JP2007081046A - Multi-directional light emitting diode - Google Patents

Multi-directional light emitting diode Download PDF

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JP2007081046A
JP2007081046A JP2005265552A JP2005265552A JP2007081046A JP 2007081046 A JP2007081046 A JP 2007081046A JP 2005265552 A JP2005265552 A JP 2005265552A JP 2005265552 A JP2005265552 A JP 2005265552A JP 2007081046 A JP2007081046 A JP 2007081046A
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chip
light emitting
emitting diode
light
frame
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Wen-Gung Sung
宋文恭
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multi-directional light emitting diode capable of emitting light over 360° wherein the light emitted therefrom can be seen from any angle. <P>SOLUTION: This multi-directional light emitting diode capable of emitting light over 360° is completed by comprising a frame, at least one chip, at least two connecting lead wires, and a light transmissive material for covering and molding the above-mentioned respective elements. The chip is connected to the frame with the connecting lead wires, and is installed in a suspended state. Further, the chip, the connecting lead wires, and a part of the frame are integrally coupled and covered with the light transmissive material. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、３６０°の多方向光を発光できる多方向発光ダイオードに関わるもので、発光ダイオード或は類似構造の多方向発光ダイオードに関するものである。   The present invention relates to a multidirectional light emitting diode capable of emitting 360 ° multidirectional light, and relates to a light emitting diode or a multidirectional light emitting diode having a similar structure.

発光ダイオードは、電気消費量が低く、寿命が長いなどの利点があるため、その多半数は電子製品の指示用途に用いられる。   Since light emitting diodes have advantages such as low electricity consumption and long life, most of them are used for indicating applications of electronic products.

従来の発光ダイオード構造を図７に示す。一般に、従来の発光ダイオードは、主に凹溝Ａ１を有する台座Ａが設置され、凹溝Ａ１内にチップＢが結合され、当該チップＢが接続ワイヤＣによりもう一つのフレームＤに接続し、最後に光透過層Ｅの射出成形により、台座ＡとチップＢと接続ワイヤＣともう一つのフレームＤとを一体に結合して、発光ダイオードが製作されている。   A conventional light emitting diode structure is shown in FIG. In general, a conventional light emitting diode has a pedestal A mainly having a concave groove A1, a chip B is coupled into the concave groove A1, and the chip B is connected to another frame D by a connecting wire C. The base A, the chip B, the connecting wire C, and the other frame D are integrally coupled to each other by injection molding of the light transmission layer E, whereby a light emitting diode is manufactured.

しかしながら、前記従来の発光ダイオードに電源を導通されると、チップが台座のカップ中に結合されるため、当該チップ周縁及び底面に発する光がともにカップに阻止し反射されるため、当該チップが正方向の光しか発光できず、その発光ダイオードの裏側にはその発光が見えない。   However, when the power is turned on to the conventional light emitting diode, the chip is coupled into the pedestal cup, so that light emitted from the peripheral edge and bottom surface of the chip is both blocked and reflected by the cup, so that the chip is correctly connected. Only light in the direction can be emitted, and the light emission cannot be seen on the back side of the light emitting diode.

または、表面マウント技術（Ｓｕｒｆａｃｅ Ｍｏｕｎｔ、ＳＭＴ）によりチップをプリント回路板に直接電気的に接続したことが、特開平５−３２７０２６号公報及び特開２０００−２２３７５２号公報（図８、図９）に示されている。当該回路板を電源導通した後に、当該チップは５面（前、後、左、右、上の面）までに発光できるが、その底面は依然として発光できない。   Alternatively, it is disclosed in Japanese Patent Laid-Open Nos. 5-327026 and 2000-223752 (FIGS. 8 and 9) that the chip is directly and electrically connected to the printed circuit board by surface mounting technology (Surface Mount, SMT). It is shown. After powering on the circuit board, the chip can emit light up to five sides (front, back, left, right, top), but its bottom still cannot emit light.

