TW202122744A - Thickness measuring method and system of PCB capable of improving the degree of precision for subsequent drillings by conducting thickness measurements on multiple locations of the PCB - Google Patents

Thickness measuring method and system of PCB capable of improving the degree of precision for subsequent drillings by conducting thickness measurements on multiple locations of the PCB Download PDF

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TW202122744A
TW202122744A TW108145794A TW108145794A TW202122744A TW 202122744 A TW202122744 A TW 202122744A TW 108145794 A TW108145794 A TW 108145794A TW 108145794 A TW108145794 A TW 108145794A TW 202122744 A TW202122744 A TW 202122744A
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circuit board
image
thickness
simulation
drilled
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TWI710747B (en
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郭進順
張家齊
林彥伶
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大陸商萬潤科技精機(昆山)有限公司
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Abstract

Disclosed is a thickness measuring method for PCB, including: providing a PCB under drilling and acquiring a pattern of the PCB; providing a simulated pattern under drilling that has arranged with a hole location design ; using an image processing device to align the simulated pattern under drilling with the pattern of the PCB; dividing the simulated pattern under drilling into a plurality of simulated zones under testing based on the hole location design; dividing the pattern of the PCB into a number of zones under testing based on the simulated zones under testing; and using a thickness measuring device to conduct thickness measurements on the PCB based on the simulated zones under testing. Additionally, the disclosed also provides a thickness measuring system for PCB. The disclosed is able to improve the degree of precision for subsequent drillings by conducting thickness measurements on multiple locations of the PCB.

Description

電路板的厚度量測方法及厚度量測系統Circuit board thickness measurement method and thickness measurement system

本發明是有關於一種量測方法，特別是指一種電路板的厚度量測方法，及一種厚度量測系統。The invention relates to a measuring method, in particular to a method for measuring the thickness of a circuit board, and a thickness measuring system.

目前用於與數個電子元件的支腳焊接的印刷電路板，通常包括一絕緣板材，及一以金屬為製成材料並形成於該絕緣板材表面或該絕緣板材中的電路層。該印刷電路板在與該等電子元件焊接之前，需要先量測該印刷電路板的厚度，再依據所量測的厚度，於一鑽孔裝置上設定合適的控制參數後，再利用該鑽孔裝置於該印刷電路板鑽設數個後續供該等支腳能穿設的貫孔，使該等電子元件能與該印刷電路板焊接。The printed circuit boards currently used for soldering with the legs of several electronic components usually include an insulating plate and a circuit layer made of metal and formed on the surface of the insulating plate or in the insulating plate. Before the printed circuit board is soldered with the electronic components, the thickness of the printed circuit board needs to be measured, and then appropriate control parameters are set on a drilling device according to the measured thickness, and then the drilling is used The device drills a plurality of through holes in the printed circuit board for the supporting legs to pass through, so that the electronic components can be welded with the printed circuit board.

然而，由於該印刷電路板的電路層並非整面性地形成於該絕緣板材，而是依據所需的電路設計佈線於該絕緣板材；因此，該印刷電路板在微觀尺寸上，不同區域的厚度會有些微的差異，導致利用該鑽孔裝置所形成的所述貫孔的精確度不佳。However, since the circuit layer of the printed circuit board is not formed on the insulating plate over the entire surface, it is wired on the insulating plate according to the required circuit design; therefore, the printed circuit board has different thicknesses in different areas in terms of microscopic dimensions. There will be some slight differences, resulting in poor accuracy of the through holes formed by the drilling device.

因此，本發明之其中一目的，即在提供一種至少能夠克服先前技術的缺點的電路板的厚度量測方法。Therefore, one of the objectives of the present invention is to provide a circuit board thickness measurement method that can at least overcome the disadvantages of the prior art.

