JP2003035517A - Lead pin pitch/levelness testing device using two- dimensional laser displacement sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a testing device for imaging a lead pin of such an electronic part as a high integrated density IC or a multicontact switch, based on light-section method by using a two-dimensional laser sensor, and measuring both levelness and mounting pitch of the lead pin to determine whether the resulted measurement value is within the prescribed tolerance range or not. SOLUTION: This is the device to calculate mounting coordinate, mounting pitch and levelness of the lead pin 1.2 on pedestal coordinate system for determining whether these calculated values are within the prescribed tolerance range or not. It comprises a floodlight section 2, a means rotating a fixed pedestal to the given angle, a detection sensor 3 detecting runout of rotation, a means coordinate converting height-related information on a slit light illumination line into the pedestal coordinate system, a means calculating mounting coordinate, etc., of the lead pin 1.2, and a means determining whether those calculated values are within the tolerance range or not.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high integration density IC
Whether the measured value is within a predetermined tolerance by imaging the lead pin of an electronic component such as a multi-contact switch or a multi-contact switch with a two-dimensional laser sensor based on the optical cutting method and measuring the flatness and mounting pitch of the lead pin. And a device for determining.

[0002]

2. Description of the Related Art In recent years, with higher integration density of electronic parts such as ICs and miniaturization of a mounted substrate, the mounting pitch of lead pins of electronic parts has become smaller. For this reason, it is important to manage the lead pin mounting accuracy. Especially for surface mount type electronic parts, not only the lead pin pitch but also the flatness of the lead pin height is important, and if the mounting accuracy is incorrect, it may be a direct cause of contact failure during board mounting. . Therefore, conventionally, the same measurement is performed by moving a one-dimensional laser sensor or the like by a two-axis traverse device to measure a planar area, or by performing a similar measurement by combining a one-axis traverse device and a rotation mechanism. A method such as detecting the flatness of the was used.

[0003]

However, in the lead pin measuring method in the above-mentioned conventional example, since the one-dimensional laser sensor or the like is driven by a two-axis traverse device or a combination of a one-axis traverse device and a rotation mechanism, the traverse device is used. Error in the measurement accuracy, such as surface roughness and running parallelism of the driving table, or error due to vibration during driving, which is added to the measurement value. However, there is a problem that the measurement takes time due to the measurement.

Therefore, in order to solve the above-mentioned problems of the prior art, the technical problem of the present invention is to provide a telecentric and a light projecting portion for obliquely irradiating a laser slit light without performing a moving step for measurement. Lens and 2D C
By using a two-dimensional laser displacement sensor composed of a CD element to detect the mounting coordinates and the mounting pitch of the lead pin in one image pickup, and by measuring the deflection amount of the fixed pedestal rotating by the rotating mechanism at three points, By detecting the inclination of the fixed pedestal plane with respect to the reference coordinates and canceling this out from the measured value, the lead pin mounting coordinates can be accurately and rapidly
It is an object of the present invention to provide a lead pin pitch / flatness inspection device using a two-dimensional laser displacement sensor capable of measuring mounting pitch and flatness.

[0005]

(1) In order to solve the above technical problems, according to the present invention, as described in claim 1, the fixed pedestal is rotated at a predetermined angle while the fixed pedestal is rotated. Laser slit light is obliquely applied to the outer surface of the attached lead pin to capture an image of this line-shaped reflection profile. From the captured image, the reference coordinate system (X, Y) defined on the image axis and the two-dimensional CCD device is captured. , Z), the height information on the slit light irradiation line is detected based on the light cutting method, and the vertical shake amount of the fixed base due to the rotation is detected by at least three base shake detection sensors. Height information on the slit light irradiation line in the reference coordinate system (X, Y, Z) is defined as a fixed pedestal coordinate system (x, y,
A device for converting coordinate values into z), calculating lead pin mounting coordinates, mounting pitch, and flatness in a pedestal coordinate system, and determining whether or not these calculated values are within a predetermined tolerance range, A light projecting unit for irradiating the lead pin with laser slit light, a set of a light projecting unit composed of a two-dimensional CCD element and a telecentric lens for imaging a reflection profile of the lead pin reflected by the laser slit light, and a fixed pedestal are provided. And a means for rotating the image pickup information in an image memory, and based on the optical cutting method, the image axis direction is the Z axis, the V direction of the two-dimensional CCD element and the H direction.
Means for calculating the direction as height information in a reference coordinate system defined as the X-axis and Y-axis, and means for detecting the amount of vertical shake of the fixed pedestal due to rotation with at least three pedestal shake detection sensors. , The rotation angle of the fixed base and the above 3
A means for coordinate conversion of height information on the slit light irradiation line in the reference coordinate system (X, Y, Z) into a pedestal coordinate system (x, y, z) defined as a fixed pedestal, from the set pedestal deflection amount. It is configured to include means for calculating the mounting coordinates, mounting pitch, and flatness of the lead pin in the coordinate system, and means for determining whether or not the calculated value is within a predetermined tolerance range.