本発明の発明者は前記欠点に鑑みて成されたもので、本発明の目的とするところは、発光ダイオードの発光がそれぞれの角度にも見られる多方向発光ダイオードを提供することにある。
本発明の主な目的は、３６０°で発光でき、如何なる角度でもその発光が見られる多方向発光ダイオードを提供することにある。
さらに本発明の目的は専念な研究や設計組立により、消費大衆の使用に提供することができる、多方向発光ダイオードを提供することにある。 The inventor of the present invention has been made in view of the above disadvantages, and an object of the present invention is to provide a multidirectional light emitting diode in which light emission of the light emitting diode can be seen at each angle.
A main object of the present invention is to provide a multidirectional light emitting diode that can emit light at 360 ° and can emit light at any angle.
It is a further object of the present invention to provide a multi-directional light emitting diode that can be provided for consumer use by dedicated research and design assembly.

上記の目的を達成する為に、本発明は、フレームと、少なくとも一つのチップと、少なくとも二つの接続リードワイヤと、前記各素子を覆い成形する光透過材とを含み、前記チップが接続リードワイヤによりフレームに接続し、チップを懸垂状に設置させ、さらに光透過材により一体に結合されたチップと接続リードワイヤとフレームの一部とを覆うことによって、３６０°で発光できる多方向発光ダイオードが完成する。   In order to achieve the above object, the present invention includes a frame, at least one chip, at least two connection lead wires, and a light transmissive material that covers and molds each element, and the chip is a connection lead wire. A multi-directional light emitting diode capable of emitting light at 360 ° by covering the chip, the connecting lead wire, and a part of the frame that are integrally connected by the light transmitting material. Complete.

すなわち、本願の第１発明は、少なくとも一つのフレームと、アノードとカソードが上面に設置され、その底部基板が透明である少なくとも一つのチップと、発光チップとフレームとを接続するための少なくとも二つの接続リードワイヤと、前記各素子を覆い成形する光透過材とを含み、光透過材の覆いによりチップを懸垂状に設置することによって、チップが３６０°で多方向発光できることを特徴とする、多方向発光ダイオードである。
本願の第２発明は、前記フレームの数は２つに設け、両回路板の外に導電物質が覆われるように形成され、且つ両フレームは対向に設置されることを特徴とする、前記第１発明に記載の多方向発光ダイオードである。
本願の第３発明は、前記フレームは回路板より構成され、前記回路板の前端面の対向両側に導電材がそれぞれ設けられ、両導電材の間に絶縁されることを特徴とする、前記第１発明に記載の多方向発光ダイオードである。
本願の第４発明は、前記導電材は金、銀、錫、クロム、ニッケル及びその合金のうちから選ばれるいずれか一つであることを特徴とする、第２発明又は第３発明に記載の多方向発光ダイオードである。
本願の第５発明は、前記光透過材で覆う時に、チップ及び接続リードワイヤを完全に覆い、フレームが部分的に覆われることを特徴とする、前記第１発明に記載の多方向発光ダイオードである。 That is, the first invention of the present application provides at least one frame, at least one chip on which an anode and a cathode are installed on the upper surface, and whose bottom substrate is transparent, and at least two for connecting the light emitting chip and the frame. Including a connecting lead wire and a light-transmitting material for covering and molding each element, and the chip can be suspended by the light-transmitting material so that the chip can emit light in multiple directions at 360 °. Directional light emitting diode.
The second invention of the present application is characterized in that the number of the frames is two, the circuit board is formed so as to be covered with a conductive material, and both the frames are installed facing each other. 1 is a multi-directional light emitting diode according to the invention;
The third invention of the present application is characterized in that the frame is constituted by a circuit board, conductive materials are provided on both sides of the front end face of the circuit board, and insulated between the two conductive materials. 1 is a multi-directional light emitting diode according to the invention;
According to a fourth invention of the present application, the conductive material is any one selected from gold, silver, tin, chromium, nickel, and an alloy thereof, according to the second or third invention. It is a multidirectional light emitting diode.
A fifth invention of the present application is the multidirectional light emitting diode according to the first invention, wherein the chip and the connecting lead wire are completely covered and the frame is partially covered when covered with the light transmitting material. is there.

