料生成裝置 7a :外觀圖像資料生成部 7b :設計圖像資料生成部 7c :順序判定部 8:顯示裝置 9:操作裝置 9a ·電路板貧訊輸入部 %:優先順序指示部 9c :圖像顯示位置指定部 100:印刷電路板的配置圖 102 :計算基準位置(標識) 23 16249pifl.doc 1274868 104 :數值資訊 106 :判定結果 10 8 :設計圖像 200 :顏色 202 :種類 204 :選擇鍵 300、400、500 :設計圖像 302、402、502 ··外觀圖像, the square column of Fig. 6 (the vertical design image 300, 400, 500, and the image of the 0/+ soil medium and the leaf image data is the appearance image data. The light color diagram of the narrow image of Fig. 4 to Fig. 5 However, it can be seen from the portion of the appearance image exposed from the design image that the portion of the appearance image stored in the image is a pink color. Here, the appearance image 3〇2, the movement, and the 5^-knife color reduction unit The determined color is identified and displayed. As described above, if the determination by the determination device 4 is negative, the design image data of the flux position determined to be no is determined. In the case of the material of the position or the image data of the position determined by the sequence number %, it is possible to perform the identification in a recognizable color. It is clear that the different parts are clearly identified. ~ 'μ Moreover, as can be seen from Fig. 6, the appearance image 302 of the solder dose actually printed by the solder is biased toward the right side of the design image 3〇〇, a part thereof (the elliptical cylinder of Fig. 6) The right side of the design image 300 is exceeded. Moreover, as shown in Figure 6, there is a calculated reference position. Then, where to make the judgment can be one: (if the design image can be light or transparent, it is more clear.) 16249pifl.doc 19 1274868 The operating device 9 has a board information wheeling unit, priority order indication and diagram The image display position specifying unit 9e # has a respective operation key and a processing device for the operation key. The board information input unit 9a is a configuration map for inputting a board i including the inspection object in advance and includes for generating The above design drawing = design value setting information, the above-mentioned allowable value, the above-mentioned calculation reference position Λ ' and used to select the circuit board i forming the inspection object, and select the I: design information, calculation reference position, allowable value The input is performed below, and the following is the main action of the U using the composition of the above training. Brother Ming (the flowchart is not green). Some of the contents are the same as the above description. Ye Zi ^ first 1 foot f The board information input unit 9a of 9 will be placed in the information storage board memory storage device 5 of the design of the second. Step S1: The circuit board forming the measurement object is placed on the measuring table. The device 9 is outputted so that the table about the circuit board 1 is output to ==ϊ=, and the equivalent inspection object is selected, and the green-shifted data is measured for 3h, ci) according to the benchmark high-yield, the second board 11 faces The reference height '(2) product is obtained as the cross-sectional area of the printed "face (calculated reference position), and this area is only the product of the printing flux of 16249pifl.doc 20 a^74868. The height of the printed solder is The average height is set as the ping 2 batch, volume, average height, and the position of the printed flux. The crop item data is sent to the set. 4. Step 4: Determine the station m judgment. 1 Set the allowable value for comparison, and Performing the good or bad step 5: In the case of this |, and the determination of the area of the [large area] H and the volume determination is negative, the storage device 6 selects the phase 1 = = ° order determination unit - the reference order storage cyan and the order 丨Γ Order. For example, it is determined that the area is large and the volume is small and red is the order 4. Part "6 6 3 = 1 part 7 b specifies the data at the image display position, and makes the judgment ^, ° on 'generate the design image cyan according to the design information, and the design image data of the position is the light design image Data #(一) Calculate the reference position of the area when the area is marked. b ^ Beko' and send it to the display device 8. The use of the 佴, 丨石广 indicates the volume of the outer part of the order 4 is small, ς; Orderly specify the image display position "^^^^: view image data, and _ display == save the member's clothing set 8 will be based on the design image & and according to the appearance of the image data of the appearance of the image : ° and 5 images of the eyes: color 9 and set 8 are displayed - ^ where the part is:;, this surface is [area large] fixed 'and can be close to the physical appearance of the image two 16249pifl.doc 21 1274868 The selection instruction unit % calls up the display screen surface of Fig. 3, and selects the key k to select the volume hour of the sequence 4, and the step image generation unit 7b is in the image map 圚, the circle image recognition position specifying unit 9c. The specified model 2 generates design image data according to the design information, and makes the judgment;:: ί: the design image data of the device It is red. In this case, it is investigated and studied. The red part is determined as a small part, and the present invention has been defined by the preferred embodiment. If you go to "~, Weifei for 4σ r R ^ ^ ..., white this technology*, do not deviate from the spirit of the invention, make some changes and retouching'. Therefore, the protection of the invention, 1U gaze BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view for explaining a functional component of the present invention. FIG. 2 is a display example of a determination result, a layout diagram, and a design image. == is a design drawing when the priority of the display, the color, and the judgment image are judged to be [small area] when the design image and the appearance image are the same as f^^^^[location deviation] is negative. Example of display of image and appearance image. Design example of design image when calculating [area is small], calculation of base soap position, and display of appearance image. [Description of main component symbols] 1 • Circuit board 16249pifl.doc 22 1274868 2: Measurement device 2a: sensor portion 2b: measurement processing unit 3: Image data generating device 3a • Measurement data storage unit 3b • Evaluation object data generating unit 4: Determination device 5: Circuit board information storage device 5a • Allowable value 5b • Calculation reference position information 6: Sequence storage device 7: Stereoscopic image data generating device 7a: Appearance image data generating unit 7b: Design image data generating unit 7c: Sequence determining unit 8: Display device 9: Operating device 9a • Circuit board poor input unit %: Priority order indicating unit 9c : Image display position specifying unit 100: Printed circuit board configuration drawing 102: Calculation reference position (identification) 23 16249pifl.doc 1274868 104: Numerical information 106: Judgment result 10 8 : Design image 200: Color 202: Type 204: Selection keys 300, 400, 500: design images 302, 402, 502 · appearance images

24 16249pifl.doc24 16249pifl.doc

Claims (1)

1274868 十、申請專利範圍: 1·一種印刷焊劑檢查裝置,包括·· 儲存裝置’儲存一設計資訊,該設計資 刷電路板上且作為-檢查物件的-被印刷 狀’其中該形狀包括對該印刷電路板 表面的各位置之一高度的位移量; 印刷;亥檢查物件的已進行印刷焊劑之該 量,並將該高度的位移量作為-測定資料 印刷料生成部,根據該測定資料,生成該被 料〜__狀巾,所包含的多數麵的-評價物件資 計資彳^置,根據來自該電路《存裝置的該設 、σ ,判定該評價物件資料的好壞; —立體圖像資料生成裝置,包括·· 設計圖像資料生成裝置,根據該設計資訊形成 X叶圖像;以及 一外__外觀圖像資料生成裝置,根據該測n料形成 規圖像;以及 體圖像裝置,將該設計圖像及該外觀圖像分別以一立 逆订顯示, &印刷焊無查裝置,其特徵在於: 16249pifl.doc 25 12748.68 時,成裝置’當該判技置判定為否 圖像進行ϋ 1將妓相像和該外觀圖像的該立體 =進仃重合顯示’且對它們之間的不同部分可進行識別 2· 一種印刷焊劑檢查裝置,包括·· 訊夺板f訊儲縣置’儲存—設計資訊,該設計資 谭上且作為-檢查物件的-被印刷 定一射” B^印席^路板的位置相對應的光,並測 疋位移1,且將該位移量作為一測定資料進行輸出; 定,:評Γ:Γ身料生成部,根據該測定裝置細 評^物件*^ 被印刷焊劑的焊劑量之多數種類的一 …-判定裝置,根據來自該電路板:#訊儲存裝置# 叶資訊,判定該評價物件資料的好壞; Λ又 一立體圖像資料生成裝置,根據該設計資訊,生 示該被印刷焊劑的焊劑量的立體一設計圖像資料,撼 該測定資料,生成被印聊_該印㈣路板表面立^ 一外觀圖像資料,另外,當該判定裝置判定為否時,古 判定為否之位置的該設計圖像資料或該外觀圖像資 L 任何一個,生成對每一種判定為否的該評價物件的淮—、 同顯示的圖像資料;以及 逆订不 -顯示裝置,將該外觀圖像資料及該設計圖像資料進 l6249pifl.d〇c 26 ^868 行重合顯示。 其特徵在^專利乾圍第2項所述之印刷焊劑檢查裝置, 一順序儲存裝置 進^不同顏色的顯示 彳u亥顯示顏色組成一 進行儲存之, 判疋為否的該评價物件對每一種類 ,並預先對該評價物件資料的該種類 組合,且對該組合賦以一優先順序並 中,對;ίΐί圖像資料生成裝置,在該設計圖像資料 圍,置置 種類中按昭t^ 對判疋為否之該評價物件的該 示顏色的該設計圖序’生成與該種類相對應的該顯 查裝第2項或第3項所述之印刷焊劑檢 在該設計資訊中,含有一容許值和在計算該容許值時 ===板上的印刷焊劑的該形狀之-計算基 該判定裝置,對該容許值和該評價物件資料進行比 較,並進行好壞判定;以及 該立體圖像生成裝置,接受該位置資訊,並對相當於 該設計圖像㈣或該外崩像龍之該計算 置,賦以可識觸-標識資訊,從而在賴示裝置上將該 設計圖像倾和斜觀圖像資料進行重合顯科,能 識該計算基準位置。 16249pifl.doc 271274868 X. Patent application scope: 1. A printing flux inspection device, comprising: a storage device 'storing a design information, the design is on the circuit board and as a - inspection object - printed shape, wherein the shape includes a displacement amount of a height of one of the positions on the surface of the printed circuit board; printing; the amount of the printed flux of the article is checked, and the amount of displacement of the height is used as a measurement material generating portion, and the measurement data is generated based on the measurement data. The material is ~__-shaped towel, and the majority of the included--evaluation item assets are set, and the information of the evaluation object is judged according to the setting and σ from the circuit. The image data generating device includes: a design image data generating device that forms an X-leaf image based on the design information; and an external image data generating device that forms a gauge image according to the measured material; In the image device, the design image and the appearance image are respectively displayed in a reverse order, and the printing soldering inspection device is characterized in that: 16249pifl.doc 25 12748.68 , when the device determines that the image is not ϋ 1 妓 妓 和 和 和 和 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且Inspection equipment, including ························································································· Light, and measure the displacement 1 and output the displacement as a measurement data; Set:: Evaluation: The body material generation unit, according to the measurement device, carefully evaluates the object *^ The majority of the solder flux of the printed solder a kind of ...-determination device, based on the leaf information from the circuit board: #信号存储装置#, determines whether the evaluation object data is good or bad; Λ another stereoscopic image data generating device, according to the design information, the display The stereoscopic design image data of the soldering flux of the printing flux, the measurement data is generated, and the appearance image data of the printing board is generated, and when the judging device judges to be no, the ancient judgment For the position of no Any one of the design image data or the appearance image resource L, generating image information of the evaluation object for each type of determination, and displaying the image data; and the reverse ordering-display device, the appearance image The data and the design image data are displayed in the line of l6249pifl.d〇c 26 ^868. The printing flux inspection device described in the second paragraph of the patent dry circumference, a sequential storage device is displayed in different colors. The display color of the display component is stored, and the evaluation object is judged as no for each category, and the category combination of the evaluation object data is pre-assigned, and the combination is given a priority order, and; ίΐί The image data generating device generates, in the design image data, the design pattern corresponding to the color of the evaluation object of the type of the object in the setting type, and the display corresponding to the category The printing flux inspection according to item 2 or item 3 includes, in the design information, an allowable value and a calculation unit for calculating the shape of the printed solder on the board when calculating the allowable value, For this The threshold value is compared with the evaluation object data, and the quality determination is performed; and the stereoscopic image generation device accepts the position information and calculates the calculation corresponding to the design image (4) or the external collapse image dragon By illuminating the identification information, the design image is tilted and the oblique image data is superimposed on the display device, and the calculation reference position can be recognized. 16249pifl.doc 27
TW094109950A 2004-03-31 2005-03-30 Apparatus inspecting printed solder TWI274868B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004103596A JP2005291760A (en) 2004-03-31 2004-03-31 Printed circuit board inspection apparatus

Publications (2)

Publication Number Publication Date
TW200532190A TW200532190A (en) 2005-10-01
TWI274868B true TWI274868B (en) 2007-03-01

Family

ID=35324871

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109950A TWI274868B (en) 2004-03-31 2005-03-30 Apparatus inspecting printed solder

Country Status (4)

Country Link
JP (1) JP2005291760A (en)
KR (1) KR100644024B1 (en)
CN (1) CN100399039C (en)
TW (1) TWI274868B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4606319B2 (en) * 2005-12-19 2011-01-05 日東電工株式会社 Recovery support device
JP5273926B2 (en) * 2007-02-13 2013-08-28 オリンパス株式会社 Defect inspection equipment
JP4737112B2 (en) * 2007-02-23 2011-07-27 パナソニック株式会社 Printing inspection apparatus and printing inspection method
JP5307407B2 (en) * 2008-01-11 2013-10-02 オリンパス株式会社 Endoscope apparatus and program
JP4550909B2 (en) 2008-02-13 2010-09-22 シーケーディ株式会社 Solder printing inspection device and component mounting system
JP4840394B2 (en) * 2008-04-18 2011-12-21 パナソニック株式会社 Device for inspecting the printed state of solder
IL194298A (en) * 2008-09-23 2016-09-29 Camtek Ltd Method, system and computer program product for reference information based evaluation
JP5218177B2 (en) * 2009-03-13 2013-06-26 オムロン株式会社 Image processing apparatus and method
JP2011232111A (en) * 2010-04-26 2011-11-17 Olympus Corp Inspection device and fault detecting method used for inspection device
JP5365645B2 (en) * 2011-01-17 2013-12-11 オムロン株式会社 Substrate inspection apparatus, substrate inspection system, and method of displaying screen for confirming substrate inspection result
KR101642897B1 (en) 2011-07-13 2016-07-26 주식회사 고영테크놀러지 Inspection method
CN103364403A (en) * 2012-04-06 2013-10-23 鸿富锦精密工业(深圳)有限公司 Automatic product quality control and management system and method
CN102967820A (en) * 2012-11-13 2013-03-13 东莞宇龙通信科技有限公司 Mobile terminal and self-detection method thereof
CN105891697B (en) * 2014-12-23 2019-08-23 中科众志信通(大连)科技有限公司 Circuit board maintenance auxiliary picture pixels dynamic link method
CN105891623B (en) * 2014-12-23 2019-08-09 中科众志信通(大连)科技有限公司 Electronic units fix assists picture pixels dynamic link method
CN104551301A (en) * 2014-12-30 2015-04-29 东莞市合易自动化科技有限公司 Full-automatic intelligent-welding assembly line
KR101794964B1 (en) 2015-07-17 2017-11-07 주식회사 고영테크놀러지 Inspection system and inspection method
TWI582629B (en) * 2016-08-19 2017-05-11 和碩聯合科技股份有限公司 Interference detection method and detecting device using the same
JP6706717B2 (en) * 2017-05-12 2020-06-10 株式会社Fuji Transfer status inspection system and component mounter
CN110006903A (en) * 2018-01-05 2019-07-12 皓琪科技股份有限公司 Printed circuit board rechecks system, marker method and reinspection method
JP2019158555A (en) * 2018-03-13 2019-09-19 株式会社Screenホールディングス Defect confirmation device, method for confirming defects, and program

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3419118B2 (en) * 1994-11-29 2003-06-23 松下電器産業株式会社 Appearance inspection device
JP3537382B2 (en) 2000-07-03 2004-06-14 アンリツ株式会社 Print solder inspection equipment
GB2388428A (en) * 2000-09-10 2003-11-12 Orbotech Ltd Reduction of false alarms in PCB inspection
JP2003172711A (en) * 2001-09-26 2003-06-20 Dainippon Screen Mfg Co Ltd Surface inspection of inspected object using image processing

Also Published As

Publication number Publication date
CN100399039C (en) 2008-07-02
JP2005291760A (en) 2005-10-20
KR100644024B1 (en) 2006-11-10
KR20060045036A (en) 2006-05-16
CN1677118A (en) 2005-10-05
TW200532190A (en) 2005-10-01

Similar Documents

Publication Publication Date Title
TWI274868B (en) Apparatus inspecting printed solder
CN100432622C (en) Printing solder detecting device
TW201231960A (en) Soldering inspection method, substrate inspection system and soldering inspection machine
CN105787980A (en) Method and system for detecting field angle of virtual reality display device
JP2007312877A (en) Body measuring apparatus
KR20100017396A (en) Image processing device and image processing method for performing three dimensional measurements
TWI274867B (en) Printed circuit board inspection apparatus
CN101198908A (en) Image processing device, image drawing device, and system
CN107656609A (en) Chromatic measuring system, image forming apparatus and image generating method
JP5640943B2 (en) Exposure apparatus setting method, substrate imaging apparatus, and storage medium
CN114902280A (en) Analysis device and analysis method
KR101750521B1 (en) Method and apparatus for inspecting a substrate
JP2005310044A (en) Apparatus, method and program for data processing
JPH09329430A (en) Method and device for measuring degree of damage of object and repair cost calculating device
JP4333349B2 (en) Mounting appearance inspection method and mounting appearance inspection apparatus
JP3684745B2 (en) Crystal grain 3D display method
JP2003510568A (en) LCD inspection method and LCD inspection apparatus by pattern comparison
JP5234941B2 (en) Alignment device
JP3621525B2 (en) Evaluation method and apparatus in dental practice
JP2003161647A (en) Measuring device
TWI787964B (en) Vending machine with test strip
JP2006078380A (en) Display method for defect inspection using image processor
TWI710747B (en) Circuit board thickness measurement method and thickness measurement system
JP3550604B2 (en) 2D imaging scanner
JP5276297B2 (en) 2D coordinate measuring machine

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees