TWI265576B - Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist - Google Patents

Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist Download PDF

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Publication number
TWI265576B
TWI265576B TW094109791A TW94109791A TWI265576B TW I265576 B TWI265576 B TW I265576B TW 094109791 A TW094109791 A TW 094109791A TW 94109791 A TW94109791 A TW 94109791A TW I265576 B TWI265576 B TW I265576B
Authority
TW
Taiwan
Prior art keywords
nanocomposite
particles
clay
nano
nanoclay
Prior art date
Application number
TW094109791A
Other languages
English (en)
Chinese (zh)
Other versions
TW200603295A (en
Inventor
Paul Koning
James C Matayabas Jr
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200603295A publication Critical patent/TW200603295A/zh
Application granted granted Critical
Publication of TWI265576B publication Critical patent/TWI265576B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW094109791A 2004-03-30 2005-03-29 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist TWI265576B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/815,291 US7126215B2 (en) 2004-03-30 2004-03-30 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist

Publications (2)

Publication Number Publication Date
TW200603295A TW200603295A (en) 2006-01-16
TWI265576B true TWI265576B (en) 2006-11-01

Family

ID=34964763

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109791A TWI265576B (en) 2004-03-30 2005-03-29 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist

Country Status (6)

Country Link
US (1) US7126215B2 (ko)
JP (1) JP2007532000A (ko)
KR (1) KR100831461B1 (ko)
CN (1) CN1938849A (ko)
TW (1) TWI265576B (ko)
WO (1) WO2005098947A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7446360B2 (en) * 2004-08-09 2008-11-04 Intel Corporation Polymer device with a nanocomposite barrier layer
US7952212B2 (en) * 2006-06-30 2011-05-31 Intel Corporation Applications of smart polymer composites to integrated circuit packaging
CN101677033B (zh) * 2008-09-19 2012-06-20 深圳先进技术研究院 一种聚合物基复合电介质材料及平板型电容器
US20100302707A1 (en) * 2009-05-26 2010-12-02 General Electric Company Composite structures for high energy-density capacitors and other devices
US8920919B2 (en) 2012-09-24 2014-12-30 Intel Corporation Thermal interface material composition including polymeric matrix and carbon filler
US20180138110A1 (en) * 2016-11-17 2018-05-17 Texas Instruments Incorporated Enhanced Adhesion by Nanoparticle Layer Having Randomly Configured Voids

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US25743A (en) * 1859-10-11 Endless chain foe
US30999A (en) * 1860-12-18 Improvement in harvesting-machines
US3258387A (en) 1961-04-06 1966-06-28 Owens Corning Fiberglass Corp Dielectric panels
CH682679A5 (de) 1990-10-02 1993-10-29 Walter Steiner Vorrichtung zum Aufhängen von Wäschestücken.
EP0633295B1 (en) 1993-01-28 2002-01-02 Otsuka Kagaku Kabushiki Kaisha Resin composition for electronic parts
US5886745A (en) * 1994-12-09 1999-03-23 Matsushita Electric Industrial Co., Ltd. Progressive scanning conversion apparatus
US5793379A (en) * 1995-04-03 1998-08-11 Nvidia Corporation Method and apparatus for scaling images having a plurality of scan lines of pixel data
US6197149B1 (en) 1997-04-15 2001-03-06 Hitachi Chemical Company, Ltd. Production of insulating varnishes and multilayer printed circuit boards using these varnishes
AU1837000A (en) 1998-12-07 2000-06-26 Eastman Chemical Company A polymer/clay nanocomposite comprising a clay mixture and process for making same
AU1648701A (en) 1999-11-30 2001-06-12 Otsuka Chemical Co. Ltd. Resin composition and flexible printed circuit board
JP3870686B2 (ja) * 2000-10-13 2007-01-24 日本ゼオン株式会社 硬化性組成物
TW521548B (en) * 2000-10-13 2003-02-21 Zeon Corp Curable composition, molded article, multi-layer wiring substrate, particle and its manufacturing process, varnish and its manufacturing process, laminate, and flame retardant slurry
EP1231637A3 (en) * 2001-02-08 2004-08-25 Hitachi, Ltd. High dielectric constant composite material and multilayer wiring board using the same
CA2533119A1 (en) 2003-07-24 2005-02-03 Qiagen Gmbh Method for the reverse transcription and/or amplification of nucleic acids

Also Published As

Publication number Publication date
KR100831461B1 (ko) 2008-05-21
WO2005098947A1 (en) 2005-10-20
US7126215B2 (en) 2006-10-24
US20050221605A1 (en) 2005-10-06
JP2007532000A (ja) 2007-11-08
TW200603295A (en) 2006-01-16
CN1938849A (zh) 2007-03-28
KR20070028343A (ko) 2007-03-12

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