TWI252953B - Micro-display module for decreasing stress - Google Patents

Abstract

A micro-display module for decreasing stress comprises a display panel and a module substrate. The display panel comprises a silicon chip and a glass substrate with a transparent electrode layer. The glass substrate of the display panel has a sidewall next to the silicon chip. The module substrate has a compound area. A sealing compound and a buffer compound is formed on the compound area for covering a plurality of bonding pads, a plurality of connecting pads and a plurality of bonding wires. The buffer compound is formed between the sealing compound and the sidewall of the glass substrate for decreasing the sealing compound causing stress on the display panel. The buffer compound is also fixed easily and doesn't drain away.

Description

1252953 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a microdisplay module, and more particularly to a micro-display module for reducing stress. [Prior Art] The Republic of China Patent Publication No. 50 5965 "LCOS backplane structure" discloses a conventional LCOS cell (LCOS panel) which comprises a stone wafer having a transparent structure The glass substrate is formed with a liquid crystal layer between the glass substrate and the broken wafer. The conventional LCOS cell obviously cannot be directly mounted on the projection display, and should be assembled into an LCOS micro display module to ensure the [The protection, heat dissipation and flatness of the COS cell, and the LCOS cell and a module substrate in the LCOS microdisplay module often have different thermal expansion coefficients, or are used to seal a dielectric heat of a plurality of bonding wires. After the solid glue is solidified, it may cause stress on the LCOS cell due to its own shrinkage, resulting in a change in the thickness of the liquid crystal layer, and improper light drying may cause a Newt〇n ring defect. In addition, the Republic of China Patent No. 549571 "LCOS (Liquid Crystal Substrate) Microdisplay Module for Reducing Stress Gradient" discloses a use of a colloidal gel for reducing the stress gradient of an LCOS panel. Connected to a LCOS cell and a module substrate, the adhesive glue system is glued to the center or the periphery of the bottom surface of the module substrate, and the coverage area of the adhesive colloid is less than the area of the bottom surface area of the module substrate The twenty-five, preferably less than ten percent of the area of the bottom surface, to improve the difference in thermal expansion coefficient between the LC〇s cell and the module substrate, reduce the stress gradient of the cell (10), and avoid Newton's ring phenomenon. , but it still can't improve the sealing of a plurality of bonding wires

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Not ===, which is covered with a buffer rubber and a sealant on one of the main glue areas of a module substrate, and the sealant is used to cover the periphery of the glue application area, and the wall is filled into a wall. A buffer rubber is interposed therebetween to protect a plurality of bonding wires and to maintain the buffer rubber in the coating region without overflowing the coating region. The utility model relates to a stress-reducing micro-display module, which comprises: a display panel, a module substrate, a sealant and a buffer adhesive, and the display panel comprises a stone wafer And a glass substrate having a dislocation portion not overlapping the glass substrate, wherein the upper dislocation portion is formed with a plurality of pads, the glass substrate having a side adjacent to the upper dislocation portion, The module substrate has a glue application area, and a plurality of connection pads are formed in the glue application area, and the plurality of bonding wires are electrically connected to the solder pads of the silicon wafer, and the sealing glue and the buffer glue are covered The sealant covers the pads, the connection pads and the bonding wires, and the buffer glue is formed between the sealant and the side of the glass substrate, preferably ' It further includes a cover to bond the module substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, the present invention will be described with reference to the following embodiments: In accordance with a first embodiment of the present invention, reference is made to FIG. 1 , a reduced stress microdisplay module 100 The display panel 110 is a LCOS (Liquid Crystal On Silicon) panel, which includes a lithographic wafer 111, a glass substrate 11 2 , and the ytterbium wafer 111 For a liquid crystal 1 1 3 between the glass substrates 112, please refer to FIGS. 2 and 3, the germanium wafer 111 has a misalignment portion 114 which is not overlapped with the glass substrate 112.

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Claims (1)

Year of the month repair (more) original '1252953 〇s Case No. 931132 pain six, the scope of application for patents [patent scope] 1 'a reduced-resistance micro-display module, including: a display panel's system contains a wafer And a glass substrate having a transparent electrode layer having a non-overlapping portion over the glass substrate, wherein the upper dislocation portion is formed with a plurality of pads, the glass substrate having a contiguous upper dislocation a side of the module; a module substrate having a glue application area, a plurality of connection pads are formed in the glue application area; a plurality of bonding wires ' electrically connecting the connection pads of the module substrate and the The soldering iron of the Shixi wafer; a sealant formed in the glue coating area and covering the solder pads, the connection pads and the bonding wires; and a buffer glue formed on the sealing Between the glue and the side of the glass substrate, wherein the sealant is harder than the buffer rubber after curing. 2. The reduced stress microdisplay module according to claim 1, wherein the buffer transition glass has a glass transition temperature (Tg) lower than a glass transition temperature of the sealant. 3. The reduced-resistance microdisplay module of claim 1, wherein the display panel is an LCOS (Liquid Crystal On Silicon) panel. 4. The reduced stress microdisplay module of claim 1, wherein the glass substrate has an upper surface, the sealant having a height not exceeding the upper surface of the glass substrate. 5. A stress reducing microdisplay as described in claim 54 Page 16 1252953 _ Docket No. 93113239 Patent application module, wherein the height of the buffer rubber is not higher than the sealant. 6. The reduced stress mini-drainer module of claim 2, wherein the buffer gel is in contact with the sealant. . The micro-display of reducing stress as described in claim 1 of the patent scope, the medium-eighth glass substrate has a dream portion that does not overlap the germanium wafer, and the transparent electrode layer extends to the lower misalignment portion. . The second embodiment of the invention provides a micro-display for reducing stress as described in the seventh aspect of the patent: the module substrate is formed with at least a solder bump electrically connected to the transparent electrode layer of the lower misalignment portion. . The wedge-shaped, ::f 2 $ micro-reducing micro-display of the first item includes a cover that is coupled to the module substrate, the cover Nie Qiu / has a mouth, which corresponds to the silicon wafer With the weight of the glass substrate. A micro-display module for reducing stress comprises: a layer of layers: a board J comprising a wafer and a transparent electrode having a surface opposite to the glass substrate having a ft overlap with the glass substrate The upper offset portion is formed with a plurality of solder pads, the glass substrate has a side adjacent to the upper offset portion, and the module substrate has a glue application region, and a plurality of connection pads are formed on the glue a plurality of bonding wires electrically connected to the connection pads of the module substrate and the solder pads of the lithographic wafer; a enamel sealer is formed on a side of the glue application zone; a buffer rubber formed on the side of the sealant and the glass substrate 1252953 ___ Case No. 93113239 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The cushioning glue. 11. The reduced stress microdisplay module of claim 1, wherein the buffer glass has a glass transition temperature lower than a glass transition temperature of the sealant. 1 . The reduced stress microdisplay module as described in claim 10, wherein the display panel is an LC〇S (Liquid Crystal On Silicon) panel. The stress reducing microdisplay module of claim 3, wherein the buffer rubber is surrounded by the sealant and the side of the glass substrate. 14. A stress-reducing microdisplay as described in claim 1 The module is not more than 15, such as a module, 16, such as a module, a portion, a module, and a module, such as a module, wherein the glass substrate is coated with the glass substrate. The first application of the first aspect of the present invention is the first aspect of the invention. The transparent substrate of the transparent substrate is disclosed in the patent application. It further comprises a cover having an upper surface, the upper surface of the sealant. The degree described in the item does not extend to the formation of the pole layer as described in the item. The reduced stress microdisplay of the item described above is higher than the sealant. The stress-reducing microdisplay overlaps the misalignment with one of the overlaps. The micro-display with reduced stress is at least one fresh block, and the micro-display with reduced stress is integrated with the module substrate, 1252953 Case No. 93113239 - Year Month Day_Amendment VI. Patent Application Scope The system has a window corresponding to the overlapping portion of the silicon wafer and the glass substrate. 1^1第19页