以上のように、本発明の装置は以下のような利点がある。
（１）発光チップを懸垂状に設置させることで、発光チップの周縁に遮断物の阻止や発光範囲を制限することがないようにし、さらに発光ダイオードが多方向で発光できるようにさせる。
（２）発光チップは光透過材により直接覆って成形され、従来の構造での接着剤によりチップを台座のカップ内に結合し、従来の発光ダイオードが正方向の光しか発光できないことと違う。
（３）チップを懸垂状に設置させることで、その発光ダイオードが如何なる角度で見ても、そのチップの発光は全て見られる。
（４）如何なる接着剤によりチップを導電フレームに結合することはなく、チップには如何なる面にも接着剤により発光を阻止することはない。 As described above, the apparatus of the present invention has the following advantages.
(1) By installing the light emitting chip in a suspended shape, it is possible to prevent blocking of the obstruction and limit the light emission range at the periphery of the light emitting chip, and to allow the light emitting diode to emit light in multiple directions.
(2) The light-emitting chip is directly covered with a light-transmitting material and molded, and the conventional light-emitting diode can emit light only in the positive direction by bonding the chip into the pedestal cup with an adhesive having a conventional structure.
(3) By placing the chip in a suspended shape, all light emission of the chip can be seen no matter what angle the light emitting diode is viewed.
(4) The chip is not bonded to the conductive frame by any adhesive, and light emission is not blocked by the adhesive on any surface of the chip.

本発明の特徴及び具体的な実施例を以下に添付した図面を参照しながら説明する。   The features and specific embodiments of the present invention will be described below with reference to the accompanying drawings.

図１を参照すると、本発明の発光ダイオード１は、主に導電可能な二つのフレームと発光チップ２０と二つの接続リードワイヤ３０と光透過材４０とが設けられる。   Referring to FIG. 1, the light emitting diode 1 of the present invention is mainly provided with two conductive frames, a light emitting chip 20, two connecting lead wires 30, and a light transmitting material 40.

二つのフレーム構造は同じであるため、一方のフレームだけで説明する。
当該フレームは小型の回路板１０より構成され、回路板１０の外には導電材１１が覆われ、当該導電材１１は金、銀、錫、クロム、ニッケル及びその合金のうちから選ばれるいずれか一つである。
両フレームは対向して設置される。チップ２０を対向に設置される両フレームの間に設置し、当該チップ２０のアノード、カソードは正面に設置される必要が有る。 Since the two frame structures are the same, only one frame will be described.
The frame is composed of a small circuit board 10, and a conductive material 11 is covered outside the circuit board 10, and the conductive material 11 is selected from gold, silver, tin, chromium, nickel, and alloys thereof. One.
Both frames are installed facing each other. It is necessary to install the chip 20 between both frames installed opposite to each other, and to install the anode and cathode of the chip 20 on the front surface.

図２に示されるように、チップ２０の発光層２１は中央に設置され、且つその底部基板は透明であるとともに、二つの接続リードワイヤ３０によりチップ２０と両フレームの導電材１１に接続し、最後に光透過材により両フレームの一部（接続リードワイヤ３０に結合する箇所）とチップ２０と両接続リードワイヤ３０とを覆って成形し、チップ２０を懸垂状に設置して組立を完了する。   As shown in FIG. 2, the light emitting layer 21 of the chip 20 is installed in the center, and its bottom substrate is transparent, and is connected to the chip 20 and the conductive material 11 of both frames by two connection lead wires 30, Finally, a part of both frames (a part to be connected to the connection lead wire 30), the chip 20 and both the connection lead wires 30 are formed by covering with the light transmitting material, and the chip 20 is installed in a suspended shape to complete the assembly. .

