TW551010B - Method of positioning pin holes for PCB manufacture controller - Google Patents

Abstract

A method of positioning pin holes for printed circuit board (PCB) manufacturing controller is disclosed. First, data of new and old pin holes are read by the controller. Then, checking steps of pin holes, like checking the area density and the location, are performed. If the position of the new pin holes are not conformed to the rule of any checking steps, the controller could auto-calculate a new displacement, and repeat to the first checking step to check the position of the new pin holes again. Another, if the position of all new pin holes are conformed to the rules of all checking steps, it represents that the positions of the new pin holes not overlap to the positions of the old pin holes on the back-up board, so that the regular drilling step could be performed.

Description

551010 V. Description of the invention α) The technical field to which the invention belongs ... The present invention relates to a printed circuit board manufacturing method (printed circuit board; referred to as PCB), and particularly to a positioning hole (Pin) in a manufacturing controller of a printed circuit board Holes) position determination method. Prior technology: The printed circuit board is based on the circuit design, drawing the electrical wiring connecting the circuit parts, wiring the pattern, and then reproducing the electrical conductor on the insulator by means of mechanical processing, surface treatment, etc. specified in the design. board. In other words, the printed circuit board refers to the substrate before the electronic parts, and the main function is to provide the mutual electrical connection of the various components on the top: the function of electronic components, and the S hoe equipment that has reached signal processing is becoming more and more "Complicated", the more and more parts are required, the PCB and parts are becoming more and more dense. Therefore, the negative design of printed circuit boards not only directly affects the overall performance and competitiveness of system products of electronic products. Also, the manufacturing process of the general board can include: multilayer wire inner layer wiring, drilling, through-hole copper plating, outer layer wiring, secondary ore

LirO wear; such as drilling and forming process must be inserted through the printed circuit board to fix the printed circuit board to the table or mold

551010

5. Description of the invention (2) Drilling or forming procedures are only carried out on the back plate of the tool. Figure 1 shows a schematic diagram of the backplane and the printed circuit board. The general steps for drilling holes and fixing pins are as follows. Referring to Fig. 1, first, the printed circuit board 20 is placed on a backing plate 10 of a drilling machine or a forming machine. Then, the controller will form a bit hole 22 at the same time on the printed circuit board 20 and the back handle μ ^ w / "τ according to the set position. Then, insert the pin (not shown) through the positioning Holes to fix the printed circuit board 20 on the backplane 10. 2 '

Generally, the back plate 10 can be made of bakelite material, and because the printed pins penetrate the printed circuit board 20 and the back plate 10 to maintain its solidity, the board is slightly used, and the old positioning holes on the back plate 10 have been used. No location = used by location. For example, if there are old traces of the previous system d 3: positioning hole 12 on the back, the positions on the printed circuit board 20 every several times down to the old positioning 1 12 cannot be repeated. :: Hole = The tip may move and cause the position of the printed circuit board 20 to be fixed, fixed, fixed, and cause errors in subsequent drilling or forming procedures. Poor mouth, and the size of the backplane is generally larger than the printed circuit board. The location of the printed circuit board on the backplane is determined by the manual inspection. = = R The location of the new positioning hole and the old positioning of the backplane "= side .The method and manual detection =: Brush the back of the circuit board, why not + J ^ You first place the name 呰 柘 p%-the machine will follow the new preset settings; "仞 在A trial drilling step was performed on the board, and the holes in the niches were very shallow, but the naked eye could produce% ^ μ & 1 〇

Then, reuse :: = :: bit hole position. Does the old ^ superimposed on the back 10 discriminate the new position on the back panel? Position L on the old bit hole. If the above new positioning holes

551010 V. Description of the invention (3) If the position of the old positioning hole overlaps, then another offset distance value of the printed circuit board is selected to obtain another new positioning hole position, and then the above-mentioned test drilling and inspection steps are repeated until the back plate is determined. The position of the new positioning hole does not overlap with the position of the old positioning hole, and then the formal positioning hole drilling step is performed. Generally, the backplane that is not used or used less frequently will easily avoid the position of the old positioning hole and quickly determine it. Printed circuit board. However, after a certain number of uses, the backplane has too many used positions on it, so it is difficult to easily determine the appropriate offset distance by using manual labor. The new positioning hole does not overlap the old positioning hole. Or, because the operating experience of the manual operator is different When there are too many traces of shallow positioning holes on the backplane, less experienced operators are not only apt to waste too much time on determining the position of the positioning holes but also unable to determine the correct offset distance. Use position 9 But when it is impossible to judge the position of the positioning hole manually, it is necessary to replace the back plate. 5 This will reduce the use of the back plate and increase the manufacturing cost of the printed circuit board. SUMMARY OF THE INVENTION Operation and trial-and-error method to avoid the used position on the backplane, can not obtain effective time control and the proportion of the use of the backplane so that the manufacturing cost of the printed circuit board increases. Therefore, the purpose of the present invention is to provide a positioning Hole position determination method 5 is applied to manufacturing control of printed circuit boards Transmitted through the vessel has storage of home-positioning holes 5 of the processed material and white on the back plate move apart to avoid that the position has been treated with 9

丨 HKJl BU I 551010 V. Description of the Invention (4) Obtain a new offset distance. In this way, the use of the backplane is controlled automatically to reduce the lead time of the printed circuit board and to obtain a higher utilization rate of the backplane.

According to the above purpose, the positioning hole position determining method of the printed circuit board manufacturing controller of the present invention includes: first, obtaining new positioning hole and old positioning hole data on the back plate; and then, performing a comparison step using the positioning hole comparison method To check the position of the new positioning hole; if any of the positions of the new positioning hole does not meet the conditions of the comparison step, the manufacturing controller performs a recalculation step and repeats the above comparison step, where the recalculation step is a new And the new offset distance value is used to simulate the new position of the new position hole on the backplane, and the comparison is performed in the comparison step; if all the positions of the new positioning holes match the comparison, The condition of the step is to complete the comparison step.

The above positioning hole comparison method includes: firstly determining whether the distance between the center of the old positioning hole and the center of the new positioning hole is less than a set limit distance. The limit distance can be the radius of the old positioning hole plus the radius of the new positioning hole, or Add the allowable error; if the distance between the center of the old positioning hole and the center of the new positioning hole is less than the limit distance, it is determined that the position of the new positioning hole does not meet the conditions of the positioning hole comparison method. To shorten the comparison time, you can set the old positioning holes in an effective comparison range before performing the above-mentioned positioning hole comparison method. The effective comparison range is defined as the square area formed by the side length equal to the radius of the largest old positioning hole on the back plate plus the radius of the new positioning hole being compared, or the allowable error value. In addition, in order to shorten the comparison time, the positioning hole comparison method can be used

Page 9 551010 V. Description of the invention (5) Perform another rough comparison step, such as the block density comparison method of the present invention. If any position of the new positioning hole does not meet the conditions of the above another comparison step, the manufacturing controller will perform a recalculation step and repeat the above another comparison step. In addition, if the positions of the new positioning holes all meet the conditions of the above-mentioned another comparison step, then the aforementioned positioning hole comparison method is continued. In addition, due to the addition of the above-mentioned another comparison step, a new positioning hole that does not comply with the positioning hole comparison method and is subjected to a recalculation step also needs to be re-compared from the above-mentioned another comparison step. The block density comparison method of the present invention includes: first virtually dividing the backplane into a plurality of blocks, and calculating the respective block densities of these blocks; then, defining a restricted block density; If the block density of a block is greater than the limit block density, it is determined that the position of the new positioning hole does not meet the conditions of the block density comparison method; and if the block density of all blocks including the new positioning hole is less than the restricted area Block density, it is determined that the position of the newly positioned hole meets the conditions of the block density comparison method. The above-mentioned block density represents the ratio of the total area ratio of all old positioning holes in a single block to the area of a single block. By applying the method of the present invention, the position of the positioning hole determined on the back plate can be automatically managed, and the operator only needs to perform the processing according to the offset position suggested by the controller, and does not need to perform the trial and error process such as trial drilling as is customary. You can avoid the used position on the back panel. And through the effective management of the controller, it can avoid the disadvantages of the operator's negligence or lack of experience that will cause the backplane utilization rate to drop. According to the above advantages, the method of the present invention can simultaneously reduce the manufacturing time of printed circuit boards and the cost of consumables.

Page 1055110 -------- ~~~---------------5. Description of the invention (6) Implementation mode: The present invention discloses a positioning hole positioning of a printed circuit board manufacturing controller. Method 'In order to make the convergence of the present invention more detailed and complete, it can be described in series and matched with the diagrams of FIGS. 2 to 6. FIG. 2 is a flowchart of a preferred embodiment of a method for determining the positioning of a printed circuit board manufacturing controller according to the present invention. Herein, the present invention uses this embodiment to describe the method of the present invention. Please refer to FIG. 2. In the embodiment of the car driver, the positioning hole workpiece program $ 0 is first opened, and the positioning hole workpiece program 50 has new positioning hole position data. All positioning holes for drilling ^ ^ "The controller will find the location of the positioning hole for the drilling step according to the file in the positioning hole workpiece program 50, which is the so-called process and the controller will find out The position of the positioning hole of the hole, the maximum distribution range 54 of the positioning hole, and the offset distance value 56 set by the positioning hole worker at 4. ^ ^ Among them, the above-mentioned maximum distribution range of 54 is that the designated bit holes must be equal to the area of the printed circuit board. In addition, the value of the program shift distance 5 6 is described in the private μ, ten, and Chinese texts, ^,, and β β 异 σ ^ are extended in the above-mentioned position hole workpiece program 50, which can be taken by the device Λ. The offset distance value refers to the distance between the dot position on the printed circuit board and the other dot position on the backplane. The specified reference points on the printed circuit board and the backplane can be defined by the operator, and the present invention is limited to this. The position of L is better under the decision. The hairpin should be recorded in the middle of the calculation. It is not necessary to control a certain road board. 55010 5. Description of the invention (7) The above steps 50 to ^ and should be familiar. In the method of each step or the positioning method using the distance value, when the positioning hole position data is obtained, the comparison of the hole position continues to select another one. Among them, the block density comparison method of the new positioning hole position controller will recalculate the 5 8 comparison steps. Step 5 6 is to learn that this technique and calculations do not limit the maximum points related to other process holes. Then, control, and construct Compared with the present invention, it is known by the present invention that the new offset of the nasal offset is not known by the controller. And% get the maximum # 'can continue here. The cloth range and the original device will be carried out-loop control value until the distance value of the new positioning hole block density comparison distance in the preferred embodiment is 60, the device obtains ~, ....... The present invention is not directed to the above two, Add or delete the above-mentioned distribution range and the first ^ Continued application after the invention ^ Offset distance value and the position of the new and old new positioning holes and the stomach & controller can be determined according to the position of the new positioning hole i S The symbol: S 'is to use the more granular location first to meet the conditions. If the conditions set by Method 5 8 are used, then the block density comparison method is controlled ^ a The position of the bit hole meets the conditions set by the block density comparison method 58, and the state of 1j will then locate the hole ratio according to the more precise positioning Compare method 62. Similarly, if the position of the new positioning hole does not conform to the bar specified in the positioning hole comparison method 62, the controller will recalculate the new offset distance value of 60, and then return to the comparison step of the block size comparison method 58. . If the position of the new positioning hole meets the conditions set by the positioning: hole comparison method 62, the positioning hole ratio is completed, which means that the position of the new positioning hole does not overlap the position of the old positioning hole, and the next drilling step can be performed again. The positioning hole comparison method can be used to confirm whether the position between the two positioning holes is heavy.

551010 V. Description of the invention (8) ® 'However, the processing time of the controller will increase due to the large number of new positioning holes and old positioning holes. Therefore, in the above-mentioned preferred embodiment of the present invention, the positioning hole comparison method is used. Before adding a block dense comparison method, you can first roughly divide the range of invalid blocks to increase the controller's discrimination speed. It should be noted that the operator may add other comparison methods or steps before the positioning hole comparison method according to the needs of the process, and the present invention is not limited thereto. Figure 3 shows a schematic diagram of the backplane, the old positioning hole and the new positioning hole using the block density comparison method. Referring to Figure 3, there are many old positioning holes 102 on the backing plate 100, as shown by the hollow dots in Figure 3. In addition, the controller first divides the backplane 100 into several small square blocks according to the specific size of the backplane first. In addition, several new positioning holes on the printed circuit board will be simulated on the backplane 100 according to the original offset position, as shown in the circle with a diagonal line in the third figure. The squares at the positioning holes 丨 2 represent the maximum distribution range 1 丨 for the positions of several new positioning holes 1 12. The so-called block density comparison method is to assume that the area of a single block is AC, and the total area occupied by the new and old positioning holes in this block is AH, and the controller calculates the block density AH of each block / A (^, and set a limit ratio of AH / AC ', such as about 70%. Then, the controller will compare the AH / AC ratio of the block where the new positioning hole 11 2 is located one by one, and detect all the new positioning holes 11 2 Whether the AH / AC ratio of the block is less than 70 ° / ...

Please refer to FIG. 4 again. In the present invention, the area of a block of 5 * 5 including the largest distribution range no is enlarged. The new positioning hole 11 2 a is located at the junction of the four blocks. Therefore, the controller must be surprised at all the blocks containing the position of the new positioning hole n 2a. That is, the point-like range of the two spoon blocks in Fig. 4 As shown, perform AH / AC

Page 13 551010 V. Description of the invention (9) Confirmation of the ratio. If the AH / AC ratios of the 5 * 5 blocks in Figure 4 are all less than 70%, it means that the position of the new positioning hole 112 is passed through the block density comparison method, and the next comparison step can be continued. However, once the AH / AC ratio of any block where the positioning hole 11 2 is located is greater than 70% during the above block density comparison method, it means that the distribution range of the new positioning hole 11 2 falls in the unavailable range. In the block, there is no need to compare the block density of other new bit holes. It is necessary to find a new offset distance and perform position simulation and comparison again. Alternatively, the operator can set the controller to make a block comparison including the location of the new positioning hole, and then determine whether there are invalid blocks (block density greater than 70%) for subsequent calculation of the new bias. The distance is shifted or the next comparison step is performed, and the present invention is not limited thereto. The above 70% maximum AH / AC limit ratio is only an example. The operator can define it by himself if necessary, and the operator can also define the rules for defining block density. The present invention is not limited to this. After entering the block degree comparison method, the positioning hole comparison method is then performed. Figure 5 Figure 5 shows the effective comparison range of the pie W. Please refer to the comparison method of the back hole on the back panel. The new positioning hole U2b is used as the center, and the largest old positioning hole diameter L1 is fixed. Adding half of the above-mentioned middle positioning hole 1 1 2b, I 2 is obtained. Once 4 u L… 4 τ, new μ α… ^ LZ plus the allowable error q 1 of the comparison, the block Gyuanyuan ancient ancient A-like pattern of the formed block—recognizing female μ, Qianwei As a valid comparison range 1 3 0. Next, all the mbs are overlapped and compared in the effective comparison range 130. The so-called overlapping alignment between the position of the hole and the positioning hole in the center, ^% $ 丨 the main you Yan τ Yu is located in the effective comparison range 1 30 half of the old fixed hole is L 3, thorn The approval is not required. The sales position quotes the controller to determine the old positioning hole and the new positioning hole 551010. 5. Description of the invention (ίο) Whether the distance between the two center points is smaller than the radius of the old positioning hole is L 3 plus the new center positioning Hole 1 1 2 b half control L 2 plus allowable error value q2. If the distance between the two center points of the old positioning hole and the new positioning hole is less than (L 3 + L 2 + q 2), it is determined that the position of the new positioning hole 1 1 2 b overlaps with the old positioning hole, that is, the position of the new positioning hole is not If the conditions are met, the new offset distance must be calculated again, and then the block comparison method must be repeated. The above-mentioned allowable error value ql and allowable error value q2 can be set by the operator according to the needs of the manufacturing process or the product. In addition, please refer to FIG. 6, which is a schematic diagram for determining the offset direction of the new positioning hole by using the spiral method. In a preferred embodiment of the present invention, the spiral method is used as a reference for calculating the offset distance. The position χι represents the original position of the reference point of the printed circuit board. When the position of the new positioning hole does not meet the conditions of the comparison method, it is first shifted to the right by a distance to position X2 ', and then the printed circuit is re- Conditionally compare the positions of the new positioning holes on the board. If the conditions are not met again, offset the positions X3, X4, X5, X6, X7, X8, X9, X10, etc. in the direction shown in Figure 6 and re-compare each. It is worth noting that the positions and their distances in Figure 6 are only: For example, the operator can apply the clockwise or counterclockwise spiral method to recalculate the offset distance. In addition, the distance between the positions is calculated differently according to the conditions that the new positioning hole does not meet, and the operator can define it by himself, but the present invention is not limited to this. = In a preferred embodiment of the present invention, if the new positioning hole does not meet the conditions of the block = degree comparison method, the controller will calculate the offset square according to the spiral law, and '10 is calculated in all invalid blocks. Move new positioning holes out of invalid blocks

551010 V. The maximum offset of invention description (11), but the controller will be used as a new offset or, if the new positioner is in addition to the two position amounts in the new positioning hole rotation method based on the addition of the previous comparison process, The comparison block density comparison method is not placed on the backplane. The drilling program can then be drilled. And stored in the case of the slot, as a result of the above-so before, so the hole machine or molding machine or molding machine control using the trial and error method of the present invention and people in accordance with the old and new positioning system will automatically produce the above spiral & If the offset is large, re-enter it again; ^ does not meet the f-off required to set your L out of the offset @ @outside. However, the distance is controlled so that if the position hole positioning device is built, the process of calculating the position of the new hole will be determined. However, the controller can be compared with the appropriate offset line, such as the offset distance value. The newly re-discussed the distance between the originating positions of the simulation holes in each area of the drill system. The condition of the original offset of 5 away from 0, then the control calculation can make the overlap. This is the above method. The above mentioned moving distance is reset to the new synchronization distance. The method of determining the synchronization data is as above. After the above maximum distance value, the positioning hole is the original offset of the distance between the spiral law and the safety range, and it conforms to all the old settings using the control controller, and it will re-position the positioning hole system next time. Controller controller. Methods and controllers to find the middle two positions suitable for hole data generation, plus the hole comparison method in the previous comparison process, and the amount of movement will be moved. The device will also be a new partial positioning hole position. In the final offset hole program, the reference density at the time of drilling is determined at the drilling position, and it is not limited to manage the fixed distance value. There are new and old settings. Moreover, if the positioning hole position of the matching area is compared with the step value, the position of the hole is stored in the file 0 or the molding step is used to drill the position hole of the drilling machine without having to overlap the automatic position hole of the system. automatic

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IHS 551010 V. Description of the invention (12) Manage the data of positioning holes, which can count the number of positioning holes of the fruit used in the backplane. These data can be retained or cleared by the operator at his discretion. Since all processes are automatically managed by the process system, printed circuit board manufacturing time can be reduced. In addition, the use of the backplane and the value of the offset distance can be uniformly managed by the system, so the utilization rate of the backplane can be increased and the cost of consumables can be reduced. This will help the manufacture of printed circuit boards and increase the competitiveness of electronic products.

As will be understood by those familiar with this technology, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application for the present invention; all others completed without departing from the spirit disclosed by the present invention, etc. Effective changes or modifications should be included in the scope of patent application described below.

551010 Simple illustration of the drawings Simple illustration of the drawings: The preferred embodiment of the present invention will be explained in more detail in the following explanatory text with the following graphic texts, where: Figure 1 shows the backplane Schematic diagram of a printed circuit board; Figure 2 shows a flowchart of a preferred embodiment of a method for determining the position of a positioning hole of a printed circuit board manufacturing controller of the present invention; Figure 3 shows a block density comparison method. Schematic diagram of the back plate, the old positioning hole and the new positioning hole; Figure 4 shows that the area containing the maximum distribution range of the positioning hole in Figure 3 is not intended, and Figure 5 shows the application of the positioning hole comparison method. Schematic diagram of effective comparison range; and Fig. 6 shows the schematic diagram of using the spiral method to determine the offset direction of the new positioning hole. 0 Comparison of drawing numbers: 10 Backplane 20 Printed circuit board 50 Positioning hole workpiece program 54 Calculating the maximum positioning hole Point 56 Get the 58 block density comparison method calculated by the program 12 Positioning hole 22 Positioning hole 5 2 Program simulation range shift distance value 60 Calculate the new offset distance value

Page 18551010 Brief description of the diagram 6 2 Positioning hole comparison method I 0 0 Back plate II 0 Maximum distribution range 1 1 2 a New positioning hole 1 3 0 Effective comparison range L1 Maximum old positioning hole diameter L3 Old positioning hole radius q2 Allowable error value 64 Completion of positioning hole comparison 1 0 2 Old positioning hole 112 New positioning hole 120 Point area L2 New positioning hole radius q 1 Allowable error value 误差

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Claims (1)

551010 VI. Scope of Patent Application1. A method for determining the position of a positioning hole, which is applied to a manufacturing controller of a printed circuit board. The method for determining the position of the positioning hole includes at least: obtaining information of a plurality of new positioning holes and being located on a back plate. The data of the plurality of old positioning holes, wherein the information of the new positioning holes includes at least a first offset distance; a first comparison step is performed, wherein the first comparison step uses a positioning hole comparison method to Inspect the positions of the new positioning holes; if any of the positions of the new positioning holes does not meet the conditions of the first comparison step, the manufacturing controller performs a recalculation step and repeats the first comparison step , Wherein the recalculating step is to obtain a second offset distance value, and use the second offset distance value to simulate the positions of the new positioning holes on the back, so as to substitute for the first comparison step to perform the comparison again. Yes; and if all the positions of the new positioning holes meet the conditions of the first matching step, the matching is completed. 2. The positioning hole position determining method according to item 1 of the scope of the patent application, wherein the above-mentioned positioning hole comparison method includes at least: determining the center of one of the old positioning holes and one of the new positioning holes. Whether the distance of the center of the circle is less than a limiting distance, where the limiting distance is the radius of the old positioning hole plus the radius of the new positioning hole; and if the center of the old positioning hole and the center of the old positioning hole are The distance between the centers of the new positioning holes is smaller than the limit distance, it is determined that the positions of the new positioning holes do not meet the conditions of the positioning hole comparison method. 551010 VI. Patent Application Range 3. The method of determining the position of the positioning hole as described in item 2 of the patent application range, wherein the above-mentioned limit distance includes an allowable error value. 4. The method for determining the position of positioning holes as described in item 2 of the scope of the patent application, wherein the old positioning holes are located in an effective comparison range, wherein the effective comparison range is a square, and The side length of the square is the radius of the largest of the old positioning holes on the back plate plus the radius of the new positioning holes. 5. The method for determining the position of a positioning hole as described in item 4 of the scope of patent application, wherein the side length of the square further includes an allowable error value. 6. The positioning hole position determination method described in item 1 of the scope of the patent application, wherein the recalculation step described above uses a spiral method. 7. The method for determining the position of the positioning hole according to item 1 of the scope of patent application, further comprising performing a second comparison step before the first comparison step, and the second comparison must be performed by the second comparison after the recalculation step described above. Steps start re-alignment, wherein the second comparison step is rougher than the first comparison step. 8. The method for determining the position of a positioning hole as described in item 7 of the scope of the patent application, wherein the above-mentioned second comparison step includes at least: if any of the positions of the new positioning holes does not meet the conditions of the second comparison step Page 21551010 6. For a patent application, the manufacturing controller performs the recalculation step and repeats the second comparison step; and if any one of the new positioning holes conforms to the second comparison step Conditions, the first comparison step is continued. 9. The positioning hole position determining method according to item 7 of the scope of the patent application, wherein the second comparison step described above uses a block density comparison method to view the positions of the new positioning holes. Specially ask Shen Rudu to cut the detailed block block to describe the imaginary board. On the back, the middle will be compared to the block as the block. The block of the block method determines the number of holes to be counted: The number of items in the block description is 9 The number of blocks that should be in the high-density block is one of the •, and the number of blocks in the new block of the porosity bit is limited. Set the holes that are not in place to be set new and to determine the rules. Then, the dense method of stripe ratios are compared to the system-restricted cells. All the holes in the block locations should be in accordance with the position of the dense blocks. Some