CN103954241B - IC pin coplanarity measuring system and measuring method based on structured light - Google Patents
IC pin coplanarity measuring system and measuring method based on structured light Download PDFInfo
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- CN103954241B CN103954241B CN201410164259.XA CN201410164259A CN103954241B CN 103954241 B CN103954241 B CN 103954241B CN 201410164259 A CN201410164259 A CN 201410164259A CN 103954241 B CN103954241 B CN 103954241B
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- vibration isolation
- coplanarity
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Abstract
The invention discloses an IC pin coplanarity measuring system and measuring method based on structured light. The system comprises a graph projector, an angular instrument, a diffusion ceramic calibration plate, a telecentric lens A, a telecentric lens B, a CCD camera and a computer. The graphic projector is connected with the telecentric lens A and is fixed to a vibration isolation testing table through a clamping device, the light of the graphic projector is perpendicular to the plane of the vibration isolation testing table, and an IC chip to be measured is placed on a horizontal plane under the graphic projector. The telecentric lens B is connected to the CCD camera and is fixed to the vibration isolation testing table through the clamping device, and an included angle is formed between the light of the CCD camera and the plane of the vibration isolation testing table. According to the system, IC pin coplanarity measurement can be converted into intelligent measurement based on machine vision, and pin coplanarity measurement on an image is mapped into the height difference between grating strips of the surface of the chip and the surface of a pin. Equipment cost is low, the technical means is simple, convenient and easy to implement, complex formula derivation and computation are eliminated, and testing efficiency is improved.
Description
Technical field
The present invention relates to integrated antenna package field, more particularly, to a kind of ic pin coplanarity measurement system based on structure light
System and its measuring method.
Background technology
With electronic information industrial expansion, integrated circuit electronic components and parts achieve development at full speed.Integrated in electronics
Circuit components produce streamline on, control and improve product surface quality be always electron trade pay special attention to interior
Hold, thus the detection to product quality seems particularly critical, wherein ic pin coplanarity is the one of impact wiring board assembling quality
Individual key factor.Ic device is the minimum pin of integrated circuit electronic device and three highest pins being not arranged on the same straight line
The distance between the plane constituting deviation definition is coplanarity error, often referred to simply as coplane degree.In pasted on surface of circuit board
(smt) in production technology, for ensureing mounting quality, attachment process proposes at a relatively high requirement to the coplane degree of pin, when drawing
When foot coplane degree exceeds a certain scope, then some pins of device cannot with the surface that pcb pad is printed circuit board pads
Be in close contact, be easy for causing the scolding tin melting when welding not reach the bottom of pin, scolding tin cannot these pins and
Pad is joined together to form good solder joint, may lead to the defects such as rosin joint, solder skip and virtual connection.
The pin coplanarity of ic device is to weigh one of key index of ic device packaging technique, and it shows ic device pin
Contact the fine or not degree of coupling with pcb bond pad surface.If device pin is not good with pcb coplane degree, easily lacks tin cream and lead to
Device not prison welding, or tin cream excessively lead to components and parts short circuit.Conversely, coplane degree is better, then the pin of ic device and pcb pad
Surface more can preferably completely attach to, and so can get best welding quality in welding process.
Traditional detection method is by human eye detection, and this method there is a problem of a lot: detection efficiency is not high；Inspection
Surveying result is easily affected by the subjective factorss of people；High labor intensive of testing staff etc..With manufacturer's speed of production
The drawbacks of improve with the raising to lead coplanarity required precision for the upstream assembling producer, Manual Visual Inspection increasingly shows especially, based on machine
The industrial products detection of device vision can overcome above-mentioned difficulties, is therefore widely used in the surface quality automatization prison of ic chip
Survey, have been developed that the automatic checkout system of high-precision ic appearance both at home and abroad.