使用する時に、本発明の発光ダイオード１の両フレームの一方側を正電気に接続し、もう一方側を負電気に接続する。
チップ２０が電流励起により発光し、チップ２０が懸垂状になっているため、その周辺にはチップ２０の光を阻止する遮断物がないため、チップ２０の発光が３６０°で発光できる。
同時に図３〜図４を参照すると、発光ダイオード１は、如何なる角度で見ても、その発光は全て見られる。よって、一般のタングステンランプの効果が達成でき、さらにタングステンランプに代えることができる。 In use, one side of both frames of the light emitting diode 1 of the present invention is connected to positive electricity and the other side is connected to negative electricity.
Since the chip 20 emits light by current excitation and the chip 20 has a suspended shape, there is no blocking object to block the light of the chip 20 around the chip 20, so that the chip 20 can emit light at 360 °.
Referring to FIGS. 3 to 4 at the same time, the light emission of the light emitting diode 1 can be seen at any angle. Therefore, the effect of a general tungsten lamp can be achieved, and it can be replaced with a tungsten lamp.

図５〜図６を参照して本発明の第２実施例を説明する。
本実施例では、フレームが設けられ、当該フレームは回路板１０より構成される。回路板１０の底縁左右両側には貫通孔１２が設けられ、貫通孔１２内には半田つけ用の点が設けられている。回路板１０の前端面の対向両側には導電材１１がそれぞれ設けられている。両導電材１１の間に絶縁され、且つチップ２０はフリップの方式で回路板１０の上方に懸垂状に設置される。この際に、チップ２０の電極と回路板１０の両導電材１１は面一に設けられる。二つの接続リードワイヤ３０によりチップ２０と両導電材１１に接続し、最後に光透過材４０によりチップ２０と両接続リードワイヤ３０とフレーム上半一部を覆って成形して、組立を完了する。 A second embodiment of the present invention will be described with reference to FIGS.
In this embodiment, a frame is provided, and the frame is composed of the circuit board 10. Through holes 12 are provided on the left and right sides of the bottom edge of the circuit board 10, and soldering points are provided in the through holes 12. Conductive materials 11 are respectively provided on opposite sides of the front end face of the circuit board 10. Insulated between the two conductive materials 11, and the chip 20 is suspended above the circuit board 10 in a flip manner. At this time, the electrode of the chip 20 and the conductive material 11 of the circuit board 10 are provided flush with each other. The chip 20 and both conductive materials 11 are connected by the two connecting lead wires 30, and finally the chip 20, the connecting lead wires 30 and the upper half of the frame are covered with the light transmitting material 40 to complete the assembly. .

以上の説明は本発明の実施可能な好ましい実施例に過ぎず、本発明はこれらの記載に限定されるものではなく、本発明の精神、特徴に基づいた改良及び変更は本発明に含まれるものである。   The above description is only a preferred embodiment of the present invention, and the present invention is not limited to these descriptions. Improvements and modifications based on the spirit and characteristics of the present invention are included in the present invention. It is.

本発明の実施例の断面図である。It is sectional drawing of the Example of this invention. 本発明のチップの外観斜視図である。It is an external appearance perspective view of the chip | tip of this invention. 本発明の実施例の使用状態を示す断面図である。It is sectional drawing which shows the use condition of the Example of this invention. 本発明の実施例の使用状態を示す平面図である。It is a top view which shows the use condition of the Example of this invention. 本発明のもう一つの実施例の外観斜視図である。It is an external appearance perspective view of another Example of this invention. 図５の断面図である。It is sectional drawing of FIG. 従来の発光ダイオードの側面図である。It is a side view of the conventional light emitting diode. 特開平５−３２７０２６号の発光ダイオードの側面図である。It is a side view of the light emitting diode of Unexamined-Japanese-Patent No. 5-327026. 特開２０００−２２３７５２号の発光ダイオードの側面図である。It is a side view of the light emitting diode of Unexamined-Japanese-Patent No. 2000-223752.

符号の説明Explanation of symbols

１・・・・・・発光ダイオード
１０・・・・・回路板
１１・・・・・導電材
１２・・・・・貫通孔
２０・・・・・発光チップ
２１・・・・・発光層
３０・・・・・接続リードワイヤ
４０・・・・・光透過材
Ａ・・・・・・台座
Ａ１・・・・・凹溝
Ｂ・・・・・・チップ
Ｃ・・・・・・接続ワイヤ
Ｄ・・・・・・フレーム
Ｅ・・・・・・光透過層 DESCRIPTION OF SYMBOLS 1 ... Light emitting diode 10 ... Circuit board 11 ... Conductive material 12 ... Through-hole 20 ... Light emitting chip 21 ... Light emitting layer 30 ... Connection lead wire 40 ... Light transmissive material A ... Base A1 ... Groove B ... Chip C ... Connection wire D ... Frame E ... Light transmission layer

Claims (5)

少なくとも一つのフレームと、
アノードとカソードが上面に設置され、その底部基板が透明である少なくとも一つのチップと、
発光チップとフレームとを接続するための少なくとも二つの接続リードワイヤと、
前記各素子を覆い成形する光透過材とを含み、
光透過材の覆いによりチップを懸垂状に設置することによって、チップが３６０°で多方向発光できることを特徴とする、
多方向発光ダイオード。 At least one frame;
At least one chip having an anode and a cathode on the top surface, the bottom substrate of which is transparent;
At least two connecting lead wires for connecting the light emitting chip and the frame;
A light transmissive material for covering and molding each element,
The chip is capable of emitting light in multiple directions at 360 ° by installing the chip in a suspended shape by covering with a light transmitting material.
Multi-directional light emitting diode. 前記フレームの数は２つに設け、両回路板の外に導電物質が覆われるように形成され、且つ両フレームは対向に設置されることを特徴とする、請求項１記載の多方向発光ダイオード。   2. The multi-directional light emitting diode according to claim 1, wherein the number of the frames is two, the conductive material is covered outside the circuit boards, and the frames are disposed opposite to each other. . 前記フレームは回路板より構成され、前記回路板の前端面の対向両側に導電材がそれぞれ設けられ、両導電材の間に絶縁されることを特徴とする、請求項１記載の多方向発光ダイオード。   The multi-directional light emitting diode according to claim 1, wherein the frame is formed of a circuit board, and conductive materials are respectively provided on both sides of the front end face of the circuit board, and are insulated between the two conductive materials. . 前記導電材は金、銀、錫、クロム、ニッケル及びその合金のうちから選ばれるいずれか一つであることを特徴とする、請求項２又は３記載の多方向発光ダイオード。   4. The multidirectional light emitting diode according to claim 2, wherein the conductive material is any one selected from gold, silver, tin, chromium, nickel and alloys thereof. 前記光透過材で覆う時に、チップ及び接続リードワイヤを完全に覆い、フレームが部分的に覆われることを特徴とする、請求項１記載の多方向発光ダイオード。   The multi-directional light emitting diode according to claim 1, wherein when the light transmitting material is covered, the chip and the connecting lead wire are completely covered, and the frame is partially covered.
JP2005265552A 2005-09-13 2005-09-13 Multi-directional light emitting diode Pending JP2007081046A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013038221A (en) * 2011-08-08 2013-02-21 Citizen Holdings Co Ltd Light emitting device
JP2013038222A (en) * 2011-08-08 2013-02-21 Citizen Holdings Co Ltd Light emitting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635656A (en) * 1986-06-25 1988-01-11 Matsushita Electric Ind Co Ltd Network controller
JP2004134414A (en) * 2002-10-04 2004-04-30 Ultrastar Ltd Package structure of surface mount light emitting diode and method for manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635656A (en) * 1986-06-25 1988-01-11 Matsushita Electric Ind Co Ltd Network controller
JP2004134414A (en) * 2002-10-04 2004-04-30 Ultrastar Ltd Package structure of surface mount light emitting diode and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013038221A (en) * 2011-08-08 2013-02-21 Citizen Holdings Co Ltd Light emitting device
JP2013038222A (en) * 2011-08-08 2013-02-21 Citizen Holdings Co Ltd Light emitting device

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