(2) Further, as described in claim 2, in the device described in claim 1, a light projecting portion for irradiating a laser slit light, a telecentric lens, and 2 are provided.
By combining a three-dimensional CCD element, the image axis direction is Z
Axis, X in the V and H directions of the 2D CCD device
Calculation for calculating distance information of a linear section irradiated by the light projecting unit in one imaging by distance measurement calculation based on the light section method in the reference coordinate system (X, Y, Z) defined as the axis and the Y axis. It is configured to include a section.

(3) Further, as described in claim 3, the apparatus according to claim 1 is configured to include means for rotating the fixed pedestal at a predetermined angle.

(4) Further, as described in claim 4, in the apparatus according to claim 1, the angle after the pedestal rotational positioning is detected, and then the vertical sway amount of the fixed pedestal after rotational positioning is detected. Is measured at three points, and from the detected three sets of shake amounts and the detected pedestal rotation angle, the reference coordinate system (X,
Y, Z) pedestal plane equation is calculated, and the pedestal coordinates that define the height information on the slit light irradiation line detected in the reference coordinate system as the fixed pedestal from the relationship between the calculated plane equation and the angle after pedestal rotation positioning The system (x, y, z) is configured to have means for coordinate conversion.

(5) Further, as described in claim 5, in the apparatus according to claim 1, height information on the slit light irradiation line in the pedestal coordinate system (X, Y, Z) is detected. It is configured to include means.

(6) Further, as described in claim 6, in the device according to claim 1, the least squares method is used from all the lead pin mounting coordinates in the pedestal coordinate system (x, y, z). A means for calculating the regression plane equation of the lead pin and calculating the flatness of the lead pin, the standard deviation of the attachment coordinates, and the lead pin attachment pitch from the plane equation and the individual lead pin attachment coordinates are provided.

(7) Further, as described in claim 7, in the structure of the apparatus and the tolerance determining means described in claim 1, the above-mentioned (1), (4), (5) and (6) are added. It is configured to include a calculation unit that determines whether or not the flatness, the mounting height, and the mounting pitch of the lead pin calculated by using each of the described means are within predetermined preset tolerances.

According to each of the above-mentioned means (1), (2) to (4), the fixed pedestal is rotated at a predetermined angle, and the laser slit light is emitted to the outer surface of the lead pin attached to the fixed pedestal. The line-shaped reflection profile is imaged by obliquely irradiating, and the lead pin mounting coordinates are detected from the imaged image in the reference coordinate system (X, Y, Z) defined with reference to the image axis and the two-dimensional CCD device. It is executed in the second imaging.
During this time, since there is no movement stroke of the imaging unit and the light projecting unit, not only high-speed measurement processing can be realized, but also an error due to the shake of the mechanical system due to the movement of the imaging unit and the light projecting unit, which has been a problem in the conventional technology. It is not mixed into the measured value.

In particular, according to the means described in (4) above, in the structure and means of the apparatus described in (1) above, the angle after rotational positioning of the pedestal is detected, and then the vertical position of the fixed pedestal after rotational positioning is determined. The amount of shake in the direction is measured at three points, and from these three detected shake amounts, the reference coordinate system (X, Y, Z)
In the pedestal coordinate system (x, the height information on the slit light irradiation line detected in the reference coordinate system is defined as the fixed pedestal from the relationship between the calculated plane equation and the angle after pedestal rotation positioning. , Y, z).

According to the means described in (5) above, in the structure and means of the apparatus described in (1) above, the height on the laser slit light irradiation line converted into the pedestal coordinate system (x, y, z) is increased. It is possible to calculate the lead pin mounting coordinates from the height information.

