TWI257465B - Lighting device with high heat dissipation efficiency - Google Patents

Lighting device with high heat dissipation efficiency Download PDF

Info

Publication number
TWI257465B
TWI257465B TW093130725A TW93130725A TWI257465B TW I257465 B TWI257465 B TW I257465B TW 093130725 A TW093130725 A TW 093130725A TW 93130725 A TW93130725 A TW 93130725A TW I257465 B TWI257465 B TW I257465B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation efficiency
lighting device
high heat
light
Prior art date
Application number
TW093130725A
Other languages
English (en)
Other versions
TW200612058A (en
Inventor
Jen-Shyan Chen
Original Assignee
Neobulb Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neobulb Technologies Inc filed Critical Neobulb Technologies Inc
Priority to TW093130725A priority Critical patent/TWI257465B/zh
Priority to US11/019,161 priority patent/US7438448B2/en
Priority to JP2005002066A priority patent/JP4627189B2/ja
Publication of TW200612058A publication Critical patent/TW200612058A/zh
Application granted granted Critical
Publication of TWI257465B publication Critical patent/TWI257465B/zh
Priority to US12/216,268 priority patent/US20080265273A1/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21LLIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022Pocket lamps
    • F21L4/027Pocket lamps the light sources being a LED
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21LLIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00Electric lighting devices with self-contained electric batteries or cells
    • F21L4/005Electric lighting devices with self-contained electric batteries or cells the device being a pocket lamp
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S9/00Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
    • F21S9/02Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Description

1257465
【發明所屬之技術領域】 本發明係有關一種照明裝置,特別是關於一種具高散 熱效率之模組搭配高功率之照明源,此散熱模組特別是應 用在高功率照明裝置,強調避免光源位置之溫度過高。 【先前技術】 照明裝置在人們的生活裡, 人類在夜晚仰賴照明裝置從 或是車燈照明,都與人類的 從愛迪生發生電燈以來 就佔有一項非常重要的地位 事活動,小至手電筒、電燈 生活息息相關。 口 f1圖所示為目前高功率發光二極體應用於照明之成 抑示忍圖’在一實心金屬導熱板ίο,如鋁板上設置有_或 數個發光二極體(Light Emitting Diode)元件12,且在金 f =熱板10上位於發光二極體元件12周圍製作電路14,但 疋當發光二極體元件12為高功率時,僅僅利用金屬 10之^傳導作為散熱途徑,其散熱能力有限,使得發光元 件内=之二極體晶片因高溫而降低其發光效率,進而使光 源的f度不如預期,LED的壽命亦同時受到影響。 式熱導體是電子產品散熱模組廣為應用的傳 :體2 0、丰么^第2圖所不導體2包括有中空且密封的 ::動=織22與工作流體’熱導體内部處於真空狀 :顯示器(I .疋當熱源26,如消耗功率的晶片、CPU或液 二踹你=uid Cyrstal DisPlay ;lcd)接觸熱導體2的 -’使工作流體蒸發成氣態’汽化後的流體可
1257465 五、發明說明(2) 熱傳至腔體2的另一端,再經由冷卻設計使流體由氣相冷 凝成液相,再藉由毛細組織22將液態工作流體吸回受熱的 一端’以利用液氣相變化原理完成散熱或均熱效果。 有鑑於此,本發明係針對上述之困擾,提出一種具高 散熱效率之模組,並且將此概念應用在高功率照明裝置 上’以改善上述之缺失。 【發明内容】 主要目的,係在提供 功率照明裝置内設置 功率照明裝置所產生 而提升亮度。 另一目的,係在提供 功率照明裝置之殼體 熱效率,使照明裝置 述之目的,本發明係 包括一殼體,在殼體 坦部,且有數個散熱 熱效率,發光裝置設 熱迅速散播開,再透 電力裝置提供電力給 一種具高散熱效率之照 有熱導體及散熱韓片, 的高熱能,以使得散熱 一種具高散熱效率之照 上開設孔洞或設置風 之發光效率及高度可發 提出一種具高散熱效率 内設置有一熱導體,其 鰭片設置在熱導體周 立於熱導體之平坦部, 過散熱鰭片釋出熱能, 發光裝置,而使發光裝 本發明之 明裝置,在高 以用來發散高 效率提高,進 本發明之 明裝置,在高 扇,以提高散 揮到最大。 為達到上 之照明裝置, 一端具有一平 圍,以提高散 利用熱導體將 另外需搭配一 置發光。 底下藉由具體實施例配合所附的圖式詳加說明,當
第6頁 1257465
技術内容、特點及其所達成的功 容易瞭解本發明的目的 效0 【實施方式】 為了解決目前高功率光源應用於照明上所面臨散熱問 因此本發明提出一種具高散熱效率之高功率照明裝 置,可應用在任何一種照明裝置,例如手電筒、汽車車 二,燈等:藉由高散熱效率以獲得更好的發光效率並且 k局光源之壽命。 第3圖所不為本發明之具高散熱效率之照明裝置的結 構d視圖,具高散熱效率之照明裝置3包括一殼體3〇, 内設置有一熱導體32 ’如熱導管(heat 或 ,導柱(heat C〇lumn),熱導體32 一端具有一平坦部此 ::部必須在#統熱導體製作㈣額外予以加工處理,孰 =3 2周圍需設置數個散熱錯片3 2 4與外界做熱對流以排 除熱1,且有一發光裝置34發ΨΙ、、店、,i Μ π 4 I出先/原以透出殼體30而用以 ’使發光裝置34設置於熱導體32之平坦部上,在此發 先裝置34上設置有二電極,在散熱體之另一端設有一電路 :36 ’如印刷電路板,力裝置3? ’如電池或交流轉換 ^流之電源供應器利用-電線連接到電路板36以形 接,電力裝置37可透過電路板36作電 送至發光裝置34,而提供電力至發裝〗輸 34發射光源,進而達到照明目的發褒置34並啟動發光裝置 第4圖及第5圖為熱導體與散熱韓片之立體圖及側視
1257465 五、發明說明(4) —-- 圓,熱導體32包括有一中空腔體32〇,其材質為銅, 空腔體3 20内容置一工作流體,且中空腔體32〇内呈真空狀 態,並在中空腔體320内設置有毛細結構(圖中未示),~ 工作流體受熱時,便會蒸發為氣態,藉由與散熱鰭片32S4 相接之一冷凝端將氣態流體凝結為液態,再由毛細結構將 工作流體吸回受熱端,藉由中空腔體結構,可將埶^ 播至散熱鰭片324。 '
並請同時參閱第6圖,第6圖所示為發光裝置之俯視 圖,發光裝置34可透過一基材340將發光源342,如發光二 極體設置在其上後後,再安置於平坦部上,電極344、346 設置在基材340上,並分別連接至每一發光源342,該基板 340之材質可以為矽,或者如第7圖所示,可直接將發光源 342,如發光二極體安置於中空腔體32〇之平坦部上,上述 一者之發光源342可以是利用打線(wire bonding)或覆晶 (f1 ip chip)晶片。
一且’散熱鰭片324具有多種實施態樣,如第8圖所示之 具回散熱效率之照明裝置的俯視圖,由圖中可知,每一散 熱鰭片324,係環設在中空腔體周圍,而散熱鰭片除了為圓 盤狀外’吏可如第9圖所示之不規則狀,此不規則狀可為 ,齒狀、花瓣狀或在鰭内製作氣流導通孔等,其材質可以 疋=或銘為底材製作而成,且可容置入殼體3〇内之形狀皆 包含在内’或者如第10圖所示,散熱鰭片324係以中空腔 體為中〜而成放射狀’係為_片片自中空腔體垂直由内向 外延伸出,且如第11圖所示,在每一個環設在中空腔體
1257465
第9頁 1257465
e 1257465 圖式簡單說明 26熱源 3具高散熱效率之高功率照明裝置 30殼體 34發光裝置 37電力裝置 320中空腔體 324散熱鰭片 342發光源 326 洞口 3 0 2孔洞 32熱導體 36電路板 340基材 344、346 電極 38風扇
第11頁

Claims (1)

1257465 六、申請專利範圍 種具高散熱效率之照明裝置,包括 端係具有 一熱導體,其係設置於該殼體内,該熱導體 一平坦部; 至少一散熱鰭片,其係設置於該殼體内並位於該熱導體 周圍’用以散熱; 一發光裝置,其係設置於該熱導體之平坦部,並發出光 源以經由殼體而照明;以及 一電力裳置’係與該發光裝置形成電連接’以提供該發 光裝置所需之電力。 進 2·如申請專利範圍第1項所述之具高散熱效率之照明裝 置,其中,該殼體上係開設至少一孔洞,以增加對流 而增加散熱效率。 3 ·如申清專利範圍第1項所述之具同政熱效率之照明裝 置,其中,每一該散熱錄片係環設於該熱導體周圍。 4·如申請專利範圍第3項所述之具高散熱效率之照明裝 置,其中,每一該散熱鰭片係為圓盤狀。 5 ·如申請專利範圍第3項所述之具高散熱效率之照明裝 置,其中,每一該散熱鰭片係為不規則狀。 更 6·如申請專利範圍第1項所述之具高效率之照明裝置, 包括一電路板,其係設置於該殼體内並位於該熱導體另一 端,並連接至該電力裝置,以使該發光裝置利用該電路板 與該電力裝置形成電連接。 7 ·如申請專利範圍第6項所述之具高散熱效率之照明裝 第12頁 I257465 申清專利範圍 置’其中,該電路板係為印刷電路板。 8 ·如申請專利範圍第1項所述之具高散熱效率之照明裝 ^ ’其中’該發光裝置包含一基材,並在該基材上設置至 匕一發光源,且有二電極設置於該基材上,該發光源發出 光線以透出該殼體,且該二電極分別連接該發光源。 •如申請專利範圍第8項所述之具高散熱效率之照明裝 置’其中,該基材係由矽材質所構成者。 I 〇 ·如申晴專利範圍第8項所述之具高散熱效率之照明裝 置’其中,該發光源係為發光二極體。 II ·如申請專利範圍第1項所述之具高散熱效率之照明裝 置’其中’該發光裝置係包含至少一發光二極體。 12 ·如申睛專利範圍第7項所述之具高散熱效率之照明裝 置’其中’每一該散熱鰭片上係開設至少一洞口,以使每 =該電線穿過該等洞口以與該電路板形成電連接,藉以使 該電力裝置提供電力至該發光裝置。 1 3 ·如申晴專利範圍第7項所述之具高散熱效率之照明裝 置’更包括一風扇,其係設置於該殼體内並位於該電路板 下方’以增加散熱效率。 1 4·如申請專利範圍第1 3項所述之具高散熱效率之照明裝 f ’其中’該風扇係與該電路板連接,以使該電路板利用 一控制電路控制該風扇之開關作動。 15·如申請專利範圍第14項所述之具高散熱效率之照明裝 置其中’該控制電路係偵測該發光裝置周圍之溫度,以 控制該風扇之開關作動。
1257465 六、申請專利範圍 16.如申請專利範圍第1項所述之具高散熱效率之照明裝 置’其中’該電力裝置係為電池或交流轉換直流之電源供 應器。 17·如申請專利範圍第1項所述之具高散熱效率之照明裝 置’其中’該熱導體係選自熱導柱或熱導管。
TW093130725A 2004-10-11 2004-10-11 Lighting device with high heat dissipation efficiency TWI257465B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW093130725A TWI257465B (en) 2004-10-11 2004-10-11 Lighting device with high heat dissipation efficiency
US11/019,161 US7438448B2 (en) 2004-10-11 2004-12-23 Light set with heat dissipation means
JP2005002066A JP4627189B2 (ja) 2004-10-11 2005-01-07 高い放熱効率の照明装置
US12/216,268 US20080265273A1 (en) 2004-10-11 2008-07-02 Light set with heat dissipation means

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093130725A TWI257465B (en) 2004-10-11 2004-10-11 Lighting device with high heat dissipation efficiency

Publications (2)

Publication Number Publication Date
TW200612058A TW200612058A (en) 2006-04-16
TWI257465B true TWI257465B (en) 2006-07-01

Family

ID=34465028

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130725A TWI257465B (en) 2004-10-11 2004-10-11 Lighting device with high heat dissipation efficiency

Country Status (3)