於是，本發明電路板的厚度量測方法，包含：利用一攝像裝置，提供一待鑽孔的電路板，並取得該電路板的電路板圖像；利用一影像處理裝置，提供一待鑽孔模擬圖像，該待鑽孔模擬圖像佈設有一孔位設計圖案；利用該影像處理裝置，將該待鑽孔模擬圖像對應至該電路板圖像；利用該影像處理裝置，依據該待鑽孔模擬圖像的該孔位設計圖案，將該待鑽孔模擬圖像區分為多個待測模擬區，並依據該等待測模擬區，將該電路板圖像區分為多個待測區；及利用一厚度量測裝置，依據該電路板圖像的該等待測區，對該電路板進行厚度量測。Therefore, the method for measuring the thickness of a circuit board of the present invention includes: using a camera device to provide a circuit board to be drilled, and obtaining a circuit board image of the circuit board; using an image processing device to provide a circuit board to be drilled A simulation image, the simulation image to be drilled is arranged with a hole design pattern; the image processing device is used to correspond the simulation image to be drilled to the circuit board image; the image processing device is used according to the to be drilled According to the hole position design pattern of the hole simulation image, the simulation image to be drilled is divided into multiple simulation areas to be tested, and the circuit board image is divided into multiple simulation areas to be tested according to the simulation area waiting to be tested; And using a thickness measuring device to measure the thickness of the circuit board according to the waiting area of the circuit board image.

因此，本發明之另一目的，即在提供一種至少能夠克服先前技術的缺點的用於量測電路板的厚度量測系統，該厚度量測系統用以進行上述之電路板的厚度量測方法。Therefore, another object of the present invention is to provide a thickness measurement system for measuring circuit boards that can at least overcome the disadvantages of the prior art, and the thickness measurement system is used to perform the above-mentioned circuit board thickness measurement method .

本發明之功效在於：利用該欲鑽孔模擬圖像區分為該等待測模擬區域的設計，量測該電路板對應該等待測區的位置的厚度，以獲得該電路板在對應該等待測區的多個厚度值，有效提升後續鑽孔的精確程度。The effect of the present invention is to use the design of the simulated image to be drilled to be divided into the waiting-for-measurement simulation area to measure the thickness of the circuit board at the position of the waiting-for-measurement area, so as to obtain that the circuit board is in the waiting-for-measurement area. The multiple thickness values of, effectively improve the accuracy of subsequent drilling.

在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

參閱圖1與圖3，本發明一用於量測一待鑽孔的電路板1的厚度量測系統2的一實施例，適用於進行該電路板1的厚度量測。Referring to FIGS. 1 and 3, an embodiment of the thickness measurement system 2 for measuring a circuit board 1 to be drilled according to the present invention is suitable for measuring the thickness of the circuit board 1.

該厚度量測系統2設有一個用以使該電路板1位於一預定位置固定夾持並用以拍攝以取得該電路板1的電路板圖像3的攝像裝置21、一與該攝像裝置21訊號連接且用以提供一模擬影像並用以處理數個影像的影像處理裝置22，及一與該影像處理裝置22訊號連接並用以量測該電路板1的預定位置之厚度的厚度量測裝置23。The thickness measurement system 2 is provided with a camera device 21 for positioning the circuit board 1 at a predetermined position and holding it fixedly and for taking pictures to obtain the circuit board image 3 of the circuit board 1, and a signal with the camera device 21 An image processing device 22 connected and used to provide an analog image and used to process a plurality of images, and a thickness measuring device 23 signally connected to the image processing device 22 and used to measure the thickness of a predetermined position of the circuit board 1.

該攝像裝置21設有一具有一用於夾持並固定該電路板1的夾持器211，及一位於該夾持器211上方並用於拍攝該電路板1的攝像器212。該影像處理裝置22設有一用於對影像資料進行分析、加工與運算(例如：降噪、影像融合、影像編輯……等)的處理器221，及一用於顯示所述影像的顯示單元222。該厚度量測裝置23與該影像處理裝置22訊號連接，並用於依據該影像處理裝置22所處理的影像資料，量測該電路板1的預定位置的厚度。於本實施例中，該顯示單元222為一顯示器；該厚度量測裝置23為一設置於該電路板1之二相反面的例如光學測距器的非接觸式測距器。The camera device 21 is provided with a holder 211 for holding and fixing the circuit board 1, and a camera 212 located above the holder 211 and used for photographing the circuit board 1. The image processing device 22 is provided with a processor 221 for analyzing, processing, and computing image data (for example, noise reduction, image fusion, image editing, etc.), and a display unit 222 for displaying the image . The thickness measuring device 23 is signally connected to the image processing device 22 and used for measuring the thickness of the predetermined position of the circuit board 1 according to the image data processed by the image processing device 22. In this embodiment, the display unit 222 is a display; the thickness measuring device 23 is a non-contact distance measuring device, such as an optical distance measuring device, arranged on the opposite side of the circuit board 1.

於本實施例的其他變化態樣中，該厚度量測裝置23為一設置於該電路板1之二相反面的例如伸縮探針的接觸式測距器。In other variations of this embodiment, the thickness measuring device 23 is a contact type rangefinder, such as a telescopic probe, which is disposed on the two opposite sides of the circuit board 1.

參閱圖1與圖2，本發明利用該厚度量測系統以進行該電路板1的厚度量測方法的一實施例，如下說明：1 and FIG. 2, the present invention uses the thickness measurement system to perform an embodiment of the thickness measurement method of the circuit board 1, as described below:

參閱圖3至圖5，利用該攝像裝置21的夾持器211，使一待鑽孔的電路板1在該預定位置被定位夾持，並利用該攝像裝置21的攝像器212，拍攝該電路板1，以取得該電路板1的電路板圖像3，再使該電路板圖像3傳送並儲存於該影像處理裝置22。該電路板1呈長方形，且具有一正面11，及三個位於該正面11的其中三個角落且分別呈「十」字圖案的實體標記12，並設有一絕緣板材13，及一由金屬材料製成並形成於該絕緣板材13表面，及/或該絕緣板材13中的電路佈線層(圖未示出)。藉由該電路板1之所述實體標記12的設計，該電路板圖像3也具有三個分別對應該等實體標記12的標記圖像31。Referring to FIGS. 3 to 5, the clamper 211 of the camera device 21 is used to position and clamp a circuit board 1 to be drilled at the predetermined position, and the camera 212 of the camera device 21 is used to photograph the circuit The board 1 is used to obtain the circuit board image 3 of the circuit board 1, and then the circuit board image 3 is transmitted and stored in the image processing device 22. The circuit board 1 is rectangular, and has a front surface 11, and three physical marks 12 located at three corners of the front surface 11 and each in a "cross" pattern, and is provided with an insulating plate 13 and a metal material It is made and formed on the surface of the insulating plate 13 and/or the circuit wiring layer in the insulating plate 13 (not shown in the figure). With the design of the physical mark 12 of the circuit board 1, the circuit board image 3 also has three mark images 31 corresponding to the physical marks 12 respectively.

參閱圖1、圖3、圖5，利用該影像處理裝置22的處理器221，提供一待鑽孔模擬圖像4，並顯示於該影像處理裝置22的顯示單元222。該待鑽孔模擬圖像4具有一圍繞成一長方形的邊界41，及三個位於該邊界41內的模擬標記42，並佈設有一具有多個模擬孔位431的孔位設計圖案43。該孔位設計圖案43的模擬孔位431是模擬該電路板1後續欲鑽孔的相對位置，且該待鑽孔模擬圖像4的尺寸可在縮小或放大一預定比例之後，與該電路板1上欲鑽孔的位置符合。於本實施例中，該等模擬孔位431為不均勻分佈；例如，該等模擬孔位431的其中一部分呈疏密不均之不規則的分布，另一部分則排列為單排或多排。每一模擬孔位431的形狀與尺寸不限制為一致，而能為圓形、楕圓形、多邊形……等。1, 3, and 5, the processor 221 of the image processing device 22 is used to provide a simulation image 4 to be drilled and displayed on the display unit 222 of the image processing device 22. The simulation image 4 to be drilled has a boundary 41 surrounding a rectangle, and three simulation marks 42 located in the boundary 41, and a hole design pattern 43 with a plurality of simulated holes 431 is arranged. The simulated hole 431 of the hole design pattern 43 simulates the relative position of the circuit board 1 to be drilled later, and the size of the simulated image 4 to be drilled can be reduced or enlarged by a predetermined ratio and compared with that of the circuit board. 1 The position to be drilled on is in accordance with. In this embodiment, the simulated holes 431 are unevenly distributed; for example, a part of the simulated holes 431 is unevenly distributed with uneven density, and the other part is arranged in a single row or multiple rows. The shape and size of each simulated hole 431 are not limited to be consistent, but can be circular, elliptical, polygon... etc.

需說明的是，也可先提供該待鑽孔模擬圖像4，再取得該電路板圖像3；或同時提供該待鑽孔模擬圖像4與取得該電路板圖像3。It should be noted that the simulation image 4 to be drilled can also be provided first, and then the circuit board image 3 is obtained; or the simulation image 4 to be drilled and the circuit board image 3 are obtained at the same time.

而後，利用該影像處理裝置22，使該等模擬標記42分別對應該等標記圖像31，而將該待鑽孔模擬圖像4與該電路板圖像3對應。具體地，該電路板圖像3與該待鑽孔模擬圖像4顯示於該影像處理裝置22的該顯示單元222；並利用該處理器221，使該待鑽孔模擬圖像4放大或縮小一預定比例之後，使該待鑽孔模擬圖像4的該等模擬標記42與該電路板圖像3的該等標記圖像31分別重疊，並使該待鑽孔模擬圖像4的邊界41對應該電路板圖像3的輪廓32，使得該待鑽孔模擬圖像4對應至該電路板圖像3，而完成該待鑽孔模擬圖像4與該電路板圖像3的對位，且在該顯示單元222顯示出該電路板圖像3與該待鑽孔模擬圖像4的對位過程。Then, the image processing device 22 is used to make the simulation marks 42 correspond to the mark images 31 respectively, and the simulation image 4 to be drilled corresponds to the circuit board image 3. Specifically, the circuit board image 3 and the to-be-drilled simulation image 4 are displayed on the display unit 222 of the image processing device 22; and the processor 221 is used to enlarge or reduce the to-be-drilled simulation image 4 After a predetermined ratio, the simulation marks 42 of the simulation image 4 to be drilled are overlapped with the mark images 31 of the circuit board image 3, and the boundary 41 of the simulation image 4 to be drilled is overlapped. Corresponding to the contour 32 of the circuit board image 3, so that the to-be-drilled simulation image 4 corresponds to the circuit board image 3, and the alignment of the to-be-drilled simulation image 4 and the circuit board image 3 is completed, In addition, the alignment process of the circuit board image 3 and the simulation image 4 to be drilled is displayed on the display unit 222.

參閱圖1、圖6，接著，利用該影像處理裝置22，依據該待鑽孔模擬圖像4的該孔位設計圖案43，使該待鑽孔模擬圖像4區分為多個供該等模擬孔位431分佈的待測模擬區432，並依據該等待測模擬區432，使該電路板圖像3區分為多個待測區33。具體地，利用該處理器221，使該待鑽孔模擬圖像4的邊界41所圈圍出的區域劃分為呈矩陣形式排列的該等待測模擬區432；參閱圖1、圖7、圖8，再利用該處理器221，使每一待測模擬區432形成有一依據該待測模擬區432內的模擬孔位431的分佈情況來決定的待測模擬點433後，再使該電路板圖像3的所述待測區33形成有多個分別對應該等待測模擬點433的待測點331。因此，該電路板圖像3的每一待測區33形成所述該待測點331，且該等待測區33的待測點331分別對應該等待測模擬區432的待測模擬點433。Referring to Figures 1 and 6, then, using the image processing device 22, according to the hole design pattern 43 of the to-be-drilled simulation image 4, the to-be-drilled simulation image 4 is divided into a plurality of for the simulation The simulation area 432 to be tested is distributed with the holes 431, and the circuit board image 3 is divided into a plurality of test areas 33 according to the simulation area to be tested 432. Specifically, the processor 221 is used to divide the area enclosed by the boundary 41 of the to-be-drilled simulation image 4 into the waiting-for-test simulation area 432 arranged in a matrix; refer to FIG. 1, FIG. 7, and FIG. 8. , And then use the processor 221 to make each simulated area to be tested 432 form a simulated point to be tested 433 determined according to the distribution of the simulated holes 431 in the simulated area to be tested 432, and then make the circuit board diagram The to-be-tested area 33 shown in Fig. 3 is formed with a plurality of to-be-tested points 331 corresponding to the simulated points to be tested 433 respectively. Therefore, each test area 33 of the circuit board image 3 forms the test point 331, and the test point 331 of the waiting test area 33 corresponds to the test simulation point 433 of the test simulation area 432 respectively.