new ones should be positioned. If the new method is more dense, the block method has a limit to the ratio of the system, and the limit is included in the block. Fan Li specially applies for the area of a certain block in the above. The histories of the dense pore block locations of the Daihe system are described above. The statutory legislation is better than the new one. Page 22 551010 VI. Scope of patent application 1 2 · A method for determining the position of a positioning hole, which is applied to a manufacturing controller of a printed circuit board. The method for determining the position of the positioning hole includes at least: obtaining information of a plurality of new positioning holes And data of a plurality of old positioning holes located on a back plate, wherein the data of the new positioning holes includes at least a first offset distance; performing a first comparison step; performing a second comparison step, wherein the first The second comparison step is more precise than the first comparison step, wherein the second comparison step uses a positioning hole comparison method to view the positions of the new positioning holes; performing a recalculation step, wherein the recalculation The steps are to obtain a second offset distance value, and use the second offset distance value to simulate the positions of the new position holes to perform a comparison again; if any of the positions of the new positioning holes does not meet the first Conditions of the comparison step, the manufacturing controller performs the recalculation step and repeats the first comparison step; if any of the positions of the new positioning holes meet the first comparison If the condition of the step is the second comparison step, if any of the positions of the new positioning holes does not meet the conditions of the second comparison step, the manufacturing controller performs the recalculation step and repeats the step. A first comparison step; and if all the positions of the new positioning holes meet the conditions of the first comparison step and the second comparison step, then the positioning hole comparison method is completed. Page 23551010 VI. Patent application scope 1 3. The positioning hole position determination method described in item 12 of the patent application scope, wherein the first comparison step described above uses a block density comparison method to inspect the positions. Position of the new positioning hole. 14. The method for determining the position of a positioning hole as described in Item 13 of the scope of patent application, wherein the above-mentioned block density comparison method at least includes: virtually dividing the backplane into a plurality of blocks, and counting the areas. Block density of blocks; define a restricted block density; if the block density of any of the blocks containing the new positioning holes is greater than the restricted block density, determine that the positions of the new positioning holes do not match The condition of the block density comparison method; and if the block density of all the blocks including all the new positioning holes is less than the restricted block density, it is determined that the positions of the new positioning holes conform to the block Conditions of the density comparison method. 15. The method for determining the position of positioning holes as described in Item 14 of the scope of the patent application, wherein the above-mentioned block density represents the total area ratio of all the new positioning holes and the old positioning holes in a single block. The proportion of a single block area. 16. The method for determining the position of a positioning hole as described in Item 12 of the scope of the patent application, wherein the positioning hole comparison method includes at least: determining the center of the circle of one of the old positioning holes and one of the new positioning holes. Whether the distance of the center of the circle is less than a limited distance, where the old positioning holes should be Page 24 551010 6. The scope of the patent application is located in an effective comparison range, and the limit distance is the radius of the old positioning hole plus the radius L 2 of the new positioning hole; and If the distance between the center of the old positioning holes and the center of the new positioning holes is less than the limit distance, it is determined that the position of the new positioning holes does not meet the conditions of the positioning hole comparison method. . 1 7. The method for determining the position of a positioning hole as described in item 16 of the scope of patent application, wherein the above-mentioned limiting distance further includes an allowable error value. 1 8. The method for determining the position of a positioning hole as described in item 16 of the scope of the patent application, wherein the above-mentioned old positioning holes are located in an effective comparison range, wherein the effective comparison range is a square And the length of the side of the square is the radius of the largest of the old positioning holes on the back plate plus the radius of the new positioning holes. 19. The method for determining the position of a positioning hole as described in item 18 of the scope of patent application, wherein the side length of the square further includes an allowable error value. 20. The method for determining the position of a positioning hole as described in item 12 of the scope of the patent application, wherein the recalculation step described above applies a spiral method.