Country Link
US (2) US7438448B2 (zh)
JP (1) JP4627189B2 (zh)
TW (1) TWI257465B (zh)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060176691A1 (en) * 2005-02-07 2006-08-10 Kalogroulis Alexander J Liquid cooled flashlight with optional display
CN100468795C (zh) * 2005-06-03 2009-03-11 新灯源科技有限公司 整合导热/散热模块的半导体发光装置
JP4991696B2 (ja) * 2005-03-28 2012-08-01 新灯源科技有限公司 高出力高効率パッケージ組込み型ダイオードランプ
WO2006128318A1 (en) * 2005-03-31 2006-12-07 Neobulb Technologies, Inc. A high power led illuminating equipment having high thermal diffusivity
CA2614803C (en) * 2005-04-05 2015-08-25 Tir Technology Lp Electronic device package with an integrated evaporator
CN1869504B (zh) * 2005-05-25 2010-04-07 新灯源科技有限公司 发光二极管群集灯泡
DE102005026662A1 (de) * 2005-05-31 2006-12-07 Karl Storz Gmbh & Co. Kg Lichtquelle für die Endoskopie oder Mikroskopie
CN2821749Y (zh) * 2005-07-21 2006-09-27 新灯源科技有限公司 发光显示面板
US7905644B2 (en) * 2005-08-19 2011-03-15 Neobulb Technologies, Inc. System in package high power high efficiency light-emitting diode lamp
CN1920379B (zh) * 2005-08-22 2010-06-09 阳杰科技股份有限公司 具有多重迭层散热结构的照明灯具
US20070133209A1 (en) * 2005-12-09 2007-06-14 Harvatek Corporation Electrical lamp apparatus
US20070253202A1 (en) * 2006-04-28 2007-11-01 Chaun-Choung Technology Corp. LED lamp and heat-dissipating structure thereof
KR20090063258A (ko) * 2006-09-14 2009-06-17 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 광원의 냉각을 제공하기 위한 조명 어셈블리 및 방법, 및 비디오 카메라 시스템
US7651245B2 (en) 2007-06-13 2010-01-26 Electraled, Inc. LED light fixture with internal power supply
US7568817B2 (en) * 2007-06-27 2009-08-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp
CN101349412A (zh) * 2007-07-18 2009-01-21 富准精密工业(深圳)有限公司 发光二极管灯具
US20100208457A1 (en) * 2007-09-05 2010-08-19 Sung-Hwan Keal Light emitting diode lamp
CN101932873A (zh) * 2007-09-07 2010-12-29 飞利浦固体状态照明技术公司 用于在舞台照明应用中提供基于led的聚光灯照明的方法和设备
TWM333512U (en) * 2007-11-06 2008-06-01 Solidlite Corp The LED lamp and lantern structure
CN101457914B (zh) * 2007-12-12 2011-06-08 富准精密工业(深圳)有限公司 发光二极管灯具
US20110018418A1 (en) * 2008-03-06 2011-01-27 Young Ho Yoo Led lighting apparatus to dissipate heat by fanless ventilation
KR100972975B1 (ko) * 2008-03-06 2010-07-29 삼성엘이디 주식회사 Led 조명장치
CN101539275A (zh) * 2008-03-19 2009-09-23 富准精密工业(深圳)有限公司 照明装置及其光引擎
US7810957B2 (en) * 2008-03-24 2010-10-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp assembly
US7626213B2 (en) * 2008-03-25 2009-12-01 Chien-Feng Lin Light-emitting diode lamp
CN101556033B (zh) * 2008-04-11 2013-04-24 富准精密工业(深圳)有限公司 照明装置及其光引擎
US7575346B1 (en) * 2008-07-22 2009-08-18 Sunonwealth Electric Machine Industry Co., Ltd. Lamp
US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
TW201022582A (en) * 2008-12-12 2010-06-16 Foxconn Tech Co Ltd Illuminating apparatus and light engine thereof
US20100294465A1 (en) * 2009-01-06 2010-11-25 Jen-Shyan Chen Energy transducing apparatus and energy transducing equipment
US20100220487A1 (en) * 2009-02-27 2010-09-02 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Lighting assembly and heat exchange apparatus for uniform heat dissipation
US9200792B2 (en) * 2009-11-24 2015-12-01 Streamlight, Inc. Portable light having a heat dissipater with an integral cooling device
US8322897B2 (en) 2010-04-05 2012-12-04 Cooper Technologies Company Lighting assemblies having controlled directional heat transfer
JP5290355B2 (ja) * 2010-09-30 2013-09-18 ツォンシャン ウェイキアン テクノロジー カンパニー、リミテッド ハイパワー放熱モジュール
US9523491B2 (en) 2010-10-07 2016-12-20 Hubbell Incorporated LED luminaire having lateral cooling fins and adaptive LED assembly
USD673720S1 (en) 2010-10-07 2013-01-01 Hubbell Incorporated Luminaire housing
JP2012155904A (ja) * 2011-01-24 2012-08-16 Syoken Co Ltd Led照明装置
CN104132293A (zh) * 2013-05-02 2014-11-05 展晶科技(深圳)有限公司 发光二极管灯管
CN104712953A (zh) * 2013-12-16 2015-06-17 天津华彩电子科技工程集团有限公司 均匀线形投光灯
CN104292795A (zh) * 2014-10-29 2015-01-21 胡运冲 一种耐冲击的聚碳酸酯的制备方法
CN107429907A (zh) * 2015-02-25 2017-12-01 赵辉·林 手术灯及用于手术灯的替换灯泡
CN105258051A (zh) * 2015-10-11 2016-01-20 常州澳德森江浪减速机有限公司 清洁灯罩的路灯
KR102014025B1 (ko) * 2018-03-28 2019-08-23 윤삼걸 발광부 냉각구조를 갖는 수중랜턴

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050279949A1 (en) * 1999-05-17 2005-12-22 Applera Corporation Temperature control for light-emitting diode stabilization
JP2001346002A (ja) * 2000-06-05 2001-12-14 Fuji Photo Film Co Ltd 光源装置及び画像読取装置
EP2241803B1 (en) * 2001-05-26 2018-11-07 GE Lighting Solutions, LLC High power LED-lamp for spot illumination
US6465961B1 (en) * 2001-08-24 2002-10-15 Cao Group, Inc. Semiconductor light source using a heat sink with a plurality of panels
JP2003092022A (ja) * 2001-09-19 2003-03-28 Yamada Shomei Kk 照明器具の放熱構造及び照明器具
US7083305B2 (en) * 2001-12-10 2006-08-01 Galli Robert D LED lighting assembly with improved heat management
JP2005513815A (ja) * 2001-12-29 2005-05-12 杭州富陽新穎電子有限公司 発光ダイオード及び発光ダイオード・ランプ
AU2003298561A1 (en) * 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US6787999B2 (en) * 2002-10-03 2004-09-07 Gelcore, Llc LED-based modular lamp
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
JP4317697B2 (ja) * 2003-01-30 2009-08-19 パナソニック株式会社 光半導体ベアチップ、プリント配線板、照明ユニットおよび照明装置
US6910794B2 (en) * 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
WO2004100220A2 (en) 2003-05-05 2004-11-18 Optolum, Inc Light emitting diode light source
US7211835B2 (en) * 2003-07-09 2007-05-01 Nichia Corporation Light emitting device, method of manufacturing the same and lighting equipment
JP4236544B2 (ja) * 2003-09-12 2009-03-11 三洋電機株式会社 照明装置
US20060100496A1 (en) * 2004-10-28 2006-05-11 Jerome Avron Device and method for in vivo illumination
US7331691B2 (en) * 2004-10-29 2008-02-19 Goldeneye, Inc. Light emitting diode light source with heat transfer means

Also Published As

Publication number Publication date
US20060098439A1 (en) 2006-05-11
TW200612058A (en) 2006-04-16
JP2005101014A (ja) 2005-04-14
US7438448B2 (en) 2008-10-21
US20080265273A1 (en) 2008-10-30
JP4627189B2 (ja) 2011-02-09

Similar Documents

Publication Publication Date Title
TWI257465B (en) Lighting device with high heat dissipation efficiency
JP4991696B2 (ja) 高出力高効率パッケージ組込み型ダイオードランプ
US8444299B2 (en) Dimmable LED bulb with heatsink having perforated ridges
JP4805347B2 (ja) 発光ダイオード・クラスタ・ランプ
WO2006128318A1 (en) A high power led illuminating equipment having high thermal diffusivity
US7611263B2 (en) Light source module with a thermoelectric cooler
JP3158694U (ja) モジュール化されたled灯器具の冷却装置
EP1528315B1 (en) Light set with heat dissipation means
TWI273858B (en) Light-emitting diode cluster lamp
WO2007019733A1 (fr) Dispositif d’eclairage a led de grande puissance et a forte capacite de dissipation thermique
TWI373592B (en) Light source module
CN1605795A (zh) 具高散热效率的照明装置
TW201043851A (en) LED lamp with heat dissipating structure
KR101023177B1 (ko) 높은 열발산성을 갖는 고출력의 led 조명 장비
TW201022582A (en) Illuminating apparatus and light engine thereof
JP5255725B1 (ja) スリーブ接合方式を用いたledモジュール及びそれを用いた灯器具
TWM366028U (en) Illumination device of LED
JP3112555U (ja) 発光ダイオードランプの放熱構造
TWI298553B (en) Light module
TWM422751U (en) Heat conduction substrate structure for LED lightbulb
TWM365284U (en) Vehicular lamp structure
TWM332162U (en) Structure of lighting device
TWI288806B (en) Light emitting diode lamp
TW200940890A (en) Illuminating apparatus and light engine thereof
TWM347529U (en) High-wattage LED lighting device having over-heating protection function

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees