525317 五、發明說明（1) 【發明領域】 本發明係提供一種防止端子轉動的方法，尤指一種防 止墊片柵袼陣列（Land Grid Package，LGP)型電連接哭端 子因轉矩不均而轉動的方法。 【發明背景】^ 按，隨電腦業發展，中央處理單元（Central Processing Unit，cpu)、晶片模組以及電連接器等組件 本身之結構越來越複雜，其功能亦越來越強大，故其對各 =件相互連接之精確性及可靠性要求亦越來越高。為匹配 :央處理器、晶片模組及電路板性能之需要，舆其對接之 ，連接器端子大都為高密度之陣列式電訊端子，因而，目 則業界廣泛採用之連接方式係柵格式陣列錫球焊接（以η =，BGA )。惟’習知的電連接器採用BGA方式將 央處理器、晶片模組及電路板黏接的成本較高、生產不 由於電連接器的焊接高度較高而使電連接器佔用體 p積較大。是以，業界又引入塾片栅格陣列型（Land Grid Package，LGP)的晶片模組封裝方式，相關之習知技術如 =專利=553，192、5,3 95,252號所揭示。請參 圖所不，積體電路模組17具有接觸墊2〇 15具有接觸塾37於上表S，端子14係大致^表形面，二路： :上臂26及-下臂27 ’自下臂27末端f折成—焊接、二括以 2〇與上臂26藉接觸部32而電訊接i U、！17之接觸塾 惟’由於端子u僅以表面黏著於電路板15上之接觸塾 525317 五、發明說明（2) 37上’該焊接結構強度不大，且中央處理 高溫也會降低焊接結構強度，又由於：】：產生的 組！7下魔及連接器的絕緣本體（未圖示片模 而下移’使端子U於電路板15之接觸塾37=^17:屋 •向之轉矩，是以，焊接部28極易從 = T針方 上剝離。又，連接器的絕緣本體(未電圖路_、板=之！_ 壓亦會下移，從而導致端子“變形歪斜τ, 晶片严組17 ,接觸墊20間的接觸力產生變異:、進而導致晶 片組17與端子14接觸*良’使電訊傳輸之穩定 =525317 V. Description of the invention (1) [Field of the invention] The present invention provides a method for preventing the terminal from rotating, especially a method for preventing the land grid grid (LGP) type electrical connection crying terminal from being uneven in torque. Method of rotation. [Background of the Invention] ^ According to the development of the computer industry, the structures of components such as the Central Processing Unit (CPU), chip modules, and electrical connectors are becoming more and more complex, and their functions are becoming more and more powerful. The requirements for the accuracy and reliability of the interconnection of each piece are also increasing. In order to match: the performance requirements of the central processor, chip module and circuit board, most of the connector terminals are high-density array telecommunication terminals. Therefore, the connection method widely used in the industry is grid array tin. Ball welding (with η =, BGA). However, the conventional electrical connector uses the BGA method to bond the central processor, chip module and circuit board. The cost is higher, and the production of the electrical connector occupies less p product due to the higher welding height of the electrical connector. Big. Therefore, the industry has also introduced a chip-grid array (LGP) chip module packaging method, and the related conventional technologies are disclosed in = patent = 553,192, 5,3 95,252. Please refer to the figure. The integrated circuit module 17 has contact pads 205 and contacts 塾 37 in the above table S. The terminal 14 is a roughly ^ surface, two ways: upper arm 26 and -lower arm 27 'from below The end f of the arm 27 is folded-welded, enclosed by 20, and the upper arm 26 is connected by telecommunication i U, via the contact portion 32! The contact of 17 塾 'because the terminal u only adheres to the surface of the circuit board 15 525317 5. Description of the invention (2) 37' The welding structure is not strong, and the high temperature of the central processing will also reduce the strength of the welding structure. Also due to:]: The group produced! 7 Lower the insulation body of the connector and the connector (not shown, move the die down to make the terminal U contact with the circuit board 15) 37 = ^ 17: the torque of the house, so the soldering part 28 is easy to remove = The T pin is peeled off. In addition, the connector's insulating body (unelectrical circuit _, board = of it! _) Will also move downwards, which will cause the terminal “deformation and distortion τ, chip string 17, contact pad 20” Variation of the contact force: This will cause the chipset 17 to contact the terminal 14 * good 'to stabilize the telecommunication transmission =
保卩爭，甚而在接觸點32與接觸墊2〇間產生錯位，而 J 片模組17與電路板15間形成斷路，導致系統的失效。日曰 【發明目的】 。。本發明之目的在於提供一種防止墊片柵格陣列型電 接器端子轉動的方法，實施該方法可以防止端子由於轉 不均而轉動，藉此可平衡端子轉矩並可防止端子焊接部 接觸墊上剝離，從而保障電訊傳輸之穩定性。 【發明特徵】 本發明之防止端子轉動的方法，係包括分別製出端子 及與端子相應設置之絕緣本體，其中端子係設有焊接部、 固持部及懸臂，該焊接部係以表面黏著技術黏著於電路板 之接觸墊上’固持部係固持於絕緣本體内，懸臂係自焊接 部一端斜向上延伸而出，懸臂末端設有一接觸部以與晶片 模組之接觸塾接觸，其特徵在於：在製造端子時，自端子 之焊接部縱向向外或自焊接部兩側橫向向外凸出至少—凸 第5頁 525317 五、發明說明（3) 出部’再在 部位置處開 部卡置於相 依據上 焊接部的焊 加於焊接部 離’進而可 而確保接觸 組之接觸墊 【圖式簡單 第一圖係由 之立 第二圖係第 第三圖係第 第四圖係第 示意 第五圖係由 之立 第六圖係第 第七圖係第 第八圖係第 第九圖係第 示意 第十圖係習 製造絕緣本體時，於奶 六 、、、、巴緣本體内對應前述凸出 設有可各置端子凸，屮立β々上# , ^ ^ ^ ^ ^ 出口p之卡槽，並使端子凸出 應§又置之 '纟巴緣本體的卡槽内。 述之發明特徵’藉凸出部之作肖，不僅可增大 接面積從而增強焊接結㈣度，而且可平衡施 的轉矩，防止焊接部從電路板之接觸墊上剥 防止懸臂因焊接部變形所引發的變形歪斜，進 力的一致性，並且可以使端子接觸部與晶片模 不會產生錯位，保障電訊傳輸之穩定性。 說明】 本發明方法所實施之電連接器端子第一實施例 體圖。 一貫施例端子所對應之絕緣本體之俯視圖。 二圖沿Π- Π線方向之剖視圖。 一實施例端子使用於晶片模組及電路板之組合 圖。 本發明方法所實施之電連接器端子第二實施例 體圖。 二實施例端子所對應之絕緣本體之俯視圖。 六圖沿VE - VII線方向之剖視圖。 六圖沿Μ- Μ線方向之剖視圖。 二實施例端子使用於晶片模組及電路板之組合 圖。 知電連接器端子使用於晶片模組及電路板之組As a result of the dispute, a misalignment even occurred between the contact point 32 and the contact pad 20, and a disconnection was formed between the J-chip module 17 and the circuit board 15, resulting in the failure of the system. Day [Objective of the invention]. . The purpose of the present invention is to provide a method for preventing the rotation of the pad grid array type electrical connector terminal, and the method can prevent the terminal from rotating due to uneven rotation, thereby balancing the terminal torque and preventing the contact pad of the terminal soldering part from touching the pad. Stripped to ensure the stability of telecommunications transmission. [Features of the invention] The method for preventing the terminal from rotating according to the present invention includes separately manufacturing the terminal and an insulating body corresponding to the terminal, wherein the terminal is provided with a welding part, a holding part and a cantilever, and the welding part is adhered by a surface adhesion technique The 'holding part' on the contact pad of the circuit board is fixed in the insulating body, the cantilever is extended obliquely upward from one end of the soldering part, and a contact part is provided at the end of the cantilever to contact the contact 塾 of the chip module, which is characterized by: In the case of a terminal, the welding portion of the terminal protrudes longitudinally outwards or laterally outwards from both sides of the welding portion at least-convex page 5 525317 V. Description of the invention (3) The opening portion is then snapped to the position at the position of the portion According to the welding of the upper welding part, the contact pads of the contact group can be ensured. [The diagram is simple. The first picture is from the second. The third picture is the fourth picture. The fourth picture is the fifth. The figure is from the sixth figure, the seventh figure, the eighth figure, the ninth figure, and the tenth figure. When the insulation body is manufactured, it corresponds to the above in the milk six ,,,, and the marginal body. The protrusion is provided with a card slot that can be placed on each terminal, and stands β々 on the #, ^ ^ ^ ^ ^ exit p, and the terminal is protruded into the card slot of the 纟 ba edge body. The characteristics of the invention described by the use of the protruding portion can not only increase the connection area and enhance the soldering joint, but also can balance the applied torque, prevent the soldering portion from peeling off from the contact pad of the circuit board, and prevent the cantilever from deforming due to the soldering portion. The distortion caused by the distortion, the uniformity of the force, and can prevent the terminal contact part and the wafer mold from dislocation, to ensure the stability of telecommunications transmission. Description] The block diagram of the first embodiment of the electrical connector terminal implemented by the method of the present invention. Top view of the insulating body corresponding to the terminal of the consistent embodiment. The second figure is a sectional view along the Π- Π line. An embodiment of the terminal is used in a chip module and a circuit board combination diagram. Body view of the second embodiment of the electrical connector terminal implemented by the method of the present invention. Top view of the insulating body corresponding to the terminal of the second embodiment. The sixth figure is a sectional view taken along the VE-VII line. The sixth figure is a cross-sectional view taken along the line M-M. The second embodiment is a combination diagram of a chip module and a circuit board. Know the electrical connector terminals used in the chip module and circuit board group
第6頁 525317 五、發明說明（4) 合示意圖。 【元件符號說明】 端子 卜 2 懸臂 21 ^ 210 焊接部 10 ^ 100 延伸部 23 ^ 230 接觸部 11、 220 固持部 25 〜250 底表面 24 絕緣本體 0 Λ yj 端子收容槽 3 0 、30 0 第二側壁 33 〜330 凹槽 3卜 310 第一側壁 38 ^ 380 卡槽 350 、460 接觸墊 43 、430 、 9〇 基體 ^ 900 40 > 400 卡固部 46 晶片模組 55 "550 凸出部 50 > 60 【較佳實施例】 電路板 80 ^ 800 請參閱第一圖為由本發明古^ ^ > 第一實施例，首先依實際運用=法所貫轭之電連接器端子 端子1。端子1係約略為-Μ 因素氣出 10，該焊接部10係以表面黏著枯’/、§又有一焊接部Page 6 525317 V. Description of the invention (4) Schematic diagram. [Description of component symbols] Terminal block 2 Cantilever 21 ^ 210 Welding portion 10 ^ 100 Extension portion 23 ^ 230 Contact portion 11, 220 Holding portion 25 to 250 Bottom surface 24 Insulating body 0 Λ yj Terminal receiving slot 3 0, 30 0 Second Side wall 33 to 330 groove 3 b 310 first side wall 38 ^ 380 card slot 350, 460 contact pad 43, 430, 90 base ^ 900 40 > 400 clamping portion 46 chip module 55 " 550 protruding portion 50 > 60 [Preferred embodiment] Circuit board 80 ^ 800 Please refer to the first figure for the present invention ^ ^ > In the first embodiment, firstly, the electrical connector terminal 1 of the yoke is passed according to the actual application = method. The terminal 1 is about -M factor outgassing 10, and the soldering portion 10 is surface-adhered, and there is a soldering portion.
Technology，SMT)黏著於電路：UI*=Ce Mounted 百、胥路板8 〇〇之接觸墊900 (第四圖 )上，焊接部10 —端斜向上延伸有一水平的延伸部23，延 伸部2 3末端兩側豎直設有固持部2 5以固持於絕緣本體3之 凹槽310(第二圖）内。自焊接部1〇另一端斜向上·彎折延伸 出一懸臂2 1，懸臂2 1末端彎折設有一接觸部2 2以與晶片模 組5 5 0之接觸墊430 (第四圖）接觸，自焊接部1〇與懸臂21交 界處於懸臂2 1兩侧縱向向外凸設有凸出部5 0，該凸出部5 0Technology (SMT) is adhered to the circuit: UI * = Ce Mounted on the contact pad 900 (fourth picture) of the 8000 board, the soldering portion 10—the end extends obliquely upward with a horizontal extension 23, the extension 2 Retaining portions 25 are vertically provided on both sides of the 3 end to be fixed in the groove 310 (second figure) of the insulating body 3. A cantilever 21 is extended obliquely upwards and bent from the other end of the soldering portion 10, and a contact portion 22 is bent at the end of the cantilever 21 to contact the contact pad 430 (fourth figure) of the chip module 5500. From the welding portion 10 to the cantilever 21 at the boundary between the cantilever 21 and the two sides of the cantilever 21 are provided with a protruding portion 50 extending longitudinally outward, and the protruding portion 50
第7頁 525317 五、發明說明、(5) 係卡置於對應絕緣本體3之基體4〇〇的卡槽35〇(第四圖）内 —凊茶閱第二圖及第三圖，其為本發明電連接器端子第 貝轭例所相應設置之絕緣本體3，當按本發明方法製出 立而子1後’接著製出與端子〗相應設置之絕緣本體3。絕緣 ^體3係設有一約略呈矩形體之基體4〇〇及貫穿基體4〇〇之 複數端子收容槽3 〇 〇，所述端子收容槽3 〇 〇呈網格狀分布於 基體40 0上並與晶片模組55〇之接觸墊43〇(第四圖）對應分 布，以使接觸墊430與端子i之接觸部22電訊接觸。每一端 ^收容槽3 0 0料呈一縱長形開槽，其設有第一侧壁38〇及 ^二側壁330，於第-側壁38()與第二側壁33()相交界處向 ϊ =容槽3 0 0Λ側開設有一凹槽310，以容設端子1之固Page 7 525317 V. Description of the invention, (5) The card is placed in the card slot 35o (fourth picture) corresponding to the base 400 of the insulating body 3. The tea is shown in the second and third pictures. When the insulating body 3 corresponding to the first yoke example of the electrical connector terminal of the present invention is manufactured according to the method of the present invention, the insulating body 3 is then manufactured to correspond to the terminal. The insulation body 3 is provided with a substantially rectangular base body 400 and a plurality of terminal receiving grooves 300 running through the base body 400. The terminal receiving grooves 300 are distributed on the base body 400 in a grid shape and The contact pads 43 (fourth figure) corresponding to the chip module 55 are distributed correspondingly, so that the contact pads 430 are in electrical contact with the contact portions 22 of the terminal i. Each side ^ receiving groove 300 is a longitudinal slot, which is provided with a first side wall 38o and a second side wall 330, facing at the intersection of the first side wall 38 () and the second side wall 33 (). ϊ = a groove 310 is provided on the side of the receiving groove 3 0 0Λ to accommodate the fixing of the terminal 1
Θ其蝴4 η η而於第一側壁330之另一側靠近基體400底表面24 向基：40。内沿端子收容槽3〇〇之縱長方向卡J ，以容設端子i之凸出部50，。 $下價dbU 續请參閱第五圖為由本蘇 子之第二實㈣，其與連接器端 端子2自焊接部1〇0兩側橫向：外係在於： 出部50具有同樣作用及效杲之几卜^ δ又有與刖述端子1之凸 置於對應絕緣本體4之基體4〇 ’該凸出部60係卡 請參閱第六圖至第八圖°，的二 第二圖)内。 2所相應設置之絕緣本體4，:為本毛明第—實施例端子 係在於卡槽之設置位置不了 ；：前述絕緣本體3不同之處 -縱長形開槽，其設有* _側3 —端子收容槽3°係約略呈 側壁38及第二側壁33，一對卡Θ Its butterfly 4 η η is on the other side of the first side wall 330 near the bottom surface 24 of the base 400 toward the base: 40. The card J in the longitudinal direction of the terminal receiving groove 300 is provided to receive the protruding portion 50 ′ of the terminal i. $ 下 价 dbU Continued please refer to the fifth figure, which is the second embodiment of Ben Suzi, which is transverse to both sides of the connector end terminal 2 from the soldering part 100: the outer part is: the output part 50 has the same function and effect. ^ Δ and the projection 1 of the terminal 1 are placed on the base 40 corresponding to the insulating body 4. The protruding portion 60 is a card (refer to the sixth and eighth figures, two and two pictures). . Corresponding insulation body 4: This is the first embodiment of Maoming. The terminal is in the position of the card slot. The difference between the foregoing insulation body 3-the longitudinal slot, which is provided with * _ side 3 —The terminal receiving groove 3 ° is approximately a side wall 38 and a second side wall 33, a pair of cards
525317 五 '發明說明（6) 固部46於第一側壁38處向端子收容槽3〇内部凸伸出，於卡 固部4 6的下方向端子收容槽3 〇之第一側壁3 8内沿橫向方向 各凸設有一卡槽460，以用於收容端子2之凸出部6〇 (第九 圖）。 藉凸出部50、60之作用，不僅可增大焊接部10、100 的焊接面積從而增強焊接結構強度，而且由於凸出部50、 60卡置於絕緣本體3、4之對應卡槽35〇、46〇内，所以產生 人立而子1 2之轉動赵勢相反的抵抗轉矩，從而平衡施加 於烊接部1 0、1 0 0的轉矩，防止焊接部丨〇、丨〇 〇從電路板之 接觸塾上剝離’並可防止懸臂2丨、2 1 〇因焊接部1 〇、1⑽變 形所引發的變形歪斜，進而確保接觸力的一致性，更進一 步地可以使端子1、2接觸部22、220與晶片模組55、550之 接觸塾43、430不會產生錯位，保障電訊傳輸之穩定性。 綜上所述，本發明確已符合發明專利之要件，爰依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例 凡熟習本發明技術之人士援依本發明之發明精神所作 之等效修飾或變化，皆應涵蓋在以下申請專利範圍内。525317 Five 'invention description (6) The fixing portion 46 protrudes to the inside of the terminal receiving groove 30 at the first side wall 38, and the inner edge of the first side wall 38 of the terminal receiving groove 3 0 in the lower direction of the fixing portion 46. A latching slot 460 is provided in each of the lateral directions for receiving the protruding portion 60 of the terminal 2 (ninth figure). By the use of the protrusions 50 and 60, not only the welding area of the welding portions 10 and 100 can be increased to enhance the strength of the welding structure, but also the protrusions 50 and 60 are clamped in the corresponding grooves 35 of the insulating bodies 3 and 4. , 46 °, so the resistance torque of the opposite side of the rotation of the human standing 12 is generated, so as to balance the torque applied to the joints 10, 100, and prevent the welding parts 丨 〇, 丨 〇〇 from The contact on the circuit board is peeled off, and can prevent the cantilever 2 丨, 2 1 〇 from being deformed due to the deformation of the soldering part 10, 1 ，, thereby ensuring the consistency of the contact force, and can further make the terminals 1 and 2 contact The contact between the parts 22, 220 and the chip modules 55, 550 43, 430 will not cause misalignment, ensuring the stability of telecommunications transmission. In summary, the present invention has indeed met the requirements for an invention patent, and a patent application has been filed in accordance with the law. However, the above are only preferred embodiments of the present invention. Any equivalent modification or change made by those skilled in the technology of the present invention with reference to the spirit of the present invention should be covered by the following patent applications.
第9頁 525317 圖式簡單說明Page 525317 Simple illustration
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