According to the means described in the above (6), in the structure and means of the device described in the above (1), from all the lead pin mounting coordinates coordinate-converted into the pedestal coordinate system (x, y, z), It is possible to calculate the regression plane equation of the lead pin by using the least squares method, and to calculate the flatness of the lead pin, the standard deviation of the attachment coordinate, and the lead pin attachment pitch from the plane equation and individual lead pin attachment coordinates.

According to the means described in (7) above, the plane of the lead pin calculated by using the means of claims 1, 4, 5 and 6 in the structure of the device and the tolerance determining means according to (1) above. It is possible to determine whether the degree, the mounting height, and the mounting pitch are within predetermined preset tolerances.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of a lead pin pitch / flatness inspection apparatus using a two-dimensional laser displacement sensor according to the present invention will be described with reference to the drawings. FIG. 2 is a block diagram for explaining the definition of the reference coordinate system of the inspection apparatus, and FIG. 3 is a block diagram for explaining the definition of the pedestal coordinate system defined on the fixed pedestal. A method of measuring a lead pin row attached to four sides by a set of an imaging unit and a light projecting unit by rotating an object will be described.

In FIG. 1, reference numeral 1 denotes a fixed pedestal for fixing an object to be inspected such as an electronic component. As shown in FIG. 3, x and y axes are defined on the installation surface, and the rotation center is orthogonal to the xy plane and the rotation center is defined. The axis passing through is defined as the z axis. It is assumed that the object to be inspected is installed at a position (x, y) = (0, 0) where its center coincides with the z axis. Next, in FIG. 2, (X, Y, Z) is a reference coordinate system, which defines the X axis and the Y axis in the V direction and the H direction of the two-dimensional CCD element, and is an axis orthogonal to the XY plane. Is defined as the Z axis. At this time, the image pickup unit 4 and the light projecting unit 2 are fixedly installed so that the Z axis coincides with the rotation center of the fixed base, and the intersection of the laser slit light and the image axis is set to Z = 0. Note that the image passes through the center of the two-dimensional CCD device and
It is defined as an axis orthogonal to the V plane.

FIG. 5 is a diagram schematically showing the measurement procedure, and the measurement procedure will be described in detail here. Control unit 6
Outputs a rotation command to the pedestal rotation mechanism unit 5 via the pedestal rotation mechanism control unit 6.4, and the lead pins reach a predetermined angle at which the laser slit light becomes parallel to the lead pin row as shown in FIG. Rotate the fixed pedestal. After the above rotational positioning is completed, the control unit 6 outputs an imaging command via the imaging control unit 6.1, images the profile in which the slit light emitted by the light projecting unit 2 is reflected on the lead pin, and acquires the imaging information. After the input, this is held in the image memory section 6.2.

Next, the light cutting calculation unit 6.7 determines the laser slit based on the light cutting method based on the image pickup information held in the image memory unit and the geometrical relationship of the image pickup unit 4 and the light projecting unit 2 in the reference coordinate system. Height information on the irradiation line is calculated. Here, a height detection method in the reference coordinate system by the light cutting method will be described. In the reference coordinate system of FIG. 2, when the tilt angle of the laser slit light is φ with respect to the Z axis and the shift amount of the image axis in the X direction is Xa, reflection of the lead pin to be inspected and the laser slit light is performed. The point is (Xa + δx,
Y, δz). That is, the reflection point is displaced in the X direction with respect to the image axis by the following relationship depending on the height of the inspection target. δx = δz · tanφ Equation 1 On the other hand, the visual field in the V direction of the telecentric lens is Lv.
If the number of pixels in the V direction of the CCD element is Nv, the deviation amount ΔP of the light receiving center of the CCD element with respect to the image axis with respect to δx.
Can be expressed by ΔP = Nv · δx / Lv = Nv · δz · tan φ / Lv Equation 2. Therefore, it is possible to calculate the height of the inspection target in the reference coordinate system based on the relationship of δz = ΔP · Lv / (Nv · tanφ) Equation 3 from the amount of deviation ΔP of the imaged light receiving center with respect to the image axis.

Now, a method of calculating the light receiving center in the present inspection apparatus will be described. It can be assumed that the irradiated laser slit light is diffusely reflected due to the surface texture of the inspection target, and exhibits the distribution f (V) of received light shown in FIG. 6 around the irradiation point.
At this time, the light receiving center Pv

[Equation 1] Then, the light receiving center Pv can be calculated by performing an integral calculation from V = Va to Vb for a pixel having a predetermined density Vth or more of all the pixels in the V column. Here, if the image axis in the CCD element coordinate system is Vax, ΔP can be expressed by ΔP = Pv−Vax Equation 5, and by substituting the above equation into Equation 3, δz can be calculated. By performing the above operation for all V rows in the H direction, all heights δz on Xa + δx in the reference coordinate system can be calculated. The relationship between the H axis and the Y axis in the reference coordinate system is as follows. If the field of view in the H direction of the telecentric lens is LH and the number of pixels in the H direction of the CCD element is NH,
The pixel resolution RH in the Y direction can be expressed by RH = LH / NH Equation 6. Here, if the image axis in the CCD device coordinate system is Hax, the value of column H in the CCD device is Y = (H-Hax) .RH = (H-Hax). (LH / NH) in the reference coordinate system Y. It can be expressed by Equation 7.

Next, the control section 6 inputs the measured values of the three pedestal shake detection sensors and the rotation angle of the pedestal, and calculates the pedestal plane equation in the reference coordinate system by the following procedure. The mounting coordinates of the base shake detection sensor are (X0, Y0, Z00),
(X1, Y1, Z01), (X2, Y2, Z02) whose measured values are (X0, Y0, Z0), (X1, Y1, Z1), (X2,
Y2, Z2), the plane equation in the reference coordinate system that passes through three points is Z = α ・ X + β ・ Y + γ Equation 8

[Equation 2] Can be expressed as Therefore,

[Equation 3] Is obtained.

Here, as shown in FIG. 7, θY and θX are inclination angles around the X-axis and Y-axis of the pedestal coordinate system accompanying the pedestal rotation, and θz is the pedestal rotation angle. The coordinate conversion formula from (X, Y, Z) to the pedestal coordinate system (x, y, z) is

[Equation 4] Can be expressed as The measured values X and Z in the reference coordinate system in the equation are X≡Xa + δx Z≡δz according to the definition of FIG.

Based on the height information on the slit line coordinate-converted to the pedestal coordinate system by the above operation, the control unit 6 uses the lead pin coordinate calculation unit 6.8 to set the lead pin attachment coordinates and attachment in the following manner. Calculate the pitch. Figure 8
FIG. 4 is a conceptual diagram of height information on a laser slit line in a pedestal coordinate system. Based on the width of the lead pin and the mounting coordinate yi of the designed i-th plate with respect to the y-axis, z (yi)
To detect. At this time, for the purpose of reducing the error due to the variation of the data, centering on the design coordinate yi shown in FIG.
In the area of surrounding n pixels

[Equation 5] The averaging process of is executed. Also, x (yi) can be calculated by the same process. By performing the above operation for all the lead pins, the lead pin mounting coordinates can be calculated. Next, the lead pin coordinate calculation unit calculates the lead pin mounting pitch by the following method. FIG. 10 is a conceptual diagram for explaining the gravity center calculation process for calculating the lead pin pitch. In the area close to the design mounting coordinate yi, the section from the range ya to the range yb where the detected height is zth or more is defined as the integration range.

[Equation 6] The center of gravity in the y direction can be calculated by executing the calculation of.
By performing this calculation for all the lead pins, the mounting pitch λi can be calculated from λi≡Pi + 1−Pi formula 14. The above operation is performed four times for all lead pins, for example, an LSI having lead pins attached to four sides as shown in FIG. 4, so that individual lead pin attachment coordinates (x (y
i), yi, z (yi)) can be calculated.

Next, the lead pin flatness calculation unit 6.9 detects all the detected lead pin attachment coordinates (x (yi), y).
From i, z (yi)), the regression plane equation in the pedestal coordinate system is calculated using the least squares method. When the regression plane equation is defined as Ax + By + z + Γ = 0 Equation 15, the deviation εi of the i-th lead pin with respect to the equation is represented by εi (x, y, z) ≡A · x (yi) + B · yi + z (yi) + Γ Equation 16 be able to. Therefore, the square of the above deviation εi 2 = (A · x (yi) + B · yi + z (yi) + Γ) 2 Formula 17 is summed with the total number n of lead pins.

[Equation 7] As an evaluation function,

[Equation 8] Calculate A, B, and Γ such that Regression plane Ax + By + z + .GAMMA. = 0 calculated by the above-described processing. Individual lead pin mounting coordinates (x (yi), y
deviation of i, z (yi)) in the z direction εi εi (x, y, z) ≡A · x (yi) + B · yi + z (yi) + Γ The difference T T between the maximum value εmax and the minimum value εmin of Equation 21 The flatness of the lead pin in the pedestal coordinate system can be detected by defining the ≡εmax-εmin formula 22 as flatness and calculating it. Also, the standard deviation σ of each lead pin with respect to the regression plane is

[Equation 9] It can be calculated by performing the calculation.

Next, the judgment calculation unit 6.10 determines whether the flatness T of the detected lead pins is a predetermined tolerance Tth, the standard deviation σ is a predetermined tolerance σth, or all the lead pin pitches λi are predetermined tolerances. It is determined whether or not λth. T ≦ Tth Expression 24 σ ≦ σth Expression 25 λi ≦ λth Expression 26 That is, in the flatness and standard deviation evaluation expressions 24 and 25, when the above expressions are true, it is determined to be normal, and otherwise is determined to be abnormal. In addition, the lead pin pitch evaluation formula 2
In No. 6, when the above formula is true for all the lead pin numbers n, it is judged to be normal, and the others are judged to be abnormal.

Next, the display section 6.11 displays and outputs the above determination result and the measurement result in the pedestal coordinate system.

[0028]

As described above, according to the lead pin pitch / flatness inspection apparatus using the two-dimensional laser displacement sensor according to the present invention, it is possible to perform a moving stroke for measurement without performing a moving stroke.
Using a two-dimensional laser displacement sensor composed of a light emitting unit that emits a laser slit light obliquely mounted, a telecentric lens, and a two-dimensional CCD element, the mounting coordinates and mounting pitch of the lead pins are detected in one image pickup. The tilt of the fixed base plane with respect to the reference coordinates is detected by measuring the deflection of the fixed base that rotates with the rotating mechanism at three points, and by offsetting this from the measured value, the lead pin mounting coordinates and mounting can be performed with high accuracy and high speed. Pitch and flatness measurements can be made.

[Brief description of drawings]

FIG. 1 is a configuration diagram clearly showing the entire lead pin pitch / flatness inspection device using a two-dimensional laser displacement sensor according to the present invention.

FIG. 2 is a configuration diagram illustrating the definition of a reference coordinate system.

FIG. 3 is a configuration diagram illustrating the definition of a pedestal coordinate system.

FIG. 4 is an explanatory diagram showing irradiation positions of laser slit light.

FIG. 5 is a flow chart illustrating a measurement procedure according to the present invention.

FIG. 6 is an explanatory diagram showing a distribution of laser reflection intensity.

FIG. 7 is an explanatory diagram of a large plane equation in a reference coordinate system.

FIG. 8 is a conceptual diagram of height information on a laser slit line in a pedestal coordinate system.

FIG. 9 is a conceptual diagram illustrating an averaging process when a lead pin height is detected.

FIG. 10 is a conceptual diagram illustrating a center of gravity calculation process for calculating a lead pin pitch.

[Explanation of symbols]

1 fixed pedestal 1.1 Electronic components 1.2 Lead pin 2 Projector 3 Large seat shake detection sensor 4 Imaging unit 4.1 Two-dimensional CCD device 4.2 Telecentrinos lens 5 Large seat rotation mechanism 5.1 Rotational drive 5.2 Pulse generator 6 control unit 6.1 Imaging control unit 6.2 Image memory section 6.3 Pedestal runout detector 6.4 Pedestal rotation mechanism control unit 6.5 Pedestal rotation angle detector 6.6 Coordinate conversion calculation unit 6.7 Optical disconnection calculation unit 6.8 Lead pin coordinate calculation unit 6.9 Lead pin flatness calculator 6.10 Judgment calculation unit

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Togo Ito             26-9 Tobuei, Ibukino, Midori-ku, Yokohama-shi, Kanagawa             Electric Industry Co., Ltd. F-term (reference) 2F065 AA02 AA03 AA04 AA06 AA07                       AA17 AA20 AA22 AA24 AA35                       CC25 DD06 FF01 FF02 FF04                       FF09 FF42 FF65 FF67 GG04                       HH05 HH12 JJ03 JJ26 LL04                       LL59 PP13 QQ03 QQ13 QQ14                       QQ18 QQ21 QQ24 QQ28 QQ41                       QQ42 RR05                 5F067 AA10 AA12 AA19 AB03 DB10

