1269493 九、發明說明： 【發明所屬之技術領域】 本發明係有關於-種電腦硬體技術，特別是有關於一 種多晶片插座型電路板晶片跨接震置，其可應用於搭配至 夕aa片插座型之i路板、且其晶片插座之間的連接線路 係採用—特定之匯流排架構，例如為HT (Hypwsp〇rt) ^之匯流排架構，用以插置至其中—或多個晶片插座上， 藉此而將另外—晶片插座上所插置的晶片裝置，例如為 AMD(Advanced Mi⑽Devices)之處理器晶片，以跨接方式 而电性連接至再另外之一晶片插座上所插置的晶片褒置， =另-鳩處理器晶片或—輸出入連 杈組晶片。 ’ 【先前技術】 =電腦的應用上，為了加強資料處理效能， 夕的電腦主機電路板已採用平行處理技術而設置有 二ί 晶片。此種多處理器型的電腦主機電路板 晶片來以平行方式處理資料，因此其 路板？ 然㈣於傳統之單處理器型的電腦主機電 處二=型電腦主機電路板的製造上，由於市場對 f造出R的需求’因此㈣便有需要設計及 雙處理器型、三處理二：機電路板，例如包括 廠商需針對雔# ㈤处理為型、等等；亦即製造 針對雙處理器型來設計一種電路板、並針對三 18132 1269493 。。型來。又β十再另一種電路板、再針對四處理器型來設計再 β另-種電路板；依此類推。然而此作法的一項缺點在於其 顯然將會大為增加薇商的製造成本而不符合成本效益。 業界因此而需求一種新的技術，其可讓使用者利用同 -種電路板即可隨意設計及製造出具有任意數目之處理器 的多處理器型硬體平台。 Μ 【發明内容】1269493 IX. Description of the Invention: [Technical Field] The present invention relates to a computer hardware technology, and more particularly to a multi-wafer socket type circuit board wafer jumper, which can be applied to match a-night The socket type i-way board and the connection line between the chip sockets adopt a specific bus bar structure, for example, a busbar architecture of HT (Hypwsp〇rt) ^ for interposing therein - or multiple On the chip socket, the chip device inserted on the other chip socket, for example, the processor chip of AMD (Advanced Mi (10) Devices), is electrically connected in a jumper manner to the other chip socket. The chipset is placed, = another processor chip or - the output chip. ‘[Prior Art] = In the application of the computer, in order to enhance the data processing performance, the computer main board of the eve has been equipped with parallel processing technology and has two wafers. This multi-processor type of computer main board chip to process data in parallel, so its board? However, (4) in the manufacture of the traditional single-processor type computer host computer two = type computer host circuit board, due to the market demand for R, so (four) there is a need to design and dual processor type, three processing two : The circuit board, for example, includes the manufacturer's need to deal with 雔# (5), and so on; that is, to design a circuit board for the dual processor type, and for the three 18132 1269493. . Type to come. Another beta circuit board, another four-processor type to design another circuit board; and so on. However, one of the disadvantages of this approach is that it will obviously increase the manufacturing cost of Weishang and is not cost effective. The industry therefore needs a new technology that allows users to design and manufacture multi-processor hardware platforms with any number of processors using the same board. Μ 【Contents】
鑒於以上所述習知技術之缺點，本發明之主要目的便 是在於提供-種多晶片插座型電路板晶片跨接裝置，其可 f使用者湘同-種電路板即可隨意設計及製造出具有任 意數目之處理器的多處理器型硬體平台。 本發明之另-目的在於提供一種多晶片插座型電路 板晶片跨接裝置，其可協助降低多處理器型電腦主機電蹈 板的製造成本。 本發明之多晶片插座型電路板晶片跨接裝置係設計 來應用於搭配至-多晶片插座型之電路板、且其晶片插座 之間的連接線路係採用-特定之匯流排架構，例如為町 (HyPerTransport)型之匯流排架構’用以插置至其中一或多 個晶片插座上，藉此而將另外一晶片插座上所插置的晶片 裝置，例如為AMD(Advanced Micro Devices)之處理器晶 片，以跨接方式而電性連接至再另外之座上所插 置的晶片裝置’例如為另—AMD處理器晶片或—輸出入 連接琿（I/O Port)模組晶片。 本發明之多晶片插座型電路板晶片跨接裝置的優點 18132 6 1269493 在於可讓使用者利用同一種電路板即可隨意設計及製造出 具有任意數目之處理器的多處理器型硬體平台，而不需針 對不同數目之處理器的需求來分別設計及製造各式不同的 電路板，因此可協助降低製造成本。 【實施方式】In view of the above-mentioned shortcomings of the prior art, the main object of the present invention is to provide a multi-wafer socket type circuit board wafer jumper device, which can be freely designed and manufactured by using the same type of circuit board. A multiprocessor hardware platform with any number of processors. Another object of the present invention is to provide a multi-wafer socket type circuit board wafer jumper which can assist in reducing the manufacturing cost of a multiprocessor type computer main circuit. The multi-wafer socket type circuit board wafer jumper device of the present invention is designed to be applied to a circuit board of a multi-chip socket type, and a connection line between the wafer sockets adopts a specific bus bar structure, for example, a town (HyPerTransport) type busbar architecture' for interposing on one or more of the chip sockets, thereby inserting a chip device inserted on another chip socket, such as a processor of AMD (Advanced Micro Devices) The chip is electrically connected in a bridging manner to a chip device inserted on another seat, such as another AMD processor chip or an I/O Port module chip. Advantages of the multi-wafer socket type circuit board wafer jumper device of the present invention 18132 6 1269493 is to enable a user to freely design and manufacture a multi-processor type hardware platform having any number of processors by using the same circuit board. Instead of having to design and manufacture a variety of different boards for different numbers of processors, it can help reduce manufacturing costs. [Embodiment]
以下即配合所附之圖式，詳細揭露說明本發明之多晶 片插座型電路板晶片跨接裝置之實施例。 曰 第1A圖即顯示本發明之多晶片插座型電路板晶片跨 接裝置100搭配至一多晶片插座型電路板1〇的基本應用架 構。如圖所示，本發明所適用之多晶片插座型電路板ι〇/'DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the polycrystalline chip socket type circuit board wafer jumper of the present invention will be described in detail in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A shows a basic application architecture of the multi-wafer socket type circuit board wafer jumper 100 of the present invention coupled to a multi-chip socket type circuit board. As shown in the figure, the multi-chip socket type circuit board ι〇/' to which the present invention is applied
上須設置有複數個晶片插座，包括一第一晶片插座u、一 第二晶片插座12、一第三晶片插座13、和一第四晶片插座 14(註：於第！圖所示之實施例中，僅以4個晶片插座為例 作說明；但於具體實施上，晶片插座的數目並無限制），而 此些晶片插座11、12、13、14之間的匯流排線路31、32、 33必須為採用一種特定之匯流排架構，例如為 (HyperTransport)型之匯流排架構。 於貝IV、應用上，上述之多晶片插座型之電路板i 〇上 的第一晶片插座11上插置有一第一晶片裝置21，例如為 -採用HT型匯流排架構的AMD(Advanced Mi⑽Devices) 之處理器晶片；第三晶片插座13則插置有—外搭之晶片裝 置23;而第四晶片插座14則插置有另—外搭之晶片裝置 24。本發明之多晶片插座型電路板晶片跨接裝置_即可 例如用來插置至上述之多晶片插座型之電路板上的第 18132 7 1269493 弟二晶片插座12,用以將該第一晶片插座u上所插置的 第一晶片裳置21以跨接方式經由該第二晶片插座12而電 性連接至該第三晶片插座13上所插置的晶片裝置以。 於第1A圖所示之應用實施中，若第-晶片插座η插 置處理时曰曰片、而第一晶片插座12插置本發明之多晶片 插座型電路板晶片跨接裝置100，則即可構成一單處理器 型電腦主機電路板。反之，如第1Β圖所示，若將第二晶 片插座12上所插置的本發明之多晶片插座型電路板晶片 跨接裝置1〇0拔除，再將-處理器晶片22_第二晶片 插座12’則即可構成—雙處理器型電腦主機電路板。於呈 體實施上，晶片插座η、12、13、14_1^#ΜΜ2Γ、 22娃23、24均必須可支援ΗΤ (咖价咖州型之匯 架構。 此外，若將二個輸出入連接4⑽㈣模組晶片^、 24分別差插置於第三晶片插座13和第四晶片插座μ，則 可用以實現-如第4圖所示之雙處理器應硬體架構。 第2A圖即顯示本發明之多晶片插座型電路板晶片跨 接衣置100的第一實施例的結構形態’其至少包含： 框架110 ;⑻-第-群組之電性接點⑵；⑷一第二群组 之電性接點Π2;以及⑷-群組之電性連接線路13〇。第 2B圖則顯示本發明之多晶片插座型電路板晶片跨接 的第二實施例100,。 、 框架no例如為-四方體之印刷電路板，其形狀 係大致對應至其所將插置的第三晶片插座13。於具體實施 18132 8 1269493 t ’此框架m的形狀可例如製成大致相同 的封裝體的形狀。 义！的日日片 第一群組之電性接點121係 一側邊的底端上，且盆實施方& U〇的 球(即相同於一般之晶片上:广列如 卜χ 又之曰曰片上吊見之針狀接腳或銲球）；1中 母一個電性接點121係對應？筮二曰 ^ Τ ._ w至弟二晶片插座13與第一曰ΰ 插座11之間的每一條匯治姐細a 、乐 日日片 B 仏匯机排線路31，用以插合至 晶片插座13上而電性接觸至 至該弟二 a u , /第一日日片插座13與該繁一 晶片插座η之間的匯流排線路 ^ 施例中’僅以5個電性接點^ ®所7F之貫· 〜, 接點為例作示範性說明；但於且# 貝施^此些電性接點的數目可能為上百個）。 4 第二群組之電性接點122 另一側邊（其可如第2A_ - ^置於上述之框架110的 ㈣ $ A圖所讀地為相鄰至第-群电之带 性接點121所在的側邊、弋| ^。 $、、且之甩 第心々千弟⑼圖所示般地為相對至 =群組之電性接點121所在的側邊)的底端上，且其二 式例如為製成針狀接腳或銲 Λ e 100 ^ 于衣，其中母一個電性接點 2係對應至該匯流排架構 ”、 5兮筮二日u 1 r的母條線路，用以插合 Μ罘一日日片插座13上而電性接 曰 與該第一曰Η杯 n q罘二日日片插座13 弟…曰片插座12之間的匯流排線路32。 ^連接線路13()係安置於上述之框架〗 如為印刷式之導電線路，用以將上述之第一群 、、、电生接點1 2 1分別電性連接至篦_ 122 〇 ^ ^ . 硬接至弟一群組之電性接點 此些電性連接線路13()可 蠻曲太斗、、击枝 > 弟2 A圖所示般地以直角 弓曲方式連接該框架11〇 两 個相鄰側邊上的第一群組之 18132 9 1269493 电性接點121和第二群組之電性接 卜 示般地以直線方式連接該_ 11()^ 、或如第2B圖所 —女^ 扎木110之二個相對側邊上的第 ^且之電性接點12i和第二群組之電性接點122(註於 ^圖所Μ實施财，僅以5條魏連接線路為例作 說明；但於具體實施上，此些電性連接線路的數目 此為^百個；且若此些電性連接線路的數目眾多，則可 歹1如用多層方式來設計此些電性連接線路的佈局）。 :3圖即顯示本發明的另一個應用實例。如圖所示， ^有:夕晶片插座型電路板4〇上設置有6個晶片插座 43 44、45、46、且假設廠商欲利用此多晶片插 ^型之電路板40來製做一個三處理器型電腦主機電路 板，則廠商可將3個處理器晶片分別 插座4i、42、44、並同時 ，、T 4個日日片 」守將乐2B圖所不之本發明之多晶 片插座型電路板晶片跨接裝置的第二實施例·插置至第 5個晶片插座4 5，即可劁傲φ ^ . 丨j衣做出一個二處理器型電腦主機電 路板。 總而言之，本發明提供了一種新穎之多晶片插座型電 =板晶片跨接裝置，其可應用於搭配至-多晶片插座型之 電路板、且此電路板上的晶片插座之間的匯流排線路係採 用一特定之匯流排架構’用以插置至其中一或多個晶片插 座上：藉此而將另外一晶片插座上所插置的晶片裝置以跨 ^方式而電性連接至再另外之―晶片插座上所插置的晶片 裝置。本發明之多晶片插座型電路板晶片跨接裝置的優點 在於可讓使用者利用同一種電路板即可隨意設計及製造出 18132 10 1269493 具有任意數目之處理器的多處理器型硬體平台，而不需針 對不同數目之處理益的需求來分別設計及製造各式不同的 電路板，因此可協助降低製造成本。本發明因此較先前技 術具有更佳之進步性及實用性。 以上所述僅為本發明之較佳實施例而已，並非用以限 定本發明之實質技術内容的範圍。本發明之實質技術内容 係廣義地定義於下述之申請專利範圍中。若任何他人所完 成之技術實體或方法與下述之申請專利範圍所定義者為= 全相同、或是為-種等效之變更，均將被視為涵蓋於本： 明之申請專利範圍之中。 【圖式簡單說明】 示本發明之多 晶片插座型電 第1A圖為一應用架構示意圖，其中顯 晶片插座型電路板晶片跨接裝置搭配至一多 路板的架構形態； 1A圖所示 路板的架 第1B圖為一應用架構示意圖，其中顯示第 之多晶片插座型電路板於用以實現一雙處理器恭 構形態； °° t 第2A圖為一結構示意圖，其中顯示本發明夕曰 插座型電路板晶片跨接裝置的第一實施例； 夕曰曰 第圖為一結構示意圖，其中顯示本發 曰 插座型電路板晶片跨接裝置的第二實施例； 曰曰 第3圖為一應用實例示意圖’其中顯示本笋A plurality of chip sockets are disposed, including a first chip socket u, a second chip socket 12, a third wafer socket 13, and a fourth wafer socket 14. (Note: the embodiment shown in Fig. In the following, only four wafer sockets are taken as an example; however, in the specific implementation, the number of wafer sockets is not limited, and the bus bars 31, 32 between the chip sockets 11, 12, 13, and 14. 33 must be a specific bus architecture, such as a (HyperTransport) type bus structure. In the above, the first wafer device 11 is inserted into the first wafer socket 11 on the multi-chip socket type circuit board i, for example, AMD (Advanced Mi (10) Devices) adopting the HT type bus bar structure. The processor chip is inserted; the third chip socket 13 is inserted with the external wafer device 23; and the fourth wafer socket 14 is inserted with the external wafer device 24. The multi-wafer socket type circuit board wafer jumper device of the present invention can be used, for example, to be inserted into the above-mentioned multi-chip socket type circuit board, the 18132 7 1269493 second chip socket 12 for the first wafer The first wafer skirt 21 inserted in the socket u is electrically connected to the wafer device inserted on the third wafer socket 13 via the second wafer socket 12 in a bridging manner. In the application implementation shown in FIG. 1A, if the first wafer socket n is inserted into the wafer and the first wafer socket 12 is inserted into the multi-wafer socket type circuit board wafer jumper 100 of the present invention, It can form a single processor type computer host circuit board. On the other hand, as shown in FIG. 1 , if the multi-wafer socket type circuit board wafer jumper device 1 0 of the present invention is inserted on the second wafer socket 12, the processor chip 22_second wafer is removed. The socket 12' can be constructed as a dual processor type computer main board. In the implementation of the presentation, the chip sockets η, 12, 13, 14_1^#ΜΜ2Γ, 22 wa 23, 24 must be able to support ΗΤ (the price of the coffee state type of the sink structure. In addition, if the two outputs are connected to the 4 (10) (four) mode The group wafers ^, 24 are respectively inserted into the third wafer socket 13 and the fourth wafer socket μ, and can be used to implement - the dual processor hardware structure as shown in Fig. 4. Fig. 2A shows the invention The structural form of the first embodiment of the multi-wafer socket type circuit board wafer jumper clothing 100 includes at least: a frame 110; (8) - a group-group electrical contact (2); (4) a second group of electrical properties Contact Π2; and (4)-group electrical connection line 13A. Fig. 2B shows a second embodiment 100 of the multi-wafer socket type circuit board wafer of the present invention, the frame no is, for example, a tetragonal The printed circuit board has a shape substantially corresponding to the third wafer socket 13 to be inserted. The specific shape of the frame m can be, for example, made into a substantially identical shape of the package. The first group of electrical contacts 121 are on the bottom side of one side, and The ball of the implementer & U〇 (that is, the same as the general wafer: a needle-like pin or a solder ball that is hanged on the cymbal of the cymbal), and a female contact 121 in the middle筮 曰 曰 Τ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The chip socket 13 is electrically connected to the bus line between the first day au, the first day chip socket 13 and the conventional chip socket η. In the embodiment, only five electrical contacts are provided. ®7F··, the contact is taken as an example for demonstration; however, the number of such electrical contacts may be hundreds or more. 4 The second group of electrical contacts 122 the other side (which can be placed as the 2A_-^ in the above-mentioned frame 110 (4) $ A map reads the adjacent to the first-group electric band contact The side where 121 is located, 弋| ^. $, and 甩 甩 甩 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( The second type is, for example, a pin-shaped pin or a soldering iron e 100 ^ in a garment, wherein one female electrical contact 2 corresponds to the busbar structure, and the mother rail line of the second-day u 1 r, The busbar line 32 is used for plugging in the day-to-day chip socket 13 and electrically connecting with the first cup cup nq罘 two-day chip socket 13 brother... the chip socket 12. 13() is placed in the above framework. If it is a printed conductive circuit, it is used to electrically connect the first group and the electric contact 1 1 1 to 篦 122 122 〇 ^ ^. The electrical connection of the group to the younger brothers, these electrical connection lines 13 () can be quite strutting, hitting the branch, as shown in the figure 2 A, the frame is connected at right angles. First group on adjacent sides The group 18132 9 1269493 electrical contact 121 and the second group of electrical connections are connected in a straight line to the _ 11 () ^, or as in Figure 2B - female ^ Zhamu 110 two relative The electrical contact 12i on the side and the electrical contact 122 of the second group (indicated in the implementation of the figure, only 5 Wei connection lines are taken as an example; but in the specific implementation In the above, the number of the electrical connection lines is one hundred; and if the number of the electrical connection lines is large, the layout of the electrical connection lines can be designed by using multiple layers. The figure shows another application example of the present invention. As shown in the figure, there are: 6 wafer sockets 43 44, 45, 46 provided on the chip-type circuit board 4, and it is assumed that the manufacturer wants to use the multi-chip insertion. ^ Type of circuit board 40 to make a three-processor type computer host circuit board, manufacturers can put 3 processor chips respectively socket 4i, 42, 44, and at the same time, T 4 Japanese film "Shou Le 2B is a second embodiment of the multi-wafer socket type circuit board wafer jumper of the present invention, which is inserted into the fifth chip socket 4 5 , you can be proud of φ ^ . 丨j clothing to make a two-processor computer host circuit board. In summary, the present invention provides a novel multi-wafer socket type electrical=board wafer jumper that can be applied to a busbar lined up to a multi-chip socket type circuit board and between the wafer sockets on the circuit board. Using a specific bus bar structure for interposing into one or more of the chip sockets: thereby electrically connecting the chip devices inserted on the other chip sockets to each other in a cross manner - A wafer device inserted on a wafer socket. The multi-wafer socket type circuit board wafer jumper device of the present invention has the advantages that the user can freely design and manufacture the 18132 10 1269493 multi-processor type hardware platform with any number of processors by using the same circuit board. Instead of having to design and manufacture a variety of different boards for different amounts of processing benefits, it can help reduce manufacturing costs. The present invention therefore has better advancement and utility than prior art. The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the technical scope of the present invention. The technical contents of the present invention are broadly defined in the following claims. If any technical entity or method completed by any other person is defined as the same or equivalent to the definition of the patent application scope described below, it shall be deemed to be covered by this: . BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic diagram of an application architecture in which a wafer socket type circuit board wafer jumper is matched to a multi-path board structure form; FIG. 1B is a schematic diagram of an application architecture, wherein the first multi-chip socket type circuit board is used to implement a dual processor configuration; °° t is a structural diagram showing the present invention. A first embodiment of a socket type circuit board wafer jumper device; a first schematic view showing a second embodiment of the hairpin socket type circuit board wafer jumper device; A schematic diagram of an application example
月插座型電路板晶片跨接裝置應用於製做-個四X處理哭; 電腦主機電路板的一個應用實例； W 18132 11 1269493 第4圖為一應用架構示意圖，其中顯示本發明之多晶 片插座型電路板晶片跨接裝置所實現之一雙處理器硬體架構。 【主1011121314 21 22232431323340414243444546 1〇0 要元件符號說明】 多晶片插座型電路板 弟一晶片插座 弟一晶片插座 弟二晶片插座 第四晶片插座 晶片裝置（處理器） 晶片裝置（處理器） 晶片裝置（輸出入連接埠模組晶 晶片裝置（輸出入連接埠模組晶 匯流排線路（HT) 匯流排線路（HT) 匯流排線路（HT) 多晶片插座型電路板 弟一晶片插座 弟二晶片插座 弟二晶片插座 弟四晶片插座 弟五晶片插座 弟六晶片插座 本發明之多晶片插座型電路板晶 片）片） 片跨接裝置 18132 12 1269493 100， (第一實施例） 本發明之多晶片插座型電路板晶片跨接裝置 110 (第二實施例） 框架 121 第一群組之電性接點 (第一實施例） 12Γ 第一群組之電性接點 (第二實施例） 122 第二群組之電性接點 (第一實施例） 122， 第二群組之電性接點 (第二實施例） 130 電性連接線路（第一 實施例） 130’ 電性連接線路（第二 實施例） 13 18132Monthly socket type circuit board wafer jumper device is applied to manufacture - four X processing crying; an application example of computer host circuit board; W 18132 11 1269493 Fig. 4 is a schematic diagram of an application architecture, showing the multi-chip socket of the present invention A dual-processor hardware architecture implemented by a type of board wafer jumper. [Main 1011121314 21 22232431323340414243444546 1〇0 Description of the symbol of the component] Multi-chip socket type circuit board, one chip socket, one chip socket, the second chip socket, the fourth wafer socket chip device (processor), the chip device (processor), the chip device ( Input and output port 埠 module crystal chip device (input and output port 晶 module crystal bus bar line (HT) bus bar line (HT) bus bar line (HT) multi-chip socket type circuit board brother one chip socket brother two chip socket brother Two-chip socket, four-chip socket, five-chip socket, six-chip socket, multi-wafer socket type circuit board wafer of the present invention)) chip-span device 18132 12 1269493 100, (first embodiment) multi-chip socket type of the present invention Circuit board wafer jumper device 110 (second embodiment) frame 121 first group of electrical contacts (first embodiment) 12 Γ first group of electrical contacts (second embodiment) 122 second group Group of electrical contacts (first embodiment) 122, second group of electrical contacts (second embodiment) 130 electrical connection lines (first embodiment) 130' electrical connection line (second embodiment) 13 18132