參閱圖6至圖8，具體而言，每一待測模擬區432的待測模擬點433的位置即為該待測模擬區432內的所述模擬孔位431的一重心。以座標的形式來說明，在界定該待鑽孔模擬圖像4之邊界41的左下角落的座標為(0,0)的情況下，每一模擬孔位431的位置都可以座標表示，當第m個待測模擬區432中的模擬孔位431的數量為n個時，m為正整數，n為不小於0的整數；其中，在第m個待測模擬區432中，第i個模擬孔位431的位置以座標(xmi,ymi)表示，第i個模擬孔位431的面積為Ami平方單位，0>i≦n，則第m個待測模擬區432的該重心(也就是該待測模擬點433)具有一座標(Xm,Ym)，該座標(Xm,Ym)的計算方式為：

Figure 02_image001
。因此，第1個待測模擬區432的待測模擬點433的座標 (X1,Y1)=(
Figure 02_image003
)，第2個待測模擬區432的待測模擬點433的座標(X2,Y2)=(
Figure 02_image005
)，第3個待測模擬區432的待測模擬點433的座標(X3,Y3)=(
Figure 02_image007
)，以此類推至最後一個待測模擬區432的待測模擬點433。Referring to FIGS. 6 to 8, specifically, the position of the simulated point to be tested 433 of each simulated area to be tested 432 is a center of gravity of the simulated hole 431 in the simulated area to be tested 432. To illustrate in the form of coordinates, when the coordinates defining the lower left corner of the boundary 41 of the simulated image 4 to be drilled are (0, 0), the position of each simulated hole 431 can be represented by coordinates. When the number of simulation holes 431 in the m simulation areas 432 to be tested is n, m is a positive integer and n is an integer not less than 0; among them, in the m simulation area 432 to be tested, the i-th simulation The position of the hole 431 is represented by coordinates (xmi, ymi), the area of the i-th simulated hole 431 is Ami square unit, 0>i≦n, then the center of gravity of the m-th simulated area 432 to be tested (that is, the The simulated point to be tested 433) has a mark (Xm, Ym), and the calculation method of the coordinate (Xm, Ym) is:
Figure 02_image001
. Therefore, the coordinates (X1, Y1) of the simulated point 433 to be tested in the first simulated area to be tested 432 (X1, Y1)=(
Figure 02_image003
), the coordinates (X2, Y2) of the simulated point to be tested 433 in the second simulated area to be tested 432 (X2, Y2)=(
Figure 02_image005
), the coordinates (X3, Y3) of the simulation point 433 to be tested in the third simulation area 432 to be tested (X3, Y3)=(
Figure 02_image007
), and so on to the simulation point 433 to be tested in the last simulation area 432 to be tested.

參閱圖1、圖7，需說明的是，在本實施例的其他變化態樣中，也能先利用該影像處理裝置22的該處理器221取得該等待測模擬區432的待測模擬點433之後，再使該待鑽孔模擬圖像4與該電路板圖像3對應，使該電路板圖像3對應形成有對應該等測測模擬點的待測點331。Referring to FIGS. 1 and 7, it should be noted that in other variations of this embodiment, the processor 221 of the image processing device 22 can also be used to obtain the simulated points 433 to be tested in the simulated waiting area 432. After that, the simulation image 4 to be drilled is corresponding to the circuit board image 3, and the circuit board image 3 is correspondingly formed with the test points 331 corresponding to the test simulation points.

參閱圖1、圖7、圖9，最後，利用該影像處理裝置22與該厚度量測裝置23，依據該電路板圖像3的該等待測區33，對該電路板1進行厚度量測。具體地，該厚度量測裝置23依據該等待測點331，對該電路板1之對應該等待測點331的位置進行厚度量測。該厚度量測裝置23為設置於該電路板1二相反面之該非接觸式測距器。Referring to FIGS. 1, 7, and 9, finally, the image processing device 22 and the thickness measuring device 23 are used to measure the thickness of the circuit board 1 according to the waiting area 33 of the circuit board image 3. Specifically, the thickness measuring device 23 measures the thickness of the position of the circuit board 1 corresponding to the waiting point 331 according to the waiting point 331. The thickness measuring device 23 is the non-contact distance measuring device installed on two opposite sides of the circuit board 1.

參閱圖10，於本實施例的其他變化態樣中，是利用該接觸式測距器作為該厚度量測裝置23，量測該電路板1的厚度。Referring to FIG. 10, in another variation of this embodiment, the contact type distance meter is used as the thickness measuring device 23 to measure the thickness of the circuit board 1.

綜上所述，本發明厚度量測方法，利用該欲鑽孔模擬圖像的該等待測模擬區432域的設計，量測該電路板1之多個分別對應該等待測點331的位置的厚度，以獲得該電路板1之各個區域之相對精確的厚度值，有效提升後續鑽孔的精確程度，故確實能達成本發明之目的。In summary, the thickness measurement method of the present invention utilizes the design of the waiting-for-measurement simulation area 432 of the simulation image to be drilled to measure the positions of the circuit board 1 corresponding to the waiting-for-measurement points 331. Thickness to obtain a relatively accurate thickness value of each area of the circuit board 1 and effectively improve the accuracy of subsequent drilling, so the purpose of the invention can be achieved.

惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

1:電路板 11:正面 12:實體標記 13:絕緣板材 2:厚度量測系統 21:攝像裝置 211:夾持器 212:攝像器 22:影像處理裝置 221:處理器 222:顯示器 23:厚度量測裝置 3:電路板圖像 31:標記圖像 32:輪廓 33:待測區 331:待測點 4:待鑽孔模擬圖像 41:邊界 42:模擬標記 43:孔位設計圖案 431:模擬孔位 432:待測模擬區 433:待測模擬點1: circuit board 11: front 12: Entity Marking 13: Insulating sheet 2: Thickness measurement system 21: camera device 211: gripper 212: Camera 22: Image processing device 221: processor 222: display 23: Thickness measuring device 3: Circuit board image 31: Mark the image 32: Contour 33: Area to be tested 331: point to be measured 4: Simulation image to be drilled 41: Border 42: analog mark 43: Hole design pattern 431: Simulated hole position 432: Simulation area to be tested 433: Analog point to be tested

本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是一示意圖，說明本發明一厚度量測系統； 圖2是一流程圖，說明本發明一電路板的厚度量測方法的一實施例； 圖3是一俯視示意圖，說明一待鑽孔的電路板； 圖4是一側視示意圖，說明利用一攝像器，取得該電路板的一電路板圖像； 圖5是一示意圖，說明一待鑽孔模擬圖像與該電路板圖像對應； 圖6是一示意圖，說明該待鑽孔模擬圖像區分為多個待測模擬區； 圖7是一示意圖，說明該等待測模擬區的其中一個； 圖8是一示意圖，說明該等待測模擬區的其中另一個； 圖9是一側視示意圖，說明利用一非接觸式測距器量測該電路板的厚度；及 圖10是一側視示意圖，說明利用一接觸式測距器量測該電路板的厚度。Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a schematic diagram illustrating a thickness measurement system of the present invention; 2 is a flowchart illustrating an embodiment of a method for measuring the thickness of a circuit board of the present invention; Figure 3 is a schematic top view illustrating a circuit board to be drilled; 4 is a schematic side view illustrating the use of a camera to obtain a circuit board image of the circuit board; FIG. 5 is a schematic diagram illustrating that a simulated image to be drilled corresponds to the image of the circuit board; Fig. 6 is a schematic diagram illustrating that the simulation image to be drilled is divided into multiple simulation areas to be tested; Figure 7 is a schematic diagram illustrating one of the waiting test simulation areas; Figure 8 is a schematic diagram illustrating another of the waiting test simulation areas; Figure 9 is a schematic side view illustrating the use of a non-contact distance measuring device to measure the thickness of the circuit board; and FIG. 10 is a schematic side view illustrating the use of a contact type distance measuring device to measure the thickness of the circuit board.

Claims (11)

一種電路板的厚度量測方法，包含： 提供一待鑽孔的電路板，並取得該電路板的電路板圖像； 提供一待鑽孔模擬圖像，該待鑽孔模擬圖像佈設有一孔位設計圖案； 利用一影像處理裝置，將該待鑽孔模擬圖像對應至該電路板圖像； 利用該影像處理裝置，依據該待鑽孔模擬圖像的該孔位設計圖案，將該待鑽孔模擬圖像區分為多個待測模擬區，並依據該等待測模擬區，將該電路板圖像區分為多個待測區；及 利用一厚度量測裝置，依據該電路板圖像的該等待測區，對該電路板進行厚度量測。A method for measuring the thickness of a circuit board, including: Provide a circuit board to be drilled, and obtain the circuit board image of the circuit board; Provide a simulation image to be drilled, and the simulation image to be drilled is arranged with a hole position design pattern; Using an image processing device to map the to-be-drilled simulation image to the circuit board image; Using the image processing device, according to the hole design pattern of the to-be-drilled simulation image, the to-be-drilled simulation image is divided into a plurality of simulation areas to be tested, and according to the simulation area to be tested, the circuit board The image is divided into multiple areas to be tested; and A thickness measuring device is used to measure the thickness of the circuit board according to the waiting area of the circuit board image. 如請求項1所述的電路板的厚度量測方法，其中，該待鑽孔模擬圖像包括一與該電路板圖像的輪廓對應的邊界，該邊界所圈圍出的區域被劃分為該等待測模擬區。The method for measuring the thickness of a circuit board according to claim 1, wherein the simulation image to be drilled includes a boundary corresponding to the outline of the circuit board image, and the area enclosed by the boundary is divided into the Waiting to test the simulation area. 如請求項1所述的電路板的厚度量測方法，其中，該待鑽孔模擬圖像的該等待測模擬區呈矩陣形式排列。The method for measuring the thickness of a circuit board according to claim 1, wherein the waiting simulation area of the simulation image to be drilled is arranged in a matrix form. 如請求項1所述的電路板的厚度量測方法，其中，該電路板圖像的每一待測區形成有一待測點，該厚度量測裝置依據該等待測點，對該電路板之對應該等待測點的位置進行厚度量測。The method for measuring the thickness of a circuit board according to claim 1, wherein each area to be measured of the circuit board image is formed with a point to be measured, and the thickness measuring device determines the thickness of the circuit board according to the waiting point. The thickness measurement is performed on the position where the measuring point should be waited for. 如請求項4所述的電路板的厚度量測方法，其中，該待鑽孔模擬圖像的該孔位設計圖案具有多個分佈於該等待測模擬區的模擬孔位，每一待測模擬區形成有一依據該待測模擬區內的模擬孔位的分佈情況來決定的待測模擬點，該等待測模擬點分別與該電路板圖像的該等待測點對應。The method for measuring the thickness of a circuit board according to claim 4, wherein the hole design pattern of the simulation image to be drilled has a plurality of simulation holes distributed in the simulation area to be tested, and each simulation to be tested The area is formed with an analog point to be tested determined according to the distribution of the analog hole positions in the analog area to be tested, and the analog point to be tested corresponds to the point to be tested in the circuit board image respectively. 如請求項5所述的電路板的厚度量測方法，其中，每一待測模擬區的待測模擬點的位置是位於該待測模擬區內的所述模擬孔位的重心。The method for measuring the thickness of a circuit board according to claim 5, wherein the position of the simulated point to be measured in each simulated area to be measured is the center of gravity of the simulated hole in the simulated area to be measured. 如請求項1所述的電路板的厚度量測方法，其中，該電路板具有多個實體標記，使該電路板圖像形成有多個分別對應該等實體標記的標記圖像，該待鑽孔模擬圖像還具有多個模擬標記，利用該等模擬標記分別對應該等標記圖像，而將該待鑽孔模擬圖像與該電路板圖像對應。The method for measuring the thickness of a circuit board according to claim 1, wherein the circuit board has a plurality of physical marks, so that the circuit board image is formed with a plurality of mark images corresponding to the physical marks, and the to-be-drilled The hole simulation image also has a plurality of simulation marks, and the simulation marks are used to respectively correspond to the mark images, and the simulation image to be drilled corresponds to the circuit board image. 如請求項7所述的電路板的厚度量測方法，其中，該電路板圖像與該待鑽孔模擬圖像顯示於該影像處理裝置的一顯示單元，並在該顯示單元顯示出該電路板圖像與該待鑽孔模擬圖像進行對位。The method for measuring the thickness of a circuit board according to claim 7, wherein the circuit board image and the simulation image to be drilled are displayed on a display unit of the image processing device, and the circuit is displayed on the display unit The board image is aligned with the simulated image to be drilled. 如請求項1所述的電路板的厚度量測方法，其中，該厚度量測裝置為一設置於該電路板兩相反面之非接觸式測距器。The method for measuring the thickness of a circuit board according to claim 1, wherein the thickness measuring device is a non-contact distance measuring device arranged on two opposite sides of the circuit board. 如請求項1所述的電路板的厚度量測方法，其中，該厚度量測裝置為一設置於該電路板兩相反面之接觸式測距器。The method for measuring the thickness of a circuit board according to claim 1, wherein the thickness measuring device is a contact type distance meter arranged on two opposite sides of the circuit board. 一種用於量測電路板的厚度量測系統，用以進行請求項1至10的其中一項所述之電路板的厚度量測方法。A system for measuring the thickness of a circuit board, which is used to measure the thickness of the circuit board according to one of claims 1 to 10.
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