Claims (7)

[Claims] 1. The fixed pedestal is rotated at a predetermined angle,
Laser slit light is obliquely applied to the outer surface of the lead pin attached to the fixed pedestal to capture an image of this line-shaped reflection profile, and an image axis and a reference coordinate system defined in the two-dimensional CCD device are obtained from the captured image. The height information on the slit light irradiation line at (X, Y, Z) is detected based on the light cutting method, and the vertical shake of the fixed pedestal due to rotation is detected by at least three pedestal shake detection sensors. Then, the height information on the slit light irradiation line in the reference coordinate system (X, Y, Z) is defined as the fixed pedestal coordinate system (x in the pedestal coordinate system (x , Y, z) to convert the lead pin mounting coordinates, mounting pitch, and flatness in the pedestal coordinate system to determine whether or not these calculated values are within a predetermined tolerance range. There A light projecting unit for irradiating the above-mentioned lead pin with laser slit light, a set of a light projecting unit consisting of a two-dimensional CCD element and a telecentric lens for imaging the reflection profile of the lead pin reflected by this laser slit light, and a fixed pedestal are provided. And a means for rotating the image pickup information in an image memory, and based on the optical cutting method, the image axis direction is the Z axis, the V direction and the H direction of the two-dimensional CCD device are the X axis and the Y direction, respectively. A means for calculating the height information in the reference coordinate system defined as an axis, a means for detecting the amount of vertical shake of the fixed pedestal due to rotation with at least three pedestal shake detection sensors, and a rotation angle of the fixed pedestal. A pedestal coordinate system (x, y, which defines height information on the slit light irradiation line in the reference coordinate system (X, Y, Z) as a fixed pedestal from the three pedestal deflection amounts.
z), coordinate conversion means, means for calculating lead pin mounting coordinates, mounting pitch, and flatness in the pedestal coordinate system, and means for determining whether the calculated values are within a predetermined tolerance range. Lead pin pitch / flatness inspection device with a two-dimensional laser displacement sensor. 2. A combination of a projection unit for irradiating laser slit light, a telecentric lens, and a two-dimensional CCD element makes the image axis direction the Z axis, the V direction of the two-dimensional CCD element, the H direction the X axis, and the Y direction, respectively. A reference coordinate system (X, Y, Z) defined as an axis is provided with a calculation unit that calculates distance information of a line-shaped section irradiated by the light projecting unit in one imaging by distance measurement calculation based on the light section method. The lead pin pitch / flatness inspection device using the two-dimensional laser displacement sensor according to claim 1. 3. The lead pin pitch / flatness inspection apparatus according to claim 1, further comprising means for rotating the fixed base at a predetermined angle. 4. The angle after the rotary positioning of the pedestal is detected, and then the deflection amount in the vertical direction of the fixed pedestal after the rotational positioning is set to 3.
The pedestal plane equation in the reference coordinate system (X, Y, Z) was calculated from the three sets of detected shake amounts and the detected pedestal rotation angle, and the relation between the calculated plane equation and the angle after pedestal rotation positioning 2. The means for converting the height information on the slit light irradiation line detected in the reference coordinate system to the pedestal coordinate system (x, y, z) defined on the fixed pedestal, according to claim 1. Lead pin pitch / flatness inspection device with a two-dimensional laser displacement sensor. 5. The device according to claim 1, further comprising means for detecting the mounting coordinates of the lead pin from the height information on the slit light irradiation line coordinate-converted into the pedestal coordinate system (x, y, z). 3D laser displacement sensor lead pin pitch / flatness inspection device. 6. The regression plane equation of the lead pin is calculated from all the lead pin mounting coordinates in the pedestal coordinate system (x, y, z) by using the least squares method, and the plane of the lead pin is calculated from the plane equation and individual lead pin mounting coordinates. 3. A means for calculating a standard deviation of a degree and a mounting coordinate, and a lead pin mounting pitch.
A lead pin pitch / flatness inspection device using the two-dimensional laser displacement sensor according to 3, 4, or 5. 7. The calculation unit for determining whether or not the calculated flatness, mounting height, and mounting pitch of the lead pins are within predetermined preset tolerances. A lead pin pitch / flatness inspection device using the two-dimensional laser displacement sensor according to item 5 or 6.