CN104359058A - LED (light-emitting diode) lamp - Google Patents

LED (light-emitting diode) lamp Download PDF

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Publication number
CN104359058A
CN104359058A CN201410642848.4A CN201410642848A CN104359058A CN 104359058 A CN104359058 A CN 104359058A CN 201410642848 A CN201410642848 A CN 201410642848A CN 104359058 A CN104359058 A CN 104359058A
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Prior art keywords
led lamp
heat dissipation
outer cover
wall
radiating segment
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CN201410642848.4A
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方恒
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HANGZHOU ZHIGAO MEDIA TECHNOLOGY Co Ltd
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HANGZHOU ZHIGAO MEDIA TECHNOLOGY Co Ltd
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Priority to CN201410642848.4A priority Critical patent/CN104359058A/en
Publication of CN104359058A publication Critical patent/CN104359058A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/04Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/02Cages
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The invention provides an LED (light-emitting diode) lamp, which comprises an outer cover and a luminous element accommodated in the outer cover, wherein the outer cover comprises an annular peripheral wall and a bottom wall arranged at one end of the peripheral wall; the luminous element is arranged on the surface, adjacent to the peripheral wall, of the bottom wall. The LED lamp also comprises an upper shell, wherein the upper shell comprises an annular radiation wall, a top wall arranged at one end of the radiation wall and a connecting part arranged at the opposite end of the radiation wall; the connecting part is formed by the extension of the end part, adjacent to the outer cover, of the radiation wall, and is fixedly attached to the surface, away from the peripheral wall, of the bottom wall of the outer cover. According to the LED lamp, by virtue of reasonable structural design and light source layout, the LED lamp is endowed with high radiation performance and radiation efficiency, and the invention can be applied to a high-power LED lamp; meanwhile, a conventional finned radiator is eliminated, so that the weight and the production cost of the LED lamp are reduced, an assembly process is simplified, and the LED lamp is attractive in overall appearance.

Description

一种LED灯具A kind of LED lamp

技术领域technical field

本发明涉及一种照明设备,尤其涉及一种LED灯具。The invention relates to a lighting device, in particular to an LED lamp.

背景技术Background technique

随着大功率LED光效的逐步提高,LED灯具已经被广泛应用于照明领域,其中采用LED作为光源的灯具有着节能、长寿命等技术特征。但是LED与传统的光源一样,其在工作期间也会产生热量,而产生热量的多少取决于LED整体的发光效率。具体地来说,LED元件工作寿命和工作温度成反比,因而良好的散热是LED灯具设计的重要环节。目前现有的LED灯具都采用将LED灯珠集中式固定的布局结构,再借助于专门用于散热的LED鳍片散热器将LED热量带走并通过鳍片向空气交换热量以达到散热的目的。这样设计的问题在于:由于LED灯珠是集中密集地固定在一个相对较小的面积上,大量的热量由于叠加效应推高了温度的同时也增加了向外传递热量的难度,特别在大功率应用时造成了散热通道不畅的瓶颈现象,同时,由于采用了体积大、重量重的鳍片散热器也提高了灯具成本,另外,为了配合鳍片散热器的安装、整体的美观感还需要设计复杂的结构和外壳将鳍片散热器固定和包裹。With the gradual improvement of the light efficiency of high-power LEDs, LED lamps have been widely used in the field of lighting. Among them, lamps using LEDs as light sources have technical characteristics such as energy saving and long life. However, LEDs, like traditional light sources, also generate heat during operation, and the amount of heat generated depends on the overall luminous efficiency of the LED. Specifically, the working life of LED components is inversely proportional to the working temperature, so good heat dissipation is an important link in the design of LED lamps. At present, the existing LED lamps adopt the layout structure of centralized and fixed LED lamp beads, and then use the LED fin radiator specially used for heat dissipation to take away the LED heat and exchange heat with the air through the fins to achieve the purpose of heat dissipation . The problem with this design is that because the LED lamp beads are concentrated and fixed on a relatively small area, a large amount of heat increases the temperature due to the superposition effect and also increases the difficulty of transferring heat to the outside, especially in high-power The bottleneck phenomenon of poor heat dissipation channels is caused during application. At the same time, the use of large and heavy fin radiators also increases the cost of lamps. In addition, in order to cooperate with the installation of fin radiators and the overall aesthetics, it needs The intricately designed structure and shell fix and wrap the finned heat sink.

发明内容Contents of the invention

有鉴于此,本发明提供一种能解决上述问题的LED灯具。In view of this, the present invention provides an LED lamp capable of solving the above problems.

为解决上述问题,本发明提供一种LED灯具,其包括外罩及容纳在所述外罩中的发光元件,所述外罩包括环形周壁及设于所述周壁一端的底壁;所述发光元件设置在所述底壁邻近所述周壁的一面;所述LED灯具进一步包括与所述底壁远离所述周壁的一面连接的上壳体,所述上壳体包括环形的散热壁、设于所述散热壁一端的顶壁及设于所述散热壁另一相对端的连接部;所述连接部由所述散热壁邻近所述外罩的端部延伸形成,所述连接部与所述外罩的底壁远离所述周壁的一面固定。In order to solve the above problems, the present invention provides an LED lamp, which includes an outer cover and a light-emitting element accommodated in the outer cover, the outer cover includes an annular peripheral wall and a bottom wall arranged at one end of the peripheral wall; the light-emitting element is arranged on The bottom wall is adjacent to one side of the peripheral wall; the LED lamp further includes an upper case connected to a side of the bottom wall away from the peripheral wall, the upper case includes an annular heat dissipation wall, and is arranged on the heat dissipation wall. The top wall at one end of the wall and the connecting portion located at the other opposite end of the heat dissipation wall; the connecting portion is formed by extending the end of the heat dissipation wall adjacent to the outer cover, and the connecting portion is far away from the bottom wall of the outer cover One side of the surrounding wall is fixed.

优选地,所述周壁的直径由邻近所述底壁的一端朝另一相对端方向逐渐增大。Preferably, the diameter of the peripheral wall gradually increases from one end adjacent to the bottom wall toward the other opposite end.

优选地,所述散热壁的直径由设有所述顶壁的一端朝设有所述连接部的一端方向逐渐增大。Preferably, the diameter of the heat dissipation wall gradually increases from the end where the top wall is located toward the end where the connecting portion is located.

优选地,所述LED灯具还包括设置在所述发光元件与所述底壁之间的电路板,所述电路板与所述底壁之间设置有热界面材料。Preferably, the LED lamp further includes a circuit board disposed between the light emitting element and the bottom wall, and a thermal interface material is disposed between the circuit board and the bottom wall.

优选地,所述散热壁邻近所述顶壁的一端开设有散热孔。Preferably, one end of the heat dissipation wall adjacent to the top wall is provided with a heat dissipation hole.

优选地,所述散热壁包括与所述连接部连接的第一散热段、由所述第一散热段远离所述连接部的一端弯折延伸的第二散热段以及由所述第二散热段远离所述第一散热段的一端弯折延伸的第三散热段,所述第三散热段远离所述第二散热段的一端与所述顶壁连接,所述第一散热段、所述第二散热段及所述第三散热段均为环形结构,且所述第一散热段的直径由其邻近所述连接部的一端朝邻近所述第二散热段的一端逐渐减小,所述第二散热段的直径由其邻近所述第一散热段的一端朝邻近所述第三散热段的一端逐渐减小,所述第三散热段的直径由其邻近所述第二散热段的一端朝所述顶壁逐渐减小。Preferably, the heat dissipation wall includes a first heat dissipation section connected to the connection part, a second heat dissipation section bent and extended from an end of the first heat dissipation section away from the connection part, and a second heat dissipation section formed by the second heat dissipation section A third heat dissipation section bent and extended from one end away from the first heat dissipation section, the end of the third heat dissipation section away from the second heat dissipation section is connected to the top wall, the first heat dissipation section, the first heat dissipation section Both the second heat dissipation section and the third heat dissipation section are ring-shaped, and the diameter of the first heat dissipation section gradually decreases from an end adjacent to the connecting part to an end adjacent to the second heat dissipation section. The diameter of the two heat dissipation sections gradually decreases from one end adjacent to the first heat dissipation section to one end adjacent to the third heat dissipation section, and the diameter of the third heat dissipation section is from one end adjacent to the second heat dissipation section to The top wall is tapered.

优选地,所述外罩中的周壁为第一散热路径,所述上壳体中的散热壁为第二散热路径,所述第一散热路径与所述第二散热路径的比值为1:100到10:1。Preferably, the peripheral wall in the outer cover is a first heat dissipation path, the heat dissipation wall in the upper housing is a second heat dissipation path, and the ratio of the first heat dissipation path to the second heat dissipation path is 1:100 to 10:1.

优选地,所述第一散热路径与所述第二散热路径的比值为1:1。Preferably, the ratio of the first heat dissipation path to the second heat dissipation path is 1:1.

优选地,所述LED灯具还包括容置于所述上壳体或外罩内的散热内壳,所述散热内壳为环形结构,且所述散热内壳的一端与所述底壁背离所述发光元件的一面固定。Preferably, the LED lamp further includes a heat dissipation inner shell accommodated in the upper casing or the outer cover, the heat dissipation inner shell is in an annular structure, and one end of the heat dissipation inner shell is away from the bottom wall. One side of the light emitting element is fixed.

优选地,所述上壳体的顶壁上开设有开口部,所述散热内壳部分地由所述开口部伸出,且所述散热内壳伸出所述开口部的部分上开设有散热孔。Preferably, an opening is opened on the top wall of the upper case, the heat dissipation inner shell is partially protruded from the opening, and the heat dissipation inner shell protrudes from the opening. hole.

优选地,所述散热内壳的数量为至少一个。Preferably, the number of the heat dissipation inner shell is at least one.

一种LED灯具,其包括一发光元件及一散热装置,所述发光元件通过所述散热装置散热,该散热器包括一上壳体及一下壳体,所述上壳体与下壳体的外侧壁一起形成一环形结构,该环状结构的直径自所述上壳体往下壳体逐渐增大;所述下壳体靠近所述上壳体的一端向内延伸出一上底部,所述上壳体靠近所述下壳体的一端与所述上底部固定连接;所述发光元件设置在上底部远离连接部的一侧。An LED lamp, which includes a light-emitting element and a heat dissipation device, the light-emitting element dissipates heat through the heat dissipation device, the radiator includes an upper shell and a lower shell, and the outer sides of the upper shell and the lower shell are The walls form an annular structure together, and the diameter of the annular structure gradually increases from the upper casing to the lower casing; an upper bottom is extended inwardly from an end of the lower casing close to the upper casing, and the One end of the upper casing close to the lower casing is fixedly connected to the upper bottom; the light-emitting element is arranged on a side of the upper bottom away from the connection part.

优选地,所述连接部的为一环形带状结构。Preferably, the connection part is an annular belt-shaped structure.

一种LED灯具,其包括外罩及容纳在所述外罩中的发光元件,所述外罩包括一上外罩及与上外罩连接的下外罩,所述上外罩靠近下外罩的端部向内延伸出一连接部,所述下外罩靠近上外罩的端部与所述连接部固定连接,所述发光元件设置在所述连接板远离上外罩的一侧。An LED lamp, which includes an outer cover and a light-emitting element accommodated in the outer cover, the outer cover includes an upper outer cover and a lower outer cover connected with the upper outer cover, and an end of the upper outer cover near the lower outer cover extends inwardly. The connecting part, the end of the lower housing close to the upper housing is fixedly connected to the connecting part, and the light-emitting element is arranged on the side of the connecting plate away from the upper housing.

本发明具有以下有益效果:The present invention has the following beneficial effects:

上述LED灯具通过合理的结构设计及光源布局,使得发光元件所产生的热量能够由周壁、上壳体等元件快速传导出去,从而使得LED灯具具有优异的散热性能和散热效率,能够适用于大功率LED灯具。同时,由于省却了传统的鳍片散热器,降低了LED灯具的重量及生产制造成本,简化了装配工艺,且能使该LED灯具具有整体的美观性。Through reasonable structural design and light source layout, the above-mentioned LED lamps enable the heat generated by the light-emitting elements to be quickly conducted away from the surrounding wall, upper casing and other components, so that the LED lamps have excellent heat dissipation performance and heat dissipation efficiency, and can be applied to high-power LED lamps. At the same time, because the traditional fin heat sink is omitted, the weight and manufacturing cost of the LED lamp are reduced, the assembly process is simplified, and the LED lamp has overall aesthetics.

附图说明Description of drawings

图1为本发明第一实施例中LED灯具的结构示意图,其中所述上壳体中连接部与外罩的底壁之间通过过盈配合或者点焊的方式连接固定。Fig. 1 is a schematic structural diagram of an LED lamp in the first embodiment of the present invention, wherein the connecting part of the upper housing and the bottom wall of the housing are connected and fixed by means of interference fit or spot welding.

图2为本发明第一实施例中LED灯具的结构示意图,其中所述上壳体中连接部与外罩的底壁之间通过钎焊的方式连接固定。Fig. 2 is a schematic structural view of the LED lamp in the first embodiment of the present invention, wherein the connecting part of the upper housing and the bottom wall of the housing are connected and fixed by brazing.

图3为本发明第一实施例中LED灯具的结构示意图,其中所述上壳体中连接部与外罩的底壁之间通过螺丝连接的方式连接固定。Fig. 3 is a schematic structural view of the LED lamp in the first embodiment of the present invention, wherein the connection part in the upper housing and the bottom wall of the housing are connected and fixed by means of screws.

图4为本发明第一实施例中LED灯具的结构示意图,其中所述上壳体中连接部与外罩的底壁之间通过铆接的方式连接固定。Fig. 4 is a schematic structural view of the LED lamp in the first embodiment of the present invention, wherein the connecting part in the upper housing and the bottom wall of the housing are connected and fixed by riveting.

图5为本发明第二实施例中LED灯具的结构示意图,其中所述上壳体内设置有一个散热内壳,且所述散热内壳容置于所述上壳体上。5 is a schematic structural diagram of an LED lamp in a second embodiment of the present invention, wherein a heat dissipation inner case is disposed in the upper case, and the heat dissipation inner case is accommodated on the upper case.

图6为本发明第二实施例中LED灯具的结构示意图,其中所述上壳体内设置有一个散热内壳,且所述散热内壳部分从所述上壳体顶壁的开口部伸出。Fig. 6 is a schematic structural view of the LED lamp in the second embodiment of the present invention, wherein a heat dissipation inner shell is disposed in the upper casing, and the inner heat dissipation casing partially protrudes from the opening of the top wall of the upper casing.

图7为本发明第三实施例中LED灯具的结构示意图,其中所述上壳体内设置有两个散热内壳。Fig. 7 is a schematic structural diagram of an LED lamp in a third embodiment of the present invention, wherein two heat-dissipating inner shells are arranged in the upper shell.

图8为本发明所提供的LED灯具的结构示意图,其中所述外罩的周壁呈喇叭状。Fig. 8 is a schematic structural view of the LED lamp provided by the present invention, wherein the peripheral wall of the outer cover is trumpet-shaped.

具体实施方式Detailed ways

下面结合附图和实施例,对本发明的具体实施方式作进一步详细描述。The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

请参阅图1,本发明第一实施例提供一种LED灯具100,其包括外罩10及容纳在所述外罩10中的发光元件20。Referring to FIG. 1 , the first embodiment of the present invention provides an LED lamp 100 , which includes a housing 10 and a light emitting element 20 contained in the housing 10 .

所述外罩10包括环形周壁11及设于所述周壁11一端的底壁12。可以理解,本实施例中,所述外罩10优选地为一桶状结构。所述周壁11位于所述底壁12的相对端,即为该LED灯具100的出光部。所述周壁11的直径可以根据该LED灯具100的使用场合来具体设定,优选地,所述周壁11的直径由邻近所述底壁12的一端朝另一相对端方向逐渐增大,即,周壁11的横截面由设有所述出光部的一端朝另一相对端逐渐缩小。可以理解,所述周壁11的形状还可以为喇叭状,具体可以参加图8。本实施例中,上述的结构设置符合人们使用LED灯具的固有习惯,同时也能获得较宽的光分布,从而能适合于大面积、工作面垂直或接近垂直的工作场所。所述外罩10周壁11的内外表面均为光滑表面,使得外罩10在使用时,能够进行辐射散热,即,能够提高该LED灯具100的散热效率。同时能提高LED灯具100的美观度,且能降低制造成本。进一步地,为提高外罩10的散热能力,所述外罩10是由散热较好的材质制成,如铝合金,陶瓷等。在本实施例中,优选地,所述外罩10由铝合金制成。The housing 10 includes an annular peripheral wall 11 and a bottom wall 12 disposed at one end of the peripheral wall 11 . It can be understood that, in this embodiment, the outer cover 10 is preferably a barrel-shaped structure. The peripheral wall 11 is located at the opposite end of the bottom wall 12 , which is the light emitting portion of the LED lamp 100 . The diameter of the peripheral wall 11 can be specifically set according to the application occasion of the LED lamp 100. Preferably, the diameter of the peripheral wall 11 gradually increases from one end adjacent to the bottom wall 12 to the opposite end, that is, The cross-section of the peripheral wall 11 is gradually reduced from one end where the light exiting portion is provided to the other opposite end. It can be understood that the shape of the peripheral wall 11 can also be trumpet-shaped, see FIG. 8 for details. In this embodiment, the above-mentioned structural arrangement conforms to people's inherent habit of using LED lamps, and at the same time can obtain a wider light distribution, so that it is suitable for workplaces with large areas and vertical or near-vertical working surfaces. The inner and outer surfaces of the surrounding wall 11 of the outer cover 10 are smooth surfaces, so that the outer cover 10 can radiate and dissipate heat when in use, that is, the heat dissipation efficiency of the LED lamp 100 can be improved. At the same time, the aesthetics of the LED lamp 100 can be improved, and the manufacturing cost can be reduced. Further, in order to improve the heat dissipation capability of the outer cover 10, the outer cover 10 is made of a material with better heat dissipation, such as aluminum alloy, ceramics and the like. In this embodiment, preferably, the outer cover 10 is made of aluminum alloy.

所述发光元件20设置在所述底壁12邻近所述周壁11的一面。所述发光元件20即为该LED灯具100的光源,优选地,所述LED灯具100的光源为大功率光源,即,所述LED灯具光源的功率大于40W。所述发光元件20包括多颗灯珠,所述多颗灯珠呈环状排列设置在所述底壁12上,且所述底壁12被多颗灯珠包围的面积小于底壁12面积的二分之一,使得发光元件20分散地分布在底壁12上,以便从而使得外罩10的各部分能对发光元件20均匀散热。The light emitting element 20 is disposed on a side of the bottom wall 12 adjacent to the peripheral wall 11 . The light emitting element 20 is the light source of the LED lamp 100. Preferably, the light source of the LED lamp 100 is a high-power light source, that is, the power of the light source of the LED lamp is greater than 40W. The light-emitting element 20 includes a plurality of lamp beads, the plurality of lamp beads are arranged on the bottom wall 12 in a ring shape, and the area of the bottom wall 12 surrounded by the plurality of lamp beads is smaller than the area of the bottom wall 12 One-half, so that the light-emitting elements 20 are dispersedly distributed on the bottom wall 12 , so that each part of the housing 10 can dissipate heat to the light-emitting elements 20 evenly.

所述LED灯具100进一步包括与所述底壁12远离所述周壁11的一面连接的上壳体30,所述上壳体30又可以细分为:环形的散热壁31、设于所述散热壁31一端的顶壁32及设于所述散热壁31另一相对端的连接部33。本实施例中,优选地,所述散热壁31的直径由设有所述顶壁32的一端朝设有所述连接部33的一端方向逐渐增大,其中所述连接部33的一端的直径与所述外罩的底壁的直径相等。The LED lamp 100 further includes an upper casing 30 connected to a side of the bottom wall 12 away from the peripheral wall 11, and the upper casing 30 can be further subdivided into: an annular heat dissipation wall 31, an A top wall 32 at one end of the wall 31 and a connecting portion 33 disposed at another opposite end of the heat dissipation wall 31 . In this embodiment, preferably, the diameter of the heat dissipation wall 31 gradually increases from the end with the top wall 32 toward the end with the connecting portion 33, wherein the diameter of the end of the connecting portion 33 is It is equal to the diameter of the bottom wall of the outer cover.

为了促进所述上壳体30的散热功效,所述散热壁31又可以具体细分为,包括与所述连接部33连接的第一散热段311、由所述第一散热段311远离所述连接部33的一端弯折延伸的第二散热段312以及由所述第二散热段312远离所述第一散热段311的一端弯折延伸的第三散热段313,所述第三散热段313远离所述第二散热段312的一端与所述顶壁32连接,所述第一散热段311、所述第二散热段312及所述第三散热段313均为环形结构,且所述第一散热段313的直径由其邻近所述连接部33的一端朝邻近所述第二散热段312的一端逐渐减小,所述第二散热段312的直径由其邻近所述第一散热段311的一端朝邻近所述第三散热段313的一端逐渐减小,所述第三散热段313的直径由其邻近所述第二散热段312的一端朝所述顶壁32逐渐减小。本实施例中,所述第二散热段312优选地设置为,连接所述第一散热段311和第三散热段313的水平圆盘状结构。这样,本实施例所提供的LED灯具100在工作时,发光元件20发光所产生的热量从外罩10的底壁12传输到上壳体30,并依次通过上壳体30散热壁31中的第一散热段311、第二散热段312以及第三散热段313把该LED灯具100内的热量及时地排放出去。In order to promote the heat dissipation effect of the upper case 30, the heat dissipation wall 31 can be further subdivided into a first heat dissipation section 311 connected to the connecting portion 33, and the first heat dissipation section 311 is away from the The second heat dissipation section 312 bent and extended from one end of the connecting portion 33 and the third heat dissipation section 313 bent and extended from the end of the second heat dissipation section 312 away from the first heat dissipation section 311 , the third heat dissipation section 313 One end away from the second heat dissipation section 312 is connected to the top wall 32, the first heat dissipation section 311, the second heat dissipation section 312 and the third heat dissipation section 313 are all ring structures, and the first heat dissipation section 311 The diameter of a heat dissipation section 313 gradually decreases from its end adjacent to the connecting portion 33 to the end adjacent to the second heat dissipation section 312 , and the diameter of the second heat dissipation section 312 decreases from its end adjacent to the first heat dissipation section 311 One end of the third heat dissipation section 313 gradually decreases toward an end adjacent to the third heat dissipation section 313 , and the diameter of the third heat dissipation section 313 gradually decreases from its end adjacent to the second heat dissipation section 312 toward the top wall 32 . In this embodiment, the second heat dissipation section 312 is preferably configured as a horizontal disk-shaped structure connecting the first heat dissipation section 311 and the third heat dissipation section 313 . In this way, when the LED lamp 100 provided by this embodiment is in operation, the heat generated by the light-emitting element 20 is transmitted from the bottom wall 12 of the outer cover 10 to the upper casing 30, and passes through the first heat dissipation wall 31 of the upper casing 30 in turn. A heat dissipation section 311 , a second heat dissipation section 312 and a third heat dissipation section 313 discharge the heat in the LED lamp 100 in a timely manner.

当然了,为了进一步促进所述上壳体30的散热功效,所述上壳体30在第三散热段313的位置处设置散热孔3131,使得该LED灯具100在使用时能够进行内外空气交换,进而提高了该LED灯具散热效率。Of course, in order to further promote the heat dissipation effect of the upper casing 30, the upper casing 30 is provided with a heat dissipation hole 3131 at the position of the third heat dissipation section 313, so that the LED lamp 100 can perform internal and external air exchange during use, Further, the heat dissipation efficiency of the LED lamp is improved.

所述连接部33由所述散热壁31邻近所述外罩10的端部延伸形成,所述连接部33与所述外罩10的底壁12远离所述周壁11的一面贴合固定。可以理解,所述外罩10的底壁12为一圆形板状结构,其上下表面均为光滑表面。所述连接部33抵靠或贴合于所述底壁12的外表面上,以将所述上壳体10固定于所述外罩10上的。所述上壳体30通过其连接部33与所述外罩10的底壁12的固定方式,便于了对该上壳体30的固定,即,方便了所述上壳体30在底壁12上的装配。同时又能使所述外罩10底壁12与连接部33的接触面积最大,使得所述底壁12上的热量能够快速地传导给上壳体30进行散热。优选地,为使所述底壁12与连接部33获得最大的接触面积,所述连接部33的结构与所述底壁12的结构对应,即,所述连接部33的表面紧紧贴合在所述底壁12的外表面。本实施例中,为了迎合本发明描述的LED灯具散热的主题,所述上壳体30的连接部33与所述周壁11间优选采用过盈配合或者焊接的方式进行固定,以获得最大的热接触面积,其中所述焊接方式可以为点焊(参见图1)、钎焊(参见图2)或者氩弧焊的方式进行固定。由于所述连接部33是通过过盈配合或者焊接的方式固定在周壁11上,使得二者更发便于装配。且,选用焊接的方式还可以让连接部33与底壁12间的热传导更好,此时的焊接材料相当于热界面材料,从而进一步提高了该LED灯具100对发光元件20的散热效率。本发明中的LED灯具在实际的应用中,优选选用过盈配合或者点焊工艺的连接方式。可以理解,在其它实施例中,根据不同的需要,所述上壳体30的连接部33与所述外罩10底壁12之间的连接方式可以采用螺丝连接(参阅图3)或者铆接(参阅图4)的方式进行连接固定。为了上壳体30具有良好的散热性能,所述连接部33与散热壁31一体成型且由具有良好散热功能的材料制成。在本实施例中,所述连接部33与散热壁31可以由铝合金一体成型而制成。The connecting portion 33 is formed by extending from the end portion of the heat dissipation wall 31 adjacent to the outer cover 10 , and the connecting portion 33 is attached and fixed to a side of the bottom wall 12 of the outer cover 10 away from the peripheral wall 11 . It can be understood that the bottom wall 12 of the outer cover 10 is a circular plate-shaped structure, and its upper and lower surfaces are smooth. The connecting portion 33 leans against or adheres to the outer surface of the bottom wall 12 to fix the upper casing 10 on the outer cover 10 . The fixing method of the upper casing 30 to the bottom wall 12 of the outer cover 10 through its connecting portion 33 facilitates the fixing of the upper casing 30, that is, facilitates the fixing of the upper casing 30 on the bottom wall 12. assembly. At the same time, the contact area between the bottom wall 12 of the housing 10 and the connecting portion 33 can be maximized, so that the heat on the bottom wall 12 can be quickly transferred to the upper casing 30 for heat dissipation. Preferably, in order to obtain the largest contact area between the bottom wall 12 and the connecting portion 33, the structure of the connecting portion 33 corresponds to the structure of the bottom wall 12, that is, the surfaces of the connecting portion 33 are closely attached to each other. on the outer surface of the bottom wall 12 . In this embodiment, in order to meet the theme of heat dissipation of LED lamps described in the present invention, the connecting portion 33 of the upper housing 30 and the surrounding wall 11 are preferably fixed by interference fit or welding to obtain the maximum heat dissipation. The contact area, wherein the welding method can be fixed by spot welding (see FIG. 1 ), brazing (see FIG. 2 ) or argon arc welding. Since the connecting portion 33 is fixed on the peripheral wall 11 by means of interference fit or welding, the two are more convenient to assemble. Moreover, the welding method can also make the heat conduction between the connecting portion 33 and the bottom wall 12 better, and the welding material at this time is equivalent to the thermal interface material, thereby further improving the heat dissipation efficiency of the LED lamp 100 to the light-emitting element 20 . In the actual application of the LED lamp in the present invention, it is preferable to use the connection method of interference fit or spot welding process. It can be understood that, in other embodiments, according to different needs, the connection between the connecting portion 33 of the upper housing 30 and the bottom wall 12 of the outer cover 10 can be screwed (see FIG. 3 ) or riveted (see FIG. 3 ). Figure 4) way to connect and fix. In order for the upper case 30 to have good heat dissipation performance, the connecting portion 33 is integrally formed with the heat dissipation wall 31 and made of a material with good heat dissipation function. In this embodiment, the connecting portion 33 and the heat dissipation wall 31 can be integrally formed by aluminum alloy.

可以理解,本实施例中LED灯具100在使用时,其外罩10周壁11及上壳体30的散热壁31是用于对该发光元件20进行散热的散热装置。具体地,定义所述外罩10中的周壁11为第一散热路径H1,所述上壳体30中的散热壁31为第二散热路径H2,所述第一散热路径H1与所述第二散热路径H1的比值为1:100到10:1。当本实施例中LED灯具100发光作业时,其发光元件20产生的热量通过底壁12后沿周壁11及散热壁31两端散去,由上可知,由于第一散热路径H1与第二散热路径的H2的大小相当,使得周壁11被连接板30隔离的上下两部分具有均衡的散热能力,进而提高了LED灯具100整体的散热效率。优选的,所述第一散热路径H1与所述第二散热路径H2的比值为1:1。It can be understood that when the LED lamp 100 in this embodiment is in use, the peripheral wall 11 of the outer cover 10 and the heat dissipation wall 31 of the upper housing 30 are heat dissipation devices for dissipating heat from the light emitting element 20 . Specifically, the peripheral wall 11 in the outer cover 10 is defined as the first heat dissipation path H1, the heat dissipation wall 31 in the upper housing 30 is defined as the second heat dissipation path H2, and the first heat dissipation path H1 is connected with the second heat dissipation path. Path H1 has a ratio of 1:100 to 10:1. When the LED lamp 100 in this embodiment is working, the heat generated by the light-emitting element 20 passes through the bottom wall 12 and dissipates along the peripheral wall 11 and the two ends of the heat dissipation wall 31. It can be seen from the above that due to the first heat dissipation path H1 and the second heat dissipation path The size of the path H2 is equal, so that the upper and lower parts of the peripheral wall 11 separated by the connecting plate 30 have a balanced heat dissipation capability, thereby improving the overall heat dissipation efficiency of the LED lamp 100 . Preferably, the ratio of the first heat dissipation path H1 to the second heat dissipation path H2 is 1:1.

为了达到本实施例中发光元件20进行正常的发光以及散热,所述LED灯具100还包括设置在所述发光元件20与所述底壁12之间的电路板40。进一步地,所述电路板40与所述底壁12之间设置有热界面材料(图中未示出),填补电路板40与外罩10底壁12接合或接触时产生的微空隙及表面凹凸不平的孔洞,减少传热接触热阻,提高电路板40和底壁12的散热性能,以便将发光元件20所散发的热量快速导给上壳体30。本实施例在具体使用的过程中,电路板40可以采用导热胶这种热界面材料粘接在底壁12朝向周壁11的一侧。可以理解,本实施例中,用于固定发光元件20的底壁12可以为电路板40。In order to achieve normal light emission and heat dissipation of the light emitting element 20 in this embodiment, the LED lamp 100 further includes a circuit board 40 disposed between the light emitting element 20 and the bottom wall 12 . Further, a thermal interface material (not shown in the figure) is provided between the circuit board 40 and the bottom wall 12 to fill the micro-gap and surface unevenness generated when the circuit board 40 is bonded or contacted with the bottom wall 12 of the housing 10 The uneven holes reduce the heat transfer contact resistance and improve the heat dissipation performance of the circuit board 40 and the bottom wall 12 so as to quickly conduct the heat emitted by the light emitting element 20 to the upper casing 30 . During the specific use of this embodiment, the circuit board 40 may be bonded to the side of the bottom wall 12 facing the peripheral wall 11 by using a thermal interface material such as thermal conductive glue. It can be understood that, in this embodiment, the bottom wall 12 for fixing the light emitting element 20 may be a circuit board 40 .

为了便于对本实施例的LED灯具100的使用,该LED灯具100还包括挂钩50,使得该LED灯具100在使用,通过挂钩50可以方便地把该LED灯具100进行悬挂起来,用于照射其外罩10周壁11所对应的场合中。可以理解,所述挂钩50设于所述上壳体30的顶壁32上。In order to facilitate the use of the LED lamp 100 of this embodiment, the LED lamp 100 also includes a hook 50, so that the LED lamp 100 can be conveniently hung through the hook 50 to illuminate its outer cover 10 when the LED lamp 100 is in use. In the case where the surrounding wall 11 corresponds. It can be understood that the hook 50 is disposed on the top wall 32 of the upper casing 30 .

可以理解,本实施例中LED灯具100在工作时,其发光元件20工作时所产生的热量是由热界面材料传导至底壁12,经由所述底壁12传导至外罩10的周壁11及上壳体30的散热壁31上进行扩散、散热。所述周壁11和散热壁31的表面同时通过辐射方式和对流方式向外界进行散热。其中决定本实施例中LED灯具100散热效率的散热路径存在的总热阻等于散热路径各个环节热阻之和。LED灯具通电工作足够时间后,在一定的环境温度和空气流速条件下,LED灯具整体会达到一热平衡,此时LED灯具的发光元件20的温度和空气之间的温度差Δt谓之LED灯具的结温升,其中LED灯具结温升越低则意味着LED的预期寿命越长。It can be understood that in this embodiment, when the LED lamp 100 is working, the heat generated by the light-emitting element 20 is conducted to the bottom wall 12 through the thermal interface material, and then to the peripheral wall 11 and the upper surface of the housing 10 via the bottom wall 12. Diffusion and heat dissipation are performed on the heat dissipation wall 31 of the casing 30 . The surfaces of the peripheral wall 11 and the heat dissipation wall 31 dissipate heat to the outside through both radiation and convection. The total thermal resistance of the heat dissipation path that determines the heat dissipation efficiency of the LED lamp 100 in this embodiment is equal to the sum of the thermal resistances of all links in the heat dissipation path. After the LED lamp is energized for a sufficient time, under certain ambient temperature and air velocity conditions, the LED lamp as a whole will reach a thermal equilibrium. At this time, the temperature difference Δt between the temperature of the light-emitting element 20 of the LED lamp and the air is called the temperature difference of the LED lamp. Junction temperature rise, where the lower the junction temperature rise of LED lamps, the longer the expected life of the LED.

下面就影响LED灯具结温升的因素做如下分析:The factors that affect the junction temperature rise of LED lamps are analyzed as follows:

由以上对散热路径的分析可知LED灯具的发光元件20到散热表面为至是传导散热,由LED灯具各散热表面到外界环境之间有辐射和对流这两种方式散热,由于不同的散热方式涉及不同的影响因素及计算方法,下面进行分别讨论:From the above analysis of the heat dissipation path, it can be known that the heat dissipation from the light-emitting element 20 of the LED lamp to the heat dissipation surface is conduction heat dissipation, and there are two ways of heat dissipation from the heat dissipation surface of the LED lamp to the external environment: radiation and convection. Since different heat dissipation methods involve Different influencing factors and calculation methods are discussed separately below:

1、在发光元件20到该LED灯具各散热表面为至的传导散热过程中,影响结温升Δt的因素有LED的耗散功率、散热路径上各种散热材料的导热系数、导热体的截面积、传热路径的长度等四项。故此,本段传热路径的温差可用一下公式表达:1. During the conduction heat dissipation process from the light-emitting element 20 to each heat dissipation surface of the LED lamp, the factors affecting the junction temperature rise Δt include the dissipation power of the LED, the thermal conductivity coefficient of various heat dissipation materials on the heat dissipation path, and the cutoff of the heat conductor. Area, length of heat transfer path and other four items. Therefore, the temperature difference in this section of the heat transfer path can be expressed by the following formula:

Δt1=L·Q1/K·A;Δt1=L·Q1/K·A;

其中,Q1表示LED灯具的耗散功率,单位为W;K表示导热系数,单位为W/m·℃;A表示导热体的截面积,单位为m2;Δt1表示本段传热路径两端温差,单位为℃;L表示传热路径长度,单位为m。Among them, Q1 represents the dissipation power of the LED lamp, in W; K represents the thermal conductivity, in W/m·℃; A represents the cross-sectional area of the heat conductor, in m 2 ; Δt1 represents the two ends of the heat transfer path in this section Temperature difference, the unit is °C; L represents the heat transfer path length, the unit is m.

本实施例采用了将发光元件20尽量分散布置的布局方案,使得单位散热材料上的等效散耗功率Q1大幅度减小,同时增加了等效的导热体截面积,另外还充分利用结构设计使得LED的散耗热量向连接板30中心和外罩10以尽量相等的距离传热,以达到更好的散热效果。This embodiment adopts the layout scheme of distributing the light emitting elements 20 as much as possible, so that the equivalent power dissipation Q1 on the unit heat dissipation material is greatly reduced, and at the same time, the equivalent cross-sectional area of the heat conductor is increased, and the structural design is also fully utilized. The dissipated heat of the LED is transferred to the center of the connection board 30 and the outer cover 10 at an equal distance as far as possible, so as to achieve a better heat dissipation effect.

2、由LED灯具的各散热表面向环境散热的环节中,其对流方式进行热传导中影响结温升Δt的因素有换热系数、有效换热面积、换热表面与流体的温差等三个因素。具体可以用以下公式表达如下:2. In the process of dissipating heat from the heat dissipation surfaces of LED lamps to the environment, the factors that affect the junction temperature rise Δt in the convective heat conduction include three factors: heat transfer coefficient, effective heat transfer area, and temperature difference between the heat transfer surface and the fluid. . Specifically, it can be expressed as follows:

Δt2=Q2/hc·A;Δt2=Q2/hc·A;

其中,Q2表示对流散热量,单位为W;hc表示换热系数,单位为W/m2·A;A表示有效换热面积,单位为m2;Δt2表示换热表面与流体温差,单位为℃。Among them, Q2 represents the amount of convective heat dissipation, in W; hc represents the heat transfer coefficient, in W/m 2 A; A represents the effective heat transfer area, in m 2 ; Δt2 represents the temperature difference between the heat transfer surface and the fluid, in ℃.

本实施例由于本实施以整个LED灯具的内外表面作为有效换热面积,其面积已大于传统鳍片散热结构,因此本结构具有良好的对流散热效果。同时传统的鳍片散热结构并不太多考虑辐射散热的作用,事实上,由于鳍片之间相隔不远,辐射散热的作用被相邻鳍片的吸收作用几乎完全抵消而不起作用,但在本实施例的LED灯具100中,由于整个LED灯具的内外表面均为光滑的结构,因此,辐射散热也起到了很大的作用,这进一步降低了结温升Δt。In this embodiment, the inner and outer surfaces of the entire LED lamp are used as the effective heat exchange area, which is larger than the traditional fin heat dissipation structure, so this structure has a good convection heat dissipation effect. At the same time, the traditional fin heat dissipation structure does not consider the effect of radiation heat dissipation too much. In fact, because the fins are not far apart, the effect of radiation heat dissipation is almost completely offset by the absorption effect of adjacent fins. However, In the LED lamp 100 of this embodiment, since the inner and outer surfaces of the entire LED lamp are smooth, radiation heat dissipation also plays a significant role, which further reduces the junction temperature rise Δt.

综上所述,本实施例中LED灯具100充分利用了散热原理并合理布置了LED的布局及利用了所述外罩10的周壁11及所述上壳体30的散热壁31等固有LED灯具的构件设计了高效的散热结构,在有效降低LED结温升Δt的同时还降低了灯具成本、简化了装配工艺、保持了该LED灯具100具有整体的美观性。In summary, the LED lamp 100 in this embodiment makes full use of the principle of heat dissipation and rationally arranges the layout of LEDs and utilizes the inherent advantages of LED lamps such as the peripheral wall 11 of the outer cover 10 and the heat dissipation wall 31 of the upper casing 30. The components are designed with an efficient heat dissipation structure, which not only effectively reduces the temperature rise Δt of the LED junction, but also reduces the cost of the lamp, simplifies the assembly process, and maintains the overall aesthetics of the LED lamp 100 .

请参考图5、图6,为本发明第二实施例所揭示的LED灯具200,其包括外罩210、容纳在所述外罩210中的发光元件220及连接在所述外罩210上,用于散热的上壳体230。Please refer to FIG. 5 and FIG. 6, which are LED lamps 200 disclosed in the second embodiment of the present invention, which include a housing 210, a light-emitting element 220 accommodated in the housing 210 and connected to the housing 210 for heat dissipation The upper case 230.

相对于本发明第一实施例所提供的LED灯具100,本发明第二实施例所提供的LED灯具200,其结构与工作原理大致相同,主要区别在于:该LED灯具200的上壳体230内增设有一容置于所述上壳体230内的散热内壳234。所述散热内壳234为环形结构,且所述散热内壳234的一端与所述底壁212背离所述发光元件220的一面连接固定。本实施例中,优选地,所述散热内壳234的直径往背离所述外罩210的方向逐渐减小。所述散热内壳234与所述上壳体230间隔设置。其中所述散热内壳234可以根据需求,容纳于所述上壳体230,或者部分从所述上壳体230的顶壁232的开口部201部分伸出,其中所述开口部201设置在所述上壳体230的顶壁231上。可以理解,本发明所提供的LED灯具,设置有的散热内壳也可以与底壁设置成一体式结构,当然了,设置有的散热内壳也可以容置于所述外罩内。Compared with the LED lamp 100 provided in the first embodiment of the present invention, the structure and working principle of the LED lamp 200 provided in the second embodiment of the present invention are roughly the same, and the main difference lies in: the inside of the upper casing 230 of the LED lamp 200 A heat dissipation inner shell 234 accommodated in the upper shell 230 is additionally provided. The heat dissipation inner shell 234 has a ring structure, and one end of the heat dissipation inner shell 234 is connected and fixed to a side of the bottom wall 212 away from the light emitting element 220 . In this embodiment, preferably, the diameter of the heat dissipation inner shell 234 gradually decreases in a direction away from the outer cover 210 . The heat dissipation inner shell 234 is spaced apart from the upper shell 230 . Wherein the heat dissipation inner case 234 can be accommodated in the upper case 230 according to requirements, or partly protrude from the opening 201 of the top wall 232 of the upper case 230, wherein the opening 201 is arranged at the On the top wall 231 of the upper housing 230 . It can be understood that, in the LED lamp provided by the present invention, the heat dissipation inner case provided can also be provided as an integrated structure with the bottom wall, and of course, the heat dissipation inner case provided can also be accommodated in the outer cover.

本实施例中在外周210的底壁211上设计了一向上延展的散热内壳234,由此形成的烟囱效应,其在使用的过程中能够产生热对流,使因发光元件220工作所产生的热空气从所述散热内壳234内传导出去,从而使得LED灯具200具有优异的散热性能和散热效率,能够适用于大功率LED灯具,且有效地利用了该LED灯具200的空间,保障了该LED灯具200整体的美观性。In this embodiment, an upwardly extending heat dissipation inner shell 234 is designed on the bottom wall 211 of the outer periphery 210, and the chimney effect formed thereby can generate heat convection during use, so that the heat produced by the light emitting element 220 can The hot air is conducted out from the heat dissipation inner shell 234, so that the LED lamp 200 has excellent heat dissipation performance and heat dissipation efficiency, can be applied to high-power LED lamps, and effectively utilizes the space of the LED lamp 200, ensuring the The aesthetics of the LED lamp 200 as a whole.

当散热内壳234容纳于所述上壳体230时,所述挂钩250固定于所述上壳体230的顶壁232;当所述散热内壳234部分伸出所述上壳体230时,所述挂钩250固定于所述散热内壳234的顶部。所述散热内壳234不仅能有效利用空间和兼顾美观,还能将热量快速散发出去。When the heat dissipation inner shell 234 is accommodated in the upper shell 230, the hook 250 is fixed on the top wall 232 of the upper shell 230; The hook 250 is fixed on the top of the heat dissipation inner shell 234 . The heat dissipation inner shell 234 can not only effectively utilize the space and take into account the appearance, but also can dissipate heat quickly.

相较于本发明第一实施例所提供的LED灯具100,本发明第二实施例所提供的LED灯具200由于所述上壳体230朝背离所述发光元件220的方向延伸有一散热内壳234,进一步提高了本发明第二实施例所述提供的LED灯具200的散热效果。Compared with the LED lamp 100 provided in the first embodiment of the present invention, the LED lamp 200 provided in the second embodiment of the present invention has a heat dissipation inner shell 234 extending in a direction away from the light-emitting element 220 due to the upper casing 230 , further improving the heat dissipation effect of the LED lamp 200 provided in the second embodiment of the present invention.

请参考图7,为本发明第三实施例所揭示的LED灯具300。其包括外罩310、容纳在所述外罩310中的发光元件320及连接在所述外罩310上,用于散热的上壳体330。Please refer to FIG. 7 , which shows an LED lamp 300 disclosed in the third embodiment of the present invention. It includes an outer cover 310 , a light emitting element 320 accommodated in the outer cover 310 and an upper casing 330 connected to the outer cover 310 for heat dissipation.

相对于本发明第二实施例所提供的LED灯具200,本发明第三实施例所提供的LED灯具300,其主要区别在于:本发明第三实施例所提供的LED灯具300多设了一个散热内壳334,其中一个散热内壳334设置在上壳体330的内部,另一个散热内壳334从上壳体330顶壁332的开口部301部分伸出。可以理解,相对于第一实施例所提供的LED灯具100,本发明第三实施例所提供的LED灯具300也具有优异的散热性能和散热效果,能够把热量及时的排放出去,适用于大功率LED灯具。Compared with the LED lamp 200 provided by the second embodiment of the present invention, the main difference of the LED lamp 300 provided by the third embodiment of the present invention is that: the LED lamp 300 provided by the third embodiment of the present invention has an additional cooling The inner shells 334 , one of the heat dissipation inner shells 334 is disposed inside the upper casing 330 , and the other heat dissipation inner shell 334 protrudes from the opening 301 of the top wall 332 of the upper casing 330 . It can be understood that, compared with the LED lamp 100 provided in the first embodiment, the LED lamp 300 provided in the third embodiment of the present invention also has excellent heat dissipation performance and heat dissipation effect, can discharge heat in time, and is suitable for high-power LED lamps.

以上所述仅为本发明的较佳实施例而已,并不用于限制本发明,凡在本发明的精神和原则之内,所做的任何修改、等同替换、改进等,均应包括在本发明保护的范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the present invention. within the scope of protection.

Claims (14)

1. a LED lamp, it comprises outer cover and is contained in the light-emitting component in described outer cover, it is characterized in that, described outer cover comprises annular perisporium and is located at the diapire of described perisporium one end; Described light-emitting component is arranged on the one side of the contiguous described perisporium of described diapire; Described LED lamp comprises the upper shell be connected away from the one side of described perisporium with described diapire further, described upper shell comprise annular heat radiation wall, be located at the roof of described heat radiation wall one end and be located at the connecting portion of described another opposite end of heat radiation wall; Described connecting portion is extended to form by the end of the contiguous described outer cover of described heat radiation wall, and the diapire of described connecting portion and described outer cover is fixed away from the one side of described perisporium.
2. LED lamp according to claim 1, is characterized in that, the diameter of described perisporium is increased towards another direction, opposite end gradually by the one end being close to described diapire.
3. LED lamp according to claim 1, is characterized in that, the diameter of described heat radiation wall is increased towards the extreme direction being provided with described connecting portion gradually by the one end being provided with described roof.
4. LED lamp according to claim 1, is characterized in that, described LED lamp also comprises the circuit board be arranged between described light-emitting component and described diapire, is provided with thermal interfacial material between described circuit board and described diapire.
5. LED lamp according to claim 1, is characterized in that, one end of the contiguous described roof of described heat radiation wall offers louvre.
6. LED lamp according to claim 1, it is characterized in that, described heat radiation wall comprises the first radiating segment be connected with described connecting portion, by described first radiating segment away from the second radiating segment of one end bending extension of described connecting portion and by three radiating segment of described second radiating segment away from one end bending extension of described first radiating segment, described 3rd radiating segment is connected with described roof away from one end of described second radiating segment, described first radiating segment, described second radiating segment and described 3rd radiating segment are loop configuration, and one end that the diameter of described first radiating segment is close to described connecting portion by it reduces gradually towards the one end being close to described second radiating segment, one end that the diameter of described second radiating segment is close to described first radiating segment by it reduces gradually towards the one end being close to described 3rd radiating segment, the diameter of described 3rd radiating segment is reduced towards described roof gradually by one end of its contiguous described second radiating segment.
7. LED lamp according to claim 1, it is characterized in that, perisporium in described outer cover is the first heat dissipation path, and the heat radiation wall in described upper shell is the second heat dissipation path, and the ratio of described first heat dissipation path and described second heat dissipation path is 1:100 to 10:1.
8. LED lamp according to claim 7, is characterized in that, the ratio of described first heat dissipation path and described second heat dissipation path is 1:1.
9. LED lamp according to claim 1, it is characterized in that, described LED lamp also comprises the heat radiation inner casing be placed in described upper shell or outer cover, and described heat radiation inner casing is loop configuration, and the one side that one end of described heat radiation inner casing and described diapire deviate from described light-emitting component is fixed.
10. LED lamp according to claim 9, is characterized in that, the roof of described upper shell offers opening portion, is stretched out by described opening portion described heat radiation inner shell sections, and described heat radiation inner casing stretch out described opening portion part on offer louvre.
11. LED lamp according to claim 9, is characterized in that, the quantity of described heat radiation inner casing is at least one.
12. 1 kinds of LED lamp, it comprises a light-emitting component and a heat abstractor, described light-emitting component is dispelled the heat by described heat abstractor, it is characterized in that, this radiator comprises a upper shell and a lower house, described upper shell forms a loop configuration together with the lateral wall of lower house, and the diameter of this circulus increases toward lower house gradually from described upper shell; Described lower house extends internally out near one end of described upper shell a upper bottom portion, and described upper shell is fixedly connected with described upper bottom portion near one end of described lower house; Described light-emitting component is arranged on the side of upper bottom portion away from connecting portion.
13. LED lamp according to claim 12, is characterized in that, described connecting portion be an endless belt-shaped structure.
14. 1 kinds of LED lamp, it comprises outer cover and is contained in the light-emitting component in described outer cover, it is characterized in that, the lower outer cover that described outer cover comprises outer cover on one and is connected with upper outer cover, described upper outer cover extends internally out near the end of lower outer cover a junction, described lower outer cover is fixedly connected with described connecting portion near the end of upper outer cover, and described light-emitting component is arranged on the side of described connecting portion away from upper outer cover.
CN201410642848.4A 2014-11-14 2014-11-14 LED (light-emitting diode) lamp Pending CN104359058A (en)

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