TWI256333B - Abrasive working plate - Google Patents

Abrasive working plate

Info

Publication number
TWI256333B
TWI256333B TW091109189A TW91109189A TWI256333B TW I256333 B TWI256333 B TW I256333B TW 091109189 A TW091109189 A TW 091109189A TW 91109189 A TW91109189 A TW 91109189A TW I256333 B TWI256333 B TW I256333B
Authority
TW
Taiwan
Prior art keywords
working plate
abrasion
abrasive working
polishing
work
Prior art date
Application number
TW091109189A
Other languages
English (en)
Inventor
Hitoshi Noguchi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Application granted granted Critical
Publication of TWI256333B publication Critical patent/TWI256333B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW091109189A 2001-10-15 2002-05-02 Abrasive working plate TWI256333B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001317080A JP2003117833A (ja) 2001-10-15 2001-10-15 研磨加工板

Publications (1)

Publication Number Publication Date
TWI256333B true TWI256333B (en) 2006-06-11

Family

ID=19135003

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091109189A TWI256333B (en) 2001-10-15 2002-05-02 Abrasive working plate

Country Status (4)

Country Link
US (1) US6860803B2 (zh)
JP (1) JP2003117833A (zh)
KR (1) KR20030031403A (zh)
TW (1) TWI256333B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462799B (zh) * 2011-10-11 2014-12-01 Shinhan Diamond Ind Co Ltd 化學機械研磨墊調節器及其製造方法
CN112135711A (zh) * 2018-05-16 2020-12-25 3M创新有限公司 研磨轮

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE375461T1 (de) * 2002-04-24 2007-10-15 Diaccon Gmbh Verfahren zur herstellung eines gleitelements
US20070032176A1 (en) * 2005-08-04 2007-02-08 Chih-Ming Hsu Method for polishing diamond wafers
JP2008006507A (ja) * 2006-06-26 2008-01-17 Ebara Corp ダイヤモンド研磨工具、ダイヤモンド研磨工具の作成方法、ダイヤモンド研磨工具の再生方法
US7922920B2 (en) * 2007-02-27 2011-04-12 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Systems, methods, and apparatus of a low conductance silicon micro-leak for mass spectrometer inlet
KR101103293B1 (ko) * 2009-06-03 2012-01-11 (주)영웅엔지니어링 갱폼의 낙하물 방지장치
KR200458345Y1 (ko) * 2009-06-04 2012-02-15 (주) 에스에프 건축용 갱폼 작업대의 작업발판
CN101935825A (zh) * 2010-09-07 2011-01-05 天津理工大学 一种利用类金刚石复合膜进行金刚石薄膜平坦化的工艺
US9149913B2 (en) 2012-12-31 2015-10-06 Saint-Gobain Abrasives, Inc. Abrasive article having shaped segments
TWI549781B (zh) * 2015-08-07 2016-09-21 智勝科技股份有限公司 研磨墊、研磨系統及研磨方法
WO2018150918A1 (ja) * 2017-02-15 2018-08-23 日本碍子株式会社 砥石、その製法及び多結晶基板の研磨方法
RU2749506C1 (ru) * 2020-04-28 2021-06-11 Общество с ограниченной ответственностью "ТехноТерм-Саратов" Способ полирования поверхности поликристаллического алмазного покрытия деталей
CN113430498B (zh) * 2021-06-23 2022-11-29 太原理工大学 一种高精密金刚石抛光片的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01177973A (ja) * 1987-12-28 1989-07-14 Idemitsu Petrochem Co Ltd 研磨工具
JPH0382156A (ja) * 1989-08-25 1991-04-08 Nec Corp 半導体メモリセルおよびその製造方法
JPH04141372A (ja) * 1990-09-28 1992-05-14 Mitsubishi Materials Corp ダイヤモンド砥石
JPH0569341A (ja) * 1991-06-28 1993-03-23 Mitsubishi Materials Corp 超精密研削用ダイヤモンドラツピングテープおよびその製造方法
US5247765A (en) * 1991-07-23 1993-09-28 Abrasive Technology Europe, S.A. Abrasive product comprising a plurality of discrete composite abrasive pellets in a resilient resin matrix
DE69526129T2 (de) * 1994-05-23 2002-08-22 Sumitomo Electric Industries, Ltd. Verfahren und Vorrichtung zum Herstellen eines mit hartem Material bedeckten Halbleiters durch Polieren
JPH07314302A (ja) * 1994-05-23 1995-12-05 Sumitomo Electric Ind Ltd 硬質ウエハ−の研磨方法及び研磨装置
DE60018634T2 (de) * 1999-05-12 2005-08-04 National Institute Of Advanced Industrial Science And Technology Schleif- und Polierwerkzeug für Diamant, Verfahren zum Polieren von Diamant und polierter Diamant, und somit erhaltener Einkristalldiamant und gesintertes Diamantpresswerkstück
WO2000078504A1 (en) 1999-06-19 2000-12-28 Speedfam-Ipec Corporation Method and apparatus for increasing the lifetime of a workpiece retaining structure and conditioning a polishing surface
KR100387954B1 (ko) * 1999-10-12 2003-06-19 (주) 휴네텍 연마패드용 컨디셔너와 이의 제조방법
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
JP2002110662A (ja) * 2000-09-29 2002-04-12 Toshiba Corp 半導体装置の製造方法および半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462799B (zh) * 2011-10-11 2014-12-01 Shinhan Diamond Ind Co Ltd 化學機械研磨墊調節器及其製造方法
CN112135711A (zh) * 2018-05-16 2020-12-25 3M创新有限公司 研磨轮

Also Published As

Publication number Publication date
JP2003117833A (ja) 2003-04-23
US20030073393A1 (en) 2003-04-17
US6860803B2 (en) 2005-03-01
KR20030031403A (ko) 2003-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees