TWI268134B - Cooler applying in electronic apparatus - Google Patents

Abstract

A cooler is applied in an electronic apparatus. The electronic apparatus comprises a shell. The shell comprises a cooling open. The cooler comprises a case and a cooling fan. The case has a connecting open. The four walls around the connecting open are comprises at least one joint for jointing the cooling open in a jointing direction. The cooling fan is located in one side of the walls and eliminates the heat in the shell in a cooling direction. The cooling direction is vertical to the jointing direction.

Description

1268134

V. INSTRUCTIONS OF THE INVENTION (1) [Technical field to which the invention pertains] The present invention relates to the fact that the 7 牯荽 sisters occupy the shackles, and will not be related to the joint direction of a 盥 electronic device joint 盥 4 private but /, electricity : η π... The heat generated by the political heat is not the same as the heat sink. <stress side [previous technique] =! The sub-device function is getting stronger and stronger, so the internal components also tend to be complicated: ;:: many of the components will be accompanied by the generation of d when standing," if this is not appropriate Exclusion, the ability of the shadow can be reduced: the life of the component. If the temperature inside the electronic device is paralyzed and affects the operation of the electronic device, the electronic device cannot be used... In order to solve the above problem, it is currently installed in the electronic device. A heat sink is mostly a fan, which mainly reduces the temperature inside the electronic device by the circulation of air. However, after the fan is installed, whether the fan is exported or introduced, the amount of noise of the electronic device is increased. The noise is mainly generated when the component is activated. The fan must rotate the blade when it is moving, so noise is also generated: f Refer to Figure 1. Figure 1 is a schematic diagram of the chassis of the conventional electronic device. When the conventional fan 12 is assembled in the case of the electronic device, the fan is locked to the chassis 10 of the electronic device by four screws 102, 1Q4, 1〇6, and 1 08. Since the screwing direction of the screw and the wind direction 102,1〇4,106,1〇8 12 rotating fan blades 122, is the same, therefore, when the fan 12 group

1268134 V. INSTRUCTIONS (2) After being installed for a period of time, the vibration of the fan 12 in the direction of rotation causes the screws 1 0 2, 1 0 4, 1 〇 6, 1 0 8 to gradually pull off and appear loose. When loosened, the fan 12 will cause the fan 12 to collide with the chassis when it is actuated, so the noise generated is even greater. The noise caused by the rotation of the fan has been significantly improved by the blade manufacturing technology and the advancement of assembly technology. However, the stress caused by the rotation of the blade causes the looseness between the fan and the chassis, and a further solution is still required. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat dissipating device in which the stress caused by the rotation of the blade 2 will not affect the engagement of the joint with the box, and the blade is operated for a long time. There is no looseness between the devices, and the device is effectively reduced. The invention is a heat sink applied to an electronic device having a chassis having a heat dissipation opening. The dispensing device includes a housing and a cooling fan. The housing includes a joint opening, and the four side walls of the opening are provided with at least one joint to interface the heat sink opening from the interior of the cabinet. The cooling fan is located on one side of the housing and is perpendicular to the joint. The present invention further discloses an accommodating device having a chassis for a heat sink of an electronic device, the chassis having a heat dissipation opening and an inner side

Policy page 6

1268134 V. Description of invention (3) Wall. The heat sink comprises a fixing device and a heat dissipation fan. The fixing device includes a first surface and a second surface, and the first surface is substantially perpendicular to the second surface. The cooling fan is coupled to the heat dissipation opening on the second surface side, and the first surface is coupled to the inner side wall of the chassis. . Thereby, since the way in which the cooling fan system is disposed is perpendicular to the position at which the electronic device is engaged with each other, the response generated when the fan is rotated does not affect the engagement position. The heat sink is applied for a period of time and is not prone to loosening. Therefore, the noise generated by the heat sink can be minimized. The advantages and spirit of the present invention will be further understood from the following detailed description. The knowledge of the invention is based on the invention, which is used to improve the mechanism, so that the heat sink and the electronic assembly technician can be connected from The direction of the stress of the joint stress (meaning that the sound is dissipated when the heat sink fan is used to dissipate the heat generated by the heat sink when dissipating heat;; 接合 the joint direction and heat sink of the case; ΐ The heat direction is not parallel to the joint direction. The schematic diagram, Figure 2B, shows the diagram of the heat sink 20 in the machine phase 30 of the H device. Figure 2A shows the assembly of the heat sink 20 and the chassis 30 in the field. The heat sink 20 of the invention is mainly assembled in electricity

Page 7 1268134 V. Description of the Invention (4) The chassis 30 is provided with a heat-dissipating opening of 3. 4 ^, and the position of the box port 304 can be in accordance with the designer's design. In this context, the internal devices of the present invention are all referred to as the electronic devices of the present invention, such as a machine, a... The present invention $: f includes a housing 202 and a cooling fan 2°4. In the 1 state, due to a case, the shell 2 〇2 is designed as a rectangular parallelepiped t" ^ ^ μ t ^ lm ^ ^ ^ ^m °2 °2 2 ° ^ ^ ^pj Count any type such as a cube. In the present embodiment, the four side casing walls of the joint opening 2022 are provided with joint portions 2024, 2026, 2 028, 2010 in a non-folded manner to engage the heat dissipation openings 3〇4 from the inside of the casing 30. The joint can be selected by using various joint elements. As shown in FIG. 2, four screws 402, 404, 406, and 408 are applied, and openings 3022, 3024, 3026, and 3028 are designed in the chassis 30 to insert screws 402 and 404. 406, 408 and the joints 2024, 2026, 2028, 2030 are provided with corresponding four screw holes 2032, 2034, 2036, 2038 to facilitate the locking of the heat sink 20 into the chassis 30 from outside the chassis 30. The materials of the chassis 30 and the housing 202 vary depending on the actual use. At present, plastic materials such as ABS are often used for electronic devices or heat sinks, and metal materials such as aluminum-magnesium alloys are used for a small number of high-order products. The cooling fan 204 is located on one side of the housing 202. As shown in FIG. 2, the cooling fan 204 is located on a side wall 2012 of the rectangular parallelepiped. The main purpose of the cooling fan in this position is to prevent the cooling fan from moving.

1268134 V. In the description of the invention, the stresses generated thereby loosen the joints 20 24, 2 〇 26, 2 〇 28, 2030. Therefore, in this preferred embodiment, the heat dissipating direction of the radiating fan 2〇4 is set to be perpendicular to the direction in which the engaging portions 2024, 2026, 2028, 2030 are connected (i.e., the direction in which the screws are locked). Similarly, the cooling fan 2〇4 can also be disposed on either side wall. The cooling fan 2〇4 has various options: it can be an export type fan, an induction type fan or a two-way cooling air. Any type of fan can be applied to the present invention. The heat dissipating fan 204 is integrally formed in the casing 202, so that it is not required to additionally use 5 wires and two people on the casing 202. ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ port, when the above specific embodiment is started, such as heat dissipation The fan system is introduced into the fan, and the airflow enters the casing from the heat dissipation opening through the joint opening, and enters the casing through the introduction fan. If the cooling fan is an export fan, on the contrary, the airflow will be exhausted from the inside of the chassis to the outside of the chassis through the joint opening and the heat dissipation opening. If it is a two-way cooling fan, you can adjust the direction of rotation of the fan to selectively export or introduce air. Basically, the heat dissipating opening and the engaging opening can be designed separately, for example, for the air circulation, the heat dissipating opening and the engaging opening can be designed to be the same size. In addition to the screw lock and the housing and housing, a variety of other engagement configurations are available for use in the present invention. Referring to Figure 3, Figure 3 is a schematic view of a second embodiment of the joints 2024, 2026, 2028, 2010 in Figure 2B'. In Figure 2, the components are identical, and only the four sets of cards and structures 2042, 2044, 2046, 2048 are used at the joint to directly embed the housing 202 in the chassis 30. Each of the cards and structures 2042, 2044, 2046, 2048 is provided by a first card and component disposed on the housing 202 and a heat dissipating opening

1268134 V. The second card and component of the invention description (6). In a preferred embodiment, the card and structure 2042, 2044, 2046, 2048 are provided with four male snaps on the joint and four female hooks are provided at the relative positions of the heat sink openings. Thereby, the housing 202 will be closely attached to the chassis 30. " In addition to the heat sink installed in a housing and assembled in the chassis of the electronic device, the side of the cooling fan can be used as a fixing device, so that the position of the cooling fan to engage the chassis is different from the position of the cooling fan. . Referring to Figure 4, Figure 4 is a schematic view of a third embodiment of the present invention. A third embodiment of the present invention discloses a heat sink 50 for use in an electronic device. The electronic device has a chassis 6 〇, and the chassis has a heat dissipation opening 602 and an inner sidewall 604. The heat sink 50 includes a fixture 5 0 2 and a heat dissipation fan 5 〇 4 . The fixing device 502 includes a first face 5 〇 2 2 and a second face 5024, and the first face 5022 is substantially perpendicular to the second face 5〇24. The heat dissipating fan 504 corresponds to the second side and the heat dissipating opening, and the airflow has been led out of the chassis or into the chassis. The first side of the fixture 50 2 engages the inner side wall 604 of the housing 6〇. The third embodiment is the same as the first embodiment, and the combination of the screw and the screw hole is used to lock and fix the device 5〇2 and the inner side wall 604. Since the locks are the same, they will not be described again. In the third embodiment of the present invention, since the heat sink 5 extends its side casing for fixing to the casing 60, the extended casing, i.e., the fixing device 502, is L-shaped. In this way, when the inner side wall 604 and the first side 5022 are locked by screws, the rotation direction of the lock screw and the heat radiation direction of the fan will not interfere with each other. In other words, the screw of the fixing device will not be loosened due to the action of the cooling fan, and the fixing device can be long.

1268134 V. INSTRUCTIONS (7) Staying fixed on the inner side wall for a long time... After the application of the present invention, the bulk cooking kitchen will not affect the stress generated by the overall heat dissipation device, and the close engagement of the chassis can be maintained = two J J . Therefore, the heat sink and the noise caused by the looseness between the chassis and the chassis are not caused by the detailed description of the above preferred embodiments, and it is desirable to have the characteristics and spirit of the == instead of the above disclosed The scope of the present invention is limited by the scope of the present invention. Conversely, the arrangement of the cookware wishing to cover various changes and equivalence is within the scope of the patent scope of the present invention.

1268134 Brief description of the diagram [Description of the diagrams] Figure 1 is a schematic diagram of a conventional electronic device and a fan. 2A is a schematic view showing a heat dissipating device in a chassis of the electronic device of the present invention. FIG. 2B is a schematic view showing the assembly of the heat dissipating device and the chassis in FIG. Figure 3 is a schematic view of a second embodiment of the joint in Figure 2B. Figure 4 is a schematic view of a third embodiment of the present invention. [Description of the reference numerals] 20, 50: heat sink 2012: side wall 202: housing 2022: joint openings 2024, 2 026, 2028, 2030: joints 2032, 2034, 2036, 2038 · screw holes 2 0 4, 5 0 4 ·· Cooling fans 2042, 2044, 2046, 2048: card and construction 30, 60: chassis 3 04, 602: heat dissipation opening

402, 404, 406, 408: Screws 3022, 3024, 3026, 3028: Opening L 502: Fixing device 5022: First side 5024: Second side 604: Inner side wall

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Claims (1)

1268134 6. Patent application scope 1. A heat dissipating device applied to an electronic device, the electronic device having a casing having a heat dissipation opening and at least a first card and an element, the heat dissipating device comprising a housing a joint opening, the four side shell walls of the joint opening are provided with at least one second card and component corresponding to the first card and the component to engage the heat dissipation opening according to a joint direction; and a heat dissipation fan located at the One side of the housing, and the thermal energy in the chassis is discharged according to a heat dissipation direction, and the heat dissipation direction is not parallel to the joint direction. 2. The heat sink of claim 1, wherein the joint opening and the heat sink opening have the same size. 3 . An electronic device comprising: a chassis having a heat dissipation opening and at least one first card and component; a housing disposed inside the chassis, the housing having at least one second card and an element corresponding to the first The card and the component engage the heat dissipation opening in a joint direction; and a heat dissipation wind is disposed in the casing to dissipate heat according to a heat dissipation direction; wherein the heat dissipation direction is not parallel to the joint direction. Page 13 1268134 6. Patent Application No. 4, a heat sink for an electronic device, the electronic device having a chassis having a heat dissipation opening, the heat sink comprising: a housing including a joint opening The four side wall of the joint opening is provided with at least one joint portion for engaging the heat dissipation opening according to an engagement direction, the joint portion is provided with at least one screw hole in the non-folding manner of the four side shell wall, and Locating at least one opening in the relative position of the chassis to lock the housing and the heat sink according to the engaging direction by using at least one screw; and a heat dissipating fan located on one side of the housing and discharging the light according to a heat dissipation direction The thermal energy in the chassis is perpendicular to the joining direction. 5. The heat dissipating device of claim 4, wherein the joint portion is provided with at least one screw hole in the four-side casing, and at least one opening is disposed at a position opposite to the chassis to utilize at least one screw. The housing and the heat sink are locked in accordance with the engagement direction. 6. The heat sink of claim 4, wherein the joint opening and the heat sink opening have the same size. 7. A heat sink device for use in an electronic device, the electronic device having Page 14 1268134 6. Patent application scope A chassis having a heat dissipation opening and an inner side wall, the heat dissipation device comprising: a heat dissipation fan; a fixing device, the fixing device comprising a first surface and a second surface, The first surface is substantially perpendicular to the second surface, and the heat dissipation fan is located on the second surface and corresponds to the heat dissipation opening, and the first surface is engaged with the inner side wall. 8. The heat dissipating device of claim 7, wherein the first surface is provided with at least one screw hole, and at least one opening is provided at a position of the inner side wall relative to the screw hole for fixing with at least one screw. The casing and the fixing device. Page 15