1254460 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種微型攝影裝置，特別係有關於一 種能節省打線步驟以及能縮小基板尺寸之微型攝影裝置。 【先前技術】 習知之微型攝影裝置中，為了解決被動元件的需求數 目越來越多的問題，通常會把被動元件排列在基板背面或 疋模組外，因而造成基板背面不平整或基板尺寸變大的困 擾。 請參閱第1圖，一種習知的微型攝影裝置ι〇〇係包含 一基板110、一影像感測晶片120、複數個銲線13〇、複數 個被動元件140及一鏡片模組150。該基板11〇係具有一 上表面111及複數個連接墊112。該影像感測晶片12〇與 該些被動元件140係設置於該基板110之該上表面U1。 該影像感測晶片120係具有一主動面12ι及複數個銲塾 122，藉由打線形成之該些銲線130電性連接該基板11〇 之该些連接墊112與該影像感測晶片120之該些銲塾 122。該鏡片模組150係結合於該基板11〇,以氣閉密封該 影像感測晶片120及該被動元件11 3。該鏡片模組！ 5〇係 具有一濾光片151與一透鏡結合座152。其中，該鏡片模 組150之該透鏡結合座152係結合一透鏡鏡筒16〇〇ens barrel)，該透鏡鏡筒160内係設置有一透鏡ι61。由於， 習知之該微型攝影裝置100係藉由打線電性連接該基板 11 0與該衫像感測晶片1 2 〇 ’並且該些被動元件1 4 〇係設 1254460 置在4些杯線1 3 0之打線區外’因此該基板11 〇需預留較 大的空間，因而造成該微型攝影裝置l〇〇(CCM)產品無法 縮小尺寸。 【發明内容】 本發明之主要目的係在於提供一種微型攝影裝置及 其製造方法，該微型攝影裝置係主要包含一承載器、一影 像感測晶片、至少一被動元件、一基板及一鏡片模組。該 承載器係具有一容置穴，該影像感測晶片係設置於該容置 • 穴内，該被動元件係設於該承載器之一上表面與該影像感 測晶片之一主動面以電性連接該承載器與該影像感測晶 片，其係可省略由打線形成之銲線，並可縮小該基板之尺 寸’以達到縮小該微型攝影裝置尺寸之功效。 本發明之次一目的在於提供一種微型攝影裝置及其 製造方法，一承載器係具有一可供設置一影像感測晶片之 容置穴，並且該影像感測晶片之一主動面大致與該承載器 之一上表面為共平面。該承載器之至少一連接墊係鄰近於 該容置穴，且該連接墊與該影像感測晶片之一銲墊之間隔 係不超過一被動元件之長度，以利該被動元件係能表面接 合在該基板與該影像感測晶片之上，其係可省略打線接合 步驟。 口 依據本發明，一種微型攝影裝置係主要包含一承載 、一影像感測晶片、至少一被動元件、一一 模組、。該承載器係具有一上表面、一下表面以及一= 穴，並且該承載器係包含有至少一位於該上表面之連接 1254460 墊，該影像感測晶片係設於該承載器之該容置穴内，該影 像感測晶片係具有一主動面並包含至少一銲墊，且該主動 面係包含有一感測區，該銲墊係位於該主動面之一側邊， 该被動元件係設於該承載器之該上表面與該影像感測晶 片之該主動面以電性連接該連接墊與該銲墊，該承載器係 表面接合至該基板，該鏡片模組係結合於該基板，以氣閉 始封该承載器、該影像感測晶片以及該被動元件。 【實施方式】 依據本發明之第一具體實施例，請參閱第2圖，一種 微型攝影裝置200係主要包含一承載器2丨〇、一影像感測 晶片220、複數個被動元件23〇、一基板24〇及一鏡片模 組250。該承載器210係可為一電路基板，其係具有一上 表面211、一下表面212以及一容置穴213，並且該承載 器2 1 0係包含有複數個位於該上表面2 1丨之連接墊2丨4， 该承載器210之該些連接墊214應鄰近於該容置穴213為 較佳，以利該些被動元件230電性連接該承載器21〇與該 影像感測晶片220。該影像感測晶片22〇係設於該承載器 210之該容置穴213内，一黏膠材260係形成於該影像感 測晶片220與該承載器210之間，用以固設該影像感測晶 片220於該承載器210之該容置穴213内，該影像感測晶 片220係具有一主動面221並包含複數個銲墊222，且該 主動面221係包含有一感測區223，該些銲墊222係位於 该主動面2 2 1之一侧邊。在本實施例中，該容置穴2 13係 具有〆適¥ /米度以使該影像感測晶片2 2 〇之該主動面2 2 1 1254460 大致與δ亥承載器210之4上表面211為共平面。較佳地， 4些連接墊214至遠些銲塾222之間隔（spacing)(間隔係指 由該些連接墊之内邊緣至該些銲墊222之内邊緣之距 離）係不超過該些被動元件230之長度，以利該些被動元件 23〇之兩端電極分別連接該承載器210之該些連接墊214 與該影像感測晶片2 2 0之該些鮮塾2 2 2，以電性連接該承 載器2 1 0與該影像感測晶片2 2 0。因此，該些被動元件2 3 0 能設置於該承載器210之該上表面211與該影像感測晶片 鲁 220之該主動面221上。在本實施例中，該微型攝影裝置 200另包含有至少一外連接元件27〇，其係配置於該承載 器210之該下表面212,並且藉由該承載器21〇之内部導 電機構（例如導通孔或是線路）而電性連接至位在該承載器 210之該上表面211之該些連接墊214。該鏡片模組25〇 係結合於該基板240,以氣閉密封該承載器21〇、該影像 感測曰曰曰Μ 220以及該些被動元件23〇。纟於，該微型攝影 φ 裝置2〇0係省略習知之銲線，且以該些被動元件230之二 端電極分別連接該承載器21〇與該影像感測晶片22〇，因 此可縮小該基板210之尺寸，以使該微型攝影裝置2〇〇達 到微小化、模組化與降低成本之功效。 第3Α至3C圖係為該微型攝影裝置2〇〇 面示意圖。首先，請參閱…，提供一承載二截 該承載器210係且有一交罢—^ 于八有谷置穴213。一黏膠材26〇係形成 於該影像感測晶片220與該承載器21〇之間，用以固設該 影像感測晶片220於該承載器21G之該容置穴213内。接 1254460 著’請參閱第3B圖，利用表面接合技術，設置複數個被 動元件230於該承載器21〇與該影像感測晶片22〇之間， 並以该些被動元件230之二端電極分別連接該被動元件 230之複數個連接墊214與該影像感測晶片220之複數個 鲜墊222 ’以電性連接該承載器2丨〇與該影像感測晶片 220 ’並且藉由該些被動元件23〇之電性連接以使該承載 器2 1 0與該影像感測晶片2 2 〇組成一影像感測器模組，即 該影像感測器模組係包含有該承載器2丨〇、該影像感測晶 片220以及該些被動元件23〇。之後，請參閱第3c圖，在 該承載器210之該下表面212係配置複數個外連接元件 270並藉由回銲該些外連接元件27〇，使該承載器21〇與 該基板240電性連接。最後，請再參閱第2圖，將該鏡片 模組250結合於該基板240，以氣閉密封該承載器210、 該影像感測晶片220以及該些被動元件230。 請參閱第4圖，在本發明之第二具體實施例中，另一 種微型攝影裝置300係主要包含一承載器310、一影像感 測晶片3 2 0、複數個被動元件3 3 0、複數個外連接元件3 4 0 及一鏡片模組3 5 0。該承載器3 1 0係具有一上表面3 11、 一下表面312以及一容置穴313，並且該承載器310係包 含有複數個位於該上表面3 11之連接墊3 14，該影像感測 晶片320係設於該承載器3 10，其係以一黏膠材360使其 固設於該承載器3 10之該容置穴3 1 3内。該影像感測晶片 320係具有一主動面321並包含複數個銲墊322。該些被 動元件330係設於該承載器310之該上表面311與該影像 1254460 感測晶片320之該主動面321上，其中該些連接墊314至 口亥些#塾3 2 2之間隔係不超過該些被動元件3 3 〇之長产， 並且該些被動元件33 0二端之電極分別連接該承載器3 1〇 之該些連接墊3 14與該影像感測晶片32〇之該些銲塾 322，以電性連接該承載器3 1 〇與該影像感測晶片32〇，其 係省略習知之銲線，而以該些被動元件23〇連接該承載器 310與該影像感測晶片320。該些外連接元件34〇係配置 於該承載器310之該下表面312，其係可為錫球，藉由該 _ 些外連接元件340可外接至一電路板（圖未繪出），該鏡 片模組350可直接結合於該承載器31〇，以氣閉密封該影 像感測晶片3 2 0以及該些被動元件3 3 〇。 本發明之保護範圍當視後附之申請專利範圍所界定 者為準，任何熟知此項技藝者，在不脫離本發明之精神和 範圍内所作之任何變化與修改，均屬於本發明之保護範 圍。 【圖式簡單說明】 • ^ 第 1 圖：習知微型攝影裝置之截面示意圖。 第2 圖：依據本發明之第一具體實施例，一種微型 攝影裝置之截面示意圖。 第3Α至3C圖：依據本發明之第一具體實施例，該微型攝 影裝置封裝過程之截面示意圖。 第4 圖：依據本發明之第二具體實施例，另一種微 型攝影裝置之截面示意圖。 【主要元件符號說明】 1254460 100 微型攝影裝置 110 基板 111 上表面 112 連接墊 ^ 120 影像感測晶片 121 主動面 122 鮮藝 - 130 鲜線 140 被動元件 150 鏡片模組 151 濾光片 152 透鏡結合座 160 透鏡鏡筒 161 透鏡 200 微型攝影裝置 210 承載器 211 上表面 212 下表面 • 213 容置穴： 214 連接墊 220 影像感測晶片 221 主動面 222 銲墊 223 感測區 230 被動元件 240 基板 250 鏡片模組 260 黏膠材 270 外連接元件 300 微型攝影裝置 310 承載器 311 上表面 312 下表面 313 容置穴 314 連接墊 _ 320 影像感測晶片 321 主動面 322 銲墊 330 被動元件 331 錫膏 350 鏡片模組 340 外連接元件 360 黏膠材 11BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a miniature photographing apparatus, and more particularly to a microphotographic apparatus capable of saving a wire bonding step and reducing the size of a substrate. [Prior Art] In the conventional micro-photographing device, in order to solve the problem that the number of passive components is increasing, the passive components are usually arranged on the back surface of the substrate or outside the germanium module, thereby causing unevenness of the back surface of the substrate or changing the substrate size. Big troubles. Referring to FIG. 1, a conventional microphotographic device includes a substrate 110, an image sensing wafer 120, a plurality of bonding wires 13A, a plurality of passive components 140, and a lens module 150. The substrate 11 has an upper surface 111 and a plurality of connection pads 112. The image sensing wafer 12 and the passive components 140 are disposed on the upper surface U1 of the substrate 110. The image sensing chip 120 has an active surface 12 ι and a plurality of soldering pads 122. The bonding wires 130 formed by wire bonding are electrically connected to the connecting pads 112 of the substrate 11 and the image sensing wafer 120. The solder fillets 122. The lens module 150 is coupled to the substrate 11A to hermetically seal the image sensing wafer 120 and the passive component 113. The lens module! The 〇 具有 has a filter 151 and a lens yoke 152. The lens assembly 152 of the lens module 150 is coupled to a lens barrel 16a. The lens barrel 160 is provided with a lens ι61. Since the micro-photographic device 100 is electrically connected to the substrate 110 and the image sensing chip 1 2 〇 ', and the passive components 1 4 〇 1215460 are placed on the 4 cup lines 1 3 0 outside the wiring area 'Therefore, the substrate 11 does not need to reserve a large space, so the miniature photography device (CCM) product cannot be downsized. SUMMARY OF THE INVENTION The main object of the present invention is to provide a miniature photographic device and a manufacturing method thereof. The micro photographic device mainly includes a carrier, an image sensing chip, at least one passive component, a substrate, and a lens module. . The carrier has a receiving hole, and the image sensing chip is disposed in the receiving hole, and the passive component is disposed on an upper surface of the carrier and an active surface of the image sensing chip to be electrically The carrier and the image sensing wafer are connected, which can omit the bonding wire formed by the wire bonding, and can reduce the size of the substrate to achieve the effect of reducing the size of the microphotographic device. A second object of the present invention is to provide a miniature photographic device and a method of manufacturing the same, a carrier having a receiving cavity for arranging an image sensing chip, and an active surface of the image sensing chip substantially corresponding to the bearing One of the upper surfaces is coplanar. The at least one connecting pad of the carrier is adjacent to the receiving hole, and the spacing between the connecting pad and one of the image sensing wafers does not exceed the length of a passive component, so that the passive component can be surface-bonded On the substrate and the image sensing wafer, the wire bonding step can be omitted. According to the present invention, a miniature photographic device mainly comprises a carrier, an image sensing chip, at least one passive component, and a module. The carrier has an upper surface, a lower surface, and a hole, and the carrier includes at least one connection 1254460 pad on the upper surface, and the image sensing chip is disposed in the receiving cavity of the carrier. The image sensing chip has an active surface and includes at least one solder pad, and the active surface includes a sensing area, the soldering pad is located on one side of the active surface, and the passive component is disposed on the bearing The upper surface of the device and the active surface of the image sensing chip are electrically connected to the connection pad and the bonding pad, the carrier surface is bonded to the substrate, and the lens module is coupled to the substrate to be air-closed The carrier, the image sensing wafer, and the passive component are initially sealed. [Embodiment] According to a first embodiment of the present invention, referring to FIG. 2, a miniature camera device 200 mainly includes a carrier 2, an image sensing chip 220, and a plurality of passive components 23, one. The substrate 24 is coupled to a lens module 250. The carrier 210 can be a circuit substrate having an upper surface 211, a lower surface 212, and a receiving cavity 213, and the carrier 210 includes a plurality of connections on the upper surface 2 1 . Preferably, the pads 214 of the carrier 210 are adjacent to the receiving holes 213, so that the passive components 230 are electrically connected to the carrier 21 and the image sensing wafer 220. The image sensing chip 22 is disposed in the receiving hole 213 of the carrier 210. A glue 260 is formed between the image sensing chip 220 and the carrier 210 for fixing the image. The sensing chip 220 is disposed in the receiving cavity 213 of the carrier 210. The image sensing die 220 has an active surface 221 and includes a plurality of pads 222, and the active surface 221 includes a sensing region 223. The pads 222 are located on one side of the active surface 2 21 . In this embodiment, the accommodating hole 2 13 has a ¥ ¥ / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / For the coplanar. Preferably, the spacing of the plurality of connection pads 214 to the distal pads 222 (the spacing refers to the distance from the inner edge of the connection pads to the inner edges of the pads 222) does not exceed the passive The length of the component 230 is such that the two end electrodes of the passive component 23 are respectively connected to the connection pads 214 of the carrier 210 and the sputum 2 2 2 of the image sensing wafer 220, to be electrically The carrier 210 is connected to the image sensing wafer 220. Therefore, the passive components 203 can be disposed on the upper surface 211 of the carrier 210 and the active surface 221 of the image sensing wafer 220. In this embodiment, the micro-photographic device 200 further includes at least one external connecting member 27, which is disposed on the lower surface 212 of the carrier 210, and has an internal conductive mechanism (for example, by the carrier 21). The vias or lines are electrically connected to the connection pads 214 located on the upper surface 211 of the carrier 210. The lens module 25 is coupled to the substrate 240 to hermetically seal the carrier 21, the image sensing port 220, and the passive components 23A. In other words, the micro-photographing device 〇0 omits the conventional bonding wire, and the two end electrodes of the passive components 230 are respectively connected to the carrier 21 〇 and the image sensing wafer 22 〇, thereby reducing the substrate The size of 210 is such that the micro-photographic device 2 is miniaturized, modularized, and reduced in cost. Figures 3 to 3C are schematic views of the microphotographic apparatus 2. First, please refer to..., providing a load bearing two sections. The carrier 210 is a system and has a handover-^ in the eight-valley pocket 213. A viscous material 26 is formed between the image sensing wafer 220 and the carrier 21 , to fix the image sensing wafer 220 in the receiving cavity 213 of the carrier 21G. Referring to FIG. 3B, a plurality of passive components 230 are disposed between the carrier 21 〇 and the image sensing wafer 22 利用 by surface bonding techniques, and the two end electrodes of the passive components 230 are respectively A plurality of connection pads 214 connected to the passive component 230 and a plurality of fresh pads 222 ′ of the image sensing die 220 are electrically connected to the carrier 2 and the image sensing die 220 ′ and by the passive components The electrical connection is such that the carrier 2 1 0 and the image sensing chip 2 2 〇 form an image sensor module, that is, the image sensor module includes the carrier 2 The image sensing wafer 220 and the passive components 23A. After that, referring to FIG. 3c, the lower surface 212 of the carrier 210 is provided with a plurality of external connecting elements 270 and the carrier 21 is electrically connected to the substrate 240 by reflowing the external connecting elements 27A. Sexual connection. Finally, referring to FIG. 2, the lens module 250 is coupled to the substrate 240 to hermetically seal the carrier 210, the image sensing wafer 220, and the passive components 230. Referring to FIG. 4, in a second embodiment of the present invention, another miniature photographic device 300 mainly includes a carrier 310, an image sensing chip 320, a plurality of passive components 303, and a plurality of The outer connecting component 3 4 0 and a lens module 3 50. The carrier 310 has an upper surface 3 11 , a lower surface 312 and a receiving hole 313 , and the carrier 310 includes a plurality of connecting pads 3 14 on the upper surface 3 11 . The wafer 320 is attached to the carrier 3 10 and is fixed to the receiving hole 3 1 3 of the carrier 3 10 by a adhesive material 360. The image sensing die 320 has an active surface 321 and includes a plurality of pads 322. The passive components 330 are disposed on the upper surface 311 of the carrier 310 and the active surface 321 of the image 1254460 sensing wafer 320, wherein the connecting pads 314 are spaced apart from each other. Not exceeding the prolonged production of the passive components 3 3 , and the electrodes of the passive components 33 0 are respectively connected to the connecting pads 3 14 of the carrier 3 1 and the image sensing chip 32 The soldering 322 is electrically connected to the carrier 3 1 〇 and the image sensing chip 32 〇, which omits the conventional bonding wire, and connects the carrier 310 and the image sensing chip with the passive components 23 〇 320. The outer connecting members 34 are disposed on the lower surface 312 of the carrier 310, which may be solder balls. The outer connecting members 340 may be externally connected to a circuit board (not shown). The lens module 350 can be directly coupled to the carrier 31 〇 to hermetically seal the image sensing wafer 320 and the passive components 3 3 〇. The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. . [Simple description of the diagram] • ^ Figure 1: Schematic diagram of a conventional micro-photographic device. Fig. 2 is a schematic cross-sectional view showing a microphotographic apparatus in accordance with a first embodiment of the present invention. 3 to 3C are schematic cross-sectional views showing the packaging process of the microphotographing apparatus according to the first embodiment of the present invention. Figure 4 is a cross-sectional view showing another microphotographic apparatus in accordance with a second embodiment of the present invention. [Main component symbol description] 1254460 100 Miniature imaging device 110 Substrate 111 Upper surface 112 Connection pad ^ 120 Image sensing wafer 121 Active surface 122 Fresh art - 130 Fresh wire 140 Passive component 150 Lens module 151 Filter 152 Lens joint 160 Lens barrel 161 Lens 200 Miniature imaging device 210 Carrier 211 Upper surface 212 Lower surface • 213 accommodating hole: 214 Connection pad 220 Image sensing wafer 221 Active surface 222 Pad 223 Sensing area 230 Passive element 240 Substrate 250 Lens Module 260 Adhesive material 270 External connection component 300 Miniature imaging device 310 Carrier 311 Upper surface 312 Lower surface 313 Retaining cavity 314 Connection pad _ 320 Image sensing wafer 321 Active surface 322 Pad 330 Passive component 331 Solder paste 350 Lens Module 340 external connection component 360 adhesive material 11