CN204254329U - A kind of LED lamp - Google Patents
A kind of LED lamp Download PDFInfo
- Publication number
- CN204254329U CN204254329U CN201420740637.XU CN201420740637U CN204254329U CN 204254329 U CN204254329 U CN 204254329U CN 201420740637 U CN201420740637 U CN 201420740637U CN 204254329 U CN204254329 U CN 204254329U
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- Prior art keywords
- led
- frame wall
- radiating subassembly
- luminescence component
- led lamp
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides a kind of LED lamp, it comprises radiating subassembly and LED luminescence component, described LED luminescence component comprises multiple LED, and described radiating subassembly comprises the distribution path that at least one its cross section is LED described in matching and the frame wall extended to the emission side in contrast to described LED; Described radiating subassembly is connected in the mode of thermo-contact with described LED luminescence component.Above-mentioned LED lamp takes full advantage of radiating principle, the spread geometry of corresponding LED or heat dissipation path are rationally provided with the cross sectional shape of radiating subassembly, or the layout rational in infrastructure of corresponding radiating subassembly LED, utilize the efficient radiator structure of the member designs of the intrinsic light fixtures such as frame wall simultaneously, effectively reducing while LED junction temperature rises △ t, also reducing light fixture cost, simplifying assembly technology and maintain the overall aesthetics of LED lamp.
Description
Technical field
The utility model relates to a kind of lighting apparatus, particularly relates to a kind of LED lamp.
Background technology
Along with the progressively raising of great power LED light efficiency, LED lamp is widely used in lighting field, wherein adopts LED to have the technical characteristics such as energy-conservation, long-life as the light fixture of light source.But LED is the same with traditional light source, it also can produce heat during operation, and the number producing heat depends on the luminous efficiency of LED entirety.Specifically, LED element working life and operating temperature are inversely proportional to, and thus good heat radiation is the important step of LED lamp design.Current existing LED lamp all adopts centralized for LED lamp bead fixing layout structure, then by means of the LED fin slices radiator being specifically designed to heat radiation LED heat taken away and by fin to air exchange heat to reach the object of heat radiation.
The problem of such design is: because LED lamp bead concentrates to be fixed on a relatively little area thick and fast, a large amount of heats due to synergistic effect raised temperature while too increase the difficulty of outside transferring heat, cause the not smooth bottleneck of heat dissipation channel when high-power applications especially.Meanwhile, have employed that volume is large, the fin slices radiator of Heavy Weight also improves light fixture cost, in addition, in order to coordinate the installation of fin slices radiator, overall its aesthetic appearance, also needing to design complicated structure and fin slices radiator is fixed and wraps up by shell.
Utility model content
In view of this, the utility model provides a kind of LED lamp that can solve the problem.
For solving the problem, the utility model provides a kind of LED lamp, it comprises radiating subassembly and LED luminescence component, described LED luminescence component comprises multiple LED, and described radiating subassembly comprises the distribution path that at least one its cross section is LED described in matching and the frame wall extended to the emission side in contrast to described LED; Described radiating subassembly is connected in the mode of thermo-contact with described LED luminescence component.
Preferably, the shape in the cross section of described frame wall be circle, ellipse, quadrangle, pentagon or hexagon one of them.
Preferably, the area of section of described frame wall is reduced towards another opposite end gradually by the one end being provided with described LED.
Preferably, described LED luminescence component also comprises the circuit board be arranged between described LED and described radiating subassembly, is interconnected between described circuit board and described radiating subassembly by thermal interfacial material.
Preferably, described radiating subassembly also comprises Fixed Division, and described Fixed Division is extended to form by the side radial direction of the contiguous described LED luminescence component of described frame wall, and described Fixed Division is connected in the mode of thermo-contact with LED luminescence component.
Preferably, described LED lamp also comprises the connecting plate connecting described frame wall and described LED luminescence component, described connecting plate is all connected in the mode of thermo-contact with described frame wall and described LED luminescence component, and described frame wall and described connecting plate surround a closed form body jointly.
Preferably, described radiating subassembly also comprises the roof and diapire that are connected with described frame wall, and described roof, described diapire and described frame wall form the housing of a closed form jointly.
The utility model also provides a kind of LED lamp, and it comprises at least one frame wall and LED luminescence component, and described LED component comprises multiple LED, and described LED is with one end of the cross sectional shape of frame wall described in matching described frame wall for path profile is arranged at; Described frame wall is connected in the mode of thermo-contact with LED luminescence component.
Preferably, the shape in the cross section of described frame wall be circle, ellipse, quadrangle, pentagon or hexagon one of them.
The utility model also provides a kind of LED lamp, it comprises radiating subassembly and LED luminescence component, described LED luminescence component comprises multiple LED, and described radiating subassembly comprises the heat distribution path of LED described at least one matching and the frame wall extended to form to the emission side in contrast to described LED; Described radiating subassembly is connected in the mode of thermo-contact with described LED luminescence component.
The utility model has following beneficial effect:
Above-mentioned LED lamp takes full advantage of radiating principle, the spread geometry of corresponding LED or heat dissipation path are rationally provided with the cross sectional shape of radiating subassembly, or the layout rational in infrastructure of corresponding radiating subassembly LED, utilize the efficient radiator structure of the member designs of the intrinsic light fixtures such as frame wall, roof and diapire simultaneously, effectively reducing while LED junction temperature rises Δ t, also reducing light fixture cost, simplifying assembly technology and maintain the overall aesthetics of LED lamp.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED lamp in the utility model embodiment.
Fig. 2 is the floor map of LED lamp shown in Fig. 1, the rounded arrangement of wherein said LED.
Fig. 3 for LED lamp shown in Fig. 1 is along the generalized section of A-A line, the rounded arrangement of wherein said LED.
Fig. 4 is the floor map of LED lamp shown in Fig. 1, the rectangular arrangement of wherein said LED.
Fig. 5 for LED lamp shown in Fig. 1 is along the generalized section of A-A line, the rectangular arrangement of wherein said LED.
Fig. 6 is the structural representation of LED lamp in another embodiment of the utility model.
Fig. 7 is the structural representation of LED lamp in the another embodiment of the utility model.
Fig. 8 is the utility model structural representation of LED lamp in an embodiment again.
Fig. 9 is the structural representation of LED lamp in the other embodiment again of the utility model.
Detailed description of the invention
Below in conjunction with drawings and Examples, detailed description of the invention of the present utility model is described in further detail.
Refer to Fig. 1, the utility model embodiment provides a kind of LED lamp 100, comprises radiating subassembly 10 and a LED luminescence component 20.Wherein, LED luminescence component 20 comprises in necessarily regularly arranged multiple LED (light emitting diode) 23.
Radiating subassembly 10 comprises the distribution path that at least one its cross section is matching LED 23 and the frame wall 11 extended to the emission side in contrast to LED 23, and radiating subassembly 10 is connected in the mode of thermo-contact with LED luminescence component 20.If the Design and manufacture being appreciated that frame wall 11 formerly, be improve the radiating effect of LED lamp 100, LED the structure of corresponding frame wall 11 can carry out layout, that is, LED 23 with the cross sectional shape of matching frame wall 11 for path profile is arranged at one end of frame wall 11; In addition, if the heat distribution path of known LED, the structure of frame wall 11 then can design according to the heat distribution path of LED 23, that is, frame wall 11 can matching LED 23 heat distribution path and extend to form to the emission side in contrast to LED 23.
LED luminescence component 20 also comprises a circuit board 21, and described LED 23 is fixed on circuit board 21.Concrete, be interconnected by thermal interfacial material between radiating subassembly 10 and circuit board 21 assembly.Further, thermal interfacial material (not shown) is provided with between circuit board 21 and radiating subassembly 10, to fill up the hole of microvoid and the surface irregularity produced when circuit board 21 engages with radiating subassembly 10 or contacts, reduce heat transfer contact thermal resistance, improve the heat dispersion of circuit board 21 and radiating subassembly 10, so that the heat distributed by LED light-emitting component 20 conducts fast to radiating subassembly 10.The present embodiment is in the concrete process used, and circuit board 21 can adopt this thermal interfacial material of heat-conducting glue to be bonded in radiating subassembly 10 one end.
So-called matching refer to certain function known some discrete function values f1, f2 ... fn}, by adjusting (the λ 1, λ 2 of some undetermined coefficient f in this function,, λ n), make the difference of this function and known point set (least square meaning) minimum.In the present embodiment, described discrete function value { f1, f2,, fn} is the position data of described LED 23 on circuit board 21, and by specific function and undetermined coefficient f (λ 1, λ 2,, λ n) calculate the shape in the cross section of frame wall 11, the cross sectional shape of the frame wall 11 finally calculated close to or be same as the spread geometry of LED 23.The spread geometry of LED 23 can be circle, ellipse, quadrangle, pentagon or hexagon one of them, accordingly, the cross sectional shape of frame wall 11 also can be circle, ellipse, quadrangle, pentagon or hexagon one of them.
See also Fig. 2-5, Fig. 2 and show structure when the spread geometry of LED 23 is circle, accordingly, the cross sectional shape of frame wall 11 is similarly circular (see Fig. 2), and two circular sizes are close.Fig. 4 shows the structure when the spread geometry of LED 23 is rectangle, and accordingly, the cross sectional shape of frame wall 11 is similarly rectangle (see Fig. 5), and the size of two rectangles is close.
See also Fig. 6 and Fig. 7, radiating subassembly 10 also comprises a Fixed Division 13, and Fixed Division 13 is extended to form by the side radial direction of the contiguous LED luminescence component 20 of frame wall 11, and Fixed Division 13 is connected in the mode of thermo-contact with LED luminescence component 10.Wherein, the bearing of trend of Fixed Division 13 both can be towards frame wall 11 extension (see Fig. 6), also can extend (see Fig. 7) in frame wall 11.
See also Fig. 8, LED lamp 100 also comprises the connecting plate 30 of a connection box wall 11 and LED luminescence component 20, connecting plate 30 is all connected in the mode of thermo-contact with frame wall 11 and LED luminescence component 30, and frame wall 11 and connecting plate 30 surround a closed form body jointly.In the present embodiment, connecting plate 30 is in one " U " type, and " U " arm part of connecting plate 30 to be sheathed in frame wall 11 and to be connected with the inner surface wall of frame wall 11.
See also Fig. 9, radiating subassembly 10 also comprises roof 15 and the diapire 17 be connected with frame wall 11, and roof 15 opposing bottom wall 17 is arranged, and roof 15, diapire 17 and frame wall 11 form the housing of a closed form jointly.Wherein, the area of section of frame wall 11 is reduced towards another opposite end gradually by the one end being provided with LED 23, is namely reduced gradually towards the one end being close to roof 15 by one end of adjacent bottom wall 17.
The surfaces externally and internally of frame wall 11, roof 15 and diapire 17 is smooth surface, makes radiating subassembly 10 in use, can carry out heat loss through radiation, that is, can improve the radiating effect of LED lamp 100.The overall appearance degree of LED lamp 100 can also be improved simultaneously and reduce manufacturing cost.Further, for improving the heat-sinking capability of radiating subassembly 10, described radiating subassembly 10 is made up of the good material of heat radiation, as aluminium alloy, and pottery etc.In the present embodiment, radiating subassembly 10 is made up of aluminium alloy.
In the present embodiment, LED lamp 100 operationally, and the heat that its LED luminescence component 20 produces conducts to radiating subassembly 10 by thermal interfacial material, and carry out spreading, dispelling the heat on whole radiating subassembly 10.Outwardly dispelled the heat by radiation mode and convection type in the surface of radiating subassembly 10.Wherein determine entire thermal resistance that the heat dissipation path of LED lamp 100 radiating efficiency in the present embodiment exists equal heat dissipation path links thermal resistance and.After LED lamp energising work enough time, under certain environment temperature and air velocities, LED lamp entirety can reach a thermal balance, the junction temperature liter of the LED lamp of the temperature difference Δ t meaning now between the temperature of the light-emitting component 20 of LED lamp and air, wherein LED lamp junction temperature rises lower, means that the life expectancy of LED is longer.
The factor risen with regard to affecting LED lamp junction temperature below does following analysis:
Be heat loss through conduction by the LED light-emitting component 20 of the known LED lamp of the above analysis to heat dissipation path to heat-delivery surface, dispel the heat by having radiation and these two kinds of modes of convection current LED lamp each heat-delivery surface to external environment, because different radiating modes relates to different influence factors and computational methods, discuss respectively below:
1, LED light-emitting component 20 to each heat-delivery surface of this LED lamp be to heat loss through conduction process in, affect the thermal conductivity factor, the sectional area of heat carrier, the length of heat-transfer path etc. four because have various heat sink material in the dissipated power of LED, heat dissipation path that junction temperature rises Δ t.So the temperature difference of this section of heat-transfer path can use following equation expression:
Δt1＝L·Q/K·A；
Wherein, Q represents the dissipated power of LED lamp, and unit is W; K represents thermal conductivity factor, and unit is W/m DEG C; A represents the sectional area of heat carrier, and unit is m
2; Δ t1 represents this section of heat-transfer path two ends temperature difference, and unit is DEG C; L represents heat-transfer path length, and unit is m.
The present embodiment have employed LED 23 with circle, one of them decentralized design of ellipse, quadrangle, pentagon or hexagon, and radiating subassembly 10 is similar to the structure that LED 23 distributes to its structure of part of LED 23 vicinity, equivalence on the unit heat sink material wasted work rate Q that falls apart significantly is reduced, add the heat carrier sectional area of equivalence, to reach better radiating effect simultaneously.
2, by each heat-delivery surface of LED lamp in the link of function of environment heat emission, its convection type carries out affecting junction temperature in heat transfer and rises three factors such as the temperature difference because have the coefficient of heat transfer, effective heat exchange area, heat exchange surface and fluid of Δ t.Specifically can be as follows with following equation expression:
Δt2＝Q/hc·A；
Wherein, Q represents heat loss through convection amount, and unit is W; Hc represents the coefficient of heat transfer, and unit is W/m
2a; A represents effective heat exchange area, and unit is m
2; Δ t2 represents heat exchange surface and fluid temperature difference, and unit is DEG C.
The present embodiment is using the surfaces externally and internally of the radiating subassembly 10 of whole LED lamp 100 as effective heat exchange area, and its area has been greater than traditional fin radiating structure, and therefore this structure has good heat loss through convection effect.The very effect considering heat loss through radiation of simultaneously traditional fin radiating structure not more, in fact, not far owing to being separated by between fin, the effect of heat loss through radiation is almost offset completely by the absorption of adjacent fin and inoperative, but in the LED lamp 100 of the present embodiment, because the surfaces externally and internally of whole radiating subassembly 10 is smooth structure, therefore, heat loss through radiation also plays a significant role, and This further reduces junction temperature and rises Δ t.
In sum, in the present embodiment, LED lamp 100 takes full advantage of radiating principle, the spread geometry of corresponding LED 23 or heat dissipation path are rationally provided with the cross sectional shape of radiating subassembly 10, or the layout rational in infrastructure of corresponding radiating subassembly 10 LED 23, utilize the efficient radiator structure of the member designs of the intrinsic LED lamp such as frame wall 11, roof 15 and diapire 17 simultaneously, effectively reducing while LED junction temperature rises Δ t, also reducing light fixture cost, simplifying assembly technology and maintain the overall aesthetics of LED lamp 100.
The foregoing is only preferred embodiment of the present utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any amendment made, equivalent replacements, improvement etc., all should be included within scope that the utility model protects.
Claims (10)
1. a LED lamp, it comprises radiating subassembly and LED luminescence component, described LED luminescence component comprises multiple LED, it is characterized in that, described radiating subassembly comprises the distribution path that at least one its cross section is LED described in matching and the frame wall extended to the emission side in contrast to described LED; Described radiating subassembly is connected in the mode of thermo-contact with described LED luminescence component.
2. a kind of LED lamp as claimed in claim 1, is characterized in that, the shape in the cross section of described frame wall be circle, ellipse, quadrangle, pentagon or hexagon one of them.
3. a kind of LED lamp as claimed in claim 1, is characterized in that, the area of section of described frame wall is reduced towards another opposite end gradually by the one end being provided with described LED.
4. a kind of LED lamp as claimed in claim 1, is characterized in that, described LED luminescence component also comprises the circuit board be arranged between described LED and described radiating subassembly, is interconnected between described circuit board and described radiating subassembly by thermal interfacial material.
5. a kind of LED lamp as claimed in claim 1, it is characterized in that, described radiating subassembly also comprises Fixed Division, and described Fixed Division is extended to form by the side radial direction of the contiguous described LED luminescence component of described frame wall, and described Fixed Division is connected in the mode of thermo-contact with LED luminescence component.
6. a kind of LED lamp as claimed in claim 1, it is characterized in that, described LED lamp also comprises the connecting plate connecting described frame wall and described LED luminescence component, described connecting plate is all connected in the mode of thermo-contact with described frame wall and described LED luminescence component, and described frame wall and described connecting plate surround a closed form body jointly.
7. a kind of LED lamp as claimed in claim 1, is characterized in that, described radiating subassembly also comprises the roof and diapire that are connected with described frame wall, and described roof, described diapire and described frame wall form the housing of a closed form jointly.
8. a LED lamp, it comprises at least one frame wall and LED luminescence component, and described LED component comprises multiple LED, it is characterized in that, described LED is with one end of the cross sectional shape of frame wall described in matching described frame wall for path profile is arranged at; Described frame wall is connected in the mode of thermo-contact with LED luminescence component.
9. a kind of LED lamp as claimed in claim 8, is characterized in that, the shape in the cross section of described frame wall be circle, ellipse, quadrangle, pentagon or hexagon one of them.
10. a LED lamp, it comprises radiating subassembly and LED luminescence component, described LED luminescence component comprises multiple LED, it is characterized in that, described radiating subassembly comprises the heat distribution path of LED described at least one matching and the frame wall extended to form to the emission side in contrast to described LED; Described radiating subassembly is connected in the mode of thermo-contact with described LED luminescence component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420740637.XU CN204254329U (en) | 2014-12-01 | 2014-12-01 | A kind of LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420740637.XU CN204254329U (en) | 2014-12-01 | 2014-12-01 | A kind of LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204254329U true CN204254329U (en) | 2015-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420740637.XU Expired - Fee Related CN204254329U (en) | 2014-12-01 | 2014-12-01 | A kind of LED lamp |
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| CN (1) | CN204254329U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104456205A (en) * | 2014-12-01 | 2015-03-25 | 方恒 | LED lamp |
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- 2014-12-01 CN CN201420740637.XU patent/CN204254329U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104456205A (en) * | 2014-12-01 | 2015-03-25 | 方恒 | LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150408 Termination date: 20201201 |
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| CF01 | Termination of patent right due to non-payment of annual fee |