Existing coplane degree detection method can be generally divided into: microsection analytic process, three coordinates measuring equipment measurement method, three-dimensional
The more common four kind measuring method such as radiographic measurement method and contact-type 3 D coordinatograph measurement method.Although microsection analytic process
Testing result is intuitively accurate, but measurement efficiency is low, belongs to destructive measurement；Although three coordinates measuring equipment measurement method is lossless and can
Repeated measure, but accuracy is relatively low, and different measuring personnel's measurement result differs greatly；Though 3-dimensional image measurement method measurement result is straight
See image, data processing is easy, but also belong to destructive measurement, measurement result is subject to sample surfaces situation (base material/copper face color, table
Face process) impact larger；The higher probe of contact-type 3 D coordinatograph measurement method accuracy high efficiency has physical size, and measurement is micro-
During small sample, position error is larger；
Content of the invention
The present invention is in order to overcome existing coplane degree measurement apparatus complex structure, bulky, device fabrication high cost, detection
Speed is slow and the low shortcoming and defect of accuracy of detection in place of, provide a kind of ic pin coplanarity measuring system based on structure light and
Its measuring method, with respect to prior art, measuring apparatus are simple, certainty of measurement improves.
The present invention is achieved through the following technical solutions:
A kind of ic pin coplanarity measuring system based on structure light, including graphics projectors 1, clinometer, circular linear light
Grid, diffusion pottery scaling board, a telecentric lens 2, b telecentric lens 4, ccd camera 5 and computer 6；Described round wire lenticular lenses
It is positioned in graphics projectors 1；Graphics projectors 1 adopt led graphics projectors.
Described graphics projectors 1 connect a telecentric lens 2, are fixed on vibration isolation testing stand by clamping device, and figure is thrown
Perpendicular to the plane of vibration isolation testing stand, ic chip to be measured is positioned over the horizontal plane immediately below graphics projectors 1 to the light of shadow instrument 1
On；
Described b telecentric lens 4 are connected to ccd camera 5, are fixed on vibration isolation testing stand by clamping device, ccd camera 5
The plane of light and vibration isolation testing stand be in 15 °～60 ° angles, ccd camera 5 is connected to computer 6, shows on computer 6
The ic chip image with grating fringe being photographed by ccd camera 5, the angle of adjustment ccd camera 5 makes the gratings strips in image
Stricture of vagina is shown as horizontal linear.
The light of described ccd camera 5 and the plane of vibration isolation testing stand are in preferably 45 ° of angles.
Ic chip pin coplanarity measuring method is measured using above-mentioned measuring system, comprises the steps:
Step 1: adjustment graphics projectors 1 and the pose of ic chip, make grating fringe be vertically projected to each of ic chip
On individual pin, then adjust the angle of ccd camera 5, the grating fringe being allowed to photograph becomes horizontal linear；
Step 2: measure ccd camera 5 or telecentric lens 4 and horizontal line angulation θ using clinometer；
Step 3: the image of the ic chip pin with grating fringe that ccd camera 5 is photographed carries out morphological image
Process, extract the skeleton of ic chip pin grating fringe, and skeleton done with the fitting a straight line of method of least square, calculate by
Pixel distance s between the straight line of the straight line of ic chip surface grating fringe matching and pin surface grating fringe matching；
Step 4: with ccd camera 5, camera calibration is done to diffusion pottery scaling board, calculate pixel distance and actual physics distance
Between proportionate relationship k；
Step 5: above-mentioned steps 3,4 process is passed through one by one to each pin of ic chip, by formula h=k s/cos θ
Draw the pin of ic chip vertical dimension h to ic chip surface；
Step 6: calculate each pin of ic chip to difference in height h of ic chip surfacei, coplane degree l ic pin and ic
The maximum h of chip surface actual height differencemaxWith minima hminDifference representing, i.e. l=hmax-hmin, it is common that l is ic pin
Face degree.
The present invention, with respect to prior art, at least has such advantages as and effect:
The measurement of ic pin coplanarity can be converted into intelligent measuring based on machine vision by the present invention, being total to of pin
Face degree measurement is mapped as the difference in height between chip surface and pin surface grating fringe on image.
Due to adopting sub-pix digital image processing techniques and the high-precision test instrunment based on machine vision, therefore can carry
High measurement accuracy.
The adopted equipment cost of the present invention low it is not necessary to complicated huge test instrunment, technological means are simple and easy to do, save
The loaded down with trivial details derivation of equation and calculating, improve the efficiency of test.
Brief description
Fig. 1 is the schematic diagram of measuring system of the present invention.
Fig. 2 is the schematic diagram to ic chip for the optical grating projection.
Fig. 3 is grating pixel difference in height schematic diagram.
Specific embodiment
With reference to specific embodiment, the present invention is more specifically described in detail.
Embodiment
As shown in Figures 1 to 3.The invention discloses a kind of ic pin coplanarity measuring system based on structure light, comprising:
Graphics projectors 1, clinometer, round wire lenticular lenses, diffusion pottery scaling board, a telecentric lens 2, b telecentric lens 4,
Ccd camera 5 and computer 6；Described round wire lenticular lenses are positioned in graphics projectors 1；Graphics projectors 1 are thrown for led figure
Shadow instrument.
Described graphics projectors 1 connect a telecentric lens 2, are fixed on vibration isolation testing stand by clamping device, and figure is thrown
Perpendicular to the plane of vibration isolation testing stand, ic chip to be measured is positioned over the horizontal plane immediately below graphics projectors 1 to the light of shadow instrument 1
On；
Described b telecentric lens 4 are connected to ccd camera 5, are fixed on vibration isolation testing stand by clamping device, ccd camera 5
The plane of light and vibration isolation testing stand be in 15 °～60 ° angles, ccd camera 5 is connected to computer 6, shows on computer 6
The ic chip image with grating fringe being photographed by ccd camera 5, the angle of adjustment ccd camera 5 makes the gratings strips in image
Stricture of vagina is shown as horizontal linear.
The light of described ccd camera 5 is minimum with the plane of vibration isolation testing stand to be in 45 ° of angles.
Above-mentioned measuring system measures ic chip pin coplanarity measuring method, can be achieved by the steps of:
Step 1: adjustment graphics projectors 1 and the pose of ic chip, make grating fringe be vertically projected to each of ic chip
On individual pin, then adjust the angle of ccd camera 5, the grating fringe being allowed to photograph becomes horizontal linear；
Step 2: measure ccd camera 5 or telecentric lens 4 and horizontal line angulation θ using clinometer；
Step 3: the image of the ic chip pin with grating fringe that ccd camera 5 is photographed carries out morphological image
Process, extract the skeleton of ic chip pin grating fringe, and skeleton done with the fitting a straight line of method of least square, calculate by
Pixel distance s between the straight line of the straight line of ic chip surface grating fringe matching and pin surface grating fringe matching；
Step 4: with ccd camera 5, camera calibration is done to diffusion pottery scaling board, calculate pixel distance and actual physics distance
Between proportionate relationship k；
Step 5: above-mentioned steps 3,4 process is passed through one by one to each pin of ic chip, by formula h=k s/cos θ
Draw the pin of ic chip vertical dimension h to ic chip surface；
Step 6: calculate each pin of ic chip to difference in height h of ic chip surfacei, coplane degree l ic pin and ic
The maximum h of chip surface actual height differencemaxWith minima hminDifference representing, i.e. l=hmax-hmin, it is common that l is ic pin
Face degree.
As described above, just can preferably realize the present invention.
Embodiments of the present invention are simultaneously not restricted to the described embodiments, other any spirit without departing from the present invention
With the change made under principle, modification, replacement, combine, simplify, all should be equivalent substitute mode, be included in the present invention's
Within protection domain.
Claims (2)
1. a kind of method measuring ic pin coplanarity using the ic pin coplanarity measuring system based on structure light, should be based on knot
The ic pin coplanarity measuring system of structure light includes:
Graphics projectors, clinometer, round wire lenticular lenses, diffusion pottery scaling board, a telecentric lens, b telecentric lens, ccd camera
And computer；Described round wire lenticular lenses are positioned in graphics projectors；
Described graphics projectors connect a telecentric lens, are fixed on vibration isolation testing stand by clamping device, the light of graphics projectors
Line is positioned on the horizontal plane immediately below graphics projectors perpendicular to the plane of vibration isolation testing stand, ic chip to be measured；
Described b telecentric lens are connected to ccd camera, are fixed on vibration isolation testing stand by clamping device, the light of ccd camera with
The plane of vibration isolation testing stand is in 15 °～60 ° angles, and ccd camera is connected to computer, shows on computers and clapped by ccd camera
The ic chip image with grating fringe taken the photograph, the angle of adjustment ccd camera makes the grating fringe in image be shown as level
Straight line；
The light of described ccd camera and the plane of vibration isolation testing stand are in 45 ° of angles；
It is characterized in that, included using the method that the ic pin coplanarity measuring system based on structure light measures ic pin coplanarity
Following steps:
Step 1: adjustment graphics projectors and the pose of ic chip, make grating fringe be vertically projected to each pin of ic chip
On, then adjusting the angle of ccd camera, the grating fringe being allowed to photograph becomes horizontal linear；
Step 2: measure ccd camera and horizontal line angulation θ using clinometer；
Step 3: the image of the ic chip pin with grating fringe that ccd camera 5 is photographed carries out the place of morphological image
Reason, extracts the skeleton of ic chip pin grating fringe, and skeleton is done with the fitting a straight line of method of least square, calculates by ic core
Pixel distance s between the straight line of the straight line of piece surface grating striped matching and pin surface grating fringe matching；
Step 4: with ccd camera 5, camera calibration is done to diffusion pottery scaling board, calculate between pixel distance and actual physics distance
Proportionate relationship k；
Step 5: above-mentioned steps 3,4 process is passed through one by one to each pin of ic chip, is drawn by formula h=k s/cos θ
Vertical dimension h to ic chip surface for the pin of ic chip；
Step 6: calculate each pin of ic chip to difference in height h of ic chip surfacei, coplane degree l ic pin and ic chip list
The maximum h of face actual height differencemaxWith minima hminDifference representing, i.e. l=hmax-hmin, l as ic pin coplanarity.
2. according to claim 1 ic pin coplanarity is measured using the ic pin coplanarity measuring system based on structure light
Method it is characterised in that: graphics projectors be led graphics projectors.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410164259.XA CN103954241B (en) | 2014-04-22 | 2014-04-22 | IC pin coplanarity measuring system and measuring method based on structured light |
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| CN201410164259.XA CN103954241B (en) | 2014-04-22 | 2014-04-22 | IC pin coplanarity measuring system and measuring method based on structured light |
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| CN103954241A CN103954241A (en) | 2014-07-30 |
| CN103954241B true CN103954241B (en) | 2017-01-25 |
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| CN104792281A (en) * | 2015-03-30 | 2015-07-22 | 智机科技（深圳）有限公司 | Terminal coplanarity measurement method |
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| CN109916816A (en) * | 2019-04-23 | 2019-06-21 | 王唐(苏州)机器人智能科技有限公司 | A kind of contact pin grid array chips appearance detection system |
| CN110455188B (en) * | 2019-08-25 | 2020-08-25 | 大连理工大学 | Single-axis translation stage and structured light 3D sensor combined measurement calibration method |
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| CN113720276B (en) * | 2021-08-25 | 2022-07-01 | 中国科学院高能物理研究所 | Method and system for calibrating parallelism of read-out chip of detector |
| CN114353676B (en) * | 2021-12-07 | 2024-03-19 | 江苏华创微系统有限公司 | Automatic measurement device for height of mounted chip and test method thereof |
| CN114252000B (en) * | 2022-03-01 | 2022-05-27 | 北京京瀚禹电子工程技术有限公司 | Device and method for testing coplanarity and spacing of chip pins |
| CN115266743B (en) * | 2022-05-17 | 2024-02-02 | 江苏汤谷智能科技有限公司 | System and method for evaluating chip quality under nondestructive testing |
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