1261376 五、發明說明（1) ’【發明所屬之技術領域】 本發明係有關一種可發出36〇度全方位光線之多向性發 光二極體，適用於發光二極體或類似結構者。 【先前技術】 由於發光二極體具有耗電量低、壽命長等優點，故發 光二極體多半用於電子產品指示用途者。 一般而言’習用發光二極體結構，請參第7圖，主要 係設有一具凹槽A 1之基座a，該凹槽a 1内結合有一晶 片B ’該晶片B再透過一連結線c與另一支架D連結，最 •後再藉一透光層E的射出成型，將基座a、晶片B、連結 線C及另一支架D結合為一體，完成發光二極體的製作。 然，上述傳統之發光二極體接通電源時，由於晶片被 結合於基座的凹杯中，該晶片周緣及底面所發射之光均被 凹杯阻擋、反射，故該晶片僅發出正向光，於該發光二極 體之背側係無法看到其所發出之光。 ， 亦或藉表面黏著技術（Surface Mount，SMT)直接將晶 片電性連接於印刷電路板上，如日本公開特許公報特開平 5-3 27026、特開2 0 0 0-22 3 752如第8、9圖所示，該電路 •板通電後，該晶片雖可達五面（前、後、左、右、上）發光 ’但其底面仍無法發光。 有鑑於此，本發明人期能提供一種多向性發光二極體 ’令發光二極體所發出之光於各個角度均可視，乃潛心研 思、設計組製，以提供消費大眾使用，為本發明所欲研創 -之創作動機者。1261376 V. INSTRUCTION DESCRIPTION (1) ′ [Technical Field to Which the Invention Is Applicable] The present invention relates to a directional light-emitting diode which emits 36-degree omnidirectional light, which is suitable for a light-emitting diode or the like. [Prior Art] Since the light-emitting diode has the advantages of low power consumption and long life, most of the light-emitting diodes are used for electronic product indication purposes. In general, the conventional light-emitting diode structure, please refer to FIG. 7, which is mainly provided with a base a with a groove A1, and a groove B is incorporated in the groove a1. The wafer B is further transmitted through a connecting line. c is connected to the other holder D, and finally, by the injection molding of the light-transmitting layer E, the base a, the wafer B, the connecting line C and the other holder D are integrated to complete the production of the light-emitting diode. However, when the conventional light-emitting diode is turned on, since the wafer is bonded to the concave cup of the susceptor, the light emitted from the periphery and the bottom surface of the wafer is blocked and reflected by the concave cup, so that the wafer only emits a positive direction. Light is not visible on the back side of the light-emitting diode. Or directly attaching the wafer to the printed circuit board by Surface Mount (SMT), as disclosed in Japanese Laid-Open Patent Publication No. Hei 5-3 27026, No. 2 0 0 0-22 3 752, No. 8. As shown in Fig. 9, after the circuit board is energized, the wafer can reach five sides (front, back, left, right, and top), but the bottom surface still cannot emit light. In view of the above, the present invention can provide a multi-directional light-emitting diode 'so that the light emitted by the light-emitting diode can be seen at various angles, and is dedicated to research and design to provide consumer use. The inventor of the invention is intended to be creative.
第5頁 1261376 五、發明說明（2) -- '【發明内容】 、本發明之主要目的，在提供一種可36 0度發光、無論 以何種角度均4視其所發出的光之多向性發光二極體者。 為達上述目的，本發明包括：一支架、至少一晶片、 ^少二連結導線丨以及一將上述各元件包覆成型之透光物 質’其中該晶片係藉連結導線與支架連結，令晶片呈懸空 狀，再藉透光物=將連結成一體的晶片、連結導線以及支 架局部包覆起；藉此，以完成一可發出3 6 0度全方位光線 之發光二極體者。 • 本發明之其他特點及具體實施例可於以下配合附圖之 詳細說明中，進一步瞭解。 【實施方式】 請參第1圖’係為本發明之第一實施例，該發光二極 體1主要設有一可導電的支架、一發光晶片2 〇、二連結 導線3 〇以及一透光物質4 0，該二支架結構相同，僅以 • 一支架說明’该支架由一小型電路板1 〇構成，該電路板 1 0外覆有導電物質1 1 ，該導電物質係選自金、銀、錫 、鉻、鎳和合金中之任一組群，而將該二支架相對置放， 丨•並將晶片2 0置於二相對置設的支架之間，該晶片2 〇的 正極與負極需設於同一面，如第2圖所示，而該晶片2 〇 的發光層2 1設於中間，且底部基板（substrate )需為透 明’同時透過二連結導線3 〇連結晶片2 0及二支架的導 電物質1 1 ，最後再藉由一透光物質4 0 —併將二支架局 ，部（結合有連結導線3 〇的部位）、晶片2 0及二連結導Page 5 1261376 V. INSTRUCTIONS (2) -- '【Contents of the Invention】 The main purpose of the present invention is to provide a 360-degree illumination that can be viewed from any angle at any angle. Sexual light-emitting diodes. In order to achieve the above object, the present invention comprises: a holder, at least one wafer, a second connecting wire, and a light-transmitting material for overmolding the above-mentioned components, wherein the wafer is connected to the bracket by a connecting wire, so that the wafer is Suspended, and then light-transmissive material = partially bonded wafer, connecting wire and bracket; thereby, to complete a light-emitting diode that can emit 360 degrees of omnidirectional light. Other features and embodiments of the present invention will be further understood from the following detailed description of the drawings. [Embodiment] FIG. 1 is a first embodiment of the present invention. The LED 1 is mainly provided with an electrically conductive support, an illuminating chip 2 〇, two connecting wires 3 〇, and a light transmissive substance. 40. The two brackets have the same structure, and only include a bracket. The bracket is composed of a small circuit board 1 . The circuit board 10 is covered with a conductive material 1 1 . The conductive material is selected from gold and silver. Any one of tin, chrome, nickel, and alloy, and the two brackets are placed opposite each other, and the wafer 20 is placed between two oppositely disposed brackets, and the positive and negative electrodes of the wafer 2 are required On the same side, as shown in FIG. 2, the light-emitting layer 2 1 of the wafer 2 is disposed in the middle, and the bottom substrate needs to be transparent 'while connecting the wafer 20 and the second support through the two connecting wires 3 〇 The conductive material 1 1 , and finally by a light-transmitting material 40 - and the two stents, the portion (the portion where the connecting wire 3 is bonded), the wafer 20 and the second connecting guide
第6頁 1261376 五、發明說明（3) •線3 0包覆成型，令該晶片2 〇係呈懸空設置，如 本發明之組裝者。 70风 “使用日守’係將本發明發光二極體1的二支架一側連接 正電’另一側連接負電，令晶片2 0受電流激發而發光， 由於該晶片2 〇呈懸空狀，其周圍未設有阻擋晶片2 〇光 線的阻擔物’故該晶片20所發出之光可3 6 0度發射，請 同日守j附第3〜4圖，因此，該發光二極體1無論由何種 角度觀之，其所發射之光均可清楚視之，如此即可達一般 鎢絲之功效，而可進一步取代鎢絲燈泡者。 ’ f爹第5〜6圖，係為本發明之第二實施例，係設有 一支架，該支架由一電路板i 〇所構成，該電路板丄〇的 底緣左右二側係設有穿孔1 2，該二穿孔1 2内可供焊錫 點設’係方便藉表面黏著技術（Sur f ace M〇unt，SMT)直接 將電路板1 〇電性連接者，而該電路板1 〇前端面之相對 二側各設有一導電物質1 1 ，二導電物質1 1之間設為絕 .緣’且該晶片2 0以倒置的方式，懸空置設於電路板1 〇 上方’此時，該晶片2 〇的電極與電路板1 0的二導電物 質1 1置於相同側，透過二連結導線3 0將晶片2 0與二 φ導電物質1 1連接，最後再以一透光物質4 0將晶片2 0 、二連結導線3 0及支架上段局部包覆成蜇，以完成組裝 由上可知，本發明之裝置係具有如下實用優點： 1 、令發光晶片呈懸空狀設置，使發光晶片周緣無阻擋物 阻擔、限制其發光範圍，進一步令發光二極體可全向Page 6 1261376 V. INSTRUCTIONS (3) • The wire 30 is overmolded so that the wafer 2 is suspended, as in the assembler of the present invention. 70 wind "Using the Guardian" system connects the two bracket sides of the light-emitting diode 1 of the present invention to the positive side, and the other side is connected to the negative power, so that the wafer 20 is excited by the current to emit light, since the wafer 2 is suspended, There is no blocking agent for blocking the light of the wafer 2 around it. Therefore, the light emitted by the wafer 20 can be emitted at 360 degrees. Please refer to Figures 3 to 4 of the same day, so that the light-emitting diode 1 is From what angle of view, the light emitted by it can be clearly seen, so that it can reach the effect of the general tungsten wire, and can further replace the tungsten filament bulb. ' f爹 5~6 is the invention The second embodiment is provided with a bracket, which is formed by a circuit board i ,, and the bottom and left sides of the bottom edge of the circuit board are provided with perforations 12, and the soldering points are available in the two through holes 12 It is convenient to use the surface adhesion technology (Surf ace M〇unt, SMT) to directly connect the circuit board 1 , and the opposite side of the front side of the circuit board 1 is provided with a conductive material 1 1 , 2 The conductive material 11 is disposed between the anode and the anode 20 and the wafer 20 is suspended in the circuit in an inverted manner. 1 〇上' At this time, the electrode of the wafer 2 is placed on the same side as the two conductive material 1 1 of the circuit board 10, and the wafer 20 is connected to the two φ conductive material 1 1 through the two connecting wires 30, and finally The wafer 20, the two connecting wires 30 and the upper portion of the stent are partially covered with a light-transmitting material 40 to complete the assembly. As can be seen from the above, the device of the present invention has the following practical advantages: 1. The light-emitting wafer is suspended. The shape of the illuminating wafer has no barrier to the periphery of the luminescent wafer, limits its illuminating range, and further makes the illuminating diode omnidirectional
第7頁 1261376 五、發明說明（4) " 發光者。 2、該發光晶片係藉透光物質直接 結構將晶片藉黏合膠劑結合於 ，令習用的發光二極體僅能發 3 、藉晶片的懸空設置，係令該發 度觀之，該晶片所發射出之光 4、並無错任何黏者膠劑將晶片黏 片上沒有任何一面受黏著膠劑 惟以上所述者，僅為本發明之 >以限定本發明可實施之範圍，凡習 作變化與修飾，皆應視為不悖離本 綜上所述，本發明確可達到創 種多向性發光二極體，具有實用價 明專利申請。 包覆成型 基座上或 出正向光 光二極體 均可視之 結於導電 阻擋發光 較佳實施 於本業之 發明之實 作之預期 值無疑， ，有別於習用 其上之凹杯中 之缺失者。 不論以何種角 者。 支架上，使晶 者。 例，當不能用 人士所明顯可 質内容。 目的，提供一 爰依法提出發Page 7 1261376 V. Inventions (4) " Luminators. 2. The light-emitting chip is bonded to the wafer by a direct structure of the light-transmitting material, so that the conventional light-emitting diode can only be used for the transmission of the wafer, and the wafer is suspended. The emitted light 4, there is no wrong adhesive agent, and there is no adhesive layer on the wafer adhesive sheet. Only the above is only the scope of the present invention to limit the scope of implementation of the present invention. Both the modification and the modification should be regarded as not departing from the above description. The present invention can indeed achieve the creation of a multi-directional light-emitting diode, and has a practical patent application. The expected value of the implementation of the invention of the invention is better than that of the coated light-emitting diode on the overmolded pedestal or the positive light-emitting diode, which is different from the defect in the concave cup used in the prior art. By. No matter what kind of corner. On the bracket, make the crystal. For example, when it is not possible to use the obvious content of the person. Purpose, provide a
第8頁 1261376_ 圖式簡單說明 ，【圖式簡單說明】 第1圖係為本發明實施例之剖示圖。 第2圖係為本發明晶片之立體外觀圖。 第3圖係為本發明實施例之使用示意剖示圖。 第4圖係為本發明實施例之使用示意俯視圖。 第5圖係為本發明另一實施例之立體外觀圖。 第6圖係為第5圖之剖示圖。 第7圖係為習用發光二極體之側示圖。 第8圖係為日本特開平5 - 3 2 7 0 2 6號發光二極體之侧示 ，圖。 第9圖係為日本特開20 0 0-223 752號發光二極體之側示 圖。 【主要元件符號說明】 - 1、發光二極體 1 0、電路板 1 2、穿孔 2 1 、發光層 1 1 、導電物質 2 0 、晶片 3 0、連結導線 B 4 0、透光物質 A 1 、凹杯 C、連接線 E、透光層 A、基座 B 、晶片 D、支架Page 8 1261376_ BRIEF DESCRIPTION OF THE DRAWINGS [Brief Description of the Drawings] Fig. 1 is a cross-sectional view showing an embodiment of the present invention. Figure 2 is a perspective view of the wafer of the present invention. Figure 3 is a schematic cross-sectional view showing the use of an embodiment of the present invention. Figure 4 is a schematic plan view showing the use of an embodiment of the present invention. Figure 5 is a perspective view of another embodiment of the present invention. Fig. 6 is a cross-sectional view of Fig. 5. Figure 7 is a side view of a conventional light-emitting diode. Fig. 8 is a side view of a light-emitting diode of Japanese Patent Laid-Open No. 5 - 3 2 7 0 2 6 . Fig. 9 is a side view of a light-emitting diode of JP-A-200-223752. [Description of main component symbols] - 1. Light-emitting diode 10, circuit board 1, 2. Perforation 2 1 , light-emitting layer 1 1 , conductive material 2 0, wafer 30, connecting wire B 4 0, light-transmitting substance A 1 , concave cup C, connecting line E, light transmitting layer A, base B, wafer D, bracket
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