TWI256909B - Apparatus and method for ball release - Google Patents

Apparatus and method for ball release

Info

Publication number
TWI256909B
TWI256909B TW091108778A TW91108778A TWI256909B TW I256909 B TWI256909 B TW I256909B TW 091108778 A TW091108778 A TW 091108778A TW 91108778 A TW91108778 A TW 91108778A TW I256909 B TWI256909 B TW I256909B
Authority
TW
Taiwan
Prior art keywords
pick head
frequencies
range
ball release
bounds
Prior art date
Application number
TW091108778A
Other languages
English (en)
Inventor
Chi Wah Cheng
Ping Kong Choy
Ping Chun Benson Chong
Ka Kin Wong
Chi Fung Chan
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Application granted granted Critical
Publication of TWI256909B publication Critical patent/TWI256909B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW091108778A 2001-04-30 2002-04-26 Apparatus and method for ball release TWI256909B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/843,704 US6607118B2 (en) 2001-04-30 2001-04-30 Apparatus and method for ball release

Publications (1)

Publication Number Publication Date
TWI256909B true TWI256909B (en) 2006-06-21

Family

ID=25290782

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091108778A TWI256909B (en) 2001-04-30 2002-04-26 Apparatus and method for ball release

Country Status (5)

Country Link
US (1) US6607118B2 (zh)
KR (1) KR100475782B1 (zh)
MY (1) MY122791A (zh)
SG (1) SG103856A1 (zh)
TW (1) TWI256909B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7285486B2 (en) * 2001-01-12 2007-10-23 Nippon Steel Materials Co., Ltd. Ball transferring method and apparatus
DE10343073A1 (de) * 2003-09-17 2005-04-21 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Herstellung einer flachen Entladungslampe mit Abstandselementen
US20050274770A1 (en) * 2004-06-07 2005-12-15 Henderson Marvin A Sr Method for the precise and reliable placement of solid metallic and non-metallic particles
KR100798662B1 (ko) * 2004-08-04 2008-01-28 이비덴 가부시키가이샤 땜납 볼 탑재 방법 및 땜납 볼 탑재 장치
SG157985A1 (en) * 2008-06-24 2010-01-29 Rokko Ventures Pte Ltd Method and apparatus for solder ball placement
JP5518500B2 (ja) * 2010-01-20 2014-06-11 昭和電工株式会社 はんだ粉末付着装置および電子回路基板に対するはんだ粉末の付着方法
KR101385932B1 (ko) * 2013-11-21 2014-04-16 주식회사 고려반도체시스템 솔더볼 어태치 툴 및 이를 이용한 솔더볼 어태치 방법
KR102307528B1 (ko) * 2014-07-21 2021-10-05 삼성전자주식회사 솔더 볼 흡착 장치
KR20220014399A (ko) 2020-07-24 2022-02-07 삼성전자주식회사 볼 점핑 장치 및 이를 이용한 볼 흡착 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5205896A (en) * 1992-02-03 1993-04-27 Hughes Aircraft Company Component and solder preform placement device and method of placement
US5284287A (en) 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
GB2284933B (en) 1993-05-31 1996-12-04 Citizen Watch Co Ltd Solder ball feeder
JP2743058B2 (ja) * 1994-02-10 1998-04-22 新日本製鐵株式会社 微小球除去方法およびその装置
US5680984A (en) 1994-05-13 1997-10-28 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting soldering balls onto surfaces of electronic components
US5657528A (en) 1994-08-25 1997-08-19 Matsushita Electric Industrial Co., Ltd. Method of transferring conductive balls
JP3079921B2 (ja) 1994-11-28 2000-08-21 松下電器産業株式会社 半田ボールの搭載装置および搭載方法
JP3196582B2 (ja) 1995-08-24 2001-08-06 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法
US5839191A (en) 1997-01-24 1998-11-24 Unisys Corporation Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
JP3252748B2 (ja) * 1997-04-25 2002-02-04 松下電器産業株式会社 導電性ボールの移載方法
US6003753A (en) 1997-07-14 1999-12-21 Motorola, Inc. Air-blow solder ball loading system for micro ball grid arrays
JP3803465B2 (ja) 1997-08-08 2006-08-02 松下電器産業株式会社 導電性ボールの移載装置および移載方法
JP3076305B2 (ja) 1998-06-23 2000-08-14 九州日本電気株式会社 半田ボール搭載装置およびその方法

Also Published As

Publication number Publication date
US6607118B2 (en) 2003-08-19
KR100475782B1 (ko) 2005-03-10
SG103856A1 (en) 2004-05-26
MY122791A (en) 2006-05-31
KR20020083920A (ko) 2002-11-04
US20020158108A1 (en) 2002-10-31

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent