TWI271885B - Package of light-emitting diode and method for packaging the same - Google Patents

Package of light-emitting diode and method for packaging the same Download PDF

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Publication number
TWI271885B
TWI271885B TW94137035A TW94137035A TWI271885B TW I271885 B TWI271885 B TW I271885B TW 94137035 A TW94137035 A TW 94137035A TW 94137035 A TW94137035 A TW 94137035A TW I271885 B TWI271885 B TW I271885B
Authority
TW
Taiwan
Prior art keywords
led
heat
die
packaging
package
Prior art date
Application number
TW94137035A
Other languages
Chinese (zh)
Other versions
TW200717850A (en
Inventor
Tseng-Hsiang Hu
Yih-Jong Hsieh
Li-Kuang Tan
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94137035A priority Critical patent/TWI271885B/en
Application granted granted Critical
Publication of TWI271885B publication Critical patent/TWI271885B/en
Publication of TW200717850A publication Critical patent/TW200717850A/en

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  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A package for a light-emitting diode (LED) and a method for packaging the LED are disclosed. The method involves placing the die of the LED directly into contact with a heat spreader in which a working fluid acting as a heat carrier is contained. Heat generated by the die of the LED is thus capable of being distributed uniformly over the heat spreader to which the die is attached through a phase change or a quick circulation of the working fluid inside the heat spreader. By this method, the thermal resistance for the LED is effectively reduced and hot-spot problem faced by the prior art is avoided, thereby effectively dissipating the heat of the LED.
TW94137035A 2005-10-21 2005-10-21 Package of light-emitting diode and method for packaging the same TWI271885B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94137035A TWI271885B (en) 2005-10-21 2005-10-21 Package of light-emitting diode and method for packaging the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94137035A TWI271885B (en) 2005-10-21 2005-10-21 Package of light-emitting diode and method for packaging the same

Publications (2)

Publication Number Publication Date
TWI271885B true TWI271885B (en) 2007-01-21
TW200717850A TW200717850A (en) 2007-05-01

Family

ID=38435345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94137035A TWI271885B (en) 2005-10-21 2005-10-21 Package of light-emitting diode and method for packaging the same

Country Status (1)

Country Link
TW (1) TWI271885B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382139B (en) * 2008-09-16 2013-01-11 Kuei Mei Kuo Lighting device of light emitting diodes and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382139B (en) * 2008-09-16 2013-01-11 Kuei Mei Kuo Lighting device of light emitting diodes and manufacturing method thereof

Also Published As

Publication number Publication date
TW200717850A (en) 2007-05-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees
MC4A Revocation of granted patent