TWI382139B - Lighting device of light emitting diodes and manufacturing method thereof - Google Patents

Description

Light-emitting diode lighting device and manufacturing method thereof

The present invention relates to a light-emitting diode lighting device and a method of manufacturing the same, and more particularly to a light-emitting diode lighting device having a vapor chamber and a method of manufacturing the same.

A light emitting diode (LED) is used to apply a forward current to emit visible light, infrared light or ultraviolet light through its semiconductor P-N interface. Compared with traditional light sources such as incandescent tungsten bulbs or fluorescent lamps, LED light sources have the greatest advantage of being energy-saving and environmentally friendly. However, the semiconductor P-N interface working area of the LED is small, so that the heat per unit area is very large, and the hot spot thus formed is liable to cause the operating temperature of the LED to rise rapidly. Therefore, the luminous intensity of the LED is lowered, the main wavelength of the light is shifted, and the life of the LED is seriously affected, and the light decay aging of the LED is further accelerated. Therefore, it is very urgent to solve the heat dissipation problem in high-power LED lighting.

At present, a typical LED heat dissipation mechanism is to place an LED chip on a substrate, and then fix the substrate on a heat conducting device or a metal fin using a material such as a thermal conductive paste. Since the substrate is composed of a plurality of layers of materials, in order to separate the LED module from the metal heat sink on the circuit, an electrical insulation and an insulator having a low thermal conductivity are often used between the two. There is also a large interface contact thermal resistance between the heat transfer device and the heat transfer device. Therefore, the LED heat dissipation mechanism described above cannot effectively reduce the P-N interface temperature and thermal resistance of the high-power LED when it is cooled.

The prior art Taiwan new patent M273165 has disclosed an LED lighting device 10. Referring to FIG. 1, the LED lighting device 10 mainly comprises: a housing 11, a plastic upper cover 12, a metal substrate 13, a heat dissipating component 14 and an LED 15, wherein the metal The substrate 13 is used to guide the heat source generated by the LED 15 to the heat sink 14 and then guide the heat source absorbed by the heat dissipating component 14 to the outside atmosphere via the heat dissipation hole 16 of the plastic upper cover 12. However, the above-mentioned prior art metal substrate 13 has a limited effect of guiding the heat source to the heat dissipating component 14, and the contact area of the heat dissipating component 14 with the outside air is limited by the size of the heat dissipating hole 16, and the heat dissipation of the high power LED cannot be solved as a whole. problem.

In order to solve the above-mentioned prior art, the present invention provides a light-emitting diode lighting device and a manufacturing method thereof. The light-emitting diode lighting device comprises a light-emitting diode module, a vapor cavity and a heat dissipation. The module, wherein the light-emitting diode module comprises a plurality of light-emitting diodes, wherein the vapor chamber system is formed by a composite substrate and a cover portion opposite to the composite substrate, and the cover portion is connected to the light-emitting diode In the polar body module, the heat dissipation module includes a plurality of heat dissipation members and is connected to the composite substrate of the vapor chamber. In addition, the interior of the vapor chamber is maintained in a vacuum state to fill a working fluid, and the composite substrate further includes an upper metal layer, an insulating layer and a lower metal layer, wherein the upper metal layer has a plurality of protrusions to form a vapor chamber interior The evaporation surface, and the lower metal layer has a circuit for electrically connecting the light emitting diode module.

Therefore, the main object of the present invention is to provide a light-emitting diode illumination device, which can reduce or eliminate the gap between the light-emitting diode and the vapor cavity by the electrical insulation and high thermal conductivity of the composite substrate of the vapor cavity. The interface contacts the thermal resistance, which in turn reduces the thermal resistance of the light-emitting diode and the PN interface temperature of the light-emitting diode.

A secondary object of the present invention is to provide a light-emitting diode lighting device, which can solve multiple hot spots of the light-emitting diode module by the high uniformity of the vapor cavity.

Another object of the present invention is to provide a light-emitting diode lighting device, wherein the evaporation mask inside the vapor chamber has a capillary structure, so that the working fluid forms a one-week and repeated thermal conduction cycle inside the vapor chamber, thereby achieving a rapid heat source uniformity. The effect of diffusion.

Another object of the present invention is to provide a light-emitting diode lighting device, which can make a phase change of a working fluid by a combination of a working fluid of a vapor chamber and a capillary structure of an evaporation surface, and further a cover portion of the vapor chamber. A condensation zone is formed.

Still another object of the present invention is to provide a method of manufacturing a light-emitting diode lighting device which is advantageous for mass production because of the simple design and low cost of the design of the vapor chamber.

The present invention discloses a light emitting diode lighting device and a manufacturing method thereof, wherein the hair is used The principle of illumination of the photodiode is well known to those of ordinary skill in the art, and therefore will not be fully described in the following description. At the same time, the drawings referred to in the following texts express the structural schematics related to the features of the present invention, and need not be completely drawn according to the actual size, which is first described.

Referring first to FIGS. 2A-2B, a first preferred embodiment of the present invention is a plan view and an exploded view of a light-emitting diode lighting device. The LED device 20 includes a light emitting diode module 21, a vapor chamber 22, and a heat dissipation module 23. The LED module 21 further includes a plurality of LEDs 210. The vapor chamber 22 includes a composite substrate 24 and a cover portion 25 opposed to the composite substrate 24. The vapor chamber 22 can be formed by welding the composite substrate 24 and the lid portion 25. The cover portion 25 is connected to the LED module 21, and the heat dissipation module 23 includes a plurality of heat sinks 230 and is connected to the composite substrate 24 of the vapor chamber 22. In addition, the interior of the vapor chamber 22 is first filled with a working fluid 26 and then maintained in a vacuum state, and the working fluid 26 may be any one of water, methanol, acetone, sodium or mercury, depending on the application. The composite substrate 24 further includes an upper metal layer 241, an insulating layer 242 and a lower metal layer 243, wherein the surface of the upper metal layer 241 is processed to form a capillary structure 240. Referring to FIG. 4, the capillary structure 240 is composed of a plurality of The raised portion 2400 is configured to provide an evaporation surface inside the vapor chamber 22, and the circuit pattern can be etched on the surface of the lower metal layer 243 by a printed circuit board to electrically connect to the light emitting diode module 21. Diode 210.

Please refer to FIG. 2A-2B. In the above embodiment, the metal layer 241, the insulating layer 242 and the lower metal layer 243 of the composite substrate 24 are formed by Direct Bonded Copper (DBC). The high thermal conductivity copper is used as the upper surface of the composite substrate 24 (that is, the upper metal layer 241), and the upper surface is processed into a capillary structure 240 having a capillary phenomenon, and the intermediate layer of the composite substrate 24 (that is, the insulating layer 242) The aluminum oxide is used as the electrical insulating layer (insulating layer 242), and the lower surface of the composite substrate 24 (that is, the lower metal layer 243) is made of high conductivity copper as the power supply circuit diagram of the light emitting diode module 21. The composite substrate 24 has both high thermal conductivity and electrical insulation, and in particular, the stability of the aluminum oxide of the insulating layer 242 can greatly improve the reliability of the overall heat dissipation. In addition, the material of the cover portion 25 may be selected from copper, copper alloy, aluminum, aluminum alloy or stainless steel to ensure that the interior of the vapor chamber 22 is resistant to vacuum. Reject atmospheric pressure to collapse the cavity. In addition, the heat dissipating member 230 is a heat dissipating fin, and any one of copper, copper alloy, aluminum, aluminum alloy or stainless steel may be selected, and the heat source absorbed by the heat dissipating fin may be further dispersed by forced convection or natural convection of the fan. In the atmosphere. In addition, according to the welding characteristics between the cover portion 25 of the vapor chamber 22 and the heat sink 230, a uniform metal layer is plated on the outer surface of the cover portion 25 to improve the soldering characteristics, for example, when the vapor chamber 22 is copper. When the heat sink 230 is aluminum, it is necessary to plate a layer of nickel on the copper surface of the vapor chamber 22 to provide better solderability between the vapor chamber 22 and the heat sink 230. In addition, a solder material is further included between the composite substrate 24 and the heat dissipation module 23 to ensure better solderability between the two, and the solder material may be a solder paste.

Referring to FIGS. 2B-2C, in the above embodiment, the heat source Q _in generated when the LED module 21 is operated is conducted to the evaporation surface inside the vapor chamber 22 via the composite substrate 24, due to the vapor chamber. The inside of 22 is evacuated, so the working fluid 26 (that is, water) will undergo a phase change boiling phenomenon at a relatively low temperature. When the working fluid 26 undergoes a phase change on the evaporation surface, a vapor V is generated, and the vapor V will It is quickly diffused outwardly by the working fluid 26 to the cover portion 25 of the vapor chamber 22. At this time, the vacancy formed by the working fluid 26 after evaporation on the evaporation surface will pass the surrounding water by the capillary structure 240 of the evaporation surface. Guided, at the same time, the cover portion 25 has a lower temperature interface due to the connection of the heat dissipation module 23, so that the entire cover portion 25 contacting the vapor quickly condenses into water on the surface thereof, and then the capillary structure guides the working fluid 26 to The evaporation surface of the heat source is generated, and the working fluid 26 is again evaporated due to the high temperature of the evaporation surface, so that the evaporation, condensation, and circulation in the capillary structure are repeated, so that the working fluid 26 is inside the vapor chamber 22. Off cycle, and then by connecting the upper surface of the heat dissipating fins to the steady flow of the vapor cavity 22 can be a light emitting diode module 21 generates Q _out of the heat source away. In other words, the entire cover portion 25 is a condensation zone, and only one region on the upper surface of the composite substrate 24 is an evaporation surface, so that the heat source is diffused from the evaporation surface to the condensation zone, thereby forming a soaking effect, that is, the original small A plurality of hot spots locally on the surface of the heating element are diffused to the upper surface of the vapor chamber 22 by vapor, and then the upper surface of the vapor chamber 22 is used to connect the large-area heat-dissipating fins to bring the heat source to the outside atmosphere.

Please refer to FIGS. 3A-3B, which is a second preferred embodiment of the present invention, and is another illuminating diode illuminating device. The LED device 30 includes a LED module 31 and a vapor chamber. 32 and a heat dissipation module 33, wherein the vapor chamber 32 includes a composite substrate 34 and a cover portion 35. Further, the LED illumination device 30 further includes an optical lens module 37 and a liquid injection tube 38, wherein The liquid injection tube 38 guides a working fluid (not shown) into the interior of the vapor chamber 32. The optical lens module 37 includes a plurality of optical lenses 370, and each of the optical lenses 370 has a recessed portion 371 for accommodating the corresponding light-emitting diode 310. The optical lens 370 can provide the light source of the light-emitting diode 310. Focusing, thereby improving the luminous efficiency of the overall diode module 31. In addition, the structure, features, and materials of the LED module 31, the vapor chamber 32, the heat dissipation module 33, the composite substrate 34, the cover portion 35, and the working fluid used in the embodiment are as described in the first preferred embodiment. .

Referring to FIG. 4 again, in the above first or second preferred embodiment, the capillary structure 240 has a capillary radius inversely proportional to the capillary force on a micro-scale scale, that is, the smaller the scale, the higher the capillary force. The more the water can be filled with the evaporation chamber, the less likely it is to burn out inside the vapor chamber. However, the finer capillary structure will also result in higher resistance to water flow, so the capillary structure must have an optimized design. In addition, the raised portion 2400 of the capillary structure 240 may be a porous particle structure, a mesh structure, a groove structure, a fibrous structure or a columnar structure, wherein the columnar structure is relatively easy to fabricate by etching. In addition, referring to FIG. 5, in the first or second preferred embodiment, the LED illumination device can further include a frame portion 29, 39 and can be drilled in the peripheral surface of the frame portions 29, 39. The positioning holes 290, 390 are formed, and the positioning holes 290, 390 are matched with the corresponding locking bolts (not shown) to connect the optical lens module (not shown), the vapor chamber composite substrates 24, 34 and the cover portions 25, 35, and The heat dissipation modules 23, 33 are fixedly locked together. In addition, the frame portions 29, 39 may be stamped from metal of different wire diameters, such as copper, aluminum or stainless steel.

In addition, a third preferred embodiment of the present invention is a method for fabricating a light-emitting diode lighting device, which is used to fabricate the light-emitting diode lighting device of the first preferred embodiment, including The following steps: (1) providing a light-emitting diode module, wherein the light-emitting diode module is provided with a plurality of light-emitting diodes; (2) providing a heat-dissipating module, wherein the heat-dissipating module is provided with a plurality of a heat dissipating member; (3) forming a composite substrate by directly laminating copper, wherein the composite substrate is composed of a metal layer, an insulating layer and a lower metal layer Forming a stack in sequence; (4) forming a plurality of raised portions having a capillary structure on the upper metal layer such that the composite substrate has an evaporation surface; (5) forming a circuit on the lower metal layer; (6) soldering a cover a portion of the composite substrate to form a vapor chamber; (7) connecting the lid portion of the vapor chamber to the light emitting diode module; (8) connecting the metal layer under the composite substrate of the vapor chamber to the light emitting layer a diode module; (9) filling a working fluid into the interior of the vapor chamber; and (10) evacuating the interior of the vapor chamber.

The structure, characteristics and materials of the light-emitting diode module, the vapor chamber, the heat dissipation module, the composite substrate, the cover portion and the working fluid used in the embodiment are as described in the first preferred embodiment, due to the vapor chamber The design makes processing simple and reduces costs, which is conducive to mass production.

In addition, a fourth preferred embodiment of the present invention is a method for fabricating another illuminating diode illuminating device, which is used to fabricate the illuminating diode illuminating device of the second preferred embodiment, including There is the following steps: (1) providing an optical lens module, wherein the optical lens module is provided with a plurality of optical lenses and a plurality of light emitting diodes, and further comprising a recessed portion in the optical lens to accommodate the corresponding The plurality of light emitting diodes; (2) providing a heat dissipating module, wherein the heat dissipating module is provided with a plurality of heat dissipating members; and (3) forming a composite substrate by directly laminating copper, wherein the composite substrate is composed of a metal layer, The insulating layer and the lower metal layer are sequentially stacked; (4) forming a plurality of protrusions having a capillary structure on the upper metal layer such that the composite substrate has an evaporation surface; and (5) forming a circuit in the lower metal layer (6) welding a cover portion on the composite substrate to form a vapor chamber; (7) connecting the cover portion of the vapor chamber to the optical lens module; (8) connecting a metal layer under the composite substrate of the vapor chamber to the light emitting diode module; (9) providing a liquid injection tube to inject a working fluid into the interior of the vapor chamber; (10) Vacuuming the interior of the vapor chamber; and (11) providing a frame portion for positioning the optical lens module, the vapor chamber and the thermal module.

The structure, characteristics and materials of the light-emitting diode module, the vapor cavity, the heat dissipation module, the composite substrate, the cover portion, the working fluid, the optical lens module, the liquid injection tube and the frame portion used in the embodiment are as follows. According to the second preferred embodiment, in addition, the design of the vapor chamber makes the processing simple and reduces the cost, which is advantageous for mass production.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the patent application rights of the present invention. The above description should be understood and implemented by those skilled in the art, so that the other embodiments are not deviated from the present invention. Equivalent changes or modifications made in the spirit of the disclosure should be included in the scope of the patent application.

11 (prior art) ‧‧‧shell

12 (prior art) ‧ ‧ plastic cover

13 (prior art) ‧ ‧ metal substrate

16 (prior art) ‧‧ ‧ vents

10 (prior art), 20, 30‧‧‧Lighting diode lighting

21, 31‧‧‧Lighting diode module

15 (prior art), 210‧‧ ‧Lighting diode

22, 32‧‧‧ vapor chamber

23, 32‧‧‧ Thermal Module

14 (prior art), 230‧‧ ‧ heat sink

24, 34‧‧‧ Composite substrate

240‧‧‧Capillary structure

2400‧‧‧ raised parts

241‧‧‧Upper metal layer

242‧‧‧Insulation

243‧‧‧Under metal layer

25, 35‧‧ ‧ cover

26, 36‧‧‧ working fluid

29, 39‧‧‧ Frame Department

290, 390‧‧‧ positioning holes

37‧‧‧Optical lens module

370‧‧‧ optical lens

371‧‧‧Depression

38‧‧‧Injection tube

V‧‧‧Vapor

Q _in , Q _out ‧ ‧ heat source

Fig. 1 is a schematic view showing the structure of a conventional light-emitting diode lighting device.

2A is a schematic view showing a composition of a light-emitting diode lighting device according to a first preferred embodiment of the present invention.

FIG. 2B is an exploded view showing a component comparison of a light-emitting diode lighting device in accordance with a first preferred embodiment of the present invention.

2C is a schematic view showing a process of convection of a working fluid of a vapor chamber to derive a heat source in accordance with a first preferred embodiment of the present invention.

Figure 3A is an exploded view of a component of a light-emitting diode lighting device in accordance with a second preferred embodiment of the present invention.

FIG. 3B is a perspective view showing an optical lens module of a light-emitting diode illumination device according to a second preferred embodiment of the present invention.

Figure 4 is a schematic view showing a capillary structure of a vapor chamber evaporation surface of a light-emitting diode lighting device according to the above preferred embodiment of the present invention.

Figure 5 is a perspective view of a frame portion of a light-emitting diode lighting device according to the above preferred embodiment of the present invention.

20‧‧‧Lighting diode lighting device

21‧‧‧Lighting diode module

210‧‧‧Lighting diode

22‧‧‧Vapor chamber

23‧‧‧ Thermal Module

230‧‧‧ Heat sink

24‧‧‧Composite substrate

241‧‧‧Upper metal layer

242‧‧‧Insulation

243‧‧‧Under metal layer

25‧‧‧ 盖部

26‧‧‧Working fluid

Claims (17)

A light-emitting diode lighting device includes: an optical lens module comprising a plurality of optical lenses and a plurality of light-emitting diodes, wherein each of the optical lenses has a recessed portion for receiving the corresponding light-emitting diode a vapor chamber formed by a composite substrate and a cover portion of the composite substrate, wherein the cover portion is coupled to the optical lens module; and a liquid injection tube guides a working fluid to Injecting into the interior of the vapor chamber; and a heat dissipation module comprising a plurality of heat dissipating members and connected to the composite substrate of the vapor chamber; wherein the vapor chamber is filled with a working fluid and maintained in a vacuum state The composite substrate further includes an upper metal layer, an insulating layer and a lower metal layer, wherein the upper metal layer has a plurality of protrusions to form an evaporation surface inside the vapor chamber, and the lower metal layer has an electric circuit The light emitting diode module is electrically connected. The illuminating diode illuminating device according to claim 1, wherein the metal layer, the insulating layer and the lower metal layer of the composite substrate are stacked in a direct copper-clad manner. The illuminating diode lighting device of claim 1, wherein the plurality of raised portions of the upper metal layer have a capillary structure. The illuminating diode illuminating device according to claim 1, wherein the metal layer on the composite substrate is a material having a high thermal conductivity. According to the light-emitting diode lighting device of claim 4, the material of the metal layer on the composite substrate is copper. The illuminating diode illuminating device according to claim 1, wherein the metal layer under the composite substrate is a material having a high electrical conductivity. According to the light-emitting diode lighting device of claim 6, wherein the material of the metal layer under the composite substrate is copper. The illuminating diode illuminating device according to claim 1, wherein the insulating layer of the composite substrate is made of alumina. The illuminating diode illuminating device according to claim 1, wherein the material of the cover portion is selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy and stainless steel. The illuminating diode device of claim 1, wherein the heat dissipating component of the heat dissipating module is a heat dissipating fin. The light-emitting diode lighting device according to claim 10, wherein the material of the heat-dissipating fin is selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy and stainless steel. The illuminating diode illuminating device according to claim 1, wherein the workflow system is selected from the group consisting of water, methanol, acetone, sodium and mercury. The illuminating diode device of claim 1, wherein a solder material is further included between the composite substrate and the heat dissipation module. The illuminating diode illuminating device according to claim 13 , wherein the soldering material is a solder paste. The illuminating diode illuminating device according to claim 1, further comprising a frame portion for positioning the optical lens module, the vapor chamber and the heat dissipation module. A method for manufacturing a light-emitting diode lighting device includes: providing a light-emitting diode module, wherein the light-emitting diode module is provided with a plurality of light-emitting diodes; and providing a heat-dissipating module The group is provided with a plurality of heat dissipating members; forming a composite substrate by directly laminating copper, wherein the composite substrate is formed by sequentially stacking a metal layer, an insulating layer and a lower metal layer; forming a plurality of convex portions having a capillary structure thereon a metal layer such that the composite substrate has an evaporation surface; a circuit is formed on the lower metal layer; a cover portion is welded on the composite substrate to form a vapor cavity; and a cover portion connecting the vapor cavity to the light emitting diode a module; a metal layer under the composite substrate connecting the vapor chamber to the light emitting diode module; filling a working fluid into the interior of the vapor chamber; The interior of the vapor chamber is evacuated. A method for fabricating a light-emitting diode illumination device includes: providing an optical lens module, wherein the optical lens module is provided with a plurality of optical lenses and a plurality of light-emitting diodes, and further comprising one optical lens a recessed portion for accommodating the corresponding light emitting diode; providing a heat dissipating module, wherein the heat dissipating module is provided with a plurality of heat dissipating members; forming a composite substrate by directly laminating copper, wherein the composite substrate is made of a metal layer and insulated Forming a layer and a lower metal layer in sequence; forming a plurality of convex portions having a capillary structure on the upper metal layer such that the composite substrate has an evaporation surface; forming a circuit in the lower metal layer; and soldering a cover portion Forming a vapor chamber; connecting a lid portion of the vapor chamber to the optical lens module; connecting a metal layer under the composite substrate of the vapor chamber to the light emitting diode module; providing a note a liquid tube for injecting a working fluid into the interior of the vapor chamber; evacuating the interior of the vapor chamber; and providing a frame portion for positioning the optical lens module, the vapor chamber and the dispersion Module.