1262497 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種模版之製作方法，尤其指一種碟片 原版之製作方法。 【先前技術】 光記錄媒體之生產過程中，一般都是利用具有溝槽或 凹洞之碟片模版（Disc Stamper)，配合射出成型的方法， ® 以製成與碟片模版具有相對應圖案之基板後，再進行後續 ， 製程以生產大量的光記錄媒體。 為了要獲得碟片模版，則需先製成一碟片原版（Disc Master) 〇 請參照圖1，習知的碟片原版3，大體上包含有一玻 璃基板31 ; —光阻層32塗佈於玻璃基板31上；一金屬層 33設於光阻層32上。而碟片原版3之製作方法包含有： φ 濕洗一玻璃基板31、塗佈一光阻層32於玻璃基板31上、 雷射刻版並顯像光阻層32，以及濺鍍一金屬層33於光阻 層32。 請同時參閱圖1及圖2，係為碟片原版3之光阻層32 塗佈厚度與碟片原版3半徑之關係，圖3中顯示光阻層32 係呈均勻分佈於玻璃基板31上。 至此，即完成碟片原版之製程。然後，即可利用碟片 原版進行電鑄（Electroforming)步驟，將金屬層加厚後， 再將金屬層與碟片原版分離，則此金屬層即為一父模版 1262497 (Father Stamper)，而後，即可重覆電鑄及分離步驟，以 獲得複數個母模版（Mother Stamper)，而每一個母模版可 繼續進行電鑄步驟，以獲得複數個子模版（s〇n Stamper)。 要大量生產光記錄媒體時，即利用父模版或子模版，以射 出成型具有預溝槽之塑膠基板（Pre-grooved Substrate )。 塑膠基板内含之預溝槽係用以提供雷射尋軌記錄或 "貝取預錄訊息之用，所以預溝槽之幾何形狀對尋執或讀取 預錄訊息而言相當重要。由於，具有預溝槽之基板成型係 =模版以及射出機台的設計與參數所共同決定。塑膠射出 盼’碟片模版中央與周緣之模溫、模壓係具有差異，常發 ^膠基板外圈深度不足之瑕疵，為彌補射出機台無法射 均勻深度之塑膠基板之限制，所以須對碟片模版之溝槽 成何形狀加以修改。 在深度部分係 由此可見，碟 然而，碟片模版之溝槽幾何形狀決定 由碟片原版之光阻塗佈及顯影過程所控制 片原版之製作方法有待進一步之改進。 【發明内容】 =上述課題’本發明之目的為提供—種碟片原版 x作方法，藉此，改善基板外圈深度 绥曰*、、 又+足之缺陷。 、、疋，為達上述目的，依本發明之碑 法，复6人1 „ 汞片原版之製作方 /、I 3 ·提供一熱源於一基板中央處· ~，塗佈一光阻層 1262497 以及形成一金屬層 於基板之上；雷射刻版並顯影光阻層 於光阻層。 承上所述，@依本發明之碟片原版之製作方法，係針 塗佈之技術加以修改，使得光阻層具有中央厚度較 驟周^度較厚之變化’之後’轨騎行雷射刻版步 w ’即能形成周緣溝槽深度較深之碟片原版，如此一 來能改善習知技術中基板外圈深度不足之缺陷，以提 升光資訊儲存媒體之生產品質。 【實施方式】 說明依本發明較佳實施例之碟 以下將參照相關圖式 片原版之製作方法。 口月 > 閱圖3至圖5，係為本發明第一較佳實施例之碟 片原版1製作方法’包含有提供—熱源於—基板中央處、 (S1〇);塗佈一光阻層於基板之上（S30);烘乾光阻層 (S40);雷射刻版並顯影光阻（S5〇);以及形成一金屬岸 於光阻層（S60)。 曰 請再參閱圖5,於步驟S10中，提供一熱源12於一基 板11#中央處。本實施例中，基板u之材質係為一玻璃、 一石英2或選用一陶瓷材料，其中陶瓷材料可為一氧化 物、一鼠化物、或一碳化物。本實施例中，熱源12係為 一加熱器121，加熱器121係直接加熱於基板u中央處， 使付基板11中央溫度高於基板11周緣溫度，當加熱完成 後，即可移除加熱器121，而將基板11移至另一機台16 1262497 (例如·旋轉塗佈機台）上，以便繼續後續步驟。 然而，除了設置於基板11 一側之加熱器121外，請 參閱圖6，熱源12也可具有一加熱器121，與一金屬塊 122，金屬塊122係直接與基板11中央接觸，之後，二側 之加熱器121，係將基板11連同金屬塊122 —起加熱。由 於金屬塊122具有較佳之熱傳導性質，使得基板u中央 處較周緣處高溫，當加熱完成後，再將基板由金屬塊122 與加熱為121 ’處移往機台16上，以便後續步驟進行。 請參閱圖3及圖4,碟片原版丨之製作方法更可包含·· . 塗佈一接著劑（Primer) 13於基板上S20，於步驟s2〇中， 接著劑13係被塗佈於基板11上。其中，接著劑η可為 一界面活性劑（Surfactant)或是一黏合促進劑（Adhesi〇n Promoter) 〇 於步驟S30中，係以旋轉塗佈（Spin_c〇ating)之方 式，將光阻層14形成於基板U之上。若基板u上已塗佈 • 有接著劑13，則光阻層14係形成於接著劑13上。由於步 驟S10，使得基板11中央溫度高於基板u周緣溫度，^ 此一來，光阻層14中央厚度較光阻層14周緣厚度薄。 請參考圖7及8,其中圖7係顯示光阻層14厚度係隨 基板11半徑增加而遞增，而圖8則顯示光阻層14厚度2 隨基板11半徑增加而呈線性增加，設計時可依實際努浐' 需求加以考量。 請再參閱圖3，本實施例中，碟片原版丨製作方法更 包含：烘烤光阻層S40。於步驟S4〇中，係將光阻層 1262497 進行烘烤，使得光阻層14硬化以進行後續步驟。 於步驟S5〇中’進行光阻層14之雷射刻版（Laser Beam Recording，LBR)然後顯影。將數位資料轉換成高頻訊號 =至刻版機台，並驅動雷射光刻版在光阻層14上。然後 由顯影把刻版的訊號顯像出來，以形成有訊號的溝槽 B \。由於，光阻層之中央厚度較薄，周緣厚度較厚，於 =圯成周緣溝槽14la深度較深，而中央溝槽14讣深度較 堯之狀態。 本於步驟S60中’係形成一金屬層15於光阻層14上。 其例中’金屬層15可利㈣鍍絲鑛的方式來形成。 ’濺鍵常用的材料為鎳/鈒合金（Ni/Vall〇y)，而蒸鑛 的材料為銀。如此_來’即完成碟片原版i之製程， ^面之金屬層15則可作為日後利用電鑄製程來製備模 之導電層。 麵由上述步驟，碟片原版！上呈現中央溝槽深度較淺 '缘溝槽深度較深之狀態，於是，利用此碟片原版i製 教^又板版與子她（碟片模版）也會呈現中央溝槽深度 版二而周緣溝槽殊度較深之狀態，如此—來，利用碟片模 往哺出成型具㈣溝槽之基板時，塑料由碟片模版中央 便周級動日守，藉由碟片模版周緣溝槽深度較深之結構， I改善習用基板外圈深度成型不足之缺點。 請參閱圖9,係為本發明碟片原版製作方法之另一流 其與前揭實施例不同之處在於：提供—熱源12，於 土板11中央處S10,與塗佈一光阻層14於基板1}上 1262497 S30之步驟係同時進行。 請參考圖10，基板11係設置於機台16上，本實施例 中’步驟S10之熱源12’係為一光源123與一光纖束124， 光源123係設於基板η中央上方，而光纖束124之一端 係與光源123連接，另端則靠近基板η中央，此時，光 纖束124係控制光源123於基板11上之照射面積，如此 一來，即可利用光源123之熱能加熱基板U中央處。當 然，亦可將光纖束124改設一透鏡，同樣地可控制光源123 於基板11之照射面積。於是，光源丨23與光纖束124同 樣地可使基板11巾央之溫度〶於基板U周緣溫度，使得 後續塗佈光阻層14時，依然具呈現光阻層14厚度隨基板 11半徑遞增之狀態。 承上所述 ㈣阳Μ 4 之碟片原版之製作方法，係針 ^先^佈之技術加以修改，使得光阻層具有中度較 薄而周緣厚度較厚之變化 、 、又 驟時，光阻層崎雷射刻版步 來’即能改善習知技術中基板相深^ f版’如此一 升光資訊儲存媒體之生產品質。X不足之缺陷，以提 以上所述僅為舉例性， 本發明之精神與範#，而對其進=制性者。任何未脫離 應包含於後附之申請專利範圍中:之等效修改或變更’均 圖式簡單說明】 圖1係為習知碟片原版之-示意圖. 1262497 圖2係為習知之塗佈光阻層於基板上以势造碟K 光阻層厚度與基板半徑之_:' 原版 圖3係為本發明碟片原版製作方法之-流程圖； 圖4係為本發明碟片原版製作方法之-示意圖； 熱源碟片原版製作方法之-示意圖， 及圖9係為本發明碟片原版製作方法之另-流程圖；以 之示意圖，顯示 圖10係為本發明碟片原版製作方法 熱源加熱基板之又一狀態。 元件符號說明： I 碟片原版 II 基板 12 121 121， 熱源 加熱器 加熱器 金屬塊 11 122 接著劑 光阻層 凹洞 凹洞 凹洞 金屬層 機台 提供一熱源於一基板中央處 塗佈一接著劑於基板上 塗佈一光阻層 烘乾光阻層 雷射刻版並顯影 形成一金屬層 熱源 光源 光纖束 碟片原版 玻璃基板 光阻層 金屬層 121262497 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method for fabricating a stencil, and more particularly to a method for fabricating a disc original. [Prior Art] In the production process of an optical recording medium, a disc stamper having a groove or a recess is generally used, and a method of injection molding is used, which is formed to have a pattern corresponding to the disc stencil. After the substrate, a subsequent process is performed to produce a large amount of optical recording medium. In order to obtain a disc stencil, a disc master is first prepared. Referring to FIG. 1, a conventional disc master 3 generally includes a glass substrate 31; a photoresist layer 32 is applied to On the glass substrate 31, a metal layer 33 is provided on the photoresist layer 32. The manufacturing method of the disc master 3 includes: φ wet-washing a glass substrate 31, coating a photoresist layer 32 on the glass substrate 31, laser etching and developing the photoresist layer 32, and sputtering a metal layer. 33 is on the photoresist layer 32. Referring to FIG. 1 and FIG. 2 simultaneously, the relationship between the coating thickness of the photoresist layer 32 of the original disc 3 and the radius of the original disc 3 is shown. In FIG. 3, the photoresist layer 32 is uniformly distributed on the glass substrate 31. At this point, the process of the original disc is completed. Then, the electroforming step can be performed by using the disc original plate, and after the metal layer is thickened, and then the metal layer is separated from the original disc, the metal layer is a parent template 1262497 (Father Stamper), and then The electroforming and separation steps can be repeated to obtain a plurality of Mother Stampers, and each master can continue the electroforming step to obtain a plurality of stencils. In order to mass-produce an optical recording medium, a parent template or a sub-template is used to project a pre-grooved substrate having a pre-groove. The pre-grooves contained in the plastic substrate are used to provide a laser tracking record or a pre-recorded message, so the geometry of the pre-groove is important for finding or reading pre-recorded messages. Because of the pre-grooved substrate forming system = the template and the design and parameters of the injection machine are determined together. The plastic injection hopes that the mold temperature and the molding system of the center and the periphery of the disc stencil are different, and the outer diameter of the outer surface of the slab is insufficient, so as to compensate for the limitation of the plastic substrate that the injection machine cannot shoot the uniform depth, the disc must be The shape of the groove of the sheet template is modified. In the depth part, it can be seen that the groove geometry of the disc stencil is determined by the photoresist coating and development process of the original disc to be further improved. SUMMARY OF THE INVENTION The above object is to provide a method for disc mastering x, thereby improving the depth of the outer ring of the substrate, 绥曰*, and the defect of the foot. , 疋, in order to achieve the above purpose, according to the inscription method of the invention, a 6-person 1 „mercury original manufacturer/, I 3 · provide a heat source at the center of a substrate · ~, coating a photoresist layer 1262497 And forming a metal layer on the substrate; laser engraving and developing the photoresist layer on the photoresist layer. According to the above, the manufacturing method of the original disc according to the invention is modified by the technique of needle coating. So that the photoresist layer has a change in the thickness of the central portion than the thickness of the sub-thickness, and then the track riding the laser engraving step w' can form a disc original with a deep groove depth, so that the conventional technique can be improved. The defect that the outer diameter of the outer circumference of the substrate is insufficient to improve the production quality of the optical information storage medium. [Embodiment] A disc according to a preferred embodiment of the present invention will be described below with reference to a method for producing the original original sheet. 3 to FIG. 5 show a method for fabricating a disc master 1 according to a first preferred embodiment of the present invention, including providing a heat source at a center of the substrate, (S1〇); coating a photoresist layer on the substrate (S30); drying the photoresist layer (S40); laser engraving and developing Resisting (S5〇); and forming a metal bank on the photoresist layer (S60). Referring to FIG. 5 again, in step S10, a heat source 12 is provided at the center of a substrate 11#. In this embodiment, the substrate u The material is a glass, a quartz 2 or a ceramic material, wherein the ceramic material can be monooxide, a rat compound, or a carbide. In this embodiment, the heat source 12 is a heater 121, a heater The 121 series is directly heated at the center of the substrate u such that the central temperature of the substrate 11 is higher than the peripheral temperature of the substrate 11. When the heating is completed, the heater 121 can be removed, and the substrate 11 can be moved to another machine 16 1262497 (for example · Rotating the coating machine) to continue the subsequent steps. However, in addition to the heater 121 disposed on the side of the substrate 11, referring to FIG. 6, the heat source 12 may also have a heater 121 and a metal block 122, The metal block 122 is directly in contact with the center of the substrate 11. Thereafter, the heaters 121 on both sides heat the substrate 11 together with the metal block 122. Since the metal block 122 has better heat conduction properties, the center of the substrate u is closer to the periphery. High temperature, when heating is completed Then, the substrate is transferred from the metal block 122 and the heated portion 121' to the machine table 16 for subsequent steps. Referring to FIG. 3 and FIG. 4, the original method of the disc can be further included. The primer 13 is on the substrate S20, and in step s2, the subsequent agent 13 is applied on the substrate 11. The adhesive η may be a surfactant or a adhesion promoter ( Adhesi〇n Promoter) In step S30, the photoresist layer 14 is formed on the substrate U by spin coating. If the substrate u is coated with an adhesive 13, the photoresist layer 14 is formed on the adhesive 13. Since the central temperature of the substrate 11 is higher than the peripheral temperature of the substrate u due to the step S10, the central thickness of the photoresist layer 14 is thinner than the peripheral thickness of the photoresist layer 14. Please refer to FIG. 7 and FIG. 8 , wherein FIG. 7 shows that the thickness of the photoresist layer 14 increases with the radius of the substrate 11 , and FIG. 8 shows that the thickness 2 of the photoresist layer 14 increases linearly with the increase of the radius of the substrate 11 . Consider the actual needs. Referring to FIG. 3 again, in the embodiment, the method for manufacturing the original disc of the disc further comprises: baking the photoresist layer S40. In step S4, the photoresist layer 1262497 is baked, so that the photoresist layer 14 is hardened for the subsequent steps. Laser Beam Recording (LBR) of the photoresist layer 14 is performed in step S5, and then developed. The digital data is converted into a high frequency signal = to the engraving machine, and the laser lithography plate is driven on the photoresist layer 14. The signal of the stencil is then developed by development to form a groove B \ having a signal. Since the central thickness of the photoresist layer is thin, the thickness of the peripheral edge is thick, and the depth of the trench 14la is deeper, and the depth of the central trench 14 is relatively high. In step S60, a metal layer 15 is formed on the photoresist layer 14. In the example, the metal layer 15 can be formed by means of a (4) plated ore. The material commonly used for splash bonds is nickel/niobium alloy (Ni/Vall〇y), while the material for steaming is silver. In this way, the process of the original disc i is completed, and the metal layer 15 of the surface can be used as an electroforming process to prepare a conductive layer of the mold. Faced by the above steps, the disc original! On the upper side, the depth of the central groove is shallower, and the depth of the groove is deeper. Therefore, the original plate i and the plate and the daughter (disc template) are also presented with the central groove depth version. The peripheral groove is in a deep state, so that when the disc mold is used to feed the substrate of the forming tool (4), the plastic is moved from the center of the disc stencil to the periphery, and the peripheral groove of the disc stencil is used. The structure with deep groove depth, I can improve the shortcomings of the outer ring depth of the conventional substrate. Please refer to FIG. 9 , which is another flow of the method for fabricating the original disc of the present invention. The difference from the previous embodiment is that the heat source 12 is provided at the center of the soil plate 11 and the photoresist layer 14 is coated with a photoresist layer 14 . The steps of 1262497 S30 on substrate 1} are performed simultaneously. Referring to FIG. 10, the substrate 11 is disposed on the machine table 16. In the embodiment, the heat source 12 of the step S10 is a light source 123 and a fiber bundle 124. The light source 123 is disposed above the center of the substrate η, and the fiber bundle is One end of the 124 is connected to the light source 123, and the other end is close to the center of the substrate η. At this time, the fiber bundle 124 controls the illumination area of the light source 123 on the substrate 11, so that the heat of the light source 123 can be used to heat the center of the substrate U. At the office. Of course, the fiber bundle 124 can be modified by a lens, and the illumination area of the light source 123 on the substrate 11 can be controlled similarly. Therefore, the light source 丨23 and the fiber bundle 124 can cause the temperature of the substrate 11 to be at the peripheral temperature of the substrate U, so that when the photoresist layer 14 is subsequently applied, the thickness of the photoresist layer 14 is still increased with the radius of the substrate 11. status. According to the above-mentioned (4) Yangpu 4 disc original production method, the technology of the needle ^ first ^ cloth to modify, so that the photoresist layer has a moderately thin and thick peripheral thickness changes, and suddenly, light The resistance layer is a step-by-step method to improve the production quality of the substrate information depth in the conventional technology. The shortcomings of X deficiency are mentioned above only as an example, and the spirit and scope of the present invention are adopted. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The resist layer is formed on the substrate to form a thickness of the photoresist layer and the radius of the substrate. _: 'The original pattern 3 is a flow chart of the original method for manufacturing the disc according to the present invention; FIG. 4 is a method for fabricating the original disc of the present invention. - schematic diagram; schematic diagram of the original method for manufacturing the heat source disc, and FIG. 9 is another flow chart of the method for manufacturing the original disc of the present invention; and FIG. 10 is a schematic diagram showing the heat source heating substrate of the original disc manufacturing method of the present invention. Another state. Description of component symbols: I Disc original II substrate 12 121 121, heat source heater heater metal block 11 122 Next photoresist layer recess cavity cavity metal layer machine provides a heat source coated at the center of a substrate Applying a photoresist layer on the substrate to dry the photoresist layer and developing to form a metal layer heat source light source fiber bundle disk original glass substrate photoresist layer metal layer 12