TWI710747B - Circuit board thickness measurement method and thickness measurement system - Google Patents

Abstract

The present invention provides a method for measuring the thickness of a circuit board, including: providing a circuit board to be drilled, and obtaining a circuit board image of the circuit board; providing a simulation image to be drilled with a hole design pattern; Using an image processing device, the simulation image to be drilled is corresponding to the circuit board image; the simulation image to be drilled is divided into a plurality of simulation areas to be tested according to the hole design pattern; In the simulation area, the circuit board image is divided into a plurality of areas to be measured; and a thickness measurement device is used to measure the thickness of the circuit board according to the waiting area. In addition, the present invention also provides a thickness measurement system. Using the thickness measurement method to measure the thickness of multiple positions of the circuit board can effectively improve the accuracy of subsequent drilling.

Description

Circuit board thickness measurement method and thickness measurement system

The invention relates to a measuring method, in particular to a thickness measuring method of a circuit board, and a thickness measuring system.

The printed circuit boards currently used for soldering with the legs of several electronic components usually include an insulating plate and a circuit layer made of metal and formed on the surface of the insulating plate or in the insulating plate. Before the printed circuit board is soldered with the electronic components, the thickness of the printed circuit board needs to be measured, and then appropriate control parameters are set on a drilling device according to the measured thickness, and then the drilling is used The device drills several through holes in the printed circuit board for the supporting legs to pass through, so that the electronic components can be welded with the printed circuit board.

However, since the circuit layer of the printed circuit board is not formed on the insulating plate over the entire surface, it is wired on the insulating plate according to the required circuit design; therefore, the printed circuit board has different thicknesses in different areas on the microscopic size. There will be slight differences, resulting in poor accuracy of the through holes formed by the drilling device.

Therefore, one of the objectives of the present invention is to provide a circuit board thickness measurement method that can at least overcome the disadvantages of the prior art.

Therefore, the method for measuring the thickness of a circuit board of the present invention includes: using a camera device to provide a circuit board to be drilled, and obtaining a circuit board image of the circuit board; using an image processing device to provide a circuit board to be drilled A simulation image, the simulation image to be drilled is arranged with a hole design pattern; the image processing device is used to correspond the simulation image to be drilled to the circuit board image; the image processing device is used according to the to be drilled According to the hole design pattern of the hole simulation image, the simulation image to be drilled is divided into multiple simulation areas to be tested, and the circuit board image is divided into multiple simulation areas to be tested according to the simulation area to be tested; And using a thickness measuring device to measure the thickness of the circuit board according to the waiting area of the circuit board image.

Therefore, another object of the present invention is to provide a thickness measurement system for measuring circuit boards that can at least overcome the disadvantages of the prior art, and the thickness measurement system is used to perform the above-mentioned circuit board thickness measurement method .

The effect of the present invention is to use the design of the simulation image to be drilled to be divided into the waiting simulation area to measure the thickness of the position of the circuit board corresponding to the waiting area to obtain the circuit board in the waiting area The multiple thickness values of, effectively improve the accuracy of subsequent drilling.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

1 and 3, the present invention is an embodiment of a thickness measurement system 2 for measuring a circuit board 1 to be drilled, which is suitable for measuring the thickness of the circuit board 1.

The thickness measurement system 2 is provided with a camera device 21 for positioning the circuit board 1 at a predetermined position and holding it fixedly and for taking pictures to obtain the circuit board image 3 of the circuit board 1, and a signal with the camera device 21 An image processing device 22 connected and used to provide an analog image and used to process a plurality of images, and a thickness measuring device 23 signally connected to the image processing device 22 and used to measure the thickness of a predetermined position of the circuit board 1.

The camera device 21 is provided with a holder 211 for holding and fixing the circuit board 1, and a camera 212 located above the holder 211 and used for photographing the circuit board 1. The image processing device 22 is provided with a processor 221 for analyzing, processing, and computing image data (for example, noise reduction, image fusion, image editing, etc.), and a display unit 222 for displaying the image . The thickness measuring device 23 is signally connected to the image processing device 22 and is used to measure the thickness of the predetermined position of the circuit board 1 according to the image data processed by the image processing device 22. In this embodiment, the display unit 222 is a display; the thickness measuring device 23 is a non-contact distance measuring device, such as an optical distance measuring device, arranged on the opposite side of the circuit board 1.

In other variations of this embodiment, the thickness measuring device 23 is a contact type distance finder, such as a telescopic probe, which is disposed on the two opposite sides of the circuit board 1.

1 and 2, the present invention uses the thickness measurement system to perform an embodiment of the thickness measurement method of the circuit board 1, as described below:

Referring to FIGS. 3 to 5, the clamper 211 of the camera device 21 is used to position and clamp a circuit board 1 to be drilled at the predetermined position, and the camera 212 of the camera device 21 is used to photograph the circuit Board 1 to obtain the circuit board image 3 of the circuit board 1, and then transmit and store the circuit board image 3 in the image processing device 22. The circuit board 1 has a rectangular shape, and has a front surface 11, and three physical marks 12 located at three corners of the front surface 11 and each in a "cross" pattern, and is provided with an insulating plate 13 and a metal material It is made and formed on the surface of the insulating plate 13 and/or the circuit wiring layer in the insulating plate 13 (not shown). With the design of the physical mark 12 of the circuit board 1, the circuit board image 3 also has three mark images 31 corresponding to the physical marks 12 respectively.

1, 3, and 5, the processor 221 of the image processing device 22 is used to provide a simulation image 4 to be drilled and displayed on the display unit 222 of the image processing device 22. The simulation image 4 to be drilled has a boundary 41 surrounded by a rectangle, and three simulation marks 42 located in the boundary 41, and a hole design pattern 43 with a plurality of simulated holes 431 is arranged. The simulated hole 431 of the hole design pattern 43 simulates the relative position of the circuit board 1 to be drilled later, and the size of the simulated image 4 to be drilled can be reduced or enlarged by a predetermined ratio and compared with the circuit board 1 The position to be drilled on is in line. In this embodiment, the simulated holes 431 are unevenly distributed; for example, a part of the simulated holes 431 is unevenly distributed with uneven density, and the other part is arranged in a single row or multiple rows. The shape and size of each simulated hole 431 are not limited to be consistent, but can be circular, elliptical, polygon... etc.

It should be noted that the simulation image 4 to be drilled can also be provided first, and then the circuit board image 3 is obtained; or the simulation image 4 to be drilled and the circuit board image 3 are obtained at the same time.

Then, the image processing device 22 is used to make the simulation marks 42 correspond to the mark images 31 respectively, and the simulation image 4 to be drilled corresponds to the circuit board image 3. Specifically, the circuit board image 3 and the simulation image 4 to be drilled are displayed on the display unit 222 of the image processing device 22; and the processor 221 is used to enlarge or reduce the simulation image 4 to be drilled After a predetermined ratio, the simulation marks 42 of the simulation image 4 to be drilled are overlapped with the mark images 31 of the circuit board image 3, and the boundary 41 of the simulation image 4 to be drilled is overlapped. Corresponding to the contour 32 of the circuit board image 3, so that the to-be-drilled simulation image 4 corresponds to the circuit board image 3, and the alignment of the to-be-drilled simulation image 4 and the circuit board image 3 is completed, In addition, the alignment process of the circuit board image 3 and the simulation image 4 to be drilled is displayed on the display unit 222.

1 and 6, next, using the image processing device 22, according to the hole design pattern 43 of the to-be-drilled simulation image 4, the to-be-drilled simulation image 4 is divided into a plurality of for the simulation The simulation area 432 to be tested is distributed with the holes 431, and the circuit board image 3 is divided into a plurality of test areas 33 according to the simulation area to be tested 432. Specifically, the processor 221 is used to divide the area enclosed by the boundary 41 of the to-be-drilled simulation image 4 into the waiting-for-test simulation area 432 arranged in a matrix; see FIGS. 1, 7, and 8 , And then use the processor 221 to make each simulated area to be tested 432 form a simulated point to be tested 433 determined according to the distribution of the simulated holes 431 in the simulated area to be tested 432, and then make the circuit board diagram The to-be-measured area 33 shown in Fig. 3 is formed with a plurality of to-be-measured points 331 corresponding to the analogue points 433 to be measured respectively. Therefore, each test area 33 of the circuit board image 3 forms the test point 331, and the test point 331 of the waiting test area 33 corresponds to the test simulation point 433 of the test simulation area 432 respectively.

。因此，第1個待測模擬區432的待測模擬點433的座標 (X1,Y1)=(

)，第2個待測模擬區432的待測模擬點433的座標(X2,Y2)=(

)，第3個待測模擬區432的待測模擬點433的座標(X3,Y3)=(

)，以此類推至最後一個待測模擬區432的待測模擬點433。 Referring to FIGS. 6 to 8, specifically, the position of the simulated point 433 to be tested in each simulated area to be tested 432 is a center of gravity of the simulated hole 431 in the simulated area to be tested 432. To illustrate in the form of coordinates, when the coordinates defining the lower left corner of the boundary 41 of the simulated image 4 to be drilled are (0, 0), the position of each simulated hole 431 can be represented by coordinates. When the number of simulation holes 431 in m simulation areas 432 to be tested is n, m is a positive integer and n is an integer not less than 0; among them, in the m simulation area to be tested 432, the i-th simulation The position of the hole 431 is represented by coordinates (xmi, ymi). The area of the i-th simulated hole 431 is Ami square unit, 0>i≦n, then the center of gravity of the m-th simulated area 432 to be tested (that is The simulated point to be tested 433) has a mark (Xm, Ym), and the calculation method of the coordinate (Xm, Ym) is:

. Therefore, the coordinates (X1, Y1) of the simulated point 433 to be tested in the first simulated area to be tested 432 (X1, Y1)=(

), the coordinates (X2, Y2) of the simulated point to be tested 433 in the second simulated area to be tested 432 (X2, Y2)=(

), the coordinates (X3, Y3) of the simulation point 433 to be tested in the third simulation area 432 to be tested (X3, Y3)=(

), and so on to the simulation point 433 to be tested in the last simulation area 432 to be tested.

Referring to FIGS. 1 and 7, it should be noted that in other variations of this embodiment, the processor 221 of the image processing device 22 can also be used to obtain the simulated points 433 to be tested in the simulated waiting area 432. After that, the simulation image 4 to be drilled is corresponding to the circuit board image 3, and the circuit board image 3 is correspondingly formed with the test points 331 corresponding to the test simulation points.

Referring to FIGS. 1, 7 and 9, finally, the image processing device 22 and the thickness measuring device 23 are used to measure the thickness of the circuit board 1 according to the waiting area 33 of the circuit board image 3. Specifically, the thickness measuring device 23 measures the thickness of the position of the circuit board 1 corresponding to the waiting point 331 according to the waiting point 331. The thickness measuring device 23 is the non-contact distance measuring device installed on two opposite sides of the circuit board 1.

Referring to FIG. 10, in another variation of this embodiment, the contact type rangefinder is used as the thickness measuring device 23 to measure the thickness of the circuit board 1.

To sum up, the thickness measurement method of the present invention utilizes the design of the waiting simulation area 432 of the simulation image to be drilled to measure the positions of the circuit board 1 corresponding to the waiting points 331. Thickness to obtain a relatively accurate thickness value of each area of the circuit board 1 and effectively improve the accuracy of subsequent drilling, so it can indeed achieve the purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

1: circuit board 11: positive 12: Entity tag 13: Insulating sheet 2: Thickness measurement system 21: Camera 211: gripper 212: Camera 22: Image processing device 221: processor 222: display 23: Thickness measuring device 3: Circuit board image 31: Mark the image 32: contour 33: Area to be tested 331: point to be measured 4: Simulation image to be drilled 41: Border 42: analog mark 43: Hole design pattern 431: Simulation hole position 432: Simulation area to be tested 433: Analog point to be tested

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a schematic diagram illustrating a thickness measurement system of the present invention; 2 is a flow chart illustrating an embodiment of a method for measuring the thickness of a circuit board of the present invention; Figure 3 is a schematic top view illustrating a circuit board to be drilled; Figure 4 is a schematic side view illustrating the use of a camera to obtain a circuit board image of the circuit board; Figure 5 is a schematic diagram illustrating that a simulated image to be drilled corresponds to the circuit board image; Fig. 6 is a schematic diagram illustrating that the simulation image to be drilled is divided into multiple simulation areas to be tested; Figure 7 is a schematic diagram illustrating one of the waiting test simulation areas; Figure 8 is a schematic diagram illustrating another one of the waiting test simulation areas; Figure 9 is a schematic side view illustrating the use of a non-contact rangefinder to measure the thickness of the circuit board; and FIG. 10 is a schematic side view illustrating the use of a contact type distance meter to measure the thickness of the circuit board.

Claims (11)

A method for measuring the thickness of a circuit board, including: Provide a circuit board to be drilled, and obtain the circuit board image of the circuit board; Provide a simulation image to be drilled, and the simulation image to be drilled is arranged with a hole design pattern; Using an image processing device to map the simulated image to be drilled to the circuit board image; Using the image processing device, according to the hole design pattern of the simulation image to be drilled, the simulation image to be drilled is divided into a plurality of simulation areas to be tested, and the circuit board is The image is divided into multiple areas to be tested; and A thickness measuring device is used to measure the thickness of the circuit board according to the waiting area of the circuit board image. The method for measuring the thickness of a circuit board according to claim 1, wherein the simulation image to be drilled includes a boundary corresponding to the contour of the circuit board image, and the area enclosed by the boundary is divided into the Waiting to test the simulation area. The method for measuring the thickness of a circuit board according to claim 1, wherein the waiting simulation area of the simulation image to be drilled is arranged in a matrix form. The method for measuring the thickness of a circuit board according to claim 1, wherein each area to be measured of the circuit board image is formed with a point to be measured, and the thickness measuring device determines the thickness of the circuit board according to the waiting point. Perform thickness measurement at the position where the measurement point should be waiting. The circuit board thickness measurement method according to claim 4, wherein the hole design pattern of the simulation image to be drilled has a plurality of simulation holes distributed in the simulation area to be tested, and each simulation to be tested The area is formed with an analog point to be tested determined according to the distribution of the analog hole positions in the analog area to be tested, and the analog point to be tested corresponds to the test point of the circuit board image respectively. The method for measuring the thickness of a circuit board according to claim 5, wherein the position of the simulated point to be measured in each simulated area to be measured is the center of gravity of the simulated hole in the simulated area to be measured. The method for measuring the thickness of a circuit board according to claim 1, wherein the circuit board has a plurality of physical marks, so that the circuit board image is formed with a plurality of mark images corresponding to the physical marks, and the to-be-drilled The hole simulation image also has a plurality of simulation marks, and the simulation marks are used to correspond to the mark images respectively, and the simulation image to be drilled corresponds to the circuit board image. The method for measuring the thickness of a circuit board according to claim 7, wherein the circuit board image and the simulation image to be drilled are displayed on a display unit of the image processing device, and the circuit is displayed on the display unit The board image is aligned with the simulated image to be drilled. The method for measuring the thickness of a circuit board according to claim 1, wherein the thickness measuring device is a non-contact distance measuring device arranged on two opposite sides of the circuit board. The method for measuring the thickness of a circuit board according to claim 1, wherein the thickness measuring device is a contact type rangefinder arranged on two opposite sides of the circuit board. A thickness measurement system for measuring the thickness of a circuit board, which is used to perform the thickness measurement method of the circuit board described in one of claims 1 to 10.

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