TWI263558B - Composition for forming polishing pad and polishing pad using the same - Google Patents

Composition for forming polishing pad and polishing pad using the same

Info

Publication number
TWI263558B
TWI263558B TW090126298A TW90126298A TWI263558B TW I263558 B TWI263558 B TW I263558B TW 090126298 A TW090126298 A TW 090126298A TW 90126298 A TW90126298 A TW 90126298A TW I263558 B TWI263558 B TW I263558B
Authority
TW
Taiwan
Prior art keywords
polishing pad
composition
forming
polishing
water
Prior art date
Application number
TW090126298A
Other languages
English (en)
Chinese (zh)
Inventor
Kuo Hasegawa
Tomoo Koumura
Yutaka Kobayashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Application granted granted Critical
Publication of TWI263558B publication Critical patent/TWI263558B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW090126298A 2000-10-24 2001-10-24 Composition for forming polishing pad and polishing pad using the same TWI263558B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000324139A JP3826702B2 (ja) 2000-10-24 2000-10-24 研磨パッド用組成物及びこれを用いた研磨パッド

Publications (1)

Publication Number Publication Date
TWI263558B true TWI263558B (en) 2006-10-11

Family

ID=18801716

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090126298A TWI263558B (en) 2000-10-24 2001-10-24 Composition for forming polishing pad and polishing pad using the same

Country Status (6)

Country Link
US (1) US6645264B2 (enExample)
EP (1) EP1201368B1 (enExample)
JP (1) JP3826702B2 (enExample)
KR (1) KR100770083B1 (enExample)
DE (1) DE60132413T2 (enExample)
TW (1) TWI263558B (enExample)

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TWI228768B (en) 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
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US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
SG185141A1 (en) 2003-03-25 2012-11-29 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
DE602004001268T2 (de) * 2003-04-25 2007-06-06 Jsr Corp. Polierkissen und chemisch-mechanisches Polierverfahren
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
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JP4697399B2 (ja) * 2004-06-11 2011-06-08 Ｊｓｒ株式会社 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 奈平科技股份有限公司 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR100909605B1 (ko) 2005-03-08 2009-07-27 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US8304467B2 (en) 2005-05-17 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
KR20080090496A (ko) * 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
US7591739B2 (en) * 2006-06-30 2009-09-22 Bridgestone Sports Co., Ltd. Golf ball material, golf ball, and method for preparing golf ball material
CN101489721B (zh) 2006-08-28 2014-06-18 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
EP2083027B8 (en) 2008-01-24 2012-05-16 JSR Corporation Mechanical polishing pad and chemical mechanical polishing method
JP2008149458A (ja) * 2008-03-03 2008-07-03 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
EP2548232B1 (en) * 2010-03-16 2017-08-23 Philips Lighting Holding B.V. Photovoltaic cell device with switchable lighting
KR101532990B1 (ko) * 2011-09-22 2015-07-01 도요 고무 고교 가부시키가이샤 연마 패드
JP2013086217A (ja) * 2011-10-19 2013-05-13 Dic Corp 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法
KR101417274B1 (ko) * 2012-05-23 2014-07-09 삼성전자주식회사 연마패드 및 그 제조방법
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
JP6312471B2 (ja) 2014-03-14 2018-04-18 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッド及びその製造方法
JP5871978B2 (ja) 2014-03-14 2016-03-01 東洋ゴム工業株式会社 研磨パッド及びその製造方法
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
SG11201704554SA (en) * 2016-04-06 2017-11-29 Kpx Chemical Co Ltd Method of manufacturing polishing pad
US12109665B2 (en) * 2018-05-11 2024-10-08 Kuraray Co., Ltd. Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad
WO2022232154A1 (en) * 2021-04-26 2022-11-03 Chempower Corporation Pad surface regeneration and metal recovery
WO2023034874A1 (en) 2021-09-03 2023-03-09 Chempower Corporation Tools for chemical planarization
CN115305057B (zh) * 2022-07-27 2023-11-21 安徽禾臣新材料有限公司 一种超细精密抛光粉及其制备方法

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US6390890B1 (en) * 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
JP2000232082A (ja) * 1998-12-11 2000-08-22 Toray Ind Inc 研磨パッドおよび研磨装置
JP2000263423A (ja) 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド

Also Published As

Publication number Publication date
JP3826702B2 (ja) 2006-09-27
US20020078632A1 (en) 2002-06-27
JP2002134445A (ja) 2002-05-10
US6645264B2 (en) 2003-11-11
DE60132413T2 (de) 2009-01-08
DE60132413D1 (de) 2008-03-06
EP1201368B1 (en) 2008-01-16
EP1201368A2 (en) 2002-05-02
EP1201368A3 (en) 2004-02-11
KR100770083B1 (ko) 2007-10-24
KR20020032330A (ko) 2002